Electroplating clamp for silver plating of semiconductor wafer

Abstract

The utility model discloses an electroplating clamp for silver plating of a semiconductor wafer, which comprises a clamp, a clamping groove is arranged on one side of the upper end face of the clamp, a wafer is arranged in the clamping groove, a cover plate is arranged above the wafer, and two sides of the upper end face of the cover plate are respectively connected with a lifting locking mechanism. The lifting locking mechanism comprises an L-shaped connecting support, a fixing groove, an L-shaped fixing plate and an elastic lifting transmission mechanism, the L-shaped connecting support is fixed to the upper end face of the cover plate, and the fixing groove is located in the outer surface of the L-shaped connecting support; the L-shaped fixing plate can be pushed towards the L-shaped connecting support in the process of moving the L-shaped connecting support downwards through the elastic lifting transmission mechanism. According to the utility model, the cover plate used for clamping the wafer can be automatically fixed, so that the cover plate does not need to be manually locked by using bolts in the wafer clamping process, and the operation complexity of the equipment is reduced through the technical scheme.

Description

Technical Field

[0001] The utility model relates to the technical field of clamps, in particular to an electroplating clamp for silver plating of semiconductor wafers. Background Art

[0002] Semiconductor wafers, also known as wafers for short, are round sheets made of high-purity silicon. Silicon is a type of semiconductor material that has the property of conducting electricity under certain conditions, which makes it an ideal material for manufacturing integrated circuits. The diameter of wafers ranges from a few inches to 12 inches. With the development of technology, the increase in diameter can increase the number of chips on a single wafer, thereby reducing costs. In order to improve the conductivity of the wafer, a layer of silver is plated on its outer surface using electroplating technology during its production process. Silver has ultra-low resistance and high conductivity. Silver plating can greatly reduce the resistance of the wafer surface, making it easier for electrons to flow, thereby improving the conductivity of the semiconductor. The clamp used in this electroplating process can be called a semiconductor wafer silver plating clamp;

[0003] However, when the wafer is fixed inside the fixture, in order to ensure the sealing, the pressure plate is pressed down with a large force so that the wafer is pressed tightly by the pressure plate. However, when the pressure plate presses the wafer, thicker wafers will be subjected to a greater clamping force, and thinner wafers are more brittle, resulting in thicker or thinner wafers being easily cracked due to the large clamping force. Patent application publication number CN117926377A in the prior art is a wafer electroplating fixture that generally places the wafer on the top of the sealing ring, the supporting portion of the spring contacts the bottom of the wafer and also contacts the sealing portion of the sealing ring, and the wafer is clamped by pressing down the cover plate. After the cover plate presses the wafer, it is locked on the carrier plate by bolts. In the process of pressing down the cover plate, the wafer presses down the supporting portion. After the supporting portion is subjected to force, the tilt angle decreases, and the thicker the wafer, the smaller the tilt angle. The wafers are all in a clamped state in the volume buffer, thereby solving the above-mentioned problem.

[0004] However, when using this type of equipment, it is necessary to manually use bolts to lock the cover to clamp the wafer, and when the electroplating process on the wafer is completed, it is necessary to remove the fixing bolts again and manually remove the cover before the wafer can be taken out from the clamping groove. The operation is relatively cumbersome; therefore, it does not meet the existing needs. In this regard, we propose a plating fixture for silver plating of semiconductor wafers. Utility Model Content

[0005] The purpose of the utility model is to provide a plating clamp for silver plating of semiconductor wafers, so as to solve the problems raised in the above-mentioned background technology that when using such equipment, it is necessary to manually use bolts to lock the cover plate to clamp the wafer, and when the electroplating treatment of the wafer is completed, it is necessary to remove the fixing bolts again and manually remove the cover plate before the wafer can be taken out from the inside of the clamping groove, and the operation is relatively cumbersome.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a plating fixture for silver plating of semiconductor wafers, comprising a fixture, a clamping groove is provided on one side of the upper end surface of the fixture, a wafer is provided inside the clamping groove, a cover plate is provided above the wafer, and a lifting and locking mechanism is connected to both sides of the upper end surface of the cover plate, the lifting and locking mechanism comprises an L-shaped connecting bracket, a fixing groove, an L-shaped fixing plate and an elastic lifting transmission mechanism, the L-shaped connecting bracket is fixed to the upper end surface of the cover plate, the fixing groove is located on the outer surface of the L-shaped connecting bracket, and the elastic lifting transmission mechanism can push the L-shaped fixing plate in the direction of the L-shaped connecting bracket during the process of moving the L-shaped connecting bracket downward.

[0007] Preferably, the elastic lifting transmission mechanism includes a cylindrical hollow shell, a stepper motor is fixedly installed on the upper side of the cylindrical hollow shell, the output shaft of the stepper motor is connected to a transmission shaft through a coupling, and the lower end surface of the transmission shaft is connected to a threaded rod.

[0008] Preferably, an internal thread sleeve is sleeved on the upper side of the outer surface of the threaded rod, the internal thread of the internal thread sleeve matches the external thread of the threaded rod, and one side of the outer surface of the internal thread sleeve is slidably connected to the inner wall of the cylindrical hollow shell.

[0009] Preferably, a circular opening is provided on one side of the outer surface of the L-shaped connecting bracket, the threaded rod vertically passes through the circular opening, and the inner wall diameter of the circular opening is larger than the cross-sectional diameter of the threaded rod.

[0010] Preferably, a connecting rod is fixedly provided on both sides of the upper end surface of the L-shaped connecting bracket, and the connecting rod vertically moves through the internal threaded sleeve, and a limit sleeve is provided on the upper side of the outer surface of the internal threaded sleeve, and the lower end surface of the limit sleeve is fitted with the upper end surface of the internal threaded sleeve, and both sides of the lower end surface of the internal threaded sleeve are connected to a spring respectively sleeved on the outer surfaces of the two connecting rods.

[0011] Preferably, an L-shaped downward pressing and pushing plate movably mounted inside the cylindrical hollow shell is provided below the internal threaded sleeve, the L-shaped fixed plate is located below the L-shaped downward pressing and pushing plate, the surface of the L-shaped downward pressing and pushing plate facing the L-shaped fixed plate and the surface of the L-shaped fixed plate facing the L-shaped downward pressing and pushing plate are both inclined surfaces, and a return spring is connected to one side of the outer surface of the L-shaped downward pressing and pushing plate.

[0012] Preferably, a circular metal cover plate is provided above the stepper motor and is located on the outer surface of the cylindrical hollow shell, and the cylindrical hollow shell and the circular metal cover plate are fixed by screws.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The utility model can automatically move the cover plate up and down to fix the wafer through the lifting and locking mechanism. The above technical solution reduces the cumbersomeness of the operation of the device, so that it is no longer necessary to manually use bolts to lock the cover plate to clamp the wafer;

[0015] 2. The utility model can move the cover plate to the inside of the clamping groove to fix the wafer, and then push the L-shaped fixing plate toward the L-shaped connecting bracket through the lifting and locking mechanism until the L-shaped fixing plate is inserted into the inside of the fixing groove located on the outer surface of the L-shaped connecting bracket. The L-shaped fixing plate inserted into the fixing groove can fix the L-shaped connecting bracket fixed to the cover plate. When the L-shaped connecting bracket is fixed, the cover plate fixed thereto will also be fixed. The above technical solution can prevent the cover plate from moving without authorization due to the external environment, thereby improving the stability of the structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is the front view of the internal structure of the utility model as a whole;

[0018] Figure 3 For this utility model Figure 2 A magnified view of the structure at center A;

[0019] Figure 4 For this utility model Figure 3 A magnified view of the structure at point B.

[0020] In the figure: 1. clamp; 2. clamping groove; 3. wafer; 4. cover plate; 5. L-shaped connecting bracket; 6. cylindrical hollow shell; 7. stepper motor; 8. threaded rod; 9. internal threaded sleeve; 10. circular opening; 11. connecting rod; 12. limit sleeve; 13. spring; 14. fixing groove; 15. L-shaped downward push plate; 16. L-shaped fixing plate; 17. reset spring. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0022] The wafer 3 (model SIO2), the stepper motor 7 (model 2S86Q) and the return spring 17 (model JX110) mentioned in the present invention can be purchased from the market or obtained through private customization.

[0023] See also Figures 1 to 4An embodiment of the utility model is: a plating fixture for silver plating of semiconductor wafers, comprising a fixture 1, a clamping groove 2 is provided on one side of the upper end surface of the fixture 1, a wafer 3 is provided inside the clamping groove 2, a cover plate 4 is provided above the wafer 3, and a lifting and locking mechanism is connected to both sides of the upper end surface of the cover plate 4. The lifting and locking mechanism comprises an L-shaped connecting bracket 5, a fixing groove 14, an L-shaped fixing plate 16 and an elastic lifting transmission mechanism. The L-shaped connecting bracket 5 is fixed to the upper end surface of the cover plate 4, and the fixing groove 14 is located on the outer surface of the L-shaped connecting bracket 5. The L-shaped fixing plate 16 can be pushed toward the direction of the L-shaped connecting bracket 5 during the process of moving the L-shaped connecting bracket 5 downward through the elastic lifting transmission mechanism.

[0024] The elastic lifting transmission mechanism includes a cylindrical hollow shell 6, a stepper motor 7 is fixedly installed on the upper side of the cylindrical hollow shell 6, the output shaft of the stepper motor 7 is connected to a transmission shaft through a coupling, and the lower end face of the transmission shaft is connected to a threaded rod 8; when it is necessary to fix the wafer 3 placed in the clamping groove 2, start the stepper motor 7, and the stepper motor 7 can drive the threaded rod 8 connected to it through the transmission shaft to rotate.

[0025] An internal threaded sleeve 9 is sleeved on the upper side of the outer surface of the threaded rod 8, the internal thread of the internal threaded sleeve 9 matches the external thread of the threaded rod 8, and one side of the outer surface of the internal threaded sleeve 9 is slidingly connected to the inner wall of the cylindrical hollow shell 6; since one side of the outer surface of the internal threaded sleeve 9 sleeved on the outer surface of the threaded rod 8 is slidingly connected to the inner wall of the cylindrical hollow shell 6, the internal threaded sleeve 9 itself cannot rotate. When the threaded rod 8 rotates, the internal threaded sleeve 9 that cannot rotate itself will move up and down under the transmission of the threaded structure.

[0026] A circular opening 10 is provided on one side of the outer surface of the L-shaped connecting bracket 5, and the threaded rod 8 vertically penetrates the circular opening 10, and the inner wall diameter of the circular opening 10 is larger than the cross-sectional diameter of the threaded rod 8; a connecting rod 11 is fixedly provided on both sides of the upper end surface of the L-shaped connecting bracket 5, and the connecting rod 11 vertically movably penetrates the internal threaded sleeve 9, and a limiting sleeve 12 is sleeved on the upper side of the outer surface of the internal threaded sleeve 9, and the lower end surface of the limiting sleeve 12 is fitted with the upper end surface of the internal threaded sleeve 9, and both sides of the lower end surface of the internal threaded sleeve 9 are connected with a spring 13 respectively sleeved on the outer surfaces of the two connecting rods 11; through the spring force of the spring 13, it can be Ensure that there is always a distance between the internal threaded sleeve 9 and the L-shaped connecting bracket 5. When the internal threaded sleeve 9 moves downward, the L-shaped connecting bracket 5 indirectly connected to it and the cover plate 4 fixedly connected to the L-shaped connecting bracket 5 will move downward synchronously. The downward moving cover plate 4 will gradually enter the interior of the clamping groove 2 to fix the wafer 3 placed in the clamping groove 2. When the cover plate 4 has clamped the wafer 3 and can no longer move downward but the internal threaded sleeve 9 continues to move downward, the distance between the internal threaded sleeve 9 and the L-shaped connecting bracket 5 will gradually shorten and squeeze the spring 13.

[0027] An L-shaped downward pressing and pushing plate 15 movably mounted inside the cylindrical hollow shell 6 is provided below the internal threaded sleeve 9, and an L-shaped fixed plate 16 is located below the L-shaped downward pressing and pushing plate 15. The surface of the L-shaped downward pressing and pushing plate 15 facing the L-shaped fixed plate 16 and the surface of the L-shaped fixed plate 16 facing the L-shaped downward pressing and pushing plate 15 are both inclined surfaces, and a return spring 17 is connected to one side of the outer surface of the L-shaped downward pressing and pushing plate 15; when the L-shaped connecting bracket 5 has stayed in place but the internal threaded sleeve 9 continues to move downward, the lower end surface of the internal threaded sleeve 9 moving downward will contact the L-shaped downward pressing and pushing plate 15 and drive the L-shaped downward pressing and pushing plate 15 to move downward together, and the L-shaped downward pressing and pushing plate 15 and the L-shaped downward pressing and pushing plate 15 are connected to the L-shaped downward pressing and pushing plate 15. The inclined surface of the outer surface of the fixing plate 16, the L-shaped fixing plate 16 located below the L-shaped downward pressing and pushing plate 15 will be pushed toward the direction of the L-shaped connecting bracket 5, and the L-shaped fixing plate 16 moving toward the direction of the L-shaped connecting bracket 5 will be stuck in the inside of the fixing groove 14 located on the outer surface of the L-shaped connecting bracket 5 that remains in the original place. The L-shaped fixing plate 16 stuck in the inside of the fixing groove 14 can fix the L-shaped connecting bracket 5 fixed to the cover plate 4. When the L-shaped connecting bracket 5 is fixed, the cover plate 4 fixed thereto will also be fixed accordingly. The above technical solution can prevent the cover plate 4 from moving without authorization due to the external environment, thereby improving the stability of this structure.

[0028] When the L-shaped fixing plate 16 is pushed toward the direction of the L-shaped connecting bracket 5, the reset spring 17 will be squeezed accordingly. When the wafer 3 needs to be taken out, the threaded rod 8 is driven to rotate in the opposite direction by the stepping motor 7. The threaded rod 8 rotating in the opposite direction will drive the internal threaded sleeve 9 to move upward. As the internal threaded sleeve 9 moves, the spring 13 between the internal threaded sleeve 9 and the L-shaped connecting bracket 5 will become loose accordingly. Only when the upper end surface of the internal threaded sleeve 9 contacts the limiting sleeve 12 fixedly sleeved on the outer surface of the connecting rod 11, the internal threaded sleeve 9 moving upward will start to drive the L-shaped connecting bracket 5 to move upward. As the internal threaded sleeve 9 rises, the reaction force of the squeezed reset spring 17 can gradually push the L-shaped fixing plate 16 outward. As the L-shaped fixing plate 16 moves, the L-shaped fixing plate 16 stuck in the fixing groove 14 gradually leaves the inside of the fixing groove 14. When the L-shaped fixing plate 16 completely leaves the inside of the fixing groove 14, the fixation of the L-shaped connecting bracket 5 is released.

[0029] When the cover plate 4 moves back to its original position, the wafer 3 can be directly taken out from the inside of the clamping groove 2. The above technical solution reduces the complexity of operating the device, and it is no longer necessary to manually use bolts to lock the cover plate 4 to clamp the wafer 3.

[0030] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A plating fixture for silver plating of semiconductor wafers, comprising a fixture (1), characterized in that: A clamping groove (2) is provided on one side of the upper end surface of the clamp (1), a wafer (3) is provided inside the clamping groove (2), a cover plate (4) is provided above the wafer (3), and both sides of the upper end surface of the cover plate (4) are connected to a lifting and locking mechanism, the lifting and locking mechanism comprising an L-shaped connecting bracket (5), a fixing groove (14), an L-shaped fixing plate (16) and an elastic lifting transmission mechanism, the L-shaped connecting bracket (5) is fixed to the upper end surface of the cover plate (4), the fixing groove (14) is located on the outer surface of the L-shaped connecting bracket (5), and the elastic lifting transmission mechanism can push the L-shaped fixing plate (16) in the direction of the L-shaped connecting bracket (5) during the process of moving the L-shaped connecting bracket (5) downward.

2. The electroplating fixture for silver plating of semiconductor wafers according to claim 1, characterized in that: The elastic lifting transmission mechanism comprises a cylindrical hollow shell (6), a stepper motor (7) is fixedly mounted on the upper side of the cylindrical hollow shell (6), an output shaft of the stepper motor (7) is connected to a transmission shaft via a coupling, and a threaded rod (8) is connected to the lower end surface of the transmission shaft.

3. The electroplating fixture for silver plating of semiconductor wafers according to claim 2, characterized in that: An internal thread sleeve (9) is sleeved on the upper side of the outer surface of the threaded rod (8), the internal thread of the internal thread sleeve (9) matches the external thread of the threaded rod (8), and one side of the outer surface of the internal thread sleeve (9) is slidably connected to the inner wall of the cylindrical hollow shell (6).

4. The electroplating fixture for silver plating of semiconductor wafers according to claim 3, characterized in that: A circular opening (10) is provided on one side of the outer surface of the L-shaped connecting bracket (5), the threaded rod (8) vertically passes through the circular opening (10), and the inner wall diameter of the circular opening (10) is greater than the cross-sectional diameter of the threaded rod (8).

5. The electroplating fixture for silver plating of semiconductor wafers according to claim 4, characterized in that: A connecting rod (11) is fixedly provided on both sides of the upper end surface of the L-shaped connecting bracket (5), and the connecting rod (11) vertically movably penetrates the internal threaded sleeve (9). A limiting sleeve (12) is sleeved on the upper side of the outer surface of the internal threaded sleeve (9), and the lower end surface of the limiting sleeve (12) is in contact with the upper end surface of the internal threaded sleeve (9), and both sides of the lower end surface of the internal threaded sleeve (9) are connected to a spring (13) respectively sleeved on the outer surfaces of the two connecting rods (11).

6. The electroplating fixture for silver plating of semiconductor wafers according to claim 3, characterized in that: An L-shaped downward pressing and pushing plate (15) movably mounted inside the cylindrical hollow shell (6) is provided below the internal threaded sleeve (9); the L-shaped fixed plate (16) is located below the L-shaped downward pressing and pushing plate (15); the surface of the L-shaped downward pressing and pushing plate (15) facing the L-shaped fixed plate (16) and the surface of the L-shaped fixed plate (16) facing the L-shaped downward pressing and pushing plate (15) are both inclined surfaces; and a return spring (17) is connected to one side of the outer surface of the L-shaped downward pressing and pushing plate (15).

7. The electroplating fixture for silver plating of semiconductor wafers according to claim 6, characterized in that: A circular metal cover plate is provided above the stepper motor (7) and is located on the outer surface of the cylindrical hollow shell (6), and the cylindrical hollow shell (6) and the circular metal cover plate are fixed by screws.

Images