EVA (Ethylene Vinyl Acetate) adhesive film flip type punching mechanism

Abstract

The utility model discloses a flip type punching mechanism for an EVA (Ethylene Vinyl Acetate) adhesive film. The punching device comprises a support, a punching bottom die fixed to the support, a first air cylinder fixed to the support, and a punching cutter which is driven by the first air cylinder to move up and down and located above the punching bottom die. The second air cylinder is fixed below the bracket; and the top film rod is driven by the second air cylinder to move up and down and is positioned below the punching bottom die. According to the utility model, the flip type punched hole can be punched on the EVA adhesive film, so that the lead can conveniently pass through the EVA adhesive film, and the phenomenon of adhesive overflow in the subsequent lamination process of the photovoltaic module is inhibited.

Description

Technical field

[0001] The utility model belongs to the technical field of photovoltaic component manufacturing, in particular to an EVA film flip-cover punching mechanism. [Background Technology]

[0002] During the photovoltaic module production process, the modules pass through a secondary cutting machine, which punches holes in the EVA film, inserts the holes into the leads, and lays them on the photovoltaic modules. This process typically utilizes an EVA cutting, punching, and laying machine. Patent publication number CN117507053A discloses an automatic EVA film punching device and its use method. This device completely separates the waste material punched from the EVA film. This disadvantage is that after lamination, the EVA adhesive on the bottom side can overflow from the punched holes.

[0003] Therefore, it is necessary to provide a new EVA film flip-top punching mechanism to solve the above-mentioned technical problems. [Utility Model Content]

[0004] The main purpose of the utility model is to provide an EVA film flip-up punching mechanism, which can punch out flip-up holes on the EVA film, facilitating the passage of leads while suppressing glue overflow during the subsequent lamination process of photovoltaic modules.

[0005] The utility model achieves the above-mentioned purpose through the following technical solution: an EVA film flip-up punching mechanism, which includes a bracket, a punching bottom mold fixed on the bracket, a first cylinder fixed on the bracket, a punching knife driven by the first cylinder to move up and down and located above the punching bottom mold, a second cylinder fixed below the bracket, and a top film rod driven by the second cylinder to move up and down and located below the punching bottom mold.

[0006] Furthermore, the punching bottom die is provided with a notch that cooperates with the punching knife, and the punching knife extends into the notch when punching the EVA film.

[0007] Furthermore, a punching bottom blade profile is formed around the notch to cooperate with the blade profile of the punching knife to achieve film cutting.

[0008] Furthermore, the punching knife is aligned with the top of the slot, and the top film rod is aligned with the bottom of the slot.

[0009] Furthermore, the punching knife is provided with a concave pit corresponding to the short side of the rectangular punching hole, so that the bottom of the punching knife forms a "concave"-shaped punching profile.

[0010] Furthermore, the two long sides of the "concave"-shaped punching profile are designed to be a downward arc structure away from the side section of the rectangular punching hole and the short side, so that the punching bottom surface of the punching knife is set at a set slope with the horizontal plane, so that a short side breaking edge is formed in the "concave"-shaped punching profile, which first breaks the short side of one side of the rectangular punching hole when punching.

[0011] The invention also provides a simple and convenient method for making a film covering the EVA film, so that the film can be easily cut out of the film and the film can be easily removed.

Brief Description of the Drawings

[0012] Figure 1 This is a schematic diagram of the three-dimensional structure of an embodiment of the utility model;

[0013] Figure 2 It is a schematic diagram of the partial structure of an embodiment of the utility model;

[0014] Figure 3 This is a schematic diagram of the bottom structure of the punching knife in the embodiment of the utility model;

[0015] Figure 4 This is a schematic structural diagram of the top film rod in an embodiment of the present utility model;

[0016] Figure 5 This is a schematic diagram of the punching structure on the EVA film in the embodiment of the utility model;

[0017] The numbers in the figure represent:

[0018] 100-EVA film flip-cover punching mechanism;

[0019] 200-EVA film, 201-flip film, 202-rectangular punching;

[0020] 1- bracket, 11- strip hole; 2- punching bottom die, 21- notch; 3- first cylinder; 4- punching knife, 41- pit, 42- "concave" shaped punching profile, 43- arc structure, 44- short side punching blade; 5- second cylinder; 6- top film rod. [Specific implementation method]

[0021] Example 1:

[0022] Please refer to Figure 1-Figure 5 This embodiment is an EVA film flip-up punching mechanism 100, which includes a bracket 1, a punching bottom mold 2 fixed on the bracket 1, a first cylinder 3 fixed on the bracket 1, a punching knife 4 driven by the first cylinder 3 to move up and down and located above the punching bottom mold 2, a second cylinder 5 fixed below the bracket 1, and a top film rod 6 driven by the second cylinder 5 to move up and down and located below the punching bottom mold 2.

[0023] The punching bottom die 2 is provided with a notch 21 that cooperates with the punching knife 4. The punching knife 4 extends into the notch 21 when punching the EVA film. A punching bottom blade profile is formed around the notch 21 to cooperate with the blade profile of the punching knife 4 to achieve film cutting.

[0024] The punching knife 4 is aligned with the top of the notch 21 , and the top film rod 6 is aligned with the bottom of the notch 21 .

[0025] In order to solve the problem of glue overflow at the punching holes during lamination of the EVA film, the punching knife 4 in this embodiment adopts a non-closed punching method to punch out a rectangular punching hole 202 with a flip-up film 201 on the EVA film 200, that is, one short side of the flip-up film 201 punched out by the punching knife 4 is connected to the EVA film 200 as a whole. Without undergoing the punching operation, the two long sides and the other short side of the flip-up film 201 are completely cut off and disconnected from the EVA film 200, thereby forming a rectangular punching hole 202 on the EVA film 200 body. When the EVA film 200 is laid, the lead can extend from the rectangular punching 202. When laminating, due to the presence of the flip-up film 201, on the one hand, the missing film at the rectangular punching 202 can be filled, eliminating the process of placing a small EVA piece at the punching hole on the EVA film before lamination to fill the punching hole in the original process. On the other hand, due to the presence of the flip-up module 201, the rectangular punching 202 can also be covered, effectively preventing the EVA glue from overflowing from the rectangular punching 202 during the hot melt process during lamination.

[0026] In order to punch out the flip-top membrane 201, this embodiment optimizes the structure of the punching knife 4. Specifically, the punching knife 4 is provided with a recess 41 corresponding to the short side of the rectangular punching hole, forming a "concave"-shaped punching profile 42 at the bottom of the punching knife 4 to prevent the membrane from being completely punched out. The two long sides of the "concave"-shaped punching profile 42, away from the short side of the rectangular punching hole, are designed with a downward curved structure 43, so that the punching bottom surface of the punching knife 4 is set at a set slope with the horizontal plane. At the same time, the "concave"-shaped punching profile 42 is formed with a short-side cutting edge 44 that first cuts off the short side of the rectangular punching hole 202 during punching. When the punching knife 4 punches the EVA film 200, the short side cutting blade 44 first cuts off the short side of one side of the rectangular punching hole 202, and then the two long side blades of the "concave" shaped punching profile 42 cut off the long sides of both sides of the rectangular punching hole 202, thereby obtaining the flip cover film 201 and the rectangular punching hole 202.

[0027] After the punching knife 4 punches out a rectangular hole 202 on the EVA film 200, the flip-cover membrane 201 is squeezed to the bottom of the EVA film 200. In order to facilitate the subsequent lead to pass through the rectangular hole 202, a top membrane rod 6 is provided in this embodiment. The top membrane rod 6 is driven upward by the second cylinder 5 to push the flip-cover membrane 201 located below the EVA film upward to the top of the EVA film, so as to facilitate the subsequent lead to pass through.

[0028] The bracket 1 is provided with a strip hole 11 , and the first cylinder 3 is mounted on the bracket 1 in a manner that its left and right positions can be adjusted, and is locked and fixed in position by screws passing through the strip hole 11 .

[0029] For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention.

Claims

1. An EVA film flip-cover punching mechanism, characterized in that: It includes a bracket, a punching bottom mold fixed on the bracket, a first cylinder fixed on the bracket, a punching knife driven by the first cylinder to move up and down and located above the punching bottom mold, a second cylinder fixed below the bracket, and a top film rod driven by the second cylinder to move up and down and located below the punching bottom mold.

2. The EVA film flip-cover punching mechanism according to claim 1, characterized in that: The punching bottom die is provided with a notch matched with the punching knife, and the punching knife extends into the notch when punching holes in the EVA film.

3. The EVA film flip-cover punching mechanism according to claim 2, characterized in that: A punching bottom blade profile is formed around the notch to cooperate with the blade profile of the punching knife to achieve film cutting.

4. The EVA film flip-cover punching mechanism according to claim 2, characterized in that: The punching knife is aligned with the upper side of the notch, and the top film rod is aligned with the lower side of the notch.

5. The EVA film flip-cover punching mechanism according to claim 1, characterized in that: The punching knife is provided with a concave pit corresponding to the short side of the rectangular punching hole, so that the bottom of the punching knife forms a "concave"-shaped punching profile.

6. The EVA film flip-cover punching mechanism according to claim 5, characterized in that: The two long sides of the "concave"-shaped punching profile are designed to be a downward arc structure away from the short side of the rectangular punching hole, so that the punching bottom surface of the punching knife is set at a set slope with the horizontal plane, so that a short side breaking blade is formed in the "concave"-shaped punching profile to first break the short side of one side of the rectangular punching hole when punching.

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