Dewelding repair table

Abstract

The utility model relates to a desoldering and repairing table, which belongs to the field of desoldering and repairing and comprises a table frame, a desoldering mechanism for desoldering a circuit board at a fixed point and cleaning soldering tin in time is arranged on the upper surface of the table frame, and a conveying mechanism for automatically feeding and discharging is arranged on the upper surface of the table frame. The desoldering mechanism comprises a supporting frame, a linear module, an air cylinder, a connecting plate, a collecting nozzle, a tin sucking pump, a material sucking pipe, a feeding pipe and a collecting box. According to the desoldering repair table, the desoldering mechanism and the linear module are arranged and used for accurately moving the air cylinder and the connecting plate so that accurate positioning of circuit board welding spots can be achieved, heating of the circuit board welding spots is achieved through the heating piece, and generated hot air is directly blown to a specific area of a circuit board through the air supply pipe and the air outlet nozzle; the tin sucking pump is matched with the material sucking pipe and the collecting nozzle to suck molten soldering tin and convey the sucked soldering tin to the collecting box, and the visual positioning sensor is installed on the lower surface of the connecting plate and used for accurately recognizing the position of a welding spot on the circuit board so as to improve the accuracy of desoldering.

Description

Technical Field

[0001] The utility model relates to the technical field of desoldering and rework, in particular to a desoldering and rework station. Background Art

[0002] PCB board, or printed circuit board, is a substrate used to connect electronic components in electronic devices. In the case of unqualified production and rework parts upgrade, the components on the PCB board need to be desoldered and reworked, which usually requires the use of special equipment, namely the PCB board desoldering and rework station.

[0003] As disclosed in Chinese Patent Publication No. (CN211557649U), a desoldering and rework device for electronic components includes a carrier mechanism for placing materials, a lower heating mechanism arranged below the carrier mechanism for preheating the materials as a whole, and an upper heating mechanism arranged above the carrier mechanism for locally heating the materials; the carrier mechanism includes a carrier frame, a first sliding module arranged at the top of the carrier frame along the length direction of the carrier frame, and a plurality of clamping plate modules arranged perpendicular to the first sliding module and slidably connected to the top of the carrier frame; the first sliding module is used to adjust the spacing between the plurality of clamping plate modules so that the clamping plate modules can clamp and fix materials of different sizes. The utility model is provided with an upper heating mechanism and a lower heating mechanism, which can first preheat the materials as a whole through the lower heating mechanism, and then concentrate the heating of the area to be desoldered through the upper heating mechanism, with fast heating speed and good heating effect, thereby reducing the melting time of solder and improving work efficiency.

[0004] However, the above patent still has the problem of poor soldering effect when desoldering the circuit board. For example, the above patent is provided with an upper heating mechanism and a lower heating mechanism to perform bidirectional heating on the circuit board to melt the solidified solder so as to facilitate the removal of components. However, in this method, the solder cannot be cleaned in time after melting. After the components are removed, the solder will remain on the circuit board. During the subsequent rework, the components need to be melted again before soldering, which greatly affects the rework efficiency. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a desoldering and rework station, which has the advantages of good desoldering and cleaning effect, and solves the problem of poor soldering treatment effect when desoldering a circuit board in the prior art.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a desoldering and rework station, comprising a stand, the upper surface of which is provided with a desoldering mechanism for performing fixed-point desoldering on a circuit board and timely cleaning the solder, and the upper surface of which is provided with a conveying mechanism for automatic loading and unloading;

[0007] The desoldering mechanism includes a support frame, a linear module, a cylinder, a connecting plate, a collecting nozzle, a desoldering pump, a suction pipe, a feeding pipe, a collecting box and a heating element. The support frame is fixed to the upper surface of the platform, the linear module is fixed to the inner top wall of the support frame, the cylinder is fixed to the lower surface of the linear module, the connecting plate is fixed to the outer side of the cylinder output shaft, a connecting port is provided on the left side of the upper surface of the connecting plate, and the collecting nozzle is fixed to the inner wall of the connecting port, the desoldering pump is fixed to the left side of the upper surface of the support frame, one end of the suction pipe is connected to the feed end of the desoldering pump, and the other end of the suction pipe is connected to the upper surface of the collecting nozzle, one end of the feeding pipe is connected to the discharge end of the desoldering pump, and the other end of the feeding pipe is connected to the collecting box, and the heating element is arranged on the right side of the upper surface of the support frame for heating and desoldering the circuit board.

[0008] Furthermore, the heating element includes a heating box fixed on the right side of the upper surface of the support frame, the right side of the heating box is connected to a fan, an electric heating wire is fixed between the upper and lower inner walls of the heating box, an air outlet is fixed on the right side of the lower surface of the connecting plate, and an air supply duct is connected between the air outlet and the opposite side of the heating box.

[0009] Furthermore, a controller is fixed on the front side of the stand, and a visual positioning sensor is provided on the lower surface of the connecting plate.

[0010] Furthermore, a cleaning port is provided on the left side of the collecting box, and a tin collecting frame is inserted into the inner wall of the cleaning port.

[0011] Furthermore, the lower surface of the air outlet nozzle and the lower surface of the collecting nozzle are located on the same horizontal plane, and a filter is fixed to the air inlet end of the fan.

[0012] Furthermore, the conveying mechanism includes a transverse conveyor belt, a longitudinal conveyor belt, an intercepting plate and a positioning baffle, the transverse conveyor belt is fixed to the upper surface of the platform, the longitudinal conveyor belt is fixed to the upper surface of the platform and is located on the left side of the transverse conveyor belt, the intercepting plate is fixed to the upper surface of the longitudinal conveyor belt, and the positioning baffle is fixed to the upper surface of the platform and is located on the front of the longitudinal conveyor belt.

[0013] Furthermore, the upper surface of the transverse conveyor belt and the upper surface of the longitudinal conveyor belt are located on the same horizontal plane.

[0014] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0015] 1. The desoldering and rework station is equipped with a desoldering mechanism. The linear module is used to accurately move the cylinder and the connecting plate to achieve accurate positioning of the solder joints on the circuit board. The heating element heats the solder joints on the circuit board. The hot air generated is directly blown to the specific area of ​​the circuit board through the air supply pipe and the air outlet nozzle. The desoldering pump cooperates with the suction pipe and the collecting nozzle to absorb the molten solder and send the sucked solder to the collecting box. The visual positioning sensor is installed on the lower surface of the connecting plate to accurately identify the position of the solder joints on the circuit board to improve the accuracy of desoldering.

[0016] 2. The desoldering and rework station is provided with a conveying mechanism, and the circuit boards that need to be desoldered and reworked can be transported in batches by using a transverse conveyor belt. The circuit boards are moved to the longitudinal conveyor belt by the conveying action of the transverse conveyor belt. At this time, the longitudinal conveyor belt is in a stopped state, and the interception plate is used to stabilize the circuit boards. The positioning baffle is used to further accurately position the circuit boards so as to stably intercept the circuit boards under the desoldering mechanism for easy desoldering. After the desoldering is completed, the longitudinal conveyor belt is started to transport and unload the circuit boards, thereby realizing automatic loading and unloading of the circuit boards, that is, automatically placing the circuit boards at the desoldering position, and automatically moving the circuit boards out of the desoldering area after the desoldering is completed. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the desoldering mechanism of the utility model;

[0019] Figure 3 It is a partial schematic diagram of the desoldering mechanism of the utility model;

[0020] Figure 4 It is a schematic diagram of the conveying mechanism of the utility model.

[0021] In the figure: 1 stand, 2 desoldering mechanism, 21 support frame, 22 linear module, 23 cylinder, 24 connecting plate, 25 collecting nozzle, 26 desoldering pump, 27 suction pipe, 28 feeding pipe, 29 collecting box, 210 heating element, 2101 heating box, 2102 fan, 2103 heating wire, 2104 air outlet nozzle, 2105 air supply pipe, 3 conveying mechanism, 31 horizontal conveyor belt, 32 longitudinal conveyor belt, 33 intercepting plate, 34 positioning baffle. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1 A desoldering and rework station in this embodiment includes a stand 1, and a desoldering mechanism 2 for performing fixed-point desoldering on a circuit board and timely cleaning the solder is provided on the upper surface of the stand 1, and a conveying mechanism 3 for automatic loading and unloading is provided on the upper surface of the stand 1.

[0024] See also Figure 2-3 In order to desolder and clean the solder of the circuit board, the desoldering mechanism 2 in this embodiment includes a support frame 21, a linear module 22, a cylinder 23, a connecting plate 24, a collecting nozzle 25, a desoldering pump 26, a suction pipe 27, a feeding pipe 28, a collecting box 29 and a heating element 210. The support frame 21 is fixed to the upper surface of the stand 1, the linear module 22 is fixed to the inner top wall of the support frame 21, the linear module 22 is used to accurately move the cylinder 23 and the connecting plate 24 to achieve accurate positioning of the solder joints of the circuit board, the cylinder 23 is fixed to the lower surface of the linear module 22, the connecting plate 24 is fixed to the outer side of the output shaft of the cylinder 23, the connecting plate 24 and the collecting nozzle 25 thereon are driven by the telescopic movement of the cylinder 23 to align with the solder joints that need to be desoldered, and the upper surface of the connecting plate 24 A connection port is provided on the left side, and the collecting nozzle 25 is fixed to the inner wall of the connection port, the tin suction pump 26 is fixed to the left side of the upper surface of the support frame 21, one end of the suction pipe 27 is connected to the feeding end of the tin suction pump 26, and the other end of the suction pipe 27 is connected to the upper surface of the collecting nozzle 25, the tin suction pump 26 is fixed on the support frame 21, and is connected to the collecting nozzle 25 through the suction pipe 27, and is used to absorb the molten solder, one end of the feeding pipe 28 is connected to the discharge end of the tin suction pump 26, and the other end of the feeding pipe 28 is connected to the collecting box 29, one end of the feeding pipe 28 is connected to the discharge end of the tin suction pump 26, and the other end is connected to the collecting box 29, and is used to send the sucked solder to the collecting box 29, and the heating element 210 is arranged on the right side of the upper surface of the support frame 21 for heating and desoldering the circuit board.

[0025] The heating element 210 includes a heating box 2101 fixed on the right side of the upper surface of the support frame 21, and the right side of the heating box 2101 is connected to a fan 2102. When current passes through the heating wires 2103, they will generate heat. The fan 2102 transfers the heat in the heating box 2101 to the circuit board through air flow to achieve heating of the solder joints of the circuit board. The heating wires 2103 are fixed between the upper and lower inner walls of the heating box 2101, and an air outlet 2104 is fixed on the right side of the lower surface of the connecting plate 24. The hot air generated by the fan 2102 is directly blown to a specific area of ​​the circuit board through an air supply pipe 2105 and the air outlet 2104. The air supply pipe 2105 is connected between the air outlet 2104 and the opposite side of the heating box 2101. The heating element 210 also includes a temperature control unit for monitoring and adjusting the temperature in the heating box 2101 to ensure that the heating process is carried out within the required temperature range to avoid thermal damage to the circuit board.

[0026] In this embodiment, a controller is fixed on the front of the stand 1, and a visual positioning sensor is provided on the lower surface of the connecting plate 24. The visual positioning sensor is used to accurately identify the position of the solder joints on the circuit board to improve the accuracy of desoldering. A cleaning port is opened on the left side of the collection box 29, and a tin collecting frame is inserted into the inner wall of the cleaning port. The lower surface of the air outlet nozzle 2104 and the lower surface of the collection nozzle 25 are located on the same horizontal plane, and a filter is fixed at the air inlet end of the fan 2102.

[0027] See also Figure 4 , in order to automatically load the circuit board for desoldering and rework, the conveying mechanism 3 in this embodiment includes a transverse conveyor belt 31, a longitudinal conveyor belt 32, an intercepting plate 33 and a positioning baffle 34. The transverse conveyor belt 31 is fixed to the upper surface of the stand 1, and the longitudinal conveyor belt 32 is fixed to the upper surface of the stand 1 and is located on the left side of the transverse conveyor belt 31. The transverse conveyor belt 31 and the longitudinal conveyor belt 32 are fixed to the upper surface of the stand 1 for moving the circuit board in the X and Y directions to achieve desoldering operations at different positions. The intercepting plate 33 is fixed to the upper surface of the longitudinal conveyor belt 32, and the positioning baffle 34 is fixed to the upper surface of the stand 1 and is located on the front of the longitudinal conveyor belt 32. The transverse conveyor belt 31 can be used to transport circuit boards that need to be desoldered and reworked in batches. The circuit boards are moved to the longitudinal conveyor belt 32 under the conveying action of the transverse conveyor belt 31. At this time, the longitudinal conveyor belt 32 is in a stopped state. The intercepting plate 33 is used to stabilize the circuit board, and the positioning baffle 34 is used to further accurately position the circuit board so as to stably intercept the circuit board under the desoldering mechanism 2 for desoldering.

[0028] In this embodiment, the upper surface of the transverse conveyor belt 31 and the upper surface of the longitudinal conveyor belt 32 are located at the same horizontal plane. After the desoldering is completed, the longitudinal conveyor belt 32 is started to transport the unloaded materials. Then, the transverse conveyor belt 31 is started and the circuit board in front is transported to the longitudinal conveyor belt 32 again under the push of the material to realize automatic material replenishment, thereby realizing automatic loading and unloading of circuit boards.

[0029] The working principle of the above embodiment is:

[0030] (1) When desoldering and cleaning solder on a circuit board, the linear module 22 is used to accurately move the cylinder 23 and the connecting plate 24 to achieve accurate positioning of the solder joints on the circuit board. The connecting plate 24 and the collecting nozzle 25 thereon are driven by the extension and contraction of the cylinder 23 to move to align with the solder joints that need to be desoldered. When current passes through the heating wire 2103, they will generate heat. The fan 2102 transfers the heat in the heating box 2101 to the circuit board through air flow to achieve heating of the solder joints on the circuit board. The hot air generated by the fan 2102 is directly Blowing towards a specific area of ​​the circuit board, the heating element 210 also includes a temperature control unit for monitoring and adjusting the temperature in the heating box 2101 to ensure that the heating process is carried out within the required temperature range to avoid thermal damage to the circuit board. The desoldering pump 26 is fixed on the support frame 21 and is connected to the collecting nozzle 25 through the suction pipe 27 to absorb the molten solder. One end of the feeding pipe 28 is connected to the discharge end of the desoldering pump 26, and the other end is connected to the collecting box 29 to send the sucked solder to the collecting box 29. The visual positioning sensor is used to accurately identify the position of the solder joints on the circuit board to improve the accuracy of desoldering.

[0031] (2) When the circuit board is automatically loaded for desoldering and rework, the transverse conveyor belt 31 and the longitudinal conveyor belt 32 are fixed on the upper surface of the stand 1, and are used to move the circuit board in the X and Y directions to realize desoldering operations at different positions. First, the transverse conveyor belt 31 can be used to transport the circuit boards that need to be desoldered and reworked in batches. The circuit boards are moved to the longitudinal conveyor belt 32 under the conveying action of the transverse conveyor belt 31. At this time, the longitudinal conveyor belt 32 is in a stopped state, the interception plate 33 is used to stabilize the circuit board, and the positioning baffle 34 is used to further accurately position the circuit board so that the circuit board can be stably intercepted under the desoldering mechanism 2 for desoldering. After the desoldering is completed, the longitudinal conveyor belt 32 is started to transport and unload the material. Then, the transverse conveyor belt 31 is started to transport the circuit board in front to the longitudinal conveyor belt 32 again under the push of the material to realize automatic material replenishment, thereby realizing automatic loading and unloading of the circuit board.

[0032] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0033] The standard parts used in this application document can all be purchased from the market and can be customized according to the instructions and drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art. The control method is automatic control through a controller. The control circuit of the controller can be implemented through simple programming by technicians in this field, which is common knowledge in this field. Therefore, this application document will no longer explain the control method and circuit connection in detail.

[0034] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that many changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention.

Claims

1. A desoldering and rework station, comprising a stand (1), characterized in that: The upper surface of the stand (1) is provided with a desoldering mechanism (2) for performing fixed-point desoldering on the circuit board and timely cleaning the solder, and the upper surface of the stand (1) is provided with a conveying mechanism (3) for automatic loading and unloading of materials; The desoldering mechanism (2) comprises a support frame (21), a linear module (22), a cylinder (23), a connecting plate (24), a collecting nozzle (25), a desoldering pump (26), a suction pipe (27), a feeding pipe (28), a collecting box (29) and a heating element (210), wherein the support frame (21) is fixed to the upper surface of the stand (1), the linear module (22) is fixed to the inner top wall of the support frame (21), the cylinder (23) is fixed to the lower surface of the linear module (22), the connecting plate (24) is fixed to the outer side of the output shaft of the cylinder (23), and the upper surface of the connecting plate (24) is fixed to the outer side of the output shaft of the cylinder (23). A connection port is provided on the left side of the surface, and the collecting nozzle (25) is fixed to the inner wall of the connection port, the desoldering pump (26) is fixed to the left side of the upper surface of the support frame (21), one end of the suction pipe (27) is connected to the feeding end of the desoldering pump (26), and the other end of the suction pipe (27) is connected to the upper surface of the collecting nozzle (25), one end of the feeding pipe (28) is connected to the discharging end of the desoldering pump (26), and the other end of the feeding pipe (28) is connected to the collecting box (29), and the heating element (210) is arranged on the right side of the upper surface of the support frame (21) for heating and desoldering the circuit board.

2. A desoldering and rework station according to claim 1, characterized in that: The heating element (210) comprises a heating box (2101) fixed on the right side of the upper surface of the support frame (21); the right side of the heating box (2101) is connected to a fan (2102); an electric heating wire (2103) is fixed between the upper and lower inner walls of the heating box (2101); an air outlet (2104) is fixed on the right side of the lower surface of the connecting plate (24); and an air supply pipe (2105) is connected between the air outlet (2104) and the side opposite to the heating box (2101).

3. A desoldering and rework station according to claim 1, characterized in that: A controller is fixed on the front of the stand (1), and a visual positioning sensor is provided on the lower surface of the connecting plate (24).

4. A desoldering and rework station according to claim 1, characterized in that: The left side of the collecting box (29) is provided with a cleaning opening, and the inner wall of the cleaning opening is plugged with a tin collecting frame.

5. A desoldering and rework station according to claim 2, characterized in that: The lower surface of the air outlet nozzle (2104) and the lower surface of the collecting nozzle (25) are located on the same horizontal plane, and a filter is fixed to the air inlet end of the fan (2102).

6. A desoldering and rework station according to claim 1, characterized in that: The conveying mechanism (3) comprises a transverse conveying belt (31), a longitudinal conveying belt (32), an intercepting plate (33) and a positioning baffle (34); the transverse conveying belt (31) is fixed to the upper surface of the platform (1); the longitudinal conveying belt (32) is fixed to the upper surface of the platform (1) and is located on the left side of the transverse conveying belt (31); the intercepting plate (33) is fixed to the upper surface of the longitudinal conveying belt (32); and the positioning baffle (34) is fixed to the upper surface of the platform (1) and is located on the front side of the longitudinal conveying belt (32).

7. A desoldering and rework station according to claim 6, characterized in that: The upper surface of the transverse conveyor belt (31) and the upper surface of the longitudinal conveyor belt (32) are located on the same horizontal plane.

Images