Electroplating equipment and electroplating liquid circulating system

Abstract

The utility model discloses electroplating equipment and an electroplating liquid circulating system. The electroplating equipment comprises an electroplating bath, a circulating system and a controller, the anode unit is mounted in the electroplating bath and comprises a plurality of rows of anode assemblies distributed at intervals, and an electroplating channel is formed between every two adjacent rows of anode assemblies; the circulating mechanism comprises a liquid storage tank, a circulating liquid supply pipe and a circulating return pipe, two ends of the circulating return pipe are respectively connected with the liquid storage tank and the electroplating tank, one end of the circulating liquid supply pipe is connected with the liquid storage tank, and the other end is connected with the electroplating tank through a flow equalizing assembly; the flow equalizing assembly comprises a flow equalizing plate and a flow equalizing pipe, a plurality of nozzles are formed in the flow equalizing pipe, the nozzles and the circulating liquid supply pipe are located at the upper end and the lower end of the flow equalizing pipe respectively, the number of the nozzles is equal to that of the electroplating channels, the nozzles are communicated in a one-to-one correspondence mode, the flow equalizing plate is arranged in the flow equalizing pipe, and a plurality of flow equalizing holes staggered with the nozzles are formed in the flow equalizing plate. By means of the flow equalizing assembly, the electroplating liquid amount and metal ions in the electroplating bath are evenly distributed, and a plating layer attached to the part to be electroplated is even.

Description

Technical Field

[0001] The present application relates to the field of electroplating technology, and in particular to an electroplating device and an electroplating liquid circulation system. Background Art

[0002] During the electroplating process, the workpiece to be plated is electrically connected to the negative pole of the power supply and immersed in the plating solution to form a cathode unit. An anode unit electrically connected to the positive pole of the power supply is installed in the plating tank. Under the action of the electric field, the metal ions in the plating solution will be liberated to the vicinity of the workpiece to be plated and form a coating on the workpiece to be plated.

[0003] Existing electroplating equipment usually uses pipes to directly transport the plating liquid in the liquid storage tank to the plating tank. This will cause the amount of plating liquid in the plating tank to be unevenly distributed. The closer the area is to the delivery position, the higher the amount of plating liquid is. When the plating liquid flows to the area far away from the delivery position, the metal ions in the plating liquid are continuously consumed, so that the metal ions in the plating tank are unevenly distributed, resulting in different coating thicknesses on multiple parts to be electroplated in different areas of the plating tank, and uneven coating thickness on each part to be electroplated. Summary of the invention

[0004] The purpose of the present application is to provide an electroplating device and an electroplating liquid circulation system, which utilizes a flow equalizing component to allow the electroplating liquid to evenly enter multiple electroplating channels, thereby making the amount of electroplating liquid and the metal ion distribution in the electroplating tank even, thereby achieving the purpose of uniform coating attached to the workpiece to be electroplated.

[0005] To achieve the above-mentioned purpose, the present application provides an electroplating device, comprising: an electroplating tank; an anode unit, installed in the electroplating tank, comprising a plurality of rows of anode assemblies spaced apart along the length direction of the electroplating tank, and an electroplating channel is formed between two adjacent rows of the anode assemblies; a circulation mechanism, comprising a liquid storage tank, a circulating liquid supply pipe and a circulating return pipe, the two ends of the circulating return pipe are respectively connected to the liquid storage tank and the electroplating tank, one end of the circulating liquid supply pipe is connected to the liquid storage tank, and the other end is connected to the electroplating tank through a flow equalizing component; the flow equalizing component comprises a flow equalizing plate and a flow equalizing pipe, a plurality of nozzles are opened on the flow equalizing pipe, the flow equalizing pipe is installed at the bottom of the electroplating tank, the circulating liquid supply pipe is connected to the flow equalizing pipe, and the nozzles and the circulating liquid supply pipe are respectively located at the upper and lower ends of the flow equalizing pipe, the number of the nozzles is equal to the electroplating channel and they are connected one-to-one, the flow equalizing plate is horizontally arranged inside the flow equalizing pipe along its length, a plurality of flow equalizing holes are arranged on the flow equalizing plate, and the flow equalizing holes are staggered with the nozzles.

[0006] As a further improvement of the above technical solution: two overflow baffles are arranged in the electroplating tank, and the two overflow baffles are arranged at intervals along the width of the electroplating tank, each of the overflow baffles is arranged along the length direction of the electroplating tank, and has a certain distance between the inner wall of the electroplating tank to divide the interior of the electroplating tank into a plating chamber and two overflow chambers, and the anode unit is arranged in the electroplating chamber; the two overflow chambers are respectively located on both sides of the electroplating chamber, the overflow chamber is connected to the top of the electroplating chamber, and the two overflow chambers are connected at the bottom to form a reflux chamber, and the circulating reflux pipe is connected to the reflux chamber.

[0007] As a further improvement of the above technical solution: the circulation mechanism can also adopt any of the following structures or a combination of two or more structures: (1) a flow meter is provided on the circulation liquid supply pipe; (2) a flow regulating valve is provided on the circulation liquid supply pipe; (3) a flow meter is provided on the circulation liquid supply pipe, and water pumps are provided on both the circulation liquid supply pipe and the circulation return pipe.

[0008] As a further improvement of the above technical solution: the number of the circulating liquid supply pipe is at least one, and when the number of the circulating liquid supply pipe is more than one, the plurality of circulating liquid supply pipes are equidistantly arranged.

[0009] As a further improvement of the above technical solution: the number of the nozzles is N, the number of the flow equalizing holes is M, wherein M≥N+1.

[0010] As a further improvement of the above technical solution: a filter is provided at one end of the circulation reflux pipe communicating with the reflux chamber, the filter is located in the reflux chamber, and a plurality of filter holes are provided on the filter.

[0011] To achieve the above-mentioned purpose, the present application further provides a plating liquid circulation system, comprising: a plurality of plating tanks arranged along a first direction, wherein the plating tanks are filled with plating liquid when the plating equipment is in operation; a circulation mechanism, the number of which is equal to the number of the plating tanks and which is connected one-to-one, the circulation mechanism comprising a liquid storage tank, a circulating liquid supply pipe and a circulating return pipe, both ends of the circulating return pipe are respectively connected to the liquid storage tank and the plating tank, one end of the circulating liquid supply pipe is connected to the liquid storage tank, and the other end is connected to the plating tank through a flow equalizing component, the plurality of liquid storage tanks are arranged along the first direction, the liquid levels of the plurality of liquid storage tanks decrease successively along the first direction, and the plating liquid flows from the beginning to the end of the first direction; an overflow buffer tank, located at the end of the first direction, one end of the overflow buffer tank is connected to the adjacent liquid storage tank through the buffer supply pipe, and the other end is connected to the liquid storage tank located at the beginning of the first direction through the buffer return pipe; a temporary storage tank, wherein the plurality of liquid storage tanks are all connected to the temporary storage tank.

[0012] As a further improvement of the above technical solution: the cache reflux pipe includes a first cache reflux branch and a second cache reflux branch, the two ends of the first cache reflux branch are respectively connected to the overflow cache tank and the metal reaction tank, and the two ends of the second cache reflux branch are respectively connected to the metal reaction tank and the liquid storage tank located at the starting end of the first direction.

[0013] As a further improvement of the above technical solution: an automatic stirrer is provided in the metal reaction tank.

[0014] As a further improvement of the above technical solution: the flow equalizing component includes a flow equalizing plate and a flow equalizing tube, the flow equalizing tube is provided with a plurality of nozzles, the flow equalizing tube is installed at the bottom of the electroplating tank, the circulating liquid supply pipe is connected to the flow equalizing tube, and the nozzles and the circulating liquid supply tube are respectively located at the upper and lower ends of the flow equalizing tube, the number of the nozzles is equal to the electroplating channel and they are connected one-to-one, the flow equalizing plate is horizontally arranged inside the flow equalizing tube along its length, the flow equalizing plate is provided with a plurality of flow equalizing holes, and the flow equalizing holes are staggered with the nozzles.

[0015] As a further improvement of the above technical solution: the electroplating liquid circulation system also includes a temporary storage tank, and the multiple liquid storage tanks are all connected to the temporary storage tank.

[0016] It can be seen that the electroplating equipment provided by the present application, through the flow equalizing holes and nozzles staggered in the flow equalizing component, makes it impossible for the plating liquid to flow directly to the nozzle after passing through the flow equalizing holes, and the plating liquid level in the flow equalizing tube will gradually rise and enter multiple nozzles at the same time. Under the structure in which each nozzle is connected to a corresponding electroplating channel, the amount of plating liquid flowing into each electroplating channel is equal, and the amount of plating liquid in the electroplating tank is evenly distributed. In this way, the metal ions in the electroplating tank are evenly distributed, and the number of metal ions attached to the workpiece to be electroplated that moves through each electroplating channel is within a preset range, so that the plating layer on the workpiece to be electroplated is uniform;

[0017] In addition, the present application also provides a plating liquid circulation system, which realizes the plating liquid circulation of a single plating tank through the cooperation between the plating tank and the liquid storage tank, and realizes the plating liquid circulation of the entire electroplating equipment through the cooperation between multiple liquid storage tanks and overflow buffer tanks. In this way, the utilization rate of the plating liquid can be improved and the electroplating cost can be reduced.

[0018] The electroplating liquid circulation system includes the entire technical solution of the electroplating equipment and therefore also possesses all the technical advantages of the electroplating equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 It is a schematic diagram of the planar structure of the electroplating tank provided in an embodiment of the present application;

[0021] Figure 2 The embodiment of this application provides Figure 1 A cross-sectional view of the electroplating tank in the EE direction is shown;

[0022] Figure 3 The embodiment of the present application provides Figure 2 The electroplating solution flow diagram corresponding to the electroplating tank shown;

[0023] Figure 4 yes Figure 3 A partial enlarged view of the middle area A;

[0024] Figure 5 is a plating liquid flow diagram of a plating liquid circulation system provided in an embodiment of the present application;

[0025] Figure 6 It is a schematic diagram of the planar structure of the connection between multiple liquid storage tanks provided in an embodiment of the present application.

[0026] Reference numerals:

[0027] 10- electroplating tank; 101- overflow baffle; 102- electroplating chamber; 103- overflow chamber; 104- reflux chamber; 105- overflow hole group;

[0028] 20-anode unit; 201-electroplating channel;

[0029] 30-circulation mechanism; 301-liquid storage tank; 302-circulation liquid supply pipe; 303-circulation return pipe; 304-flow meter; 305-flow regulating valve; 306-overflow pipe

[0030] 40-flow balancing assembly; 401-flow balancing plate; 4011-flow balancing hole; 402-flow balancing tube; 4021-nozzle

[0031] 50-overflow buffer tank; 501-first buffer return branch pipe; 502-second buffer return branch pipe;

[0032] 60-Metal reaction tank;

[0033] 70-temporary storage slot. DETAILED DESCRIPTION

[0034] To make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings. Terms such as "upper", "above", "lower", "below", "first end", "second end", "one end", "the other end" used in the present application to represent spatial relative positions are used to describe the relationship of a unit or feature relative to another unit or feature as shown in the accompanying drawings for the purpose of convenience of explanation. Terms of spatial relative position may be intended to include different orientations of the device in use or work other than the orientation shown in the figure. For example, if the device in the figure is turned over, the unit described as being "below" or "below" other units or features will be located "above" other units or features. Therefore, the exemplary term "below" can encompass both the above and below orientations. The device can be oriented in other ways (rotated 90 degrees or other orientations), and the spatially related descriptive words used in this article are interpreted accordingly.

[0035] In addition, the terms "installed", "set", "provided with", "connected", "slidingly connected", "fixed", and "sleeved" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the embodiments described in this application are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0037] The electroplating equipment provided in the embodiment of the present application is used to electroplate the workpiece to be electroplated so that a layer of metal film is attached to the entire area or part of the area on the surface of the workpiece to be electroplated. The electroplating equipment can be a vertical electroplating equipment, and the workpiece to be electroplated can be a product that needs to be given some special physical properties or decorative effects, such as PCB boards, solar cells, silicon wafers, chips, etc.

[0038] See also Figure 1-Figure 4As shown, the electroplating equipment at least includes an electroplating tank 10, an anode unit 20 and a circulation mechanism 30. Specifically, the anode unit 20 is installed in the electroplating tank 10, and the anode unit 20 includes multiple rows of anode assemblies spaced apart along the length direction of the electroplating tank 10, and an electroplating channel 201 is formed between two adjacent rows of anode assemblies; the anode assembly is composed of an anode piece and an anode mounting seat, and the anode piece is arranged on the anode mounting seat. When the electroplating equipment is in operation, the electroplating tank 10 is filled with electroplating liquid, the anode piece is immersed in the electroplating liquid and is electrically connected to the positive pole of the power supply, and the parts to be electroplated are installed on the carrier, and the number of parts to be electroplated is equal to the number of electroplating channels 201. Each part to be electroplated is located in an electroplating channel 201, and the part to be electroplated is electrically connected to the negative pole of the power supply. When the carrier is driven by a moving tool to move along the length of the electroplating tank 10, the part to be electroplated moves along the length of the electroplating channel 201, and the area to be plated is immersed in the electroplating liquid. The metal ions ionized by the anode piece and the metal ions in the electroplating liquid itself will adhere to the surface of the part to be electroplated under the action of the electric field to form a coating.

[0039] See also Figure 3 As shown, the circulation mechanism 30 includes a liquid storage tank 301, a circulating liquid supply pipe 302 and a circulating return pipe 303, the two ends of the circulating return pipe 303 are respectively connected to the liquid storage tank 301 and the electroplating tank 10, one end of the circulating liquid supply pipe 302 is connected to the liquid storage tank 301, and the other end is connected to the electroplating tank 10 through the flow equalization component 40; the plating liquid in the electroplating tank 10 can flow out of the electroplating tank 10 through the circulating return pipe 303 and enter the liquid storage tank 301 for storage, and the plating liquid in the liquid storage tank 301 flows into the electroplating tank 10 through the circulating liquid supply pipe 302 and the flow equalization component 40 to supply liquid to the electroplating tank 10, so that the liquid circulation of a single electroplating tank 10 can be realized.

[0040] Among them, see Figure 4As shown, the flow equalizing component 40 includes a flow equalizing plate 401 and a flow equalizing tube 402, and a plurality of nozzles 4021 are provided on the flow equalizing tube 402. The flow equalizing tube 402 is installed at the bottom of the electroplating tank 10, and the circulating liquid supply tube 302 is connected to the flow equalizing tube 402, and the nozzles 4021 and the circulating liquid supply tube 302 are respectively located at the upper and lower ends of the flow equalizing tube 402, and the number of nozzles 4021 is equal to the electroplating channel 201 and is connected one by one. The flow equalizing plate 401 is horizontally arranged inside the flow equalizing tube 402 along the length thereof, and a plurality of flow equalizing holes 4011 are provided on the flow equalizing plate 401, and the flow equalizing holes 4011 and the nozzles 4021 are staggered; after the electroplating liquid in the circulating liquid supply tube 302 enters the flow equalizing tube 402, it passes through the flow equalizing holes 4011 and The nozzle 4021 flows into the electroplating tank 10. Since the flow equalizing hole 4011 and the nozzle 4021 are multiple and staggered, the plating liquid cannot flow directly to the nozzle 4021 after flowing through the flow equalizing hole 4011. The plating liquid level in the flow equalizing tube 402 will gradually rise and enter multiple nozzles 4021 at the same time. Under the structure in which each nozzle 4021 is connected to a corresponding electroplating channel 201, the amount of plating liquid flowing into each electroplating channel 201 is equal, and the amount of plating liquid in the electroplating tank 10 is evenly distributed. In this way, the metal ions in the electroplating tank 10 are evenly distributed, and the number of metal ions attached to the workpiece to be electroplated that moves through each electroplating channel 201 is within a preset range, so that the plating layer on the workpiece to be electroplated is uniform.

[0041] In this embodiment, see Figure 2 , Figure 3As shown, two overflow baffles 101 are arranged in the electroplating tank 10, and the two overflow baffles 101 are arranged at intervals along the width of the electroplating tank 10, and each overflow baffle 101 is arranged along the length direction of the electroplating tank 10, and has a certain distance between it and the inner wall of the electroplating tank 10, so as to divide the inside of the electroplating tank 10 into a plating chamber 102 and two overflow chambers 103, and the anode unit 20 is arranged in the electroplating chamber 102; the two overflow chambers 103 are respectively located on both sides of the electroplating chamber 102, the overflow chamber 103 is connected to the top of the electroplating chamber 102, and the two overflow chambers 103 are connected at the bottom to form a reflux chamber 104, and the circulating reflux pipe 303 is connected to the reflux chamber 104. Specifically, the height of the overflow baffle 101 is the amount of plating liquid that can be contained in the plating chamber 102. When the amount of plating liquid in the plating chamber 102 is too much, the plating liquid level in the plating chamber 102 will be located above the overflow baffle 101, and will flow into the overflow chamber 103, the reflux chamber 104 and the circulating reflux pipe 303 in sequence, thereby avoiding excessive amount of plating liquid in the plating tank 10 and realizing the recycling of the plating liquid. In addition, by arranging the overflow chamber 103 on both sides of the plating chamber 102, the plating liquid can be refluxed in time to ensure that the liquid level in the plating chamber 102 is always at a preset height. Under this structure, the amount of liquid in each area of ​​the plating chamber 102 is equal and the metal ions in the liquid are evenly distributed, thereby ensuring the uniformity of the plating layer during electroplating.

[0042] In practical applications, the overflow baffle 101 includes an upper plate portion and a lower plate portion connected in the vertical direction, the lower plate portion extends in the vertical direction, the upper plate portion extends upward from the upper end of the lower plate portion and obliquely in the direction away from the electroplating chamber 102 until it is connected to the inner wall of the electroplating tank 10, and an overflow hole group 105 for connecting the electroplating chamber 102 and the overflow chamber 103 is provided on the upper plate portion. In this way, after the plating liquid in the electroplating chamber 102 rises to the position of the overflow hole group 105, it will flow into the overflow chamber 103 from the overflow hole group 105. Since the upper plate portion is inclined, the speed of the liquid level rise is slowed down, providing a buffer for the discharge of excess plating liquid. At the same time, the inclined extension of the upper plate portion makes the process of discharging the plating liquid more stable, reducing the disturbance of the plating liquid in the electroplating chamber 102.

[0043] Furthermore, the angle α between the inclined extension direction of the upper plate portion and the inner wall of the electroplating tank 10 is greater than 0° and less than 45°. In this way, the space is more reasonably utilized, and the discharge process of the electroplating solution is also smoother and more stable.

[0044] Further, see Figure 1-Figure 3As shown, a plurality of overflow hole groups 105 are arranged at intervals along the length direction of the electroplating tank 10, and each overflow hole group 105 includes a plurality of overflow holes arranged at intervals along the length direction of the electroplating tank 10, and a plurality of rows of overflow holes are arranged at intervals along the inclined direction of the upper plate portion, so that the plating liquid can be discharged faster through the gradually increasing overflow holes during the gradually rising process, thereby avoiding excessive amount of plating liquid in the plating chamber 102.

[0045] It should be noted that the reflux chamber 104 refers to the space after the two overflow chambers 103 are connected, and can be formed by the structure of the circulating reflux pipe 303 or the structure of the electroplating tank 10. If the reflux chamber 104 is a part of the structure of the circulating reflux pipe 303, the circulating reflux pipe 303 includes a first circulating reflux branch pipe and a second circulating reflux branch pipe. There are two first circulating reflux branches, which are respectively connected to the two overflow chambers 103. The end of the first circulating reflux branch pipe away from the overflow chamber 103 is connected to the second circulating reflux branch pipe, and the second circulating reflux branch pipe is connected to the liquid storage tank 301. That is to say, under this structure, the reflux chamber 104 is located in the second circulating reflux branch pipe; if the reflux chamber 104 is a part of the structure of the electroplating tank 10, The electroplating chamber 102 is a part of the structure, and a trough structure connected with the two overflow chambers 103 is provided at the bottom of the electroplating chamber 102, and the circulation reflux pipe 303 is connected with the trough structure. In order to avoid the mixing of the refluxed liquid and the supply liquid, the flow equalizing pipe 402 is not connected with the reflux chamber 104. In other words, the trough structure does not completely cover the bottom of the electroplating tank 10, and the flow equalizing pipe 402 and the trough structure are both located at the bottom of the electroplating chamber 102, or the trough structure covers the bottom of the electroplating tank 10, and the flow equalizing pipe 402 passes through the trough structure and is connected with the electroplating chamber 102.

[0046] In one possible implementation, see Figure 3As shown, a flow meter 304 is provided on the circulating liquid supply pipe 302. The flow meter 304 is provided on the circulating liquid supply pipe 302 to monitor the flow in the circulating liquid supply pipe 302. In practical applications, the flow in the circulating liquid supply pipe 302 and the amount of electroplating liquid in the electroplating chamber 102 both have a preset range, that is, when the flow is within the preset range, the amount of electroplating liquid in the electroplating chamber 102 is also within the preset range, so that the amount of liquid in the electroplating chamber 102 is evenly distributed and the liquid level is higher than the area to be plated of the electroplated part to be plated and lower than the top of the electroplating tank 10. Of course, the electroplating equipment may also include a controller, and there is a communication line (wired or wireless communication line) between the flow meter 304 and the controller, and the controller may receive the signal sent by the flow meter 304, and then obtain the real-time flow in the circulating liquid supply pipe 302 (if a non-communication line connection method is adopted, the value of the flow meter 304 may be monitored by manual monitoring). When the flow rate of the electroplating solution in the circulating liquid supply pipe 302 is outside the preset range, the flow meter 304 can feed back to the controller via the above-mentioned communication line, and then the controller will issue a reminder in the form of sound, light and electricity.

[0047] Further, see Figure 3 As shown, a flow regulating valve 305 is provided on the circulating liquid supply pipe 302. The flow regulating valve 305 is provided on the circulating liquid supply pipe 302 to adjust the flow in the circulating liquid supply pipe 302. In practical applications, the flow regulating valve 305 is electrically connected to the controller, and the controller can control the valve opening of the flow regulating valve 305 (if a non-communication line connection method is adopted, the valve opening of the flow regulating valve 305 can be adjusted manually). In this way, when the flow rate of the plating liquid in the circulating liquid supply pipe 302 is higher than the preset liquid volume range, the controller will reduce the valve opening of the flow regulating valve 305 to reduce the plating liquid entering the plating chamber 102, thereby avoiding that there is too much plating liquid in the plating chamber 102 and cannot be discharged in time. When the flow rate of the plating liquid in the circulating liquid supply pipe 302 is lower than the preset liquid volume range, the controller will increase the valve opening of the flow regulating valve 305 to increase the plating liquid entering the plating chamber 102, thereby avoiding that there is too little plating liquid in the plating chamber 102, and the area to be plated of the electroplated part cannot be immersed in the plating liquid for electroplating.

[0048] Furthermore, a liquid level sensor is provided in the electroplating chamber 102. There are two liquid level sensors, and the two liquid level sensors are respectively provided at the highest liquid level and the lowest liquid level of the preset electroplating liquid volume range. The liquid level sensor is electrically connected to the controller, and the controller can receive the signal sent by the liquid level sensor, and then obtain the real-time liquid level in the electroplating chamber 102. In this way, when the liquid level is higher than the preset highest liquid level, the controller will reduce the valve opening of the flow regulating valve 305, and when the liquid level is higher than the preset lowest liquid level, the controller will increase the valve opening of the flow regulating valve 305. In actual application, the highest liquid level is provided on the upper plate and is located above the overflow hole. When the electroplating liquid level is higher than the overflow hole, the amount of electroplating liquid in the electroplating chamber 102 is too much and cannot be discharged in time. At this time, the electroplating liquid input into the electroplating chamber 102 through the liquid inlet pipe can be reduced.

[0049] In a feasible implementation, water pumps are provided on both the circulating liquid supply pipe 302 and the circulating return pipe 303. By providing the water pumps, kinetic energy is provided to the liquids in the circulating liquid supply pipe 302 and the circulating return pipe 303.

[0050] It should be noted that, in practical applications, the circulation mechanism 301 can adopt any one of the above structures or a combination of two or more structures as needed.

[0051] In an achievable implementation, the number of circulating liquid supply pipes 302 is at least one. When the number of circulating liquid supply pipes 302 is more than one, multiple circulating liquid supply pipes 302 are equidistantly arranged. By increasing the number of circulating liquid supply pipes 302 to increase the amount of liquid input into the equalizing flow pipe 402, and equidistantly arranging multiple circulating liquid supply pipes 302, the plating liquid can flow into the equalizing flow pipe 402 uniformly, and the secondary distribution of the equalizing flow holes 4011 can make the plating liquid enter the nozzle 4021 uniformly. Specifically, when there are multiple circulating liquid supply pipes 302, each circulating liquid supply pipe 302 is provided with a flow meter and a flow regulating valve to simultaneously control the flow of multiple circulating liquid supply pipes 302, realize segmented liquid feeding and segmented control of the equalizing flow pipe 402, and further improve the uniformity of the liquid flowing out of the equalizing flow pipe 402 by controlling the amount of liquid in each segment of the equalizing flow pipe 402.

[0052] Preferably, the number of the nozzles 4021 is N, and the number of the flow-balancing holes 4011 is M, wherein M≥N+1. Since the nozzles 4021 and the flow-balancing holes 4011 are staggered, when the orthographic projection area of ​​the flow-balancing holes 4011 in the horizontal direction is larger than the orthographic projection area of ​​the nozzles 4021 in the horizontal direction, the plating solution can evenly enter the plurality of nozzles 4021. In order to make the orthographic projection area of ​​the flow-balancing holes 4011 in the horizontal direction larger than the orthographic projection area of ​​the nozzles 4021 in the horizontal direction, it is necessary to ensure that the number of the flow-balancing holes 4011 is larger than the number of the nozzles 4021.

[0053] Different from the above-mentioned embodiment in which the nozzle 4021 is provided on the flow equalizing tube 402, in a feasible embodiment, a plurality of liquid inlet pipes are provided on the flow equalizing tube 402, the number of which is equal to the number of the electroplating channels 201, and the flow equalizing tube 402 transports the electroplating liquid to the electroplating chamber 102 through the liquid inlet pipe, and the liquid inlet pipe is staggered with the flow equalizing hole 4011. The difference from the arrangement of the nozzle 4021 is that a flow regulating valve 305 and a flow meter 304 can be provided on each liquid inlet pipe, that is, by controlling the regulating valve and the flow meter 304 on the liquid inlet pipe, the amount of liquid entering each electroplating channel 201 can be directly adjusted, so as to ensure that the amount of electroplating liquid entering the plurality of electroplating channels 201 is equal, thereby making the electroplating liquid in the electroplating tank 10 uniform.

[0054] In a feasible embodiment, a filter is provided at one end of the circulating reflux pipe 303 connected to the reflux chamber 104, the filter is located in the reflux chamber 104, and a plurality of filter holes are provided on the filter. In order to prevent the impurities generated during the electroplating process from affecting the electroplating quality of the parts to be electroplated, a filter is provided on the electroplating solution circulation loop to filter the circulating electroplating solution. Specifically, the electroplating solution in the electroplating chamber 102 flows through the overflow chamber 103, the reflux chamber 104, the filter and the circulating reflux pipe 303 in sequence, and enters the liquid reservoir 301. Among them, a filter can also be provided in the liquid reservoir 301. Since the liquid reservoir 301 is independently provided, when the electroplating solution does not reflux, the impurities will be filtered and retained in the liquid reservoir 301, so that the electroplating solution transported from the liquid reservoir 301 to the electroplating chamber 102 does not contain impurities.

[0055] Furthermore, a plurality of filter holes are evenly arranged on the side wall of the filter. If the filter holes are arranged on the upper surface of the filter, under the suction force of the water pump, the electroplating liquid on the surface of the liquid storage tank 301 will be subject to less resistance and will flow to the filter faster. Since the amount of electroplating liquid overflowing from the electroplating chamber 102 is limited, the electroplating liquid in the overflow chamber 103 cannot be replenished in time, so that the overflow chamber 103 forms a negative pressure zone above the filter holes. The negative pressure zone will drive the electroplating liquid around it to accelerate the flow, and the electroplating liquid near the edge of the overflow chamber 103 will move toward the negative pressure zone and rotate to form a vortex. Therefore, in order to avoid the above phenomenon, the filter evenly arranges a plurality of filter holes on its side wall, so that the electroplating liquid in the overflow chamber 103 can continue to stably flow into the circulation reflux pipe 303.

[0056] In a feasible implementation, in order to prevent leakage of the plating liquid in the plating liquid circulation loop, the connecting parts of the circulating liquid supply pipe 302, the liquid inlet pipe and the circulating return pipe 303 are all provided with sealing rings. The sealing rings can be made of rubber material and use their own elasticity to seal the gap between the pipe and the electroplating tank 10.

[0057] In one embodiment disclosed in the present application, a plating liquid circulation system is also provided, and the plating liquid circulation system is applied to the electroplating equipment in the aforementioned embodiment. The plating liquid circulation system is used to realize liquid circulation inside the electroplating equipment, including liquid circulation of a single electroplating tank 10 and liquid circulation between multiple electroplating tanks 10, so as to realize the reuse of the plating liquid, thereby reducing the electroplating cost.

[0058] See also Figure 5 As shown, the plating liquid circulation system at least includes a plating tank 10, a circulation mechanism 30 and an overflow buffer tank 50. Specifically, a plurality of plating tanks 10 are arranged along the first direction. When the electroplating equipment is in operation, the plating tanks 10 are filled with plating liquid. The number of the circulation mechanisms 30 is equal to that of the plating tanks 10 and they are connected one by one. The circulation mechanism 30 includes a liquid storage tank 301, a circulating liquid supply pipe 302 and a circulating reflux pipe 303. Both ends of the circulating reflux pipe 303 are respectively connected to the liquid storage tank 301 and the plating tank 10. One end of the circulating liquid supply pipe 302 is connected to the liquid storage tank 301, and the other end is connected to the plating tank 10 through the flow equalization component 40. In this way, the liquid storage tank 301 is connected to the plating tank 10 through the circulation equalization component 40. The liquid tank 301 and the electroplating tank 10 are connected to each other to realize the liquid circulation of a single electroplating tank 10, so that the amount of electroplating liquid in the electroplating tank 10 is within a preset range, and the electroplating liquid can be reused, thereby reducing the cost of electroplating; a plurality of liquid storage tanks 301 are arranged along a first direction, and the liquid levels of the plurality of liquid storage tanks 301 decrease in sequence along the first direction, and the electroplating liquid flows from the beginning to the end of the first direction, and the overflow buffer tank 50 is located at the end of the first direction, and one end of the overflow buffer tank 50 is connected to the adjacent storage tank 50 through a buffer liquid supply pipe. The first end of the liquid storage tank 301 is connected to the liquid storage tank 301, and the other end is connected to the liquid storage tank 301 located at the beginning of the first direction through the buffer return pipe. Specifically, multiple liquid storage tanks 301 are arranged continuously or at intervals along the first direction. When multiple liquid storage tanks 301 are arranged continuously, two adjacent liquid storage tanks 301 are separated by a liquid storage overflow plate. The heights of the multiple liquid storage overflow plates are sequentially reduced along the first direction. When the electroplating liquid level in the liquid storage tank 301 is higher than the liquid storage overflow plate, the electroplating liquid will flow to the liquid storage tank 301 located on the other side of the liquid storage overflow plate. When the height decreases successively, the plating liquid can flow in a preset direction; in another structure, the heights of the multiple liquid storage overflow plates are equal, and each liquid storage overflow plate is provided with multiple rows of liquid storage overflow ports, and the number of rows of liquid storage overflow ports provided on each liquid storage overflow plate is different. The more rows of liquid storage overflow ports provided, the more liquid can flow out through the liquid storage overflow plate. The number of rows of liquid storage overflow ports increases successively along the first direction, so that the liquid level in the multiple liquid storage tanks 301 decreases successively along the first direction, and the plating liquid can flow in the first direction. See Figure 6As shown, when multiple liquid storage tanks 301 are arranged at intervals, two adjacent liquid storage tanks 301 are connected through an overflow pipe 306, and the heights of the multiple overflow pipes 306 are successively reduced along the first direction. When the liquid level of the plating liquid in the liquid storage tank 301 is higher than the lower tube surface of the overflow pipe 306, the plating liquid will flow to another liquid storage tank 301 connected to the overflow pipe 306. When the height of the overflow pipe 306 is successively reduced, the plating liquid can flow along a preset direction, and the plating liquid stored in the overflow buffer tank 50 will flow into the liquid storage tank 301 at the starting end of the first direction again, thereby realizing liquid circulation between the multiple liquid storage tanks 301, and further achieving the purpose of liquid circulation between the multiple electroplating tanks 10.

[0059] In one possible implementation, see Figure 5 As shown, the cache return pipe includes a first cache return branch pipe 501 and a second cache return branch pipe 502. The two ends of the first cache return branch pipe 501 are respectively connected to the overflow cache tank 50 and the metal reaction tank 60, and the two ends of the second cache return branch pipe 502 are respectively connected to the metal reaction tank 60 and the liquid storage tank 301 located at the beginning of the first direction. An automatic stirrer is arranged in the metal reaction tank 60. Since the metal ions will adhere to the surface of the workpiece to be electroplated during the use of the electroplating solution, that is, the metal ions in the electroplating solution decrease with the increase of the use time. After a certain period of time, the metal ions attached to the surface of the workpiece to be electroplated will not be able to form a coating of sufficient thickness. Therefore, in this embodiment, the metal reaction tank 60 is arranged on the electroplating solution circulation loop of the liquid storage tank 301 to supplement the metal ions in the liquid loop. It should be noted that the metal component in the metal reaction tank 60 can be selected according to the needs of the coating. For example, when copper is plated on the surface of the workpiece to be electroplated, the metal reaction tank 60 adopts a copper dissolving tank.

[0060] Preferably, an automatic stirrer is provided in the metal reaction tank 60. The automatic stirrer is provided to make the metal ions in the metal reaction tank 60 evenly distributed, so that the electroplating solution entering the liquid storage tank 301 and the electroplating tank 10 has evenly distributed metal ions.

[0061] In one possible implementation, see Figure 5As shown, the electroplating liquid circulation system also includes a temporary storage tank, and multiple liquid storage tanks 301 are all connected to the temporary storage tank. After the electroplating equipment has been used for a period of time, it needs to be maintained, or after the electroplating liquid has been used for a period of time, there may be a large amount of process residues, so that the electroplating liquid does not meet the use standards, and it needs to be completely discharged and replaced. Specifically, multiple liquid storage tanks 301 each discharge the liquid into the temporary storage tank through multiple first temporary storage tubes connected thereto, and the temporary storage tank inputs the liquid into multiple liquid storage tanks 301 through multiple second temporary storage tubes. In order to achieve uniform liquid supply, a third temporary storage tube can also be added, and the two sides of the third temporary storage tube are respectively connected to the temporary storage tank and the liquid storage tank 301, that is, the electroplating liquid flowing out of the temporary storage tank will diffuse in the third temporary storage tube and evenly enter the multiple liquid storage tanks 301.

[0062] The following is a specific application example of an electroplating liquid circulation system, which includes the following steps:

[0063] Connect the electroplating tank 10 and the liquid storage tank 301 through a circulating liquid supply pipe 302;

[0064] A flow meter 304 and a flow regulating valve 305 are provided on the circulating liquid supply pipe 302;

[0065] Obtaining data from the flow meter 304, and adjusting the opening of the flow regulating valve 305 according to the data, so that the flow rates in the plurality of circulating liquid supply pipes 302 are all within a preset range;

[0066] The electroplating tank 10 and the liquid storage tank 301 are connected through the circulation reflux pipe 303, so that the liquid storage tank 301, the circulation liquid supply pipe 302, the electroplating tank 10 and the circulation reflux pipe 302 together form a first liquid loop;

[0067] Arrange a plurality of liquid storage tanks 301 along a first direction, and arrange an overflow pipe 306 between two adjacent liquid storage tanks 301, and arrange the overflow pipe 306 at a height that is successively lowered along the first direction, so that the electroplating solution in the plurality of liquid storage tanks 301 flows along the first direction;

[0068] An overflow buffer slot 50 is provided at the end of the first direction;

[0069] The liquid storage tanks 301 located at the beginning and the end of the first direction are connected to the overflow buffer tank 50, so that the multiple liquid storage tanks 301 and the overflow buffer tank 50 together form a second liquid loop.

[0070] By setting up a flow meter 304 to monitor the flow through the circulation return pipe 303 in real time, adjusting the opening of the flow control valve 305 can change the flow entering the electroplating tank 10, thereby changing the electroplating efficiency and electroplating uniformity accordingly.

[0071] The multiple electroplating tanks 10 are respectively supplied with liquid and refluxed through the circulation mechanisms connected thereto. Specifically, the electroplating liquid 10 in the liquid storage tank 301 enters the equalizing tube 402 through the circulating liquid supply tube 302. The liquid in the equalizing tube 402 flows through the equalizing hole 4011. After the liquid volume is evenly distributed through the equalizing hole 4011, it enters the electroplating channel 201 of the electroplating tank 10 through the nozzle 4021, thereby realizing uniform liquid inflow to the electroplating tank 10. When the liquid level in the electroplating tank 10 is too high, it will flow into the overflow chamber 103 and the reflux chamber 104 in turn. The electroplating liquid entering the reflux chamber 104 will return to the liquid storage tank 301 again through the circulating reflux tube 303, thereby completing the liquid circulation of a single electroplating tank 10.

[0072] Liquid circulation is achieved between multiple liquid storage tanks 301 arranged along the first direction by overflow. Specifically, each liquid storage tank 301 has a preset liquid volume, and the preset liquid volumes of the multiple liquid storage tanks 301 decrease successively along the first direction, that is, when the liquid volume in the liquid storage tank 301 reaches the preset liquid volume, the plating liquid will overflow into the liquid storage tank 301 that is connected to the liquid storage tank 301 and located downstream of it in the first direction. An overflow buffer tank is also provided at the end of the first direction. The liquid storage tank 301 located at the end of the first direction overflows its excess plating liquid into the overflow buffer tank 50, and the liquid in the overflow buffer tank 50 will be transported to the liquid storage tank 301 located at the beginning of the first direction. In this way, liquid circulation between multiple electroplating tanks 10 and liquid storage tanks 301 in an electroplating device can be achieved.

[0073] It can be seen that the present application provides an electroplating device, through the flow equalizing holes 4011 and the nozzles 4021 that are staggered in the flow equalizing component 40, so that the plating liquid cannot flow directly to the nozzles 4021 after flowing through the flow equalizing holes 4011, and the plating liquid level in the flow equalizing tube 402 will gradually rise and enter multiple nozzles 4021 at the same time. Under the structure that each nozzle 4021 is connected to a corresponding electroplating channel 201, the amount of plating liquid flowing into each electroplating channel 201 is equal, and the amount of plating liquid in the electroplating tank 10 is evenly distributed. In this way, the metal ions in the electroplating tank 10 are evenly distributed, and the number of metal ions attached to the workpiece to be electroplated that moves through each electroplating channel 201 is within a preset range, so that the plating layer on the workpiece to be electroplated is uniform;

[0074] In addition, the present application also provides a plating liquid circulation system, which realizes the plating liquid circulation of a single plating tank 10 through the cooperation between the plating tank 10 and the liquid storage tank 301, and realizes the plating liquid circulation of the entire electroplating equipment through the cooperation between multiple liquid storage tanks 301 and the overflow buffer tank 50. In this way, the utilization rate of the plating liquid can be improved and the electroplating cost can be reduced.

[0075] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. An electroplating device, characterized in that: include: Electroplating tanks; an anode unit, installed in the electroplating tank, comprising a plurality of rows of anode assemblies spaced apart along the length direction of the electroplating tank, with an electroplating channel formed between two adjacent rows of anode assemblies; The circulation mechanism comprises a liquid storage tank, a circulating liquid supply pipe and a circulating return pipe, wherein the two ends of the circulating return pipe are respectively connected to the liquid storage tank and the electroplating tank, one end of the circulating liquid supply pipe is connected to the liquid storage tank, and the other end is connected to the electroplating tank through a flow balancing component; The flow equalizing component includes a flow equalizing plate and a flow equalizing tube, the flow equalizing tube is provided with a plurality of nozzles, the flow equalizing tube is installed at the bottom of the electroplating tank, the circulating liquid supply tube is connected to the flow equalizing tube, and the nozzles and the circulating liquid supply tube are respectively located at the upper and lower ends of the flow equalizing tube, the number of the nozzles is equal to the electroplating channel and they are connected one-to-one, the flow equalizing plate is horizontally arranged inside the flow equalizing tube along the length thereof, a plurality of flow equalizing holes are arranged on the flow equalizing plate, and the flow equalizing holes are staggered with the nozzles.

2. The electroplating equipment according to claim 1, characterized in that: Two overflow baffles are arranged in the electroplating tank, and the two overflow baffles are arranged at intervals along the width of the electroplating tank. Each overflow baffle is arranged along the length direction of the electroplating tank, and has a certain distance from the inner wall of the electroplating tank to divide the inside of the electroplating tank into an electroplating chamber and two overflow chambers, and the anode unit is arranged in the electroplating chamber; The two overflow chambers are respectively located at both sides of the electroplating chamber, the overflow chamber is connected to the top of the electroplating chamber, and the bottoms of the two overflow chambers are connected to form a reflux chamber, and the circulating reflux pipe is connected to the reflux chamber.

3. The electroplating equipment according to claim 1, characterized in that: The circulation mechanism may also adopt any of the following structures or a combination of two or more structures: (1) A flow meter is provided on the circulating liquid supply pipe; (2) The circulating liquid supply pipe is provided with a flow regulating valve; (3) Water pumps are provided on the circulating liquid supply pipe and the circulating return pipe.

4. The electroplating equipment according to claim 1, characterized in that: The number of the circulating liquid supply pipe is at least one. When the number of the circulating liquid supply pipe is more than one, the plurality of circulating liquid supply pipes are arranged at equal intervals.

5. The electroplating equipment according to claim 1, characterized in that: The number of the nozzles is N, and the number of the flow-balancing holes is M, wherein M≥N+1.

6. The electroplating equipment according to claim 2, characterized in that: A filter is disposed at one end of the circulation reflux pipe communicating with the reflux chamber. The filter is located in the reflux chamber and has a plurality of filter holes.

7. A plating solution circulation system, characterized in that: include: A plurality of electroplating tanks are arranged along a first direction, and when the electroplating equipment is in operation, the electroplating tanks are filled with electroplating liquid; Circulation mechanisms, the number of which is equal to that of the electroplating tanks and which are connected one-to-one, the circulation mechanism comprising a liquid storage tank, a circulation liquid supply pipe and a circulation return pipe, both ends of the circulation return pipe are respectively connected to the liquid storage tank and the electroplating tank, one end of the circulation liquid supply pipe is connected to the liquid storage tank, and the other end is connected to the electroplating tank through a flow equalizing component, a plurality of the liquid storage tanks are arranged along a first direction, the liquid levels of the plurality of the liquid storage tanks are successively reduced along the first direction, and the electroplating solution flows from the beginning to the end of the first direction; The overflow buffer tank is located at the end of the first direction. One end of the overflow buffer tank is connected to the adjacent liquid storage tank through a buffer liquid supply pipe, and the other end is connected to the liquid storage tank located at the beginning of the first direction through a buffer return pipe.

8. The electroplating solution circulation system according to claim 7, characterized in that: The cache reflux pipe includes a first cache reflux branch pipe and a second cache reflux branch pipe, the two ends of the first cache reflux branch pipe are respectively connected to the overflow cache tank and the metal reaction tank, and the two ends of the second cache reflux branch pipe are respectively connected to the metal reaction tank and the liquid storage tank located at the starting end of the first direction.

9. The electroplating solution circulation system according to claim 8, characterized in that: The metal reaction tank is provided with an automatic stirrer.

10. The electroplating solution circulation system according to claim 7, characterized in that: An anode unit is installed in the electroplating tank, and the anode unit includes multiple rows of anode assemblies spaced apart along the length direction of the electroplating tank, and an electroplating channel is formed between two adjacent rows of the anode assemblies; the current equalizing assembly includes a current equalizing plate and a current equalizing tube, and the current equalizing tube is provided with multiple nozzles. The current equalizing tube is installed at the bottom of the electroplating tank, and the circulating liquid supply pipe is connected to the current equalizing tube, and the nozzles and the circulating liquid supply pipe are respectively located at the upper and lower ends of the current equalizing tube, and the number of the nozzles is equal to the electroplating channel and is connected one-to-one. The current equalizing plate is horizontally arranged inside the current equalizing tube along its length, and multiple current equalizing holes are arranged on the current equalizing plate, and the current equalizing holes are staggered with the nozzles.

11. The electroplating solution circulation system according to claim 7, characterized in that: The electroplating solution circulation system also includes a temporary storage tank, and the plurality of liquid storage tanks are all connected to the temporary storage tank.

Images