Bridge vibration monitoring system based on IMU

Abstract

The utility model discloses a bridge vibration monitoring system based on an IMU, and belongs to the technical field of bridge vibration monitoring. Comprising a single-chip microcomputer, an IMU sensor, a 4G module, a battery interface module, a LoRa communication module, a sensor switch control circuit connected with the IMU sensor, a 4G module switch control circuit connected with the 4G module, a battery connected with the battery interface module, and a solar photovoltaic battery charging module connected with the battery, wherein the IMU sensor, the 4G module, the battery interface module and the LoRa communication module are connected with the single-chip microcomputer. The camera module is in wireless connection with the LoRa communication module, the server is in wireless connection with the 4G module, and the battery interface module is connected with the sensor switch control circuit and the 4G module switch control circuit. According to the utility model, data can be rapidly and accurately detected and processed, traffic flow and road conditions can be detected at the same time, the data can be transmitted to the server for storage, and the query of bridge vibration states at characteristic time and the query of traffic flow and road conditions at corresponding time can be realized.

Description

Technical Field

[0001] The utility model belongs to the technical field of bridge vibration monitoring, and in particular relates to an IMU-based bridge vibration monitoring system. Background Art

[0002] Bridge safety issues have received widespread attention from the whole society. The reasons for bridge collapse are varied, including: bridge collapse caused by natural disasters, including but not limited to floods, typhoons, earthquakes, etc.; accidents during construction, many of which involve risky construction that violates relevant safety operation regulations; bridge collapse caused by human factors such as overloading, traffic accidents, and accidental damage; problems left over from the early planning and design process, resulting in substandard bridge quality and accidents after being put into use; bridge collapse due to large vibration amplitude. Due to the frequent occurrence of bridge collapse accidents in recent years, health detection and real-time maintenance of beam structures have become urgent.

[0003] Currently, the detection of bridge health status mostly adopts manual detection and maintenance of bridge data, but these methods are slow, costly and have safety risks. At the same time, it is impossible to obtain real-time information on the health status of the bridge. It takes a long time to complete the data collection of the bridge structure, the monitoring efficiency is low, and it is difficult to ensure the consistency of the working status of the data at each measuring point, and the accuracy of the manually recorded and processed data. Utility Model Content

[0004] In view of the above-mentioned deficiencies in the prior art, the utility model provides a bridge vibration monitoring system and method, which can solve the problem of being unable to detect bridge data in real time and accurately by collecting characteristic values ​​such as dynamic displacement, vibration acceleration, and vibration frequency of the bridge, thereby solving the current problems of slow speed, low efficiency, high cost and safety risks in the detection of bridge structures.

[0005] In order to achieve the above-mentioned purpose of the utility model, the technical solution adopted by the utility model is: a bridge vibration monitoring system based on IMU, including: a single-chip microcomputer, an IMU sensor connected to the single-chip microcomputer respectively, a 4G module, a battery interface module and a LoRa communication module, a sensor switch control circuit connected to the IMU sensor, a 4G module switch control circuit connected to the 4G module, a battery connected to the battery interface module, a solar photovoltaic battery charging module connected to the battery, a camera module wirelessly connected to the LoRa communication module and a server wirelessly connected to the 4G module, and the battery interface module is respectively connected to the sensor switch control circuit and the 4G module switch control circuit.

[0006] Further: the IMU sensor includes a sensor chip U2;

[0007] The 1st pin, the 2nd pin, the 3rd pin, the 10th pin and the 11th pin of the sensor chip U2 are all grounded, the 5th pin of the sensor chip U2 is respectively connected to the battery interface module and one end of the capacitor C23, the other end of the capacitor C23 is connected to the 6th pin and the 7th pin of the sensor chip U2, and is grounded, the 8th pin of the sensor chip U2 is respectively connected to the battery interface module, the grounded capacitor C24 and the grounded capacitor C25, the 12th pin of the sensor chip U2 is connected to one end of the resistor R14, the other end of the resistor R14 is connected to the battery interface module, the 13th pin of the sensor chip U2 is connected to one end of the resistor R12, the 14th pin of the sensor chip U2 is connected to one end of the resistor R13, the other end of the resistor R12 is connected to the other end of the resistor R13, and is grounded.

[0008] Further: the single chip microcomputer includes a chip U1;

[0009] The first pin of the chip U1 is connected to one end of the resistor R10, the other end of the resistor R10 is connected to one end of the protection battery U6, and the other end of the protection battery U6 ​​is grounded. The third pin, the fourth pin, the fifth pin and the sixth pin of the chip U1 are all connected to the crystal oscillator. The seventh pin of the chip U1 is respectively connected to one end of the capacitor C20, the resistor R9 and one end of the switch S1. The other end of the resistor R9 is connected to the battery interface module. The other end of the switch S1 is connected to the other end of the capacitor C20 and is grounded. The 12th pin of the chip U1 is respectively connected to the 18th pin, the 63rd pin, one end of the capacitor C21 and one end of the capacitor C22 and is grounded. The other end of the capacitor C21 is connected to the 47th pin of the chip U1, and the other end of the capacitor C22 is connected to the 31st pin of the chip U1. The 13th pin of the chip U1 is respectively connected to the 19th pin, the 3 The 2nd pin, the 48th pin, the 64th pin, and one end of the resistor R11 are connected to the battery interface module, the other end of the resistor R11 is connected to the positive electrode of the light-emitting diode D1, and the negative electrode of the light-emitting diode D1 is grounded, the 16th pin, the 17th pin, the 34th pin and the 35th pin of the chip U1 are all connected to the LoRa module, the 29th pin of the chip U1, the 24th pin, the 42nd pin, the 43rd pin, the 51st pin and the 52nd pin of the chip U1 are all connected to the 4G module, the 55th pin of the chip U1 is connected to the 3rd pin of the LED lamp D3, the 56th pin of the chip U1 is connected to the 1st pin of the LED lamp D3, the 2nd pin of the LED lamp D3 is connected to one end of the resistor R8, the other end of the resistor R8 is connected to the battery interface module, and the 46th and 47th pins of the chip U1 are connected to the serial port J1.

[0010] Further: the 4G module includes a 4G chip P1;

[0011] The first pin of the 4G chip P1 is connected to the 24th pin of the chip U1, the second pin, the 11th pin, the 17th pin, the 18th pin, the 19th pin, the 20th pin, the 21st pin, the 22nd pin, the 23rd pin, the 26th pin, the 27th pin, the 28th pin, the 29th pin, the 30th pin and the 31st pin of the 4G chip P1 are all grounded, the sixth pin of the 4G chip P1 is connected to the 52nd pin of the chip U1, the eighth pin of the 4G chip P1 is connected to the 43rd pin of the chip U1, Pin 9 of the 4G chip P1 is connected to pin 42 of the chip U1, pin 10 of the 4G chip P1 is connected to pin 51 of the chip U1, pins 15 and 16 of the 4G chip P1 are both connected to a 4.2V power supply, pins 24 and 25 of the 4G chip P1 are both connected to a battery interface module, pin 32 of the 4G chip P1 is connected to the cathode of the light-emitting diode D2, the anode of the light-emitting diode D2 is connected to one end of the resistor R1, and the other end of the resistor R1 is connected to the battery interface module.

[0012] Further: the LoRa communication module includes a LoRa communication chip U9A;

[0013] The first pin of the LoRa communication chip U9A is respectively connected to one end of the capacitor C1 and one end of the capacitor C2, and is grounded. The other end of the capacitor C1 and the other end of the capacitor C2 are connected to the second pin of the LoRa communication chip U9A and the battery interface module. The third pin of the LoRa communication chip U9A is connected to one end of the resistor R2, and the other end of the resistor R2 is connected to the positive electrode of the light-emitting diode D4, and the negative electrode of the light-emitting diode D4 is grounded. The fourth pin of the LoRa communication chip U9A is connected to the 17th pin of the chip U1. Pin 5 of the LoRa communication chip U9A is connected to pin 16 of the chip U1, pin 6 of the LoRa communication chip U9A is connected to pin 34 of the chip U1, pins 12, 13 and 14 of the LoRa communication chip U9A are all grounded, pin 22 of the LoRa communication chip U9A is respectively connected to one end of the resistor R3 and one end of the capacitor C3, the other end of the resistor R3 is connected to the battery interface module, and the other end of the capacitor C3 is connected to pin 23 of the LoRa communication chip U9A and grounded.

[0014] The beneficial effects of the utility model are as follows: the utility model provides a low-power bridge vibration detection system powered by a battery, which can accurately detect and analyze data through a server and a communication module, and can perform real-time and rapid data transmission. When the dynamic displacement of the bridge vibration exceeds a trigger threshold, the camera module is triggered to timely capture and detect vehicle flow and road conditions, and the data is transmitted to the server for storage, thereby realizing the query of the bridge vibration state at a specific time and the query of the vehicle flow and road conditions at the corresponding time. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a structural diagram of a bridge vibration monitoring system based on IMU;

[0016] Figure 2 This is the pin connection diagram of the microcontroller chip STM32F405rgt6;

[0017] Figure 3 This is the pin connection diagram of the acceleration sensor ICM-42688-P;

[0018] Figure 4 This is the pin connection diagram of the 4G chip AIR724UG;

[0019] Figure 5 This is the pin connection diagram of the LoRa communication chip E22-400T33S;

[0020] Figure 6 This is the circuit structure diagram of 4.2V to 3.3V in the battery interface module. DETAILED DESCRIPTION

[0021] The specific implementation methods of the utility model are described below to facilitate technical personnel in this technical field to understand the utility model, but it should be clear that the utility model is not limited to the scope of the specific implementation methods. For ordinary technical personnel in this technical field, as long as various changes are within the spirit and scope of the utility model defined and determined by the attached claims, these changes are obvious, and all utility model creations using the concept of the utility model are protected.

[0022] like Figure 1As shown, a structural diagram of an IMU-based bridge vibration monitoring system includes: a single-chip microcomputer, an IMU sensor connected to the single-chip microcomputer, a 4G module, a battery interface module and a LoRa communication module, a sensor switch control circuit connected to the IMU sensor, a 4G module switch control circuit connected to the 4G module, a battery connected to the battery interface module, a solar photovoltaic battery charging module connected to the battery, a camera module wirelessly connected to the LoRa communication module and a server wirelessly connected to the 4G module, and the battery interface module is respectively connected to the sensor switch control circuit and the 4G module switch control circuit.

[0023] Among them, the single-chip microcomputer is used to process the data detected by the IMU sensor, calculate the real-time dynamic displacement caused by the bridge vibration, and upload it to the cloud server through the communication module;

[0024] IMU sensor, used to detect acceleration data of bridge vibration;

[0025] A sensor switch control circuit, used to control the power supply of the IMU sensor;

[0026] 4G module, used for wireless data communication with cloud servers;

[0027] 4G module switch control circuit, used to control the power supply of the 4G module;

[0028] Solar photovoltaic charging module, used to convert solar energy into electrical energy and store it in batteries;

[0029] Batteries to store electrical energy and provide power to the IMU-based bridge vibration monitoring system;

[0030] Battery interface module, used to distribute voltage to IMU sensor, MCU and 4G module;

[0031] LoRa communication module, used to control the camera module recording on and off;

[0032] A camera module is used to capture the traffic and road conditions on the bridge;

[0033] The server is used to parse the bridge data uploaded by the microcontroller and save it. It can transmit data wirelessly with the 4G module or in wired form through the bus RS485.

[0034] In one embodiment of the utility model, the single chip microcomputer can be selected from STM32F405rgt6, the 4G module can be selected from AIR724UG, the IMU sensor can be selected from the acceleration sensor ICM-42688-P, the battery can be selected from a 4.2V lithium battery, and the LoRa communication module can be selected from E22-400T33S.

[0035] In one embodiment of the present invention, Figure 2 As shown in FIG. 1 , it is a pin connection diagram of the single-chip microcomputer chip STM32F405rgt6, wherein the first pin of the single-chip microcomputer chip STM32F405rgt6 is connected to one end of the resistor R10, the other end of the resistor R10 is connected to one end of the protection battery U6, the other end of the protection battery U6 ​​is grounded, the third pin, the fourth pin, the fifth pin and the sixth pin of the single-chip microcomputer chip STM32F405rgt6 are all connected to the crystal oscillator, the seventh pin of the single-chip microcomputer chip STM32F405rgt6 is respectively connected to one end of the capacitor C20, the resistor R9 and one end of the switch S1, and the resistor R The other end of switch S1 is connected to the VDD33 power supply, the other end of switch S1 is connected to the other end of capacitor C20 and grounded, the 12th pin of single-chip microcomputer chip STM32F405rgt6 is respectively connected to the 18th pin, the 63rd pin, one end of capacitor C21 and one end of capacitor C22 and grounded, the other end of capacitor C21 is connected to the 47th pin of single-chip microcomputer chip STM32F405rgt6, the other end of capacitor C22 is connected to the 31st pin of single-chip microcomputer chip STM32F405rgt6, the 13th pin of single-chip microcomputer chip STM32F405rgt6 is respectively connected to the 18th pin, the 63rd pin, one end of capacitor C21 and one end of capacitor C22 and grounded, the other end of capacitor C21 is connected to the 47th pin of single-chip microcomputer chip STM32F405rgt6, the other end of capacitor C22 is connected to the 31st pin of single-chip microcomputer chip STM32F405rgt6 The 19th, 32nd, 48th, and 64th pins of the single-chip microcomputer chip STM32F405rgt6 are respectively connected to the 19th, 32nd, 48th, and 64th pins, one end of the resistor R11, and the VDD33 power supply. The other end of the resistor R11 is connected to the positive electrode of the light-emitting diode D1, and the negative electrode of the light-emitting diode D1 is grounded. The 16th, 17th, 34th, and 35th pins of the single-chip microcomputer chip STM32F405rgt6 are all connected to the LoRa module. The 29th pin of the single-chip microcomputer chip STM32F405rgt6, the 24th, 42nd, 43rd, and 51st pins of the single-chip microcomputer chip STM32F405rgt6 The 55th and 52nd pins are connected to the 4G module, the 55th pin of the single-chip microcomputer chip STM32F405rgt6 is connected to the 3rd pin of the LED lamp D3, the 56th pin of the single-chip microcomputer chip STM32F405rgt6 is connected to the 1st pin of the LED lamp D3, the 2nd pin of the LED lamp D3 is connected to one end of the resistor R8, and the other end of the resistor R8 is connected to the VDD33 power supply, the 46th and 47th pins of the single-chip microcomputer chip STM32F405rgt6 are connected to the serial port J1, and Table 1 is the other pin connection table of the single-chip microcomputer chip STM32F405rgt6.

[0036] Table 1

[0037]

[0038] Among them, the single-chip microcomputer chip STM32F405rgt6 is connected to the acceleration sensor ICM-42688-P and the electrically erasable programmable read-only memory AT24C08C through the IIC clock line and the IIC data line respectively, and the single-chip microcomputer chip STM32F405rgt6 is connected to the LoRa communication chip E22-400T33S in the camera module through pin RESET, pin USART2_TXD_GPRS, pin USART2_RXD_GPRS, pin AUX, pin M1 and pin M0, and is connected to the isolation transceiver TD301M485 in the RS485 bus isolation circuit through pin 485_TXD and pin 485_RXD.

[0039] In one embodiment of the present invention, Figure 3 As shown in the figure, it is the pin connection diagram of the acceleration sensor ICM-42688-P, wherein the 1st pin, the 2nd pin, the 3rd pin, the 10th pin and the 11th pin of the acceleration sensor ICM-42688-P are all grounded, the 5th pin of the acceleration sensor ICM-42688-P is respectively connected to the VDD33 power supply and one end of the capacitor C23, the other end of the capacitor C23 is connected to the 6th pin and the 7th pin of the sensor chip U2, and is grounded, the 8th pin of the acceleration sensor ICM-42688-P is respectively connected to the VDD33 power supply and one end of the capacitor C23, the other end of the capacitor C23 is connected to the 6th pin and the 7th pin of the sensor chip U2, and is grounded, The 12th pin of the acceleration sensor ICM-42688-P is connected to one end of the resistor R14, and the other end of the resistor R14 is connected to the VDD33 power supply. The 13th pin of the acceleration sensor ICM-42688-P is connected to one end of the resistor R12. The 14th pin of the acceleration sensor ICM-42688-P is connected to one end of the resistor R13, and the other end of the resistor R12 is connected to the other end of the resistor R13 and grounded.

[0040] In one embodiment of the present invention, Figure 4As shown in the figure, it is a pin connection diagram of the 4G chip AIR724UG, wherein the 1st pin of the 4G chip AIR724UG is connected to the 24th pin of the single-chip microcomputer chip STM32F405rgt6, the 2nd pin, the 11th pin, the 17th pin, the 18th pin, the 19th pin, the 20th pin, the 21st pin, the 22nd pin, the 23rd pin, the 26th pin, the 27th pin, the 28th pin, the 29th pin, the 30th pin and the 31st pin of the 4G chip AIR724UG are all grounded, the 6th pin of the 4G chip AIR724UG is connected to the 52nd pin of the single-chip microcomputer chip STM32F405rgt6, the 8th pin of the 4G chip AIR724UG is connected to the 52nd pin of the single-chip microcomputer chip STM32F4 05rgt6, the 9th pin of the 4G chip AIR724UG is connected to the 42nd pin of the single-chip computer chip STM32F405rgt6, the 10th pin of the 4G chip AIR724UG is connected to the 51st pin of the single-chip computer chip STM32F405rgt6, the 15th pin and the 16th pin of the 4G chip AIR724UG are both connected to the 4.2V power supply, the 24th pin and the 25th pin of the 4G chip AIR724UG are both connected to the VDD33 power supply, the 32nd pin of the 4G chip AIR724UG is connected to the cathode of the light-emitting diode D2, the anode of the light-emitting diode D2 is connected to one end of the resistor R1, and the other end of the resistor R1 is connected to the VDD33 power supply.

[0041] In one embodiment of the present invention, Figure 5As shown in the figure, it is a pin connection diagram of the LoRa communication chip E22-400T33S, wherein the first pin of the LoRa communication chip E22-400T33S is respectively connected to one end of the capacitor C1 and one end of the capacitor C2, and is grounded, the other end of the capacitor C1 and the other end of the capacitor C2 are both connected to the second pin of the LoRa communication chip E22-400T33S and the VDD33 power supply, the third pin of the LoRa communication chip E22-400T33S is connected to one end of the resistor R2, the other end of the resistor R2 is connected to the positive electrode of the light emitting diode D4, the negative electrode of the light emitting diode D4 is grounded, and the fourth pin of the LoRa communication chip E22-400T33S is connected to the 17th pin of the microcontroller chip STM32F405rgt6. The 5th pin of the LoRa communication chip E22-400T33S is connected to the 16th pin of the single-chip microcomputer chip STM32F405rgt6, the 6th pin of the LoRa communication chip E22-400T33S is connected to the 34th pin of the single-chip microcomputer chip STM32F405rgt6, the 12th pin, the 13th pin and the 14th pin of the LoRa communication chip E22-400T33S are all grounded, the 22nd pin of the LoRa communication chip E22-400T33S is respectively connected to one end of the resistor R3 and one end of the capacitor C3, the other end of the resistor R3 is connected to the VDD33 power supply, and the other end of the capacitor C3 is connected to the 23rd pin of the LoRa communication chip E22-400T33S and grounded.

[0042] In one embodiment of the present invention, Figure 6 As shown, it is a circuit structure diagram of 4.2V to 3.3V in the battery interface module, wherein the first pin of the linear regulator SGM2036 is a 4.2V power supply access pin, and is connected to one end of the resistor R16, the positive electrode of the grounded capacitor CD3, the positive electrode of the grounded capacitor CD4, the positive electrode of the grounded capacitor CD5 and the positive electrode of the grounded capacitor CD6. The other end of the resistor R16 is connected to the third pin of the linear regulator SGM2036. The linear regulator SGM2 The second pin of SGM2036 is grounded, the fourth pin of linear regulator SGM2036 is connected to grounded capacitor C27, the fifth pin of linear regulator SGM2036 is 3.3V power output pin, and is connected to one end of capacitor C28, the positive electrode of electrolytic capacitor CD7 and the positive electrode of electrolytic capacitor CD8, and the other end of capacitor C28 is connected to the negative electrode of electrolytic capacitor CD7 and the negative electrode of electrolytic capacitor CD8, and is grounded, as shown in Table 2 below, which is the main pin wiring table of battery interface module:

[0043] Table 2

[0044]

[0045] In one embodiment of the present invention, the IMU sensor can select the acceleration sensor ICM-42688-P, and transmit the monitoring data to the SCL1 and SDA1 pins of the single-chip microcomputer STM32F405rgt6 through the IIC clock line and the IIC data line, and the single-chip microcomputer processes the data; the SCL2 pin and the SDA2 pin of the single-chip microcomputer can output the data processing result, and transmit the processing result to the electrically erasable programmable read-only memory AT24C08C through the IIC clock line and the IIC data line; the single-chip microcomputer transmits information to the LoRa communication chip E22-400T33S through the USART2_TXD_GPRS pin and the USART2_RXD_GPRS pin , control the opening and closing of the camera module recording; the microcontroller communicates with the 4G chip AIR724UG through the USART4_RXD_GPRS pin, USART1_RXD_GPRS pin, USART1_TXD_GPRS pin and USART4_TXD_GPRS pin to process the data, and the 4G module can upload the data processing results to the server; the solar photovoltaic charging module transmits power to the circuit through the pins Solar_In+ and Solar_In- and converts it into 4.2V to power the circuit. At the same time, it can charge the 4.2V lithium battery and output the power to the microcontroller, IMU sensor and LoRa communication module through VVD33.

[0046] The beneficial effects of the utility model are as follows: the utility model provides a low-power bridge vibration detection system powered by a battery, which can accurately detect and analyze data through a server and a communication module, and can perform real-time and rapid data transmission. When the dynamic displacement of the bridge vibration exceeds a trigger threshold, the camera module is triggered to timely capture and detect vehicle flow and road conditions, and the data is transmitted to the server for storage, thereby realizing the query of the bridge vibration state at a specific time and the query of the vehicle flow and road conditions at the corresponding time.

Claims

1. A bridge vibration monitoring system based on IMU, characterized in that: include: A single-chip microcomputer, an IMU sensor, a 4G module, a battery interface module and a LoRa communication module respectively connected to the single-chip microcomputer, a sensor switch control circuit connected to the IMU sensor, a 4G module switch control circuit connected to the 4G module, a battery connected to the battery interface module, a solar photovoltaic battery charging module connected to the battery, a camera module wirelessly connected to the LoRa communication module and a server wirelessly connected to the 4G module, wherein the battery interface module is respectively connected to the sensor switch control circuit and the 4G module switch control circuit.

2. The IMU-based bridge vibration monitoring system according to claim 1, characterized in that: The IMU sensor includes a sensor chip U2; The 1st pin, the 2nd pin, the 3rd pin, the 10th pin and the 11th pin of the sensor chip U2 are all grounded, the 5th pin of the sensor chip U2 is respectively connected to the battery interface module and one end of the capacitor C23, the other end of the capacitor C23 is connected to the 6th pin and the 7th pin of the sensor chip U2, and is grounded, the 8th pin of the sensor chip U2 is respectively connected to the battery interface module, the grounded capacitor C24 and the grounded capacitor C25, the 12th pin of the sensor chip U2 is connected to one end of the resistor R14, the other end of the resistor R14 is connected to the battery interface module, the 13th pin of the sensor chip U2 is connected to one end of the resistor R12, the 14th pin of the sensor chip U2 is connected to one end of the resistor R13, the other end of the resistor R12 is connected to the other end of the resistor R13, and is grounded.

3. The IMU-based bridge vibration monitoring system according to claim 2, characterized in that: The single chip microcomputer includes a chip U1; The first pin of the chip U1 is connected to one end of the resistor R10, the other end of the resistor R10 is connected to one end of the protection battery U6, and the other end of the protection battery U6 ​​is grounded. The third pin, the fourth pin, the fifth pin and the sixth pin of the chip U1 are all connected to the crystal oscillator. The seventh pin of the chip U1 is respectively connected to one end of the capacitor C20, the resistor R9 and one end of the switch S1. The other end of the resistor R9 is connected to the battery interface module. The other end of the switch S1 is connected to the other end of the capacitor C20 and is grounded. The 12th pin of the chip U1 is respectively connected to the 18th pin, the 63rd pin, one end of the capacitor C21 and one end of the capacitor C22 and is grounded. The other end of the capacitor C21 is connected to the 47th pin of the chip U1, and the other end of the capacitor C22 is connected to the 31st pin of the chip U1. The 13th pin of the chip U1 is respectively connected to the 19th pin, the 3 The 2nd pin, the 48th pin, the 64th pin, and one end of the resistor R11 are connected to the battery interface module, the other end of the resistor R11 is connected to the positive electrode of the light-emitting diode D1, and the negative electrode of the light-emitting diode D1 is grounded, the 16th pin, the 17th pin, the 34th pin and the 35th pin of the chip U1 are all connected to the LoRa module, the 29th pin of the chip U1, the 24th pin, the 42nd pin, the 43rd pin, the 51st pin and the 52nd pin of the chip U1 are all connected to the 4G module, the 55th pin of the chip U1 is connected to the 3rd pin of the LED lamp D3, the 56th pin of the chip U1 is connected to the 1st pin of the LED lamp D3, the 2nd pin of the LED lamp D3 is connected to one end of the resistor R8, the other end of the resistor R8 is connected to the battery interface module, and the 46th and 47th pins of the chip U1 are connected to the serial port J1.

4. The IMU-based bridge vibration monitoring system according to claim 3, characterized in that: The 4G module includes a 4G chip P1; The first pin of the 4G chip P1 is connected to the 24th pin of the chip U1, the second pin, the 11th pin, the 17th pin, the 18th pin, the 19th pin, the 20th pin, the 21st pin, the 22nd pin, the 23rd pin, the 26th pin, the 27th pin, the 28th pin, the 29th pin, the 30th pin and the 31st pin of the 4G chip P1 are all grounded, the sixth pin of the 4G chip P1 is connected to the 52nd pin of the chip U1, the eighth pin of the 4G chip P1 is connected to the 43rd pin of the chip U1, Pin 9 of the 4G chip P1 is connected to pin 42 of the chip U1, pin 10 of the 4G chip P1 is connected to pin 51 of the chip U1, pins 15 and 16 of the 4G chip P1 are both connected to a 4.2V power supply, pins 24 and 25 of the 4G chip P1 are both connected to a battery interface module, pin 32 of the 4G chip P1 is connected to the cathode of the light-emitting diode D2, the anode of the light-emitting diode D2 is connected to one end of the resistor R1, and the other end of the resistor R1 is connected to the battery interface module.

5. The IMU-based bridge vibration monitoring system according to claim 4, characterized in that: The LoRa communication module includes a LoRa communication chip U9A; The first pin of the LoRa communication chip U9A is respectively connected to one end of the capacitor C1 and one end of the capacitor C2, and is grounded. The other end of the capacitor C1 and the other end of the capacitor C2 are connected to the second pin of the LoRa communication chip U9A and the battery interface module. The third pin of the LoRa communication chip U9A is connected to one end of the resistor R2, and the other end of the resistor R2 is connected to the positive electrode of the light-emitting diode D4, and the negative electrode of the light-emitting diode D4 is grounded. The fourth pin of the LoRa communication chip U9A is connected to the 17th pin of the chip U1. Pin 5 of the LoRa communication chip U9A is connected to pin 16 of the chip U1, pin 6 of the LoRa communication chip U9A is connected to pin 34 of the chip U1, pins 12, 13 and 14 of the LoRa communication chip U9A are all grounded, pin 22 of the LoRa communication chip U9A is respectively connected to one end of the resistor R3 and one end of the capacitor C3, the other end of the resistor R3 is connected to the battery interface module, and the other end of the capacitor C3 is connected to pin 23 of the LoRa communication chip U9A and grounded.

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