Electroplating bath of semiconductor electroplating equipment

Abstract

The utility model discloses an electroplating bath of semiconductor electroplating equipment, which comprises an electroplating bath, three support brackets are fixedly mounted on each of two sides of the surface of the top end of the electroplating bath, lifting grooves are formed in the surfaces of the support brackets, and suspension rods are movably mounted between the support brackets on the two sides. Rotating shafts are movably installed in the middle positions of the surfaces of the hanging rods, fixing frames are fixedly installed at the bottom ends of the rotating shafts, a plurality of hooks are movably connected to the surfaces of the bottom ends of the fixing frames in an inserted mode, and a cylinder part is arranged on the outer surface of one fixing frame. According to the device, the hook is rotated to drive the linear plate to rotate in the rotating groove, and when the linear plate rotates to the position of the clamping groove from the interior of the rotating groove, the hook is pulled out downwards, so that the surface position of the fixing frame is vacated, and at the moment, a cylindrical part can be clamped into the surface position of the fixing frame; therefore, the device can be used for electroplating parts with various sizes and different shapes.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating tanks, in particular to an electroplating tank for semiconductor electroplating equipment. Background Art

[0002] The electroplating tank is the most basic equipment in the electroplating equipment, and its main function is to install the solution. The use of the electroplating tank can be arranged in a straight line according to the manual process production line, or arranged according to the site space according to the local conditions. If it is a mechanical automatic production line, it is basically arranged according to the process flow;

[0003] When the electroplating tank is in use, it is usually necessary to hang the parts that need to be electroplated and put them into the electroplating tank for electroplating.

[0004] Regarding the existing patent number: CN202122999490.9, the patent name is: A plating tank for semiconductor electroplating equipment, which places the raw materials inside the main body of the plating tank, and then cooperates with the power motor to provide power to drive the connecting rod and the transmission gear to rotate, which is conducive to the meshing of the transmission gear, thereby driving the stirring column to rotate, and then the rotation of the stirring blade accelerates the flow of the internal liquid to achieve a uniform mixing effect, which solves the problem of uneven input during the addition process, and is conducive to uniform mixing of the device, thereby improving the working efficiency of the device, but when it is in use, it is impossible to hang and clamp different types of parts, which is inconvenient to use.

[0005] When hanging parts in the existing electroplating tank, it is difficult to change the hanging structure according to the size and type of the parts, which makes it inconvenient to use. During electroplating, the parts are stationary in the electroplating solution, and bubbles are easily attached to the surface of the parts, resulting in uneven electroplating. Therefore, it does not meet the existing needs. In this regard, we propose an electroplating tank for semiconductor electroplating equipment. Utility Model Content

[0006] The utility model aims to provide a plating tank for semiconductor electroplating equipment to solve the problems that when suspending parts in the plating tank proposed in the above-mentioned background technology, it is difficult to change the suspension structure according to the size and type of the parts, resulting in inconvenience in use, and when electroplating, the parts are stationary in the plating solution, bubbles are easily attached to the surface of the parts, resulting in uneven electroplating, etc.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a plating tank of a semiconductor electroplating equipment, comprising a plating tank, three supporting brackets are fixedly installed on both sides of the top surface of the plating tank, the surfaces of the supporting brackets are provided with lifting grooves, the positions between the supporting brackets on both sides are movably installed with hanging rods, the middle positions of the surfaces of the hanging rods are movably installed with rotating shafts, the bottom ends of the rotating shafts are fixedly installed with fixing frames, the bottom end surfaces of the fixing frames are movably plugged with a plurality of hooks, and the outer surface of one of the fixing frames is provided with a cylindrical part.

[0008] Preferably, a straight plate is fixedly mounted on the top of the hook, a plurality of card slots are arranged on the bottom surface of the fixing frame, a rotating slot is arranged on the inner side of the card slot, and the straight plate is movably inserted into the rotating slot through the card slot.

[0009] Preferably, the outer surface of the fixing frame is provided with a plurality of spring grooves, movable rods are slidably installed inside the spring grooves, and compression springs are movably installed between the movable rods and the inside of the spring grooves.

[0010] Preferably, an electric push rod is fixedly installed inside the electroplating tank near the supporting bracket, and the output end of the electric push rod is slidably inserted into the interior of the lifting tank. Lifting blocks are fixedly installed at both ends of the suspension rod, and the lifting blocks are slidably inserted into the interior of the lifting tank, and the output end of the electric push rod is in contact with the bottom end surface of the lifting block.

[0011] Preferably, a connecting plate is fixedly connected between the output ends of the three electric push rods located on the same side, three water collection ports are provided on the bottom surface inside the electroplating tank, pressure relief valves are provided inside the water collection ports, and a drain pipe is fixedly installed on one side of the surface of the electroplating tank.

[0012] Preferably, the outer surface of the movable rod is in contact with the inner wall surface of the cylindrical part, a servo motor is fixedly installed at the middle position of the top end of the suspension rod, and the output end of the servo motor is connected to the rotating shaft through a coupling.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The utility model cooperates with the hook and the movable rod so that when the device electroplates the parts, smaller parts can be hung at the position of the hook, so that multiple small parts can be electroplated. At the same time, when it is necessary to hang larger or cylindrical parts, such as cylindrical parts, the hook can be rotated first, so that the hook drives the straight plate to rotate inside the rotating groove. When the straight plate rotates from the inside of the rotating groove to the position of the clamping groove, the hook is pulled out downward to vacate the surface position of the fixed frame. At this time, according to the inner diameter size of the cylindrical part, the movable rod can be pressed inward to retract the movable rod to the inside of the spring groove, and then the cylindrical part is clamped into the surface position of the fixed frame. At this time, the movable rod is subjected to the elastic potential energy of the compression spring and pops outward to clamp the cylindrical part, so that the device can electroplate parts of various sizes and shapes;

[0015] 2. The utility model cooperates with the servo motor and the rotating shaft. When the device is electroplating parts, the output end can be retracted by the electric push rod, so that the output end of the electric push rod no longer supports the lifting block. The lifting block will descend according to the output end of the electric push rod due to gravity inside the lifting slot, so that the parts suspended on the hook surface or installed on the surface of the fixed frame are placed in the electroplating liquid. Then the servo motor can be controlled to drive the rotating shaft to rotate slowly, so that the rotating shaft drives the fixed frame, that is, the fixed frame drives the parts to rotate in the electroplating liquid, so that the parts are fully shaken to get rid of the bubble attachment of the parts and achieve the purpose of uniform electroplating effect during the electroplating process, thereby improving the efficiency of electroplating. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a sectional side view of the utility model as a whole;

[0018] Figure 3 It is a cross-sectional front view of the utility model as a whole;

[0019] Figure 4 For this utility model Figure 2 Schematic diagram of the local structure of part A;

[0020] Figure 5 For this utility model Figure 3 Schematic diagram of the local structure of part B.

[0021] In the figure: 1. electroplating tank; 2. supporting bracket; 3. lifting tank; 4. hanging rod; 5. lifting block; 6. servo motor; 7. rotating shaft; 8. fixing frame; 9. movable rod; 10. hook; 11. drain pipe; 12. electric push rod; 13. connecting plate; 14. cylindrical part; 15. straight plate; 16. spring groove; 17. compression spring; 18. rotating slot; 19. card slot; 20. water collection port. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0023] See also Figures 1 to 5 The utility model provides an embodiment: a plating tank of a semiconductor electroplating device, comprising a plating tank 1, three support brackets 2 are fixedly installed on both sides of the top surface of the plating tank 1, and the surfaces of the support brackets 2 are provided with lifting grooves 3, and the positions between the support brackets 2 on both sides are movably installed with hanging rods 4, and the middle positions of the surfaces of the hanging rods 4 are movably installed with rotating shafts 7, and the bottom ends of the rotating shafts 7 are fixedly installed with fixing frames 8, and the bottom end surfaces of the fixing frames 8 are movably plugged with multiple hooks 10, and the outer surface of one of the fixing frames 8 is provided with a cylindrical part 14.

[0024] A straight plate 15 is fixedly installed on the top of the hook 10, and a plurality of card slots 19 are provided on the bottom surface of the fixing frame 8. The inner sides of the card slots 19 are provided with rotation slots 18, and the straight plates 15 are movably inserted into the rotation slots 18 through the card slots 19. Through the cooperation of the hook 10 and the movable rod 9, when the device is electroplating parts, smaller parts can be hung at the position of the hook 10, so that multiple small parts can be electroplated. At the same time, when it is necessary to hang larger or cylindrical parts, such as the cylindrical part 14, the hook 10 can be rotated first, so that the hook 10 drives the straight plate 15 to rotate inside the rotating groove 18. When the straight plate 15 rotates from the inside of the rotating groove 18 to the position of the clamping groove 19, the hook 10 is pulled out downward to vacate the surface position of the fixed frame 8. At this time, according to the inner diameter size of the cylindrical part 14, the movable rod 9 can be pressed inward to retract the movable rod 9 to the inside of the spring groove 16, and then the cylindrical part 14 is clamped into the surface position of the fixed frame 8. At this time, the movable rod 9 is subjected to the elastic potential energy of the compression spring 17, and pops outward to clamp the cylindrical part 14, so that the device can electroplate parts of various sizes and shapes.

[0025] The outer surface of the fixing frame 8 is provided with a plurality of spring grooves 16 , and movable rods 9 are slidably installed inside the spring grooves 16 , and compression springs 17 are movably installed between the movable rods 9 and the inside of the spring grooves 16 .

[0026] Electric push rods 12 are fixedly installed at positions near the support bracket 2 inside the electroplating tank 1, and the output ends of the electric push rods 12 are slidably inserted into the interior of the lifting tank 3. Lifting blocks 5 are fixedly installed at both ends of the hanging rod 4, and the lifting blocks 5 are slidably inserted into the interior of the lifting tank 3, and the output ends of the electric push rods 12 are in contact with the bottom surface of the lifting blocks 5. Through the cooperation of the servo motor 6 and the rotating shaft 7, when the device is electroplating the parts, the output end can be retracted by the electric push rod 12, so that the output end of the electric push rod 12 no longer supports the lifting block 5, and the lifting block 5 will fall inside the lifting tank 3 according to the output end of the electric push rod 12 due to gravity, so that the parts suspended on the surface of the hook 10 or installed on the surface of the fixed frame 8 are placed in the electroplating solution, and then the servo motor 6 can be controlled to drive the rotating shaft 7 to rotate slowly, so that the rotating shaft 7 drives the fixed frame 8, that is, the fixed frame 8 drives the parts to rotate in the electroplating solution, so that the parts are fully shaken to get rid of the bubble attachment of the parts and achieve the purpose of uniform electroplating effect during the electroplating process, thereby improving the efficiency of electroplating.

[0027] A connecting plate 13 is fixedly connected between the output ends of the three electric push rods 12 located on the same side, three water collection ports 20 are provided on the bottom surface inside the electroplating tank 1, and pressure relief valves are provided inside the water collection ports 20. A drain pipe 11 is fixedly installed on one side of the surface of the electroplating tank 1.

[0028] The outer surface of the movable rod 9 is in contact with the inner wall surface of the cylindrical part 14 , and a servo motor 6 is fixedly installed at the middle position of the top end of the hanging rod 4 , and the output end of the servo motor 6 is connected to the rotating shaft 7 through a coupling.

[0029] When the electroplating tank of the semiconductor electroplating equipment is in use, small parts are first hung on the surface of the hook 10, and when it is necessary to clamp large parts or parts in the shape of the cylindrical part 14, the hook 10 can be rotated first, so that the hook 10 drives the straight plate 15 to rotate inside the rotating groove 18. When the straight plate 15 rotates from the inside of the rotating groove 18 to the position of the clamping groove 19, the hook 10 is pulled out downward to vacate the surface position of the fixing frame 8. At this time, according to the inner diameter size of the cylindrical part 14, the movable rod 9 can be pressed inward to retract the movable rod 9 to the inside of the spring groove 16, and then the cylindrical part 14 is clamped into the surface position of the fixing frame 8. At this time, the movable rod 9 is subjected to the elastic potential energy of the compression spring 17, and pops outward to clamp the cylindrical part 14, thereby completing the clamping of the parts;

[0030] Then, the electric push rod 12 is controlled to retract the output end, so that the output end of the electric push rod 12 no longer supports the lifting block 5. The lifting block 5 will drop inside the lifting slot 3 according to the output end of the electric push rod 12 due to gravity, so that the parts suspended on the surface of the hook 10 or mounted on the surface of the fixed frame 8 are placed in the electroplating liquid. Then, the servo motor 6 can be controlled to drive the rotating shaft 7 to rotate slowly, so that the rotating shaft 7 drives the fixed frame 8, that is, the fixed frame 8 drives the parts to rotate in the electroplating liquid, so as to fully shake the parts to get rid of the bubble attachment and achieve the purpose of uniform electroplating effect during the electroplating process, thereby completing the electroplating of the parts.

[0031] Finally, when the electroplating of the parts is completed, the electric push rod 12 is controlled to push out the output end, so that the output end of the electric push rod 12 pushes the lifting block 5 from the bottom end of the lifting tank 3 to the top, thereby removing the parts from the electroplating liquid, and then through the pressure relief valve inside the water collection port 20, all the plating liquid flows into the bottom end of the electroplating tank 1 through the water collection port 20, and the plating liquid is discharged and recycled through the drain pipe 11.

[0032] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. An electroplating tank for semiconductor electroplating equipment, comprising an electroplating tank (1), characterized in that: Three support brackets (2) are fixedly installed on both sides of the top surface of the electroplating tank (1), and the surfaces of the support brackets (2) are provided with lifting grooves (3). The positions between the support brackets (2) on both sides are movably installed with hanging rods (4), and the middle positions of the surfaces of the hanging rods (4) are movably installed with rotating shafts (7). The bottom ends of the rotating shafts (7) are fixedly installed with fixing frames (8), and the bottom end surfaces of the fixing frames (8) are movably plugged with multiple hooks (10), and the outer surface of one of the fixing frames (8) is provided with a cylindrical part (14).

2. The electroplating tank of a semiconductor electroplating device according to claim 1, characterized in that: A straight-shaped plate (15) is fixedly mounted on the top of the hook (10), a plurality of clamping grooves (19) are provided on the bottom surface of the fixing frame (8), a rotating groove (18) is provided inside the clamping groove (19), and the straight-shaped plate (15) is movably clamped into the inside of the rotating groove (18) through the clamping groove (19).

3. The electroplating tank of a semiconductor electroplating device according to claim 1, characterized in that: The outer surface of the fixing frame (8) is provided with a plurality of spring grooves (16), and movable rods (9) are slidably installed inside the spring grooves (16), and compression springs (17) are movably installed between the movable rods (9) and the inside of the spring grooves (16).

4. The electroplating tank of a semiconductor electroplating device according to claim 1, characterized in that: An electric push rod (12) is fixedly installed at a position near the supporting bracket (2) inside the electroplating tank (1), and the output end of the electric push rod (12) is slidably inserted into the interior of the lifting groove (3). Lifting blocks (5) are fixedly installed at both ends of the hanging rod (4), and the lifting blocks (5) are slidably inserted into the interior of the lifting groove (3), and the output end of the electric push rod (12) is in contact with the bottom surface of the lifting block (5).

5. The electroplating tank of a semiconductor electroplating device according to claim 4, characterized in that: A connecting plate (13) is fixedly connected between the output ends of the three electric push rods (12) located on the same side, three water collection ports (20) are provided on the bottom surface inside the electroplating tank (1), and pressure relief valves are provided inside the water collection ports (20), and a drainage pipe (11) is fixedly installed on one side of the surface of the electroplating tank (1).

6. The electroplating tank of a semiconductor electroplating device according to claim 3, characterized in that: The outer surface of the movable rod (9) is in contact with the inner wall surface of the cylindrical part (14); a servo motor (6) is fixedly installed at the middle position of the top end of the suspension rod (4); and the output end of the servo motor (6) is connected to the rotating shaft (7) via a coupling.

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