Laser processing system

Abstract

The embodiment of the utility model provides a laser processing system. The laser processing system comprises a light path module, transmission equipment, first processing equipment, processing dust removal equipment and second processing equipment, the first processing equipment, the second processing equipment, the processing dust removal equipment and the light path module are arranged on the transmission equipment; the light path module comprises a light path transmission assembly, the light path transmission assembly is used for transmitting laser, and the light path transmission assembly is used for transmitting the laser to the first machining equipment to achieve chamfering machining; or the light path transmission assembly is used for transmitting the laser to the second processing equipment to realize lineation cutting processing or drilling processing; and the processing dust removal equipment is used for removing dust generated during processing of the first processing equipment and the second processing equipment.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor processing technology, and more specifically, the embodiments of the present application relate to a laser processing system. Background Art

[0002] Semiconductors are electronic devices made of semiconductor materials and are the most widely used electronic components in the world today. This type of electronic component has the characteristics of small size, low power consumption, high stability, and good reliability, and has been widely used in the field of electronic information technology.

[0003] At present, the semiconductor equipment industry is one of the core supports of the semiconductor industry, the cornerstone of the iterative development of semiconductor products and a leading indicator of production capacity supply. Due to the high complexity of semiconductor product manufacturing processes and strict requirements on volume performance, the value of its production, manufacturing, testing and other equipment is generally high, and with the update and iteration of products, the requirements for semiconductor processing equipment are also getting higher and higher.

[0004] Existing semiconductor laser processing systems can usually only meet the needs of specific processing methods and are unable to improve product process diversity and equipment utilization.

[0005] In view of this, it is necessary to provide a new technical solution to solve the above technical problems. Utility Model Content

[0006] The purpose of this application is to provide a new technical solution for laser processing systems.

[0007] The present application provides a laser processing system. The laser processing system includes: an optical path module, a transmission device, a first processing device, a processing dust removal device, and a second processing device;

[0008] The first processing equipment, the second processing equipment, the processing dust removal equipment and the optical path module are all arranged on the transmission equipment;

[0009] The optical path module includes an optical path transmission component, the optical path transmission component is used to transmit laser, the optical path transmission component transmits the laser to the first processing equipment to realize chamfering processing; or the optical path transmission component transmits the laser to the second processing equipment to realize scribing and cutting processing or drilling processing;

[0010] The processing dust removal equipment is used to remove dust generated during processing by the first processing equipment and the second processing equipment.

[0011] Optionally, the optical path transmission component includes a first optical path transmission component, a second optical path transmission component and a third optical path transmission component;

[0012] The third optical path transmission component includes a light spot rotation component and a second optical shutter component, and the light spot rotation component has an open state and a closed state; the second optical path transmission component includes a first optical shutter component;

[0013] When the first shutter component is opened and the second shutter component is closed, the laser emitted by the first optical path transmission component is transmitted to the first processing equipment through the second optical path transmission component to perform chamfering processing;

[0014] When the first optical shutter component is closed, the second optical shutter component is opened, and the light spot rotation component is opened, the laser emitted by the first optical path transmission component is transmitted to the second processing equipment through the third optical path transmission component to realize drilling processing;

[0015] When the first optical shutter component is closed, the second optical shutter component is opened, and the light spot rotation component is closed, the laser emitted by the first optical path transmission component is transmitted to the second processing equipment through the third optical path transmission component to implement scribing and cutting processing.

[0016] Optionally, the optical path module further includes a beam splitter component, which is capable of splitting the laser emitted by the first optical path transmission component into a first light ray and a second light ray, and the beam splitter component transmits the first light ray and reflects the second light ray;

[0017] When the first optical shutter component is opened and the second optical shutter component is closed, the light splitting component can transmit the first light to the second optical path transmission component;

[0018] When the first optical shutter component is closed and the second optical shutter component is opened, the light splitting component can reflect the second light to the third optical path transmission component.

[0019] Optionally, the first optical path transmission component includes a third optical shutter component, a laser beam expansion component, a first reflector component and a wave plate component in sequence along the laser transmission direction.

[0020] Optionally, the second optical path transmission component also includes a second reflector assembly, a third reflector assembly and a fourth reflector assembly in sequence along the laser transmission direction, the second reflector assembly receives the laser emitted by the first optical gate assembly, and the fourth reflector reflects the received laser to the first processing equipment.

[0021] Optionally, the third optical path transmission assembly further includes a fifth reflector assembly, a sixth reflector assembly and a seventh reflector assembly;

[0022] The fifth reflector assembly is located between the third optical shutter assembly and the light spot rotation assembly, the sixth reflector assembly is located between the light spot rotation assembly and the seventh reflector assembly, and the seventh reflector assembly reflects the laser light it receives to the second processing equipment.

[0023] Optionally, the laser processing system further comprises a transmission device, wherein the transmission device comprises: a driving source, a transmission component, a transmission connecting member and a first transmission mounting plate;

[0024] The first processing device and the second processing device are mounted on the first transmission mounting plate;

[0025] The driving source is connected to the transmission component through the transmission connector, and the transmission component drives the first transmission mounting plate to move so that the first processing equipment corresponds to the second optical path transmission component or the second processing equipment corresponds to the third optical path transmission component.

[0026] Optionally, the laser processing system further comprises a processing light path box and a light path box mounting plate, and the processing light path box and the light path box mounting plate are fixedly connected;

[0027] The first processing equipment and the second processing equipment are installed on the processing light path box, and the light path box mounting plate is arranged on the first transmission mounting plate.

[0028] Optionally, the first processing equipment includes a first optical path hose, an optical path adjustment element, a galvanometer assembly and a field lens assembly, and the laser emitted by the second optical path transmission assembly sequentially passes through the first optical path hose, the optical path adjustment element, the galvanometer assembly to the field lens assembly to achieve chamfering processing;

[0029] The first optical path hose is arranged on the processing optical path box, the optical path adjustment element is located in the processing optical path box, the galvanometer assembly and the field lens assembly are fixedly connected, and the galvanometer assembly is connected to the processing optical path box through an optical path connecting plate.

[0030] Optionally, the second processing equipment includes a second optical path hose, an optical diffraction component and a cutting head component;

[0031] The second optical path hose and the cutting head assembly are both arranged on the processing optical path box, and the optical diffraction assembly can be movably arranged in the processing optical path box and can move between a first position and a second position;

[0032] When the optical diffraction component moves to the first position, the laser emitted by the third optical path transmission component sequentially passes through the second optical path hose, the optical diffraction component and the cutting head component to implement scribing and cutting processing;

[0033] When the optical diffraction component moves to the second position, the laser emitted by the third optical path transmission component passes through the second optical path hose to the cutting head component to realize drilling processing.

[0034] Optionally, the laser processing system further comprises a processing dust removal device, wherein the processing dust removal device comprises a dust extractor, a first dust removal component and a second dust removal component;

[0035] The first dust removal component and the second dust removal component are both connected to the dust extractor;

[0036] The first dust removal component corresponds to the first processing equipment, and the second dust removal component corresponds to the second processing equipment.

[0037] Optionally, the first dust removal assembly includes a first dust collector, a first dust removal pipeline and a first dust removal hose, and the first dust collector and the first dust removal pipeline are connected through the first dust removal hose.

[0038] Optionally, the laser processing system further comprises a visual positioning device, and the visual positioning device is used to observe the quality of the processed surface of the workpiece.

[0039] According to an embodiment of the present application, a laser processing system is provided, which includes three optical path modules used for integrated laser processing, and also includes a first processing device capable of realizing chamfering processing and a second processing device capable of realizing drilling and scribing cutting, so that the laser processing system can meet the three requirements of chamfering processing, drilling processing and scribing cutting processing, thereby realizing the diversification of product processes, that is, the improvement of the utilization rate of the laser processing system.

[0040] Other features and advantages of the present specification will become apparent from the following detailed description of exemplary embodiments of the present specification with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the specification and, together with the description, serve to explain the principles of the specification.

[0042] Figure 1 Shown is a schematic diagram of the structure of the laser processing system provided in an embodiment of the present application.

[0043] Figure 2 Shown is a schematic diagram of the structure of the optical path module provided in an embodiment of the present application.

[0044] Figure 3 Shown is a schematic diagram of the structure of the transmission device provided in an embodiment of the present application.

[0045] Figure 4Shown is a schematic diagram of the structures of the first processing equipment and the second processing equipment provided in an embodiment of the present application.

[0046] Figure 5 Shown is a schematic structural diagram of the processing dust removal equipment provided in an embodiment of the present application.

[0047] Figure 6 Shown is a schematic diagram of the structure of the visual positioning device provided in an embodiment of the present application.

[0048] Description of reference numerals:

[0049] 1. Optical path module; 101. Optical path module frame; 102. Third optical shutter assembly; 103. Laser beam expansion assembly; 104. First reflector assembly; 105. Wave plate assembly; 106. Spectral assembly; 107. Second optical shutter assembly; 108. First optical shutter assembly; 109. Second reflector assembly; 110. Third reflector assembly; 111. Fourth reflector assembly; 112. Seventh reflector assembly; 113. Sixth reflector assembly; 114. Spot rotation assembly; 115. Fifth reflector assembly;

[0050] 2. Transmission equipment; 201. Drive source; 202. Mounting base; 203. Transmission motor transmission cable; 204. Second transmission mounting plate; 205. Cross roller guide rail; 206. First transmission mounting plate; 207. Transmission components; 208. Screw nut connecting block; 209. Transmission connecting piece; 210. Bearing clamp; 211. Bearing seat assembly;

[0051] 3. First processing equipment; 301. First optical path hose; 302. Optical path adjustment element; 303. Optical path connection plate; 304. Galvanometer assembly; 305. Field lens assembly;

[0052] 4. Processing dust removal equipment; 401. First dust removal pipeline; 402. Second dust removal pipeline; 403. First dust removal hose; 404. First dust removal proximal pipeline; 405. First dust collector; 406. Dust removal mounting plate; 407. Second dust collector; 408. Second dust removal proximal pipeline; 409. Second dust removal hose;

[0053] 5. Second processing equipment; 501. Second optical path hose; 502. Processing optical path box; 503. Optical diffraction component; 504. Optical path box mounting plate; 505. Cutting head component; 506. Cylinder motion component;

[0054] 6. Visual positioning equipment; 601. Precision positioning visual transmission cable; 602. Precision positioning camera; 603. Precision positioning lens; 604. Precision positioning lens mounting plate; 605. Precision positioning point light source; 606. Precision positioning ring light source mounting plate; 607. Precision positioning ring light source; 608. Coarse positioning ring light source; 609. Coarse positioning point light source; 610. Coarse positioning lens; 611. Coarse positioning lens mounting plate; 612. Coarse positioning camera; 613. Coarse positioning visual transmission cable. DETAILED DESCRIPTION

[0055] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0056] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or uses.

[0057] Techniques and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the techniques and equipment should be considered part of the specification.

[0058] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0059] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0060] The embodiment of the present application provides a laser processing system, the laser processing system comprising: an optical path module 1, a transmission device 2, a first processing device 3, a processing dust removal device 4, and a second processing device 5;

[0061] The first processing equipment 3, the second processing equipment 5, the processing dust removal equipment 4 and the optical path module 1 are all arranged on the transmission equipment;

[0062] The optical path module 1 includes an optical path transmission component, which is used to transmit laser light, and the optical path transmission component transmits the laser light to the first processing equipment 3 to achieve chamfering processing; or the optical path transmission component transmits the laser light to the second processing equipment 5 to achieve scribing and cutting processing or drilling processing;

[0063] The processing dust removal equipment 4 is used to remove dust generated during processing by the first processing equipment 3 and the second processing equipment 5 .

[0064] In the embodiment of the present application, the laser processing system includes an optical path module 1, a transmission device 2, a first processing device 3, a processing dust removal device 4, and a second processing device 5. The laser processing system guides the laser to different processing devices through the optical path module to achieve multiple processing functions, and uses the processing dust removal device to keep the processing environment clean. The laser processing system has high flexibility and processing accuracy and is suitable for various material processing scenarios.

[0065] The optical path module 1 is the core part of the laser processing system and is responsible for the transmission and guidance of the laser. The optical path module includes optical path transmission components that can accurately guide the laser to the required processing equipment to achieve specific processing tasks.

[0066] The transmission device 2 is the basic structure of the laser processing system, which is used to support and fix other components. It ensures the relative position and stability between the various components, so that the laser can be accurately transmitted to the target device.

[0067] The first processing device 3 is mainly used to perform chamfering. When the optical path module transmits the laser to the first processing device, the first processing device 3 uses the energy of the laser to perform chamfering on the material, that is, to remove the sharp angle of the edge of the material to make it smooth.

[0068] The second processing device 5 is mainly used to implement scribing and cutting processing or drilling processing. When the optical path module transmits the laser to the second processing device, the device will use the high energy of the laser to cut or drill the material.

[0069] During laser processing, especially in chamfering and scribing, a lot of dust and debris will be generated. The main task of the processing dust removal equipment 4 is to remove these dust and debris to keep the processing environment clean and prevent dust from affecting the processing quality and equipment performance.

[0070] Therefore, in an embodiment of the present application, a laser processing system is provided, which includes an optical path module 1 used for three types of integrated laser processing, and also includes a first processing device 3 capable of chamfering processing and a second processing device 5 capable of drilling and scribing cutting, so that the laser processing system can meet the three requirements of chamfering processing, drilling processing and scribing cutting processing, and realizes the diversification of product processes, that is, the improvement of the utilization rate of the laser processing system. The laser processing system uses a shared optical path module 1 and a shared second processing device 5, so that the optical path module 1 is a shared optical path module 1 for three laser processing processes, and the second processing device 5 is a shared processing device for two laser processing processes, which saves the mechanical size of the integrated mechanism, reduces the volume of the laser processing system, and also saves costs.

[0071] Reference Figure 1-Figure 6The optical path transmission component includes a first optical path transmission component, a second optical path transmission component and a third optical path transmission component.

[0072] The third optical path transmission component includes a light spot rotation component 114 , and the light spot rotation component 114 has an open state and a closed state; the second optical path transmission component includes a first optical shutter component 108 , and the third optical path transmission component includes a second optical shutter component 107 .

[0073] When the first shutter component 108 is opened and the second shutter component 107 is closed, the laser emitted by the first optical path transmission component is transmitted through the second optical path transmission component to the first processing equipment 3 to implement chamfering processing.

[0074] When the first shutter component 108 is closed, the second shutter component 107 is opened, and the light spot rotation component 114 is opened, the laser emitted by the first optical path transmission component is transmitted to the second processing equipment 5 through the third optical path transmission component to realize drilling processing.

[0075] When the first shutter component 108 is closed, the second shutter component 107 is opened, and the light spot rotation component 114 is closed, the laser emitted by the first optical path transmission component is transmitted to the second processing equipment 5 through the third optical path transmission component to implement scribing and cutting processing.

[0076] In the embodiment of the present application, the laser processing system mainly includes an optical path module 1, a first processing device 3 and a second processing device 5. A set of laser processing systems in the embodiment of the present application can meet the needs of three processing methods: chamfering, drilling and scribing, realize the integration of multiple processes, and also realize the diversification of product processes and the improvement of equipment utilization. Among them, the chamfering process, the drilling process and the scribing and cutting process share a set of optical path modules 1, the first processing device 3 can realize the chamfering process, and according to the type of laser emitted by the optical path module 1, the second processing device 5 can realize scribing or drilling. In other words, the laser processing system uses the shared optical path module 1 and the shared second processing device 5, so that the optical path module 1 is the optical path module 1 shared by the three laser processing processes, and the second processing device 5 is the processing equipment shared by the two laser processing processes, which saves the mechanical size of the integrated mechanism, reduces the volume of the laser processing system, and also saves costs.

[0077] Specifically, the optical path module 1 includes optical path designs for three processing techniques: chamfering, drilling, and scribing.

[0078] The optical path module 1 includes a first optical path transmission component, which serves as a common optical path transmission component for chamfering laser transmission, drilling laser transmission and scribing laser transmission.

[0079] The optical path module 1 also includes a second optical path transmission component and a third optical path transmission component. The second optical path transmission component serves as an optical path transmission component for chamfering laser transmission, and the third optical path transmission component serves as a common optical path transmission component for drilling laser transmission and scribing laser transmission.

[0080] The second optical path transmission component includes a first optical shutter component 108, and the third optical path transmission component includes a second optical shutter component 107. The basic principle of the optical shutter component is to control the transmission of light through a shutter. When the optical shutter is closed, the shutter will block the transmission path of light and prevent the laser from passing through; when the optical shutter is opened, the shutter will move away to allow the laser to pass through. The user can select the open or closed state of the first optical shutter component 108 and the second optical shutter component 107 according to actual needs.

[0081] When the shutter of the first shutter assembly 108 is open and the shutter of the second shutter assembly 107 is closed, the laser emitted by the first optical path transmission assembly cannot pass through the second optical path transmission assembly 107, and can only be transmitted to the second optical path transmission assembly through the first optical path transmission assembly 108. When the laser emitted by the first optical path transmission assembly is transmitted to the second optical path transmission assembly, the laser is transmitted to the first processing equipment 3 through the second optical path transmission assembly to realize chamfering of the product.

[0082] When the shutter of the first shutter assembly 108 is closed and the shutter of the second shutter assembly 107 is open, the laser emitted by the first optical path transmission assembly cannot pass through the first optical path transmission assembly 108, and can only be transmitted to the third optical path transmission assembly through the second optical path transmission assembly 107. When the laser emitted by the first optical path transmission assembly is transmitted to the third optical path transmission assembly, the laser is transmitted to the second processing device through the third optical path transmission assembly to realize drilling processing of the product or scribing and cutting processing of the product.

[0083] The third optical path transmission component includes a spot rotation component 114, which has an on state and a off state. When the spot rotation component 114 is in the on state, the laser passes through the spot rotation component 114, and the spot rotation component 114 can adjust the laser spot size and laser spot shape. For example, the spot rotation component 114 includes a drive motor and an optical device, and the drive motor drives the optical device to rotate so that the spot rotation component 114 is in the on state or the off state. The user can choose the spot rotation component 114 to be in the off state or the on state according to actual needs.

[0084] When the first optical gate component 108 is closed, the second optical gate component 107 is opened, and the light spot rotation component 114 is opened, when the laser emitted by the first optical path transmission component is transmitted to the third optical path transmission component, the laser passes through the light spot rotation component 114, and the light spot rotation component 114 can obtain an optical spot for drilling processing, and the optical spot is transmitted to the second processing equipment 5 to realize drilling processing.

[0085] When the first optical shutter component 108 is closed, the second optical shutter component 107 is opened and the light spot rotation component 114 is closed, when the laser emitted by the first optical path transmission component is transmitted to the third optical path transmission component, the laser is not transmitted through the light spot rotation component 114 to the second processing equipment 5 to implement scribing and cutting processing.

[0086] In this embodiment, the first optical path transmission component, the second optical path transmission component and the third optical path transmission component work together with two optical shutter components (the first optical shutter component 108 and the second optical shutter component 107) and a light spot rotation component 114 to control the path and processing function of the laser, that is, the laser processing system realizes a variety of laser processing functions, including chamfering, drilling and scribing cutting, through different optical path configurations and state control of the optical shutter and light spot rotation components.

[0087] In one embodiment, referring to Figure 2 The optical path module 1 also includes a splitter component 106, which can split the laser emitted by the first optical path transmission component into a first light beam and a second light beam, and the splitter component 106 transmits the first light beam and reflects the second light beam.

[0088] When the first optical shutter component 108 is opened and the second optical shutter component 107 is closed, the light splitting component 106 can transmit the first light to the second optical path transmission component.

[0089] When the first optical shutter component 108 is closed and the second optical shutter component 107 is opened, the light splitting component 106 can reflect the second light to the third optical path transmission component.

[0090] In this embodiment, the optical path module 1 further includes a splitter component 106, which is located between the first optical path transmission component and the second optical path transmission component, and the splitter component 106 is also located between the first optical path transmission component and the third optical path transmission component.

[0091] When the laser light source is incident on the first optical path transmission component and passes through the spectroscopic component 106, the spectroscopic component 106 splits the laser into a first light and a second light. For example, the first light is P light and the second light is S light. The spectroscopic component 106 can transmit P light and reflect S light.

[0092] When the first optical shutter component 108 is opened and the second optical shutter component 107 is closed, the spectroscopic component 106 can transmit the first light and transmit the first light to the second optical path transmission component. The first light is transmitted to the first processing equipment 3 through the second optical path transmission component to achieve chamfering of the product.

[0093] When the first optical shutter component 108 is closed and the second optical shutter component 107 is opened, the spectroscopic component 106 can reflect the second light to the third optical path transmission component, and the second light is transmitted to the second processing equipment 5 through the third optical path transmission component to realize drilling or scribing and cutting of the product.

[0094] Therefore, in the embodiment of the present application, the light splitting component 106 is located between the first optical path transmission component and the second optical path transmission component, and the light splitting component 106 is also located between the first optical path transmission component and the third optical path transmission component, so that the first optical path transmission component, the second optical path transmission component and the third optical path transmission component are arranged reasonably, and the space occupied by the arrangement of the optical path module 1 is reduced to a certain extent. For example, the laser processing system includes an optical path module frame 101, and the optical path module frame 101 is set to a sealed, slightly positive pressure environment, and the first optical path transmission component, the light splitting component 106, the second optical path transmission component and the third optical path transmission component are all integrated in the optical path module frame 101. When the first optical path transmission component, the light splitting component 106, the second optical path transmission component and the third optical path transmission component are arranged in the optical path module frame 101, the volume of the optical path module frame 101 can be reduced.

[0095] In one embodiment, referring to Figure 2 The first optical path transmission component includes a third optical shutter component 102, a laser beam expansion component 103, a first reflector component 104 and a wave plate component 105 in sequence along the laser transmission direction.

[0096] In this embodiment, the first optical path transmission component includes a third optical gate component 102, a laser beam expansion component 103, a first reflector component 104 and a wave plate component 105 along the transmission direction of the laser, wherein the third optical gate component 102 has an open state and a closed state. When the work is suspended, the third optical gate component 102 is closed to prevent the laser light source from passing through.

[0097] The laser emitted from the third optical shutter assembly 102 passes through the laser beam expansion assembly 103, and the laser beam expansion assembly 103 improves the focusing effect of the processing laser spot.

[0098] The laser is transmitted to the first reflector assembly 104 through the laser beam expansion assembly 103. The first reflector assembly 104 changes the transmission direction of the laser. By changing the transmission direction of the laser, the arrangement of the first optical path transmission assembly is adjusted to avoid the overall structure of the optical path module frame 101 being too long.

[0099] The first reflector assembly 104 changes the transmission direction of the laser and transmits the laser to the wave plate assembly 105. The wave plate assembly 105 can adjust the laser energy. For example, the wave plate assembly 105 is used to adjust the power and intensity of the laser output. By adjusting the position and direction of the wave plate, the intensity distribution of the laser can be changed.

[0100] The laser emitted by the wave plate component 105 is transmitted to the spectroscopic component 106. According to the actual needs of the user, the laser emitted by the spectroscopic component 106 can be transmitted to the second optical path transmission component or the laser emitted by the spectroscopic component 106 can be transmitted to the third optical path transmission component.

[0101] In one embodiment, referring to Figure 2 The second optical path transmission component includes a second reflector component 109, a third reflector component 110 and a fourth reflector component 111 in sequence along the laser transmission direction. The second reflector component 109 receives the laser emitted by the first optical gate component 108, and the fourth reflector reflects the received laser to the first processing equipment 3.

[0102] In this embodiment, the second optical path transmission component includes a second reflector component 109, a third reflector component 110 and a fourth reflector component 111, wherein when the first optical shutter component 108 is turned on, the laser emitted by the light splitting component 106 reaches the first optical shutter component 108, passes through the second reflector component 109, the third reflector component 110 and the fourth reflector component 111 in sequence, and the fourth reflector component 111 reflects the processing light source to the light incident point of the first processing device 3. Figure 2 , the light path indicated by arrow A is the chamfering processing light path.

[0103] In this embodiment, the second optical path transmission component includes a plurality of reflector components to make the arrangement of the second optical path transmission component more reasonable. For example, the reflector components can be arranged in combination with the overall internal structure of the optical path module frame 101 to facilitate the laser emitted by the fourth reflector component 111 to reach the light incident point of the first processing device 3.

[0104] It should be noted that the second optical path transmission component includes but is not limited to three reflector components, and more or fewer reflector components can be set according to the internal structure of the optical path module frame 101 and the position of the first processing equipment 3.

[0105] In one embodiment, referring to Figure 2 , the third optical path transmission component further includes a fifth reflector assembly 115, a sixth reflector assembly 113 and a seventh reflector assembly 112;

[0106] The fifth reflector assembly 115 is located between the second optical shutter assembly 107 and the light spot rotation assembly 114 , the sixth reflector assembly 113 is located between the light spot rotation assembly 114 and the seventh reflector assembly 112 , and the seventh reflector assembly 112 reflects the laser light it receives to the second processing equipment 5 .

[0107] In this embodiment, the third optical path transmission component also includes a fifth reflector component 115, a sixth reflector component 113 and a seventh reflector component 112. When the second optical shutter component 107 is turned on and the light spot rotation component 114 is turned on, the laser emitted by the light splitting component 106 passes through the fifth reflector component 115, the light spot rotation component 114, the sixth reflector component 113 and the seventh reflector component 112 in sequence and is incident on the second processing device 5 to perform drilling processing. Figure 2 As shown, the light path indicated by arrow B is the drilling light path.

[0108] When the second shutter assembly 107 is turned on and the spot rotating assembly 114 is turned off, the laser emitted by the light splitting assembly 106 passes through the fifth reflector assembly 115, the sixth reflector assembly 113 and the seventh reflector assembly 112 in sequence and enters the second processing equipment 5 to perform scribing and cutting processing. Figure 2 , the light path indicated by arrow C is the scribing cutting light path.

[0109] In this embodiment, the third optical path transmission component includes a plurality of reflector components to make the arrangement of the third optical path transmission component more reasonable. For example, the reflector components can be arranged in combination with the overall internal structure of the optical path module frame 101 so that the laser emitted by the seventh reflector component 112 can reach the light incident point of the second processing device 5.

[0110] It should be noted that the third optical path transmission component includes but is not limited to three reflector components, and more or fewer reflector components can be set according to the internal structure of the optical path module frame 101 and the position of the second processing equipment 5.

[0111] In one embodiment, referring to Figure 3 , the laser processing system further comprises a transmission device 2, the transmission device 2 comprises: a driving source 201, a transmission component 207, a transmission connecting member 209 and a first transmission mounting plate 206;

[0112] The first processing equipment 3 and the second processing equipment 5 are mounted on the first transmission mounting plate 206;

[0113] The driving source 201 is connected to the transmission component 207 through the transmission connector 209, and the transmission component 207 drives the first transmission mounting plate 206 to move so that the first processing equipment 3 corresponds to the second optical path transmission component or the second processing equipment 5 corresponds to the third optical path transmission component.

[0114] In this embodiment, the laser processing system further includes a transmission device 2, which drives the first processing device 3 and the second processing device 5 to move to a preset position. For example, the transmission device 2 drives the first processing device 3 to move to a first preset position so that the laser emitted by the second optical path transmission component can be incident on the light incident port of the first processing device 3. The transmission device 2 drives the second processing device 5 to move to a second preset position so that the laser emitted by the third optical path transmission component can be incident on the light incident port of the second processing device 5.

[0115] Specifically, the transmission device 2 includes a driving source 201, for example, the driving source 201 can be a servo drive motor, the servo drive motor is the main power source of the transmission device, and the servo drive motor is connected to the controller and the power supply through a transmission motor transmission cable 203 to implement control feedback.

[0116] The output shaft of the driving source 201 is connected to the transmission component 207 through a transmission connector 209. For example, the transmission component 207 is a transmission screw, and the output shaft of the servo drive motor is connected to the transmission screw through the transmission connector 209 to transmit torque. Optionally, the rotating shaft of the transmission screw is supported and fixed by a bearing seat assembly 211, and the rotating bearing shaft of the transmission screw is pressed by a bearing pressing member 210. Optionally, the output shaft of the transmission component 207 is provided with a screw nut connection block 208.

[0117] The transmission device 2 also includes a first transmission mounting plate 206, which is connected to a transmission connecting member 209. The first processing equipment 3 and the second processing equipment 5 are installed on the first transmission mounting plate 206. The transmission component 207 can rotate to move the first transmission mounting plate 206, so that the first processing equipment 3 and the second processing equipment 5 are moved to a preset position.

[0118] In an optional embodiment, the transmission component 207 rotates to drive the first transmission mounting plate 206 to slide, so that the first processing device 3 and the second processing device 5 move to a preset position. For example, the transmission device may also include a second transmission mounting plate 204 and a cross roller guide 205, the first transmission mounting plate 206 is connected to the transmission connector 209, the transmission screw rotates to drive the first transmission mounting plate 206 to slide, and the cross roller guide 205 is guided, the cross roller guide 205 is installed on the second transmission mounting plate 204, and the second transmission mounting plate 204 is integrally installed on the mounting base 202 of the transmission device.

[0119] It should be noted that, in this embodiment, the manner in which the transmission component 207 drives the first transmission mounting plate 206 to slide includes but is not limited to realizing the movement of the first transmission mounting plate 206 through the cross roller guide rail 205 .

[0120] In one embodiment, referring to Figure 4 , the laser processing system further comprises a processing light path box 502 and a light path box mounting plate 504, the processing light path box 502 and the light path box mounting plate 504 are fixedly connected;

[0121] The first processing device 3 and the second processing device 5 are installed on the processing optical path box 502 , and the optical path box mounting plate 504 is arranged on the first transmission mounting plate 206 .

[0122] In this embodiment, the laser processing system further includes a processing light path box 502 , and the first processing device 3 and the second processing device 5 are mounted on the processing light path box 502 , thereby ensuring the integrity of the first processing device 3 and the second processing device 5 .

[0123] In addition, the laser processing system also includes an optical path box mounting plate 504, the processing optical path box body 502 is fixedly connected to the optical path box mounting plate 504, and the optical path box mounting plate 504 is mounted on a transmission mounting plate, so that when the transmission component 207 drives the transmission mounting plate to move, the transmission mounting plate can drive the first processing equipment 3 and the second processing equipment 5 to move to their corresponding preset positions.

[0124] In one embodiment, referring to Figure 4 The first processing equipment 3 includes a first optical path hose 301, an optical path adjustment element 302, a galvanometer assembly 304 and a field lens assembly 305, and the laser emitted by the second optical path transmission assembly sequentially passes through the first optical path hose 301, the optical path adjustment element 302, the galvanometer assembly 304 to the field lens assembly 305 to realize chamfering processing;

[0125] The first optical path hose 301 is arranged on the processing optical path box 502, the optical path adjustment element 302 is located in the processing optical path box 502, the galvanometer assembly 304 and the field lens assembly 305 are fixedly connected, and the galvanometer assembly 304 is connected to the processing optical path box 502 via an optical path connecting plate 303.

[0126] In this embodiment, the fourth reflector assembly 111 reflects the laser to the first optical path hose 301, the first optical path hose 301 emits the laser to reach the optical path adjustment element 302, the laser changes direction through the optical path adjustment element 302 and is incident on the galvanometer assembly 304, the galvanometer assembly 304 changes the direction of the laser and is incident on the field lens assembly 305, and the field lens assembly 305 emits the laser to complete the chamfering process. The field lens assembly 305 is connected to the galvanometer assembly 304 by threads, and the galvanometer assembly 304 is connected to the processing optical path box 502 through the chamfering optical path connection plate 303, so that the first processing device 3 is installed on the processing optical path box 502.

[0127] Optionally, the optical path adjustment element 302 may be a reflector, and the optical path adjustment element 302 is disposed in the processing optical path box 502 . For example, the optical path adjustment element 302 may be fixed in the processing optical path box 502 .

[0128] In one embodiment, referring to Figure 4 The second processing equipment 5 includes a second optical path hose 501, an optical diffraction component 503 and a cutting head component 505.

[0129] The second optical path hose 501 and the cutting head assembly 505 are both disposed on the processing optical path box 502 , and the optical diffraction assembly 503 is movably disposed in the processing optical path box 502 and is capable of moving between a first position and a second position.

[0130] When the optical diffraction component 503 moves to the first position, the laser emitted by the third optical path transmission component sequentially passes through the second optical path hose 501, the optical diffraction component 503 and the cutting head component 505 to implement scribing and cutting processing.

[0131] When the optical diffraction component 503 moves to the second position, the laser emitted by the third optical path transmission component passes through the second optical path hose 501 to the cutting head component 505 to perform drilling processing.

[0132] In this embodiment, the optical diffraction component 503 is movably arranged in the processing optical path box 502, for example, the optical diffraction component 503 can be driven to move between the first position and the second position by the cylinder movement component 506. When the optical diffraction component 503 moves to the first position, the optical diffraction component 503 is located directly above the cutting head component 505 and directly below the second optical path hose 501, so that the laser emitted by the third optical path transmission component sequentially passes through the second optical path hose 501, the optical diffraction component 503 to the cutting head component 505 to achieve the scribing and cutting process. When the optical diffraction component 503 moves to the second position, the setting position of the optical diffraction component 503 is equivalent to the offset of the cutting head component 505 and the setting position of the optical diffraction component 503 is offset relative to the second optical path hose 501.

[0133] In this embodiment, the seventh reflective rib assembly reflects the laser to the second optical path hose 501, and the laser enters the processing optical path box 502 through the second optical path hose 501. When the optical diffraction assembly 503 moves to the second position, the laser does not pass through the optical diffraction assembly 503 and directly enters the cutting head assembly 505 to finally realize the drilling process.

[0134] In this embodiment, the seventh reflective rib assembly reflects the laser to the second optical path hose 501, and the laser enters the processing optical path box 502 through the second optical path hose 501. When the optical diffraction assembly 503 moves to the first position, the laser passes through the optical diffraction assembly 503 and directly enters the cutting head assembly 505 to finally realize the scribing and cutting processing.

[0135] In one embodiment, referring to Figure 5 , the laser processing system further includes a processing dust removal device 4, the processing dust removal device includes a dust extractor, a first dust removal component and a second dust removal component;

[0136] The first dust removal component and the second dust removal component are both connected to the dust extractor;

[0137] The first dust removal component corresponds to the first processing equipment 3, and the second dust removal component corresponds to the second processing equipment 5.

[0138] In this embodiment, the laser processing system also includes a processing dust removal device 4, which removes dust generated during drilling, scribing and chamfering to ensure the cleanliness of the product and the accuracy of processing. Optionally, the processing dust removal device 4 can be installed on the transmission mounting plate, so that the first dust removal component can correspond to the first processing device 3, and the first dust removal component can be used to remove dust generated during chamfering. In addition, the processing dust removal device is installed on the transmission mounting plate, so that the second dust removal component can correspond to the second processing device 5 in real time, and the second dust removal component can be used to remove dust generated during drilling and scribing.

[0139] In one embodiment, the first dust removal assembly includes a first dust collector 405 , a first dust removal pipeline 401 and a first dust removal hose 403 , and the first dust collector 405 and the first dust removal pipeline 401 are connected via the first dust removal hose 403 .

[0140] In this embodiment, the dust particles generated by the first processing equipment 3 are sucked into the first dust removal proximal pipeline 404 by the exhaust method of the first dust collector 405, and enter the dust extractor through the first dust removal hose 403 and the pipeline of the first dust removal pipeline 401, wherein the first dust removal hose 403 can neutralize and eliminate the installation error between the first dust removal pipeline 401 and the first dust collector 405.

[0141] Optionally, the first dust collector 405 can be arranged about 3 mm above the product to be processed, and the center of the dust removal port of the first dust collector 405 roughly coincides with the center of the processing light spot to ensure the dust removal effect.

[0142] In addition, the second dust removal assembly includes a second dust collector 407 , a second dust removal pipeline 402 and a second dust removal hose 409 , and the second dust collector 407 and the second dust removal pipeline 402 are connected via the second dust removal hose 409 .

[0143] Specifically, the dust particles generated by the second processing equipment 5 are sucked into the second dust collection proximal pipeline 408 through the suction method of the second dust collector 407, and enter the dust extractor through the second dust collection hose 409 and the pipeline of the second dust collection pipeline 402, wherein the second dust collection hose 409 can neutralize and eliminate the installation error between the second dust collection pipeline 402 and the second dust collector 407.

[0144] Optionally, the second dust collector 407 is installed approximately 3 mm above the product to be processed, and the center of the dust removal port of the second dust collector 407 roughly coincides with the center of the processing light spot to ensure the dust removal effect.

[0145] Optionally, the processing dust removal equipment may further include a dust removal mounting plate 406 , and the first dust collector 405 and the second dust collector 407 may be mounted on the dust removal mounting plate 406 .

[0146] In one embodiment, referring to Figure 6 The laser processing system also includes a visual positioning device 6, which is used to observe the quality of the processed surface of the workpiece.

[0147] In this embodiment, the laser processing system also includes a visual positioning device 6, which is installed on the optical path box mounting plate 504. The visual positioning device 6 is used to position the product to be processed by the first processing device 3, and the visual positioning device 6 is used to position the product to be processed by the second processing device 5.

[0148] Specifically, the visual positioning device 6 includes a coarse positioning device and a fine positioning device. The coarse positioning device includes a coarse positioning camera 612, a coarse positioning visual transmission cable 613, a coarse positioning lens 610, a coarse positioning point light source 609, a coarse positioning ring light source 608 and a coarse positioning lens mounting plate 611. The fine positioning device includes a fine positioning camera 602, a fine positioning visual transmission cable 601, a fine positioning lens 603, a fine positioning point light source 605, a fine positioning ring light source 607 and a fine positioning ring light source mounting plate 606.

[0149] The coarse positioning camera 612 is connected to the controller through the coarse positioning visual transmission cable 613 for data transmission and processing, etc. The coarse positioning camera 612 has its field of view magnified by the coarse positioning lens 610, and can find a feature target on the processed product for rough positioning. In visual positioning, different coarse positioning point light sources 609 and coarse positioning ring light sources 608 need to be matched according to the material and color of the product. Through testing, it is found out which light source the coarse positioning camera 612 is matched with to obtain more accurate results. The coarse positioning camera 612 and the coarse positioning lens 610 are connected together by threads, and the coarse positioning lens 610 is clamped by the coarse positioning lens mounting plate 611 and fixed on the optical path box mounting plate 504. The positioning accuracy of the coarse positioning system does not meet the requirements for processing, so after the coarse positioning is completed, the fine positioning system is used for secondary positioning.

[0150] The precision positioning camera 602 is connected to the controller through the precision positioning visual transmission cable 601 for data transmission and processing, etc. The precision positioning camera 602 has its field of view magnified by the precision positioning lens 603, which can more accurately magnify the visual image of the processed product and find a characteristic size on the product for rough positioning. In visual positioning, different precision positioning point light sources 605 and precision positioning ring light sources 607 need to be matched according to the material and color of the product, wherein the precision positioning ring light source 607 is connected to the precision positioning ring light source mounting plate 606, and the precision positioning ring light source mounting plate 606 is bolted to the precision positioning lens mounting plate 604. Through experimental tests, it is found out which light source is matched with the precision positioning camera 602 to obtain more accurate results. The precision positioning camera 602 and the precision positioning lens 603 are connected together by threads, and the precision positioning lens 603 is clamped by the precision positioning lens mounting plate 604 and fixed on the optical path box mounting plate 504.

[0151] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0152] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A laser processing system, characterized in that: The laser processing system comprises: an optical path module (1), a transmission device (2), a first processing device (3), a processing dust removal device (4), and a second processing device (5); The first processing equipment (3), the second processing equipment (5), the processing dust removal equipment (4) and the optical path module (1) are all arranged on the transmission equipment (2); The optical path module (1) comprises an optical path transmission component, the optical path transmission component is used to transmit laser light, the optical path transmission component transmits the laser light to the first processing device (3) to implement chamfering processing; or the optical path transmission component transmits the laser light to the second processing device (5) to implement scribing and cutting processing or drilling processing; The processing dust removal equipment (4) is used to remove dust generated during processing by the first processing equipment (3) and the second processing equipment (5).

2. The laser processing system according to claim 1, characterized in that: The optical path transmission component includes a first optical path transmission component, a second optical path transmission component and a third optical path transmission component; The third optical path transmission component comprises a light spot rotation component (114) and a second optical shutter component (107), wherein the light spot rotation component (114) has an open state and a closed state; the second optical path transmission component comprises a first optical shutter component (108); When the first optical shutter component (108) is opened and the second optical shutter component (107) is closed, the laser light emitted by the first optical path transmission component is transmitted to the first processing equipment (3) through the second optical path transmission component to perform chamfering processing; When the first optical shutter component (108) is closed, the second optical shutter component (107) is opened, and the light spot rotation component (114) is opened, the laser light emitted by the first optical path transmission component is transmitted to the second processing equipment (5) through the third optical path transmission component to perform drilling processing; When the first optical shutter component (108) is closed, the second optical shutter component (107) is opened, and the light spot rotation component (114) is closed, the laser light emitted by the first optical path transmission component is transmitted to the second processing equipment (5) through the third optical path transmission component to implement scribing and cutting processing.

3. The laser processing system according to claim 2, characterized in that: The optical path module (1) further comprises a light splitting component (106), wherein the light splitting component (106) is capable of splitting the laser light emitted by the first optical path transmission component into a first light beam and a second light beam, and the light splitting component (106) transmits the first light beam and reflects the second light beam; When the first optical shutter component (108) is opened and the second optical shutter component (107) is closed, the light splitting component (106) is capable of transmitting the first light to the second optical path transmission component; When the first optical shutter component (108) is closed and the second optical shutter component (107) is opened, the light splitting component (106) can reflect the second light to the third optical path transmission component.

4. The laser processing system according to claim 2, characterized in that: The first optical path transmission component comprises, in sequence along the laser transmission direction, a third optical shutter component (102), a laser beam expansion component (103), a first reflector component (104) and a wave plate component (105).

5. The laser processing system according to claim 2, characterized in that: The second optical path transmission component also includes a second reflector component (109), a third reflector component (110) and a fourth reflector component (111) in sequence along the laser transmission direction, wherein the second reflector component (109) receives the laser emitted by the first optical shutter component (108), and the fourth reflector component (111) reflects the received laser to the first processing equipment (3).

6. The laser processing system according to claim 2, characterized in that: The third optical path transmission component further comprises a fifth reflector component (115), a sixth reflector component (113) and a seventh reflector component (112); The fifth reflector assembly (115) is located between the second optical shutter assembly (107) and the light spot rotation assembly (114), the sixth reflector assembly (113) is located between the light spot rotation assembly (114) and the seventh reflector assembly (112), and the seventh reflector assembly (112) reflects the laser light it receives to the second processing equipment (5).

7. The laser processing system according to claim 1, characterized in that: The transmission device (2) comprises: a driving source (201), a transmission component (207), a transmission connecting member (209) and a first transmission mounting plate (206); The first processing device (3) and the second processing device (5) are mounted on the first transmission mounting plate (206); The driving source (201) is connected to the transmission component (207) via the transmission connection member (209), and the transmission component (207) drives the first transmission mounting plate (206) to move so that the first processing device (3) corresponds to the second optical path transmission component or so that the second processing device (5) corresponds to the third optical path transmission component.

8. The laser processing system according to claim 7, characterized in that: The laser processing system further comprises a processing light path box (502) and a light path box mounting plate (504), wherein the processing light path box (502) and the light path box mounting plate (504) are fixedly connected; The first processing device (3) and the second processing device (5) are installed on the processing optical path box (502), and the optical path box mounting plate (504) is arranged on the first transmission mounting plate (206).

9. The laser processing system according to claim 8, characterized in that: The first processing equipment (3) comprises a first optical path hose (301), an optical path adjustment element (302), a galvanometer assembly (304) and a field lens assembly (305); the laser light emitted by the second optical path transmission assembly sequentially passes through the first optical path hose (301), the optical path adjustment element (302), the galvanometer assembly (304) and the field lens assembly (305) to achieve chamfering processing; The first optical path hose (301) is arranged on the processing optical path box (502), the optical path adjustment element (302) is located in the processing optical path box (502), the galvanometer assembly (304) and the field lens assembly (305) are fixedly connected, and the galvanometer assembly (304) is connected to the processing optical path box (502) via an optical path connection plate (303).

10. The laser processing system according to claim 8, characterized in that: The second processing equipment (5) comprises a second optical path hose (501), an optical diffraction component (503) and a cutting head component (505); The second optical path hose (501) and the cutting head assembly (505) are both arranged on the processing optical path box (502), and the optical diffraction assembly (503) is movably arranged in the processing optical path box (502) and is capable of moving between a first position and a second position; When the optical diffraction component (503) moves to the first position, the laser light emitted by the third optical path transmission component sequentially passes through the second optical path hose (501), the optical diffraction component (503) and the cutting head component (505) to implement scribing and cutting processing; When the optical diffraction component (503) moves to the second position, the laser light emitted by the third optical path transmission component passes through the second optical path hose (501) to the cutting head component (505) to perform drilling processing.

11. The laser processing system according to claim 1, characterized in that: The laser processing system further comprises a processing dust removal device (4), wherein the processing dust removal device (4) comprises a dust extractor, a first dust removal component and a second dust removal component; The first dust removal component and the second dust removal component are both connected to the dust extractor; The first dust removal component corresponds to the first processing equipment, and the second dust removal component corresponds to the second processing equipment.

12. The laser processing system according to claim 11, characterized in that: The first dust removal assembly comprises a first dust collector (405), a first dust removal pipeline (401) and a first dust removal hose (403), and the first dust collector and the first dust removal pipeline are connected via the first dust removal hose.

13. The laser processing system according to claim 1, characterized in that: The laser processing system further comprises a visual positioning device (6), wherein the visual positioning device (6) is used to observe the quality of the processed surface of the workpiece.

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