Anti-collision semiconductor diode storage mechanism

Abstract

The utility model discloses an anti-collision semiconductor diode storage mechanism which comprises a box body, a box cover is hinged to one side of the box body, a rubber pad adheres to the inner wall of the bottom of the box body, a storage box adheres to the upper surface of the rubber pad, a plurality of containing cavities are formed in the top of the storage box and are evenly distributed, and the bottom of the box body is provided with an opening. The containing cavity is filled with filler wrapping the diodes, and a fixing mechanism for locking the box cover after the box cover is closed is arranged on one side of the box body. According to the utility model, not only can the diodes be not easy to move and the positions of the diodes be kept through the arrangement of the fillers, and the protection effect of the device be improved, but also the fillers can be prevented from flowing out of the placing cavity in the transportation process through the arrangement of the fixing mechanism, so that the sealing and storage effect of the placing box is improved; and through the arrangement of the elastic protrusions, the filler can be limited, the filler is prevented from coming out of the containing cavity, and the protection effect of the device is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of diode storage, in particular to a collision-proof semiconductor diode storage mechanism. Background Art

[0002] A diode is an electronic device made of semiconductors that can only carry current in one direction and is often used in electronic circuits.

[0003] For example, a light-emitting diode storage device disclosed in the announcement number CN211711552U has a rubber sealing block inside the storage box cover that fits with the rubber sealing block on the storage box body, so that the stored light-emitting diodes have secondary waterproofness. The diodes are directly placed in the space of the partition, which is square, while the diodes are mostly cylindrical and can easily shake in the space, causing damage to the diodes. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a collision-proof semiconductor diode storage mechanism.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A collision-proof semiconductor diode storage mechanism comprises a box body, a box cover is hinged on one side of the box body, a rubber pad is bonded to the bottom inner wall of the box body, a storage box is bonded to the upper surface of the rubber pad, a plurality of placement cavities are opened on the top of the storage box, and the plurality of placement cavities are evenly distributed, and the placement cavities are filled with fillers for wrapping diodes, and a fixing mechanism for locking the box cover after the box cover is closed is provided on one side of the box body.

[0007] As a further solution of the utility model, the filler is a plurality of foam balls, the plurality of foam balls are filled in the placement cavity, the foam balls wrap the diode, and at least one pin of the diode passes through the foam balls.

[0008] As a further solution of the utility model, the filler is a plurality of airbags, and the plurality of airbags are placed in the placement cavity. The plurality of diodes are combined and wrapped between the plurality of airbags, and the plurality of diodes are not in contact with each other, and the plurality of airbags are bonded to each other by glue.

[0009] As a further solution of the utility model, the filler is a sponge cover, the sponge cover is inserted into the placement cavity, at least one placement hole is opened on the top of the sponge cover, and the diode is inserted into the placement hole.

[0010] As a further solution of the utility model, the fixing mechanism includes at least one iron plate and a T-shaped frame. The iron plate is rotatably connected to one side of the box cover, and the T-shaped frame is fixed to one side of the box body by bolts. An arc-shaped groove is opened on one side of the iron plate, and a magnetic block is bonded to one side of the box body, and the magnetic block is located below the T-shaped frame.

[0011] As a further solution of the utility model, two sponge rings are bonded to the inner walls around the box body, and the sponge rings are fixed to the storage box.

[0012] As a further solution of the utility model, a sponge pad is bonded to the inner wall of one side of the box cover, and a plurality of elastic protrusions are integrally formed in one side of the sponge pad, and the elastic protrusions can be inserted into the placement cavity.

[0013] The beneficial effects of the utility model are:

[0014] 1. The utility model provides a filler, which tightly wraps the diode, making it difficult for the diode to shake and move, so that the position of the diode is maintained, thereby improving the protection effect of the device.

[0015] 2. The utility model ensures that the entire placement box is in a closed state for a long time by setting a fixing mechanism, thereby preventing the filling material from flowing out of the placement cavity during transportation, thereby improving the sealing effect of the placement box.

[0016] 3. The utility model provides an elastic protrusion, and when the box cover is closed, the elastic protrusion can squeeze the filler to limit the filler and prevent the filler from coming out of the placement cavity, thereby further improving the protective effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A three-dimensional structural schematic diagram of a collision-proof semiconductor diode storage mechanism embodiment 1 proposed by the utility model;

[0018] Figure 2 It is a partial cross-sectional structural schematic diagram of a collision-proof semiconductor diode storage mechanism embodiment 1 proposed by the utility model;

[0019] Figure 3 This is a partially enlarged structural schematic diagram of Example 2 of a collision-proof semiconductor diode storage mechanism proposed by the utility model.

[0020] Figure 4 It is a partial enlarged structural schematic diagram of Example 3 of a collision-proof semiconductor diode storage mechanism proposed by the utility model.

[0021] In the figure: 1. box body; 2. sponge ring; 3. storage box; 4. sponge pad; 5. box cover; 6. elastic protrusion; 7. iron plate; 8. arc-shaped slot; 9. foam ball; 10. placement cavity; 11. T-shaped frame; 12. magnetic block; 13. rubber pad; 14. air bag; 15. sponge cover; 16. placement hole. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. The described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0023] Example 1

[0024] Reference Figure 1-Figure 2 A collision-proof semiconductor diode storage mechanism comprises a box body 1, a box cover 5 is hinged on one side of the box body 1, a rubber pad 13 is bonded to the inner wall of the bottom of the box body 1, a storage box 3 is bonded to the upper surface of the rubber pad 13, two sponge rings 2 are bonded to the inner walls around the box body 1, and the sponge rings 2 are fixed to the storage box 3, and can assist in resetting the storage box 3 during the shaking of the storage box 3, a plurality of placement cavities 10 are opened on the top of the storage box 3, and the plurality of placement cavities 10 are evenly distributed, and the placement cavities 10 are filled with fillers for wrapping diodes, and the box cover A sponge pad 4 is bonded to the inner wall of one side of 5, and a plurality of elastic protrusions 6 are integrally formed in one side of the sponge pad 4, and the elastic protrusion 6 can be inserted into the placement cavity 10. When the box cover 5 is closed, the elastic protrusion 6 can squeeze the filler and limit the filler to prevent the filler from coming out of the placement cavity 10. A fixing mechanism is provided on one side of the box body 1 to lock the box cover 5 after the box cover 5 is closed. The filler tightly wraps the diode, making it difficult for the diode to shake. At the same time, the diode is not easy to move, so the position of the diode is maintained, thereby improving the protection effect of the device.

[0025] Among them, the filler is a plurality of foam balls 9, and the plurality of foam balls 9 are filled in the placement cavity 10. The foam balls 9 wrap the diode so that the diode does not contact the placement cavity 10. At least one pin of the diode passes through the foam ball 9, thereby increasing the fixation between the diode and the foam ball 9 and making it difficult for the diode to move in the placement cavity 10, thereby achieving the effect of protecting the diode.

[0026] Among them, the fixing mechanism includes at least one iron plate 7 and a T-frame 11. The iron plate 7 is rotatably connected to one side of the box cover 5. The T-frame 11 is fixed to one side of the box body 1 by bolts. An arc-shaped groove 8 is opened on one side of the iron plate 7. A magnetic block 12 is bonded to one side of the box body 1, and the magnetic block 12 is located below the T-frame 11. After the box cover 5 is closed, the iron plate 7 is rotated to make the arc-shaped groove 8 engage with the T-frame 11. At this time, the magnetic block 12 will adsorb the iron plate 7 and fix the angle of the iron plate 7, thereby ensuring that the entire placement box is in a closed state for a long time, avoiding the filling material from flowing out of the placement cavity 10 during transportation, thereby improving the sealing effect of the placement box.

[0027] Example 2

[0028] Reference Figure 3 The filler is a plurality of airbags 14, and the plurality of airbags 14 are placed in the placement cavity 10. The plurality of diodes are combined and wrapped between the plurality of airbags 14, and the plurality of diodes do not contact each other, and the plurality of airbags 14 are bonded together by glue. The plurality of airbags 14 are bonded and combined, and at least one diode is placed in the gap between the airbags 14, and then placed in the placement cavity 10 at the same time. The diodes can also be placed in the gap between the airbags 14 and the placement cavity 10, so that the diodes do not contact each other and do not move.

[0029] Example 3

[0030] Reference Figure 4 The filler is a sponge cover 15, which is inserted into the placement cavity 10. At least one placement hole 16 is provided on the top of the sponge cover 15. The diameter of the placement hole 16 is slightly smaller than the diameter of the diode. The diode is inserted into the placement hole 16 at intervals so that its pins are inserted into the sponge cover 15. At this time, the diode will expand the placement hole 16, so that the friction between the placement hole 16 and the diode is enhanced, thereby fixing the diode. At the same time, the diode will squeeze the adjacent placement hole 16 and deform it, so that the adjacent placement hole 16 cannot place the diode, thereby making the overall fixing effect better.

[0031] Finally, it should be noted that: for those skilled in the art, they can still modify the technical solutions recorded in the above embodiments, or replace some of the technical features therein with equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this utility model shall be included in the protection scope of this utility model.

Claims

1. A collision-proof semiconductor diode storage mechanism, comprising a box body (1), a box cover (5) being hingedly connected to one side of the box body (1), characterized in that: A rubber pad (13) is fixedly connected to the inner wall of the bottom of the box body (1), a storage box (3) is fixedly connected to the upper surface of the rubber pad (13), a plurality of placement cavities (10) are provided on the top of the storage box (3), and the plurality of placement cavities (10) are evenly distributed, the placement cavities (10) are filled with a filler for wrapping diodes, and a fixing mechanism for locking the box cover (5) when the box cover (5) is closed is provided on one side of the box body (1).

2. The anti-collision semiconductor diode storage mechanism according to claim 1, characterized in that: The filler is a plurality of foam balls (9), the plurality of foam balls (9) are filled in the placement cavity (10), the foam balls (9) wrap the diode, and at least one pin of the diode passes through the foam balls (9).

3. The anti-collision semiconductor diode storage mechanism according to claim 1, characterized in that: The filler is a plurality of airbags (14), the plurality of airbags (14) are all placed in the placement cavity (10), the plurality of diodes are combined and wrapped between the plurality of airbags (14), the plurality of diodes are not in contact with each other, and the plurality of airbags (14) are bonded to each other by glue.

4. The anti-collision semiconductor diode storage mechanism according to claim 1, characterized in that: The filler is a sponge cover (15), which is inserted into the placement cavity (10). At least one placement hole (16) is provided on the top of the sponge cover (15), and the diode is inserted into the placement hole (16).

5. The anti-collision semiconductor diode storage mechanism according to claim 1, characterized in that: The fixing mechanism comprises at least one iron plate (7) and a T-shaped frame (11); the iron plate (7) is rotatably connected to one side of the box cover (5); the T-shaped frame (11) is fixedly connected to one side of the box body (1); an arc-shaped slot (8) is provided on one side of the iron plate (7); a magnetic block (12) is fixedly connected to one side of the box body (1); and the magnetic block (12) is located below the T-shaped frame (11).

6. The anti-collision semiconductor diode storage mechanism according to claim 5, characterized in that: Two sponge rings (2) are fixedly connected to the inner walls of the box body (1), and the sponge rings (2) are fixed to the storage box (3).

7. The anti-collision semiconductor diode storage mechanism according to claim 5, characterized in that: A sponge pad (4) is fixedly connected to the inner wall of one side of the box cover (5), and a plurality of elastic protrusions (6) are integrally formed in one side of the sponge pad (4), and the elastic protrusions (6) can be inserted into the placement cavity (10).

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