Semiconductor wafer glue tearing and hole exposing equipment

Abstract

The utility model discloses a semiconductor wafer glue tearing and hole exposing device. According to the processing flow, the semiconductor wafer glue tearing and hole exposing device sequentially comprises a feeding mechanism, a glue tearing mechanism and a discharging mechanism. The material transferring mechanism is used for achieving material transferring of the mechanism, and the material transferring mechanism extends to the position of the discharging mechanism from the feeding mechanism; stepping type material transferring work among the feeding mechanism, the adhesive tearing mechanism and the discharging mechanism is achieved through the material transferring mechanism. The feeding mechanism, the adhesive tearing mechanism and the discharging mechanism are arranged in a matched mode, so that the automatic processing flow of automatic feeding, adhesive tearing and discharging of semiconductor wafers is achieved; and in the adhesive tearing mechanism, high-precision adhesive clamping and tearing processing actions can be realized through a visual system and a discharging device capable of realizing multi-axis adjustment, so that the processing efficiency of adhesive tearing work is effectively improved, the manual labor cost is reduced, and meanwhile, the high-quality processing effect is achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor wafer processing and relates to a semiconductor wafer adhesive peeling and hole exposing device. Background Art

[0002] Semiconductor etching processing includes wafer coating, pre-baking, exposure, development, hardening, corrosion, and stripping. During the reaction process, some positions of the semiconductor do not need to be etched, so before processing, a coating of the semiconductor will be performed at the processing position that does not need to be etched. Shielding is achieved through photoresist.

[0003] After completing the corresponding processing work, it is necessary to carry out the processing work of peeling off the glue to expose the holes. The traditional process of peeling off the glue to expose the holes is mainly achieved manually. For continuous production and processing, the overall processing efficiency is low. For this reason, the present application proposes an automated processing equipment that can realize automatic glue sticking and hole plugging. Through this equipment, the work of peeling off the glue to expose the holes of semiconductor wafers can be realized fully automatically, which effectively improves the processing efficiency and reduces the labor cost. Utility Model Content

[0004] In order to solve the implementation technical problems, the utility model adopts the following technical solutions:

[0005] A semiconductor wafer adhesive peeling and hole exposing device, which comprises, in accordance with the processing flow, a loading mechanism, an adhesive peeling mechanism and an unloading mechanism;

[0006] It also includes a set of material transfer mechanisms for realizing material transfer, and the material transfer mechanism extends from the loading mechanism to the unloading mechanism. The material transfer mechanism is used to realize step-by-step material transfer between the loading mechanism, the glue peeling mechanism and the unloading mechanism.

[0007] As a further solution of the utility model: the glue peeling mechanism includes: a glue peeling group for realizing glue peeling and a material discharge group for realizing material discharge;

[0008] The glue peeling group includes: a glue peeling moving module, a glue peeling lifting module installed on the glue peeling moving module, a glue peeling rotating module installed on the glue peeling lifting module, and a glue peeling clamp installed on the glue peeling rotating module;

[0009] The unloading group includes an X-axis driving module, a Y-axis driving module installed on the X-axis driving module, and an R-axis rotating module installed on the Y-axis driving module; a unloading table for unloading is installed on the R-axis rotating module;

[0010] The glue peeling group is also provided with a group of visual positioning modules, and the visual positioning modules are arranged on the glue peeling lifting module.

[0011] As a further solution of the utility model: the adhesive peeling mechanism also includes: an adhesive film collecting group for collecting the waste adhesive film after the adhesive peeling;

[0012] It includes: a material receiving box for collecting waste materials and a material receiving mechanism for receiving waste materials;

[0013] The material receiving mechanism includes: a group of material receiving lifting modules, a group of material receiving moving modules installed on the material receiving lifting modules, the material receiving moving modules are located at the lower end of the glue peeling moving module and are arranged parallel to it; a material receiving clamp is installed on the material receiving moving module, and the material receiving clamp is located at the upper end of the material receiving box and at the lower end of the glue peeling moving module.

[0014] As a further solution of the utility model: a group of glue pressing units is also arranged in the rear processing position of the feeding mechanism, which includes: a glue pressing table, a glue pressing lifting module arranged at the upper end of the glue pressing table, and a glue pressing moving module installed on the glue pressing lifting module, a glue pressing wheel frame is installed on the glue pressing moving module, and a glue pressing roller wheel for realizing glue pressing is installed on the glue pressing wheel frame;

[0015] As a further solution of the utility model: the loading mechanism and the unloading mechanism have the same structure, and both include: a material moving group and a material transfer group;

[0016] The material transfer group includes: a rotating truncated table, on which a plurality of material placement seats are arranged around the rotating truncated table, and a plurality of semiconductor wafers stacked in gaps are placed in the material placement seats; the position where the rotating truncated table and the material transfer group are connected is a material transfer position, and a material transfer lifting module is arranged on the material transfer position;

[0017] The material transfer group includes: a material transfer lifting module and a material transfer moving module installed on the material transfer lifting module, and a material transfer frame is installed on the material transfer moving module, and a group of electrostatic suction cups extending toward the rotating table are arranged on the material transfer frame;

[0018] The material transfer group comprises a material transfer table, a through material discharge position is formed on the material transfer table, and sunken material supporting grooves are formed at both ends of the material discharge position on the material transfer table.

[0019] As a further solution of the utility model: a material discharging frame for fixing the material discharging seat is arranged on the rotating round table of the material transfer group, and the material discharging frame is surrounded by four limit frames with a right-angle cross-section structure;

[0020] The material discharging seat is installed into the material discharging frame from the upper end of the material discharging frame;

[0021] The front end of the material discharging seat is connected with the inside to form a material taking port; the inside of the material discharging seat is hollow, and a plurality of stacked material discharging grooves are formed on both sides of the inner wall of the material discharging seat, and a material discharging cavity for placing semiconductor wafers is formed between two material discharging grooves located opposite to each other on both sides.

[0022] As a further solution of the utility model: the material transfer mechanism includes: a group of material transfer transverse shifting modules spanning from the loading mechanism to the unloading mechanism; a group of material picking forward pushing modules arranged vertically therewith are formed on the material transfer transverse shifting modules, a material picking rack is installed on the material picking forward pushing modules, and a plurality of groups of material picking lifting cylinders for downward movement are installed on the material picking rack;

[0023] A three-axis material transfer device is formed between the material transfer transverse shift module, the material picking forward push module and the material picking lifting cylinder. A material support rack extending toward the upward material mechanism is arranged on the material picking lifting cylinder; and a material picking trough for inserting the material support rack is arranged at the bottom of the material discharge position of the material loading mechanism, the glue tearing mechanism and the material unloading mechanism.

[0024] The beneficial effects of the utility model are as follows: the automatic loading, glue removal and unloading of semiconductor wafers are realized by arranging the loading mechanism, the glue removal mechanism and the unloading mechanism in a coordinated manner;

[0025] The glue peeling mechanism can realize high-precision glue peeling processing through the visual system and the feeding device capable of multi-axis adjustment, which can effectively improve the processing efficiency of the glue peeling work, reduce labor costs, and achieve high-quality processing results. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the structure of the utility model.

[0027] Figure 2 It is a structural schematic diagram of the glue peeling group in the utility model.

[0028] Figure 3 It is a structural schematic diagram of the discharge group in the utility model.

[0029] Figure 4 It is a structural schematic diagram of the medium pressure glue unit of the utility model.

[0030] Figure 5 It is a structural schematic diagram of a feeding mechanism and a feeding mechanism in the utility model.

[0031] Figure 6 It is a structural schematic diagram of the material transfer mechanism of the utility model.

[0032] Figure 7 It is a structural schematic diagram of the plastic film collecting group in the utility model. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. It should be understood that the present application is not limited to the example embodiments disclosed herein. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0034] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0036] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] The utility model provides Figures 1 to 7 In an embodiment of the utility model, a semiconductor wafer adhesive peeling and hole exposing device includes, in accordance with the processing flow, a loading mechanism 1, an adhesive peeling mechanism 4 and an unloading mechanism 7;

[0038] It also includes a set of material transfer mechanisms 2 for realizing material transfer, and the material transfer mechanism 2 extends from the loading mechanism 1 to the unloading mechanism 7. The material transfer mechanism 2 is used to realize the step-by-step material transfer work between the loading mechanism 1, the glue peeling mechanism 4 and the unloading mechanism 7.

[0039] Furthermore, the glue peeling mechanism 4 includes: a glue peeling group 41 for realizing glue peeling and a material discharge group 42 for realizing material discharge;

[0040] The glue peeling group 41 includes: a glue peeling moving module 412, a glue peeling lifting module 411 installed on the glue peeling moving module 412, a glue peeling rotating module 414 installed on the glue peeling lifting module 411, and a glue peeling clamp 415 installed on the glue peeling rotating module 414;

[0041] The material unloading group 42 includes an X-axis driving module 424, a Y-axis driving module 423 installed on the X-axis driving module 424, and an R-axis rotating module 422 installed on the Y-axis driving module 423; a material unloading table 421 for unloading is installed on the R-axis rotating module 422;

[0042] During the glue peeling process, in order to ensure that the glue peeling jaws 415 can smoothly realize the glue clamping and glue peeling action, a group of visual positioning modules 413 are also provided in the glue peeling group 41, and the visual positioning module 413 is arranged on the glue peeling lifting module 411; when working, the visual positioning module 413 performs visual recognition and positioning to determine the glue peeling position of the hole-blocking adhesive film on the wafer, and in order to facilitate the glue peeling work, the adhesive film used for wafer hole blocking will reserve a glue peeling strip extending outside the round wafer, and the visual positioning module 413 can directly perform the positioning of the glue peeling strip;

[0043] The glue tearing strip is clamped by the glue tearing movable module 412 and the glue tearing lifting module 411, and then the glue tearing movable module 412, the glue tearing lifting module 411 and the glue tearing rotating module 414 cooperate for a second time to drive the glue tearing clamp 415 to tear the glue film from the wafer in a manner similar to manual film peeling, thereby avoiding the possibility of wear on the wafer during the glue tearing process.

[0044] In order to ensure that the glue tearing jaws 415 can accurately clamp the glue tearing strips, during the glue tearing process, the X-axis driving module 424, the Y-axis driving module 423 and the R-axis rotating module 422 in the material discharge group 42 will also drive the material discharge table 421 to adjust its position according to the visual recognition information to ensure that the glue tearing jaws 415 can smoothly perform the clamping work.

[0045] Furthermore, the adhesive peeling mechanism 4 further includes: an adhesive film collecting group 5 for collecting the waste adhesive film after the adhesive peeling;

[0046] It includes: a material receiving box 54 for collecting waste materials and a material receiving mechanism for receiving waste materials;

[0047] The material receiving mechanism includes: a group of material receiving lifting modules 51, and a group of material receiving moving modules 52 installed on the material receiving lifting modules 51, and the material receiving moving modules 52 are located at the lower end of the glue tearing moving module 412 and are arranged parallel to it; a material receiving clamp 53 is installed on the material receiving moving module 52, and the material receiving clamp 53 is located at the upper end of the material receiving box 54 and at the lower end of the glue tearing moving module 412.

[0048] After the glue tearing group 41 completes the glue tearing action, the glue tearing moving module 412 will drive the glue tearing jaw 415 to move toward the glue film collecting group, and at the same time, the material receiving moving module 52 will drive the material receiving jaw 53 to move to the lower end position of the glue tearing jaw 415, and then the material receiving lifting module 51 will drive the material receiving jaw to push up and take the waste glue film from the glue tearing jaw 415, and then the material receiving mechanism will reset, and the material receiving jaw 54 will send the waste material into the material receiving box 54, completing the collection of the waste glue film.

[0049] Furthermore, a set of glue pressing units 3 is also arranged in the rear processing position of the feeding mechanism 1, which includes: a glue pressing platform 33, a glue pressing lifting module 31 arranged on the upper end of the glue pressing platform 33, and a glue pressing moving module 32 installed on the glue pressing lifting module 31, a glue pressing wheel frame 34 is installed on the glue pressing moving module 32, and a glue pressing roller wheel 35 for realizing glue pressing is installed on the glue pressing wheel frame 34;

[0050] The wafer sent out from the loading mechanism 1 will be placed on the glue pressing table 33, and then the glue pressing roller 35 will be driven by the glue pressing moving module 32 and the glue pressing lifting module 31 to roll on the glue film to flatten the tearing strip of the glue film to ensure that the tearing jaws 415 can smoothly clamp and tear the glue.

[0051] Furthermore, the loading mechanism 1 and the unloading mechanism 7 have the same structure, and both include: a material shifting group 11 and a material transfer group 12;

[0052] The material transfer group 12 includes: a rotating table 117, on which a plurality of material discharging seats 111 arranged around the rotating table 117 are arranged, and a plurality of semiconductor wafers stacked with gaps are placed in the material discharging seats 111; the position where the rotating table 117 is connected to the material transfer group 12 is a material transfer position, and a material transfer lifting module 118 is arranged at the material transfer position, and the position where the material discharging seat 111 is installed in the rotating table 117 is provided with an avoidance groove 116, and the material transfer lifting module 118 can drive the material discharging seat 111 to perform lifting work, so as to achieve the effect of clip-type material discharging or feeding;

[0053] The material transfer group 11 includes: a material transfer lifting module 125 and a material transfer moving module 124 installed on the material transfer lifting module 125, and a material transfer frame 123 is installed on the material transfer moving module 124, and a group of electrostatic suction cups 122 extending toward the rotating table 117 are arranged on the material transfer frame 123;

[0054] The material transfer group 12 includes: a material transfer table 128, on which a through material discharge position 126 is formed, and at both ends of the material discharge position 126 on the material transfer table 128, sunken material supporting grooves 121 are formed; during the loading operation, the material transfer lifting module 125 and the material transfer moving module 124 in the material transfer group 11 drive the electrostatic suction cup 122 to suck the bottom of the semiconductor wafer from the material discharge seat 111, take it out and place it in the material discharge position 126, and support it through the material supporting grooves 121 on both sides; and during the unloading operation, the electrostatic suction cup 122 is driven to take the processed semiconductor wafer out of the material discharge position 126 and place it in the material discharge seat 111.

[0055] Furthermore, a material discharging frame 112 for fixing the material discharging seat 111 is provided on the rotating truncated table 117 of the material transfer group 12, and the material discharging frame 112 is formed by four limiting frames with a right-angle cross-section structure.

[0056] The material discharging seat 111 is loaded into the material discharging frame 112 from the upper end thereof. During the processing, the operator can achieve the effect of rapid material change in the material transfer group 12 by directly replacing the material discharging seat 111;

[0057] The front end of the material discharging seat 111 is connected with the interior thereof to form a material taking port 113; the interior of the material discharging seat 111 is hollow, and a plurality of stacked material discharging grooves 114 are formed on both sides of the inner wall of the material discharging seat 111, and a material discharging cavity for placing semiconductor wafers is formed between two material discharging grooves 114 located opposite to each other on both sides; during the processing, the electrostatic suction cup 122 is taken out of the material discharging cavity or sent into the material discharging cavity by the material transfer lifting module 125 and the material transfer moving module 124 in the material transfer group 11.

[0058] Furthermore, the material transfer mechanism 2 includes: a group of material transfer transverse shifting modules 21 spanning from the material loading mechanism 1 to the material unloading mechanism 7; a group of material picking forward pushing modules 22 arranged vertically therewith are formed on the material transfer transverse shifting modules 21, a material picking rack 23 is installed on the material picking rack 23, and a plurality of groups of material picking lifting cylinders 24 that move downward are installed on the material picking rack 23;

[0059] A three-axis material transfer device is formed between the material transfer transverse shifting module 21, the material picking forward pushing module 22 and the material picking lifting cylinder 24. A material support frame 25 extending toward the upper material mechanism 1 is provided on the material picking lifting cylinder 24; and a material discharging position 126 of the material feeding mechanism 1, the glue tearing mechanism 4 and the material discharging mechanism 7 (specifically including: the material transfer table 128 of the material feeding mechanism 1 and the material discharging mechanism 7, the material discharging table 421 of the glue tearing mechanism 4 and the glue pressing table 33) is provided at the bottom with a material trough 127 for inserting the material support frame 25;

[0060] During the material transfer process, the material transfer transverse shift module 21, the material picking forward push module 22 and the material picking lifting cylinder 24 cooperate with each other to drive the support frame 25 to be inserted into the material picking slot 127 of the corresponding mechanism material discharge position, and the semiconductor wafer is transferred by lifting it to avoid contact with its working surface and causing damage, and it is sent from the current processing position to the next processing position to achieve the material transfer processing effect; and the support frame 25 can also use vacuum adsorption to achieve a stable adsorption effect of the semiconductor wafer;

[0061] In order to reduce the contact area between the support frame 25 and the semiconductor wafer, the support frame 25 adopts a "U"-shaped support structure, which can stably support the semiconductor wafer while reducing the contact area therewith to avoid causing surface wear thereon.

[0062] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "including a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0063] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A semiconductor wafer adhesive peeling and hole exposing device, characterized in that: According to the processing flow, it includes: feeding mechanism, glue peeling mechanism and unloading mechanism; It also includes a set of material transfer mechanisms for realizing material transfer, and the material transfer mechanism extends from the loading mechanism to the unloading mechanism. The material transfer mechanism is used to realize step-by-step material transfer between the loading mechanism, the glue peeling mechanism and the unloading mechanism.

2. The semiconductor wafer adhesive peeling and hole exposing device according to claim 1, characterized in that: The glue peeling mechanism includes: a glue peeling group for realizing glue peeling and a material discharge group for realizing material discharge; The glue peeling group includes: a glue peeling moving module, a glue peeling lifting module installed on the glue peeling moving module, a glue peeling rotating module installed on the glue peeling lifting module, and a glue peeling clamp installed on the glue peeling rotating module; The unloading group includes an X-axis driving module, a Y-axis driving module installed on the X-axis driving module, and an R-axis rotating module installed on the Y-axis driving module; a unloading table for unloading is installed on the R-axis rotating module; The glue peeling group is also provided with a group of visual positioning modules, and the visual positioning modules are arranged on the glue peeling lifting module.

3. The semiconductor wafer adhesive peeling and hole exposing device according to claim 2, characterized in that: The adhesive peeling mechanism also includes: an adhesive film collecting group for collecting waste adhesive films after adhesive peeling; It includes: a material receiving box for collecting waste materials and a material receiving mechanism for receiving waste materials; The material receiving mechanism includes: a group of material receiving lifting modules, a group of material receiving moving modules installed on the material receiving lifting modules, the material receiving moving modules are located at the lower end of the glue peeling moving module and are arranged parallel to it; a material receiving clamp is installed on the material receiving moving module, and the material receiving clamp is located at the upper end of the material receiving box and at the lower end of the glue peeling moving module.

4. The semiconductor wafer adhesive peeling and hole exposing device according to claim 2, characterized in that: A group of glue pressing units is also arranged in the rear processing position of the feeding mechanism, which includes: a glue pressing table, a glue pressing lifting module arranged at the upper end of the glue pressing table, and a glue pressing moving module installed on the glue pressing lifting module, a glue pressing wheel frame is installed on the glue pressing wheel frame, and a glue pressing roller for realizing the glue pressing work is installed on the glue pressing wheel frame.

5. The semiconductor wafer adhesive peeling and hole exposing device according to claim 1, characterized in that: The loading mechanism has the same structure as the unloading mechanism, and both include: a material transfer group and a material transfer group; The material transfer group includes: a rotating truncated table, on which a plurality of material placement seats are arranged around the rotating truncated table, and a plurality of semiconductor wafers stacked in gaps are placed in the material placement seats; the position where the rotating truncated table and the material transfer group are connected is a material transfer position, and a material transfer lifting module is arranged on the material transfer position; The material transfer group includes: a material transfer lifting module and a material transfer moving module installed on the material transfer lifting module, and a material transfer frame is installed on the material transfer moving module, and a group of electrostatic suction cups extending toward the rotating table are arranged on the material transfer frame; The material transfer group comprises a material transfer table, a through material discharge position is formed on the material transfer table, and sunken material supporting grooves are formed at both ends of the material discharge position on the material transfer table.

6. The semiconductor wafer adhesive peeling and hole exposing device according to claim 5, characterized in that: A material discharging frame for fixing the material discharging seat is arranged on the rotating round table of the material transfer group, and the material discharging frame is surrounded by four limit frames with a right-angle cross-section structure; The material discharging seat is installed into the material discharging frame from the upper end of the material discharging frame; The front end of the material discharging seat is connected with the inside to form a material taking port; the inside of the material discharging seat is hollow, and a plurality of stacked material discharging grooves are formed on both sides of the inner wall of the material discharging seat, and a material discharging cavity for placing semiconductor wafers is formed between two material discharging grooves located opposite to each other on both sides.

7. The semiconductor wafer adhesive peeling and hole exposing device according to claim 1, characterized in that: The material transfer mechanism includes: a group of material transfer transverse shifting modules spanning from the material loading mechanism to the material unloading mechanism; a group of material picking forward pushing modules arranged vertically therewith are formed on the material transfer transverse shifting modules, a material picking rack is installed on the material picking forward pushing modules, and a plurality of groups of material picking lifting cylinders for downward movement are installed on the material picking rack; A three-axis material transfer device is formed between the material transfer transverse shift module, the material picking forward push module and the material picking lifting cylinder. A material support rack extending toward the upward material mechanism is arranged on the material picking lifting cylinder; and a material picking trough for inserting the material support rack is arranged at the bottom of the material discharge position of the material loading mechanism, the glue tearing mechanism and the material unloading mechanism.

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