Wafer box reversing jig

Abstract

The utility model provides a wafer box reversing jig, which comprises a bottom plate, a bearing seat and a tray, the bearing seat is connected with the bottom plate, one surface of the bearing seat back to the bottom plate is movably connected with the tray, one surface of the tray back to the bearing seat is concave inwards to form a box carrying area, the box carrying area is used for carrying a first wafer box and a second wafer box, and the box carrying area comprises a first box carrying area and a second box carrying area. The first box carrying area is matched with a first wafer box, the second box carrying area is matched with a second wafer box, a base plate is vertically and movably connected in the second box carrying area, the surface, back on to the bottom plate, of the bearing seat is connected with a wafer jacking module, and the wafer jacking module is used for abutting against wafers in the first wafer box or the second wafer box when the tray moves towards the wafer jacking module. By arranging the box carrying area matched with the clamping plugs, the butt joint of the two wafer clamping plugs can be more accurate and stable, by arranging the base plate with the adjustable height, the clamping plugs can be conveniently aligned, the tolerance can be overcome, and the phenomena that a film source is scratched and the film source is polluted in the box pouring process due to the fact that the heights of the two clamping plugs are different are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a wafer inversion fixture. Background Art

[0002] In the LED industry, wet cleaning refers to the process of using various chemical reagents to react or dissolve impurities and oil stains adsorbed on the surface of the object to be cleaned, which can be accompanied by physical measures such as ultrasound, heating, and vacuuming to desorb impurities from the surface of the object to be cleaned, and then rinse with a large amount of high-purity deionized water to obtain a clean surface.

[0003] The chemical reagents used in wet cleaning of LED wafers are mostly strong acids and strong alkalis. Therefore, during the wet cleaning process, the wafer products need to be transferred from the PP (Polypropylene) material carrier plug to the PFA (Polyfluoroalkoxy) material carrier plug before they can be normally put into the machine for cleaning. After cleaning, the wafer products need to be poured from the PFA material plug back into the PP material plug to be transported to the next process.

[0004] When transferring wafer products, the two types of plugs are usually docked and the box is inverted. However, in this process, the two types of plugs are made of different materials and are often manufactured by different manufacturers. There is a large tolerance between the plugs, and there is a gap when docking. This can easily lead to the risk of scratches on the front side of the wafer during the inverting process, which can easily cause dirt to adhere, thus affecting the product yield. Utility Model Content

[0005] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a wafer inverting jig, which aims to solve the problem in the prior art that there is a large tolerance between the jams, which easily leads to scratches and dirt adhesion on the wafer during the inverting process.

[0006] In order to achieve the above purpose, the utility model is implemented through the following technical solutions:

[0007] A wafer inverting box fixture comprises a base plate, a supporting seat and a tray, the supporting seat being connected to the base plate, the supporting seat having a side facing away from the base plate being movably connected to the tray, the side of the tray facing away from the supporting seat being concave to form a box carrying area, the box carrying area being used to carry a first wafer box and a second wafer box, the box carrying area comprising a first box carrying area and a second box carrying area, the first box carrying area being adapted to the first wafer box, the second box carrying area being adapted to the second wafer box, a pad being vertically movably connected in the second box carrying area, the supporting seat having a side facing away from the base plate being connected to a top sheet module, the top sheet module being used to abut against wafers in the first wafer box or the second wafer box when the tray moves toward the top sheet module.

[0008] Compared with the prior art, the beneficial effects of the utility model are: by setting the box carrier area adapted to the plug, the two wafer plugs can be docked more accurately and stably, and by setting the pad with adjustable height, it is convenient to align the plug, overcome tolerance, and avoid scratching and contamination of the wafer source by dirt during the box inversion process due to the different heights of the two plugs, and by setting the movable tray and the top plate module, after fixing the plug, only the tray needs to be moved, and the wafer can be transferred between the two plugs with the help of the top plate module, reducing the risk of misalignment of the plug, and the operation process of box inversion is fixed, and the operator's operation is more standardized and controllable under the constraint of the fixture, thereby improving the product yield.

[0009] Furthermore, matching grooves are provided at both ends of the tray, and the matching grooves extend from one end of the tray toward the box carrying area, and the matching grooves penetrate the tray.

[0010] Furthermore, a plurality of positioning holes are arranged in the second box carrying area, positioning members are movably connected in the positioning holes, and the positioning members are connected to the pad to adjust the setting height of the pad.

[0011] Furthermore, the top sheet module includes a first top sheet and a second top sheet, one end of the second top sheet is connected to the supporting seat, the second top sheet is connected to the first top sheet on a side facing the tray, and the height of the first top sheet is the same as the height of the first wafer box.

[0012] Furthermore, a circular arc portion adapted to the wafer is provided on a side of the first top sheet facing the tray.

[0013] Furthermore, a receiving groove is provided at one end of the second top sheet close to the bearing seat, the receiving groove penetrates the second top sheet, and the receiving groove is located on a side of the second top sheet facing the tray.

[0014] Furthermore, a height of a side of the first top sheet facing the supporting seat is greater than a height of the box carrying area.

[0015] Furthermore, the side wall of the bottom plate is connected to a plurality of brackets, and one end of the plurality of brackets away from the bottom plate is connected to a fixing plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of a wafer inversion fixture in an embodiment of the utility model;

[0017] Figure 2 This is a schematic diagram of the disassembled structure of the wafer flipping fixture in the embodiment of the utility model;

[0018] Figure 3 This is a schematic diagram of the disassembled structure of the wafer flipping fixture in the embodiment of the utility model;

[0019] Figure 4 A schematic diagram of a wafer inversion jig in an embodiment of the utility model;

[0020] Description of main component symbols:

[0021] Base Plate 100 Connectors 110 Bearing seat 200 tray 300 First loading area 310 Second box loading area 320 Positioning parts 330 Pad 400 Top sheet module 500 First top sheet 510 Arc 511 Second top sheet 520 Receiving slot 521 Bracket 600 Fixed plate 610 First Wafer Box 710 Second wafer box 720 Wafer 800

[0022] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0023] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0026] See also Figures 1 to 4The wafer box inversion fixture in the embodiment of the utility model includes a base plate 100, a supporting seat 200 and a tray 300. The supporting seat 200 is connected to the base plate 100. The side of the supporting seat 200 facing away from the base plate 100 is movably connected to the tray 300. Matching grooves are provided at both ends of the tray 300. The side of the tray 300 facing away from the supporting seat 200 is concave to form a box carrying area. The box carrying area is used to carry the first wafer box 710 and the second wafer box 720. The matching groove extends from one end of the tray 300 to the box carrying area. The matching groove runs through the tray 30 0, the box carrier area includes a first box carrier area 310 and a second box carrier area 320, the first box carrier area 310 is adapted to the first wafer box 710, the second box carrier area 320 is adapted to the second wafer box 720, the side of the supporting seat 200 facing away from the bottom plate 100 is connected to the top plate module 500, the second box carrier area 320 is vertically movably connected to the pad 400, a plurality of positioning holes are arranged in the second box carrier area 320, the positioning holes are movably connected to the positioning members 330, the positioning members 330 are connected to the pad 400 to adjust the setting height of the pad 400. Preferably, the bottom plate 100 is made of steel plate for counterweight to stabilize the wafer inverting jig, the bearing seat 200 is fixed to the bottom plate 100 by bolts, a protrusion is arranged on the side of the bearing seat 200 facing away from the bottom plate 100, the protrusion is arranged along the length direction of the bearing seat 200 and is located on the central axis of the bearing seat 200 to limit the moving track of the tray 300 on the bearing seat 200, a concave portion adapted to the protrusion is arranged on the side of the tray 300 facing the bearing seat 200, the top sheet module 500 is arranged on the protrusion, and the tray 300 can Slide along the raised portion toward the top sheet module 500. Since the plug, that is, the box for placing the wafers, has a groove running through the plug at the bottom, the matching grooves at both ends of the tray 300 are adapted to the shape of the grooves on the plug, that is, adapted to the shape of the plug, to facilitate the transfer operation of the wafers therein. The shape of the box carrying area is the shape after the first wafer box 710 and the second wafer box 720 are docked. The positioning member 330 uses bolts. The first wafer box 710 is a plug made of PFA material, and the second wafer box 720 is a plug made of PP material. The two plugs are not consistent in height when placed on the same plane. It can be understood that the sliding track of the tray 300 on the supporting base 200 is single, and the box carrying area is adapted to the shape of the plug, which helps to reduce operational errors and irregularities, improve product yield, and help to accurately dock the plug in the horizontal direction. The pad 400 is adjusted to align the height of the second wafer box 720 with the height of the first wafer box 710, reducing the risk of scratching the film source during the box inversion operation and avoiding the negative impact of dirt on the film source.

[0027] Furthermore, the tray 300 can be removed from the supporting base 200 and reversed. It can be understood that the first wafer box 710 can be flipped into the second wafer box 720, and the second wafer box 720 can be flipped into the first wafer box 710. The flexibility of the fixture is good.

[0028] The top sheet module 500 is used to abut the wafer 800 in the first wafer box 710 or the second wafer box 720 when the tray 300 moves toward the top sheet module 500. The top sheet module 500 includes a first top sheet 510 and a second top sheet 520. One end of the second top sheet 520 is connected to the support seat 200, and the second top sheet 520 is connected to the first top sheet 510 on the side facing the tray 300. The height of the first top sheet 510 is the same as the height of the first wafer box 710. The first top sheet 510 is provided with an arc portion 511 adapted to the wafer 800 on the side facing the tray 300. The second top sheet 520 is provided with a receiving groove 521 on one end close to the support seat 200. The receiving groove 521 penetrates the second top sheet 520. The receiving groove 521 is located on the side of the second top sheet 520 facing the tray 300. The height of the first top sheet 510 facing the support seat 200 is greater than the height of the box carrier area. Preferably, refer to Figure 4 , the tray 300 drives the first wafer box 710 and the second wafer box 720 to move toward the top sheet module 500, and the top sheet module 500 extends into the first wafer box 710 to support the wafer 800. When the tray 300 continues to move, the top sheet module 500 abuts against the wafer 800, blocking the movement of the wafer 800. The wafer 800 moves relative to the box-carrying area of ​​the tray 300 and is transferred from the first wafer box 710 to the second wafer box 720. Specifically, the arc portion 511 on the first top sheet 510 abuts against the wafer 800. It can be understood that the arc surface is adapted to the wafer 800, which can prevent the wafer 800 from being worn during the abutment process.

[0029] Furthermore, the receiving groove 521 is provided on the second top sheet 520. When the tray 300 moves toward the top sheet module 500 to transfer the wafer 800, the first top sheet 510 will pass over the first box carrier area 310 because the bottom of the first top sheet 510 is higher than the first box carrier area 310. The tray 300 can continue to move toward the second top sheet 520, and the receiving groove 521 can accommodate part of the tray 300 in the first box carrier area 310 to prevent the tray 300 from colliding with the second top sheet 520.

[0030] Furthermore, the support seat 200, the tray 300 and the top plate module 500 are all made of PTFE (Polytetrafluoroethylene) material, which has a low friction coefficient, a smooth surface, and does not generate particles when sliding against each other, which helps to make the inverting process of the wafer 800 smooth and reduce dirty particles in the inverting environment.

[0031] The side wall of the bottom plate 100 is connected to a plurality of brackets 600, and one end of the plurality of brackets 600 away from the bottom plate 100 is connected to a fixing plate 610. Preferably, the height of the fixing plate 610 is adapted to the height of the first wafer box 710 after being placed in the first box carrier area 310. When the second wafer box 720 is aligned with the first wafer box 710 in height, the first wafer box 710 and the second wafer box 720 can be abutted by the fixing plate 610 on one side facing the bearing seat 200. Specifically, a plurality of connectors 110 are provided on the side wall of the bottom plate 100, and the connectors 110 are used to disassemble and connect the brackets 600. It can be understood that the fixing plate 610 helps to stabilize the plug, stabilize the box inversion process, and further protect the wafer product. In addition, in the face of plugs of different specifications, the brackets 600 of different heights can be replaced.

[0032] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0033] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A wafer flipping fixture, characterized in that: It includes a base plate, a supporting seat and a tray, the supporting seat is connected to the base plate, the side of the supporting seat facing away from the base plate is movably connected to the tray, the side of the tray facing away from the supporting seat is concave to form a box carrying area, the box carrying area is used to carry a first wafer box and a second wafer box, the box carrying area includes a first box carrying area and a second box carrying area, the first box carrying area is adapted to the first wafer box, the second box carrying area is adapted to the second wafer box, the second box carrying area is vertically movably connected to a pad, the side of the supporting seat facing away from the base plate is connected to a top sheet module, the top sheet module is used to abut against the wafers in the first wafer box or the second wafer box when the tray moves toward the top sheet module.

2. The wafer flipping fixture according to claim 1, characterized in that: Matching grooves are provided at both ends of the tray. The matching grooves extend from one end of the tray toward the box carrying area, and the matching grooves penetrate the tray.

3. The wafer flipping fixture according to claim 1, characterized in that: A plurality of positioning holes are arranged in the second box carrying area, positioning members are movably connected in the positioning holes, and the positioning members are connected to the pad to adjust the setting height of the pad.

4. The wafer flipping fixture according to claim 1, characterized in that: The top sheet module includes a first top sheet and a second top sheet, one end of the second top sheet is connected to the supporting seat, the second top sheet is connected to the first top sheet on a side facing the tray, and the height of the first top sheet is the same as that of the first wafer box.

5. The wafer flipping fixture according to claim 4, characterized in that: A circular arc portion adapted to the wafer is provided on a side of the first top sheet facing the tray.

6. The wafer flipping fixture according to claim 4, characterized in that: An accommodating groove is arranged at one end of the second top sheet close to the bearing seat, and the accommodating groove penetrates the second top sheet. The accommodating groove is located at a side of the second top sheet facing the tray.

7. The wafer flipping fixture according to claim 4, characterized in that: The height of a side of the first top sheet facing the supporting seat is greater than the height of the box carrying area.

8. The wafer flipping fixture according to claim 1, characterized in that: The side wall of the bottom plate is connected to a plurality of brackets, and one end of the plurality of brackets away from the bottom plate is connected to a fixing plate.

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