The invention relates to a resin adhesive vacuum encapsulation device and a process thereof, which belong to the resin adhesive vacuum encapsulation technical field. The encapsulation device comprises a vacuum drying box, a vacuum pump, a sealing tube, a circuit tube, an overflow adhesive cup, connecting pipelines and valves and the like, which wholly form a complete set of differential-pressure vacuum encapsulation system with encapsulating adhesive automatic flowing for vacuum pumping and atmospheric pressure pushing. The differential-pressure encapsulation device has reasonable design and simple and practical structure, and is worth applying and promoting. The encapsulation process includes the following steps of preparing vacuum encapsulation adhesive, assembling the encapsulation device, operating a valve system of the device for a vacuum-pumping process, encapsulating a circuit, and finishing the encapsulation process. The encapsulation process is adopted to form a differential-pressure encapsulation circuit process with automatic flowing of resin adhesive, the encapsulation device is adopted, the resin adhesive is improved, and the whole structure of the circuit is enhanced, and the impact resistance and the vibration resistance and other harsh environment resistance and the insulation performance for the electronic device and components are increased. The encapsulation process of the invention is applied to engineering test under various harsh environments and complex conditions, and has good practical effect.