High-precision IC (integrated circuit) carrier plate test fixture

Abstract

The utility model belongs to the field of test jigs, and particularly relates to a high-precision IC (integrated circuit) carrier plate test jig, which comprises an upper die holder, a lower die holder and one end of a guide rod uniformly arranged at the lower end of the upper die holder, a pressing plate is arranged on the guide rod in a sliding manner, and a probe for power-on test is arranged at the lower end of the pressing plate; the lower die holder is connected with the other end of the guide rod, the lower die holder is provided with an inward concave placing cavity, and the IC carrier plate is located in the placing cavity; an alignment groove group is formed in the periphery of the placement cavity, an alignment convex groove group is further formed in the lower end of the pressing plate, and the alignment convex groove group is connected with the alignment groove group in an embedded mode; the lower die base is further provided with a clamping assembly used for clamping the IC carrier plate. According to the test fixture, the embedded connection design of the alignment groove group and the alignment convex groove group is adopted, limiting deviation caused by factors such as friction force of the pressing plate can be effectively reduced, and the clamping assembly is matched to clamp the IC carrier plate, so that the test accuracy is improved, and the test result of the IC carrier plate is more accurate and reliable.

Description

Technical Field

[0001] The utility model belongs to the field of testing fixtures, and in particular relates to a high-precision IC carrier board testing fixture. Background Art

[0002] IC is a general term for semiconductor component products, including integrated circuits, diodes, special electronic components, and more broadly speaking, all electronic components, such as resistors, capacitors, circuit boards, and many other related products. Most carriers have multiple expansion slots for IC plugging. After workers manually plug the IC into the carrier, they need to further test the IC carrier to see if there are short circuits, open circuits, poor contact, etc. However, since the quality test of the IC carrier involves multiple expansion slots, it is necessary to test multiple expansion slots at the same time. Currently, a downward pressure test fixture is generally used to detect the IC carrier. In order to improve work efficiency, it is necessary to continuously connect the downward pressure to power on the operation. Due to factors such as friction, the limit of the IC carrier by the downward pressure test fixture is slightly offset, resulting in inaccurate test indexes. Utility Model Content

[0003] The purpose of the utility model is to provide a high-precision IC substrate testing fixture to solve the above problems.

[0004] To achieve the above-mentioned purpose, the utility model provides a high-precision IC carrier board testing fixture for testing the IC carrier board, comprising an upper die base, a lower die base and one end of a guide rod evenly arranged at the lower end of the upper die base, a pressure plate is slidably arranged on the guide rod, and a probe for power-on testing is arranged at the lower end of the pressure plate; the lower die base is connected to the other end of the guide rod, the lower die base is provided with an inwardly concave placement cavity, and the IC carrier board is located in the placement cavity; an alignment groove group is provided around the placement cavity, and an alignment convex groove group is also provided at the lower end of the pressure plate, and the alignment convex groove group is engaged and connected with the alignment groove group; the lower die base is also provided with a clamping assembly for clamping the IC carrier board.

[0005] Further, the alignment groove group is provided in two groups and is located at the front end and the rear end of the placement cavity, the alignment groove group includes a first groove and a second groove, the second groove is provided at the periphery of the first groove, and a spacing convex groove is provided between the two; the alignment convex groove group is provided in two groups and is correspondingly located at the front end and the rear end of the pressure plate, the alignment convex groove group includes a first convex groove and a second convex groove, and a spacing groove is provided between the first convex groove and the second convex groove. The alignment groove group and the alignment convex groove group are interlocked with each other.

[0006] Furthermore, the clamping assembly includes a handle, a connecting rod and a spring, the lower die seat is provided with a hollow connecting body, a spring is fixed in the connecting body, one end of the connecting rod extends into one end of the connecting body and passes through the spring and extends from the other end of the connecting body, and the other end of the connecting rod is connected to a limiter. The clamping assembly is provided with four groups, and the limiter is provided with two groups of clamping assemblies connected with one group of limiters, and the two groups of limiters are respectively provided at the left end and the right end of the placement cavity.

[0007] Furthermore, the topmost point of the IC carrier is lower than the topmost point of the limiting member.

[0008] Furthermore, the limiting member is in the form of a downwardly inclined slot structure, and the width of the uppermost end of the limiting member is smaller than the width of the lowermost end.

[0009] Furthermore, a non-slip layer is provided on the side of the stopper that is in contact with the IC carrier.

[0010] Furthermore, a lifting cylinder is provided at the upper end of the upper die seat, and a driving end of the lifting cylinder is connected to the pressing plate and drives it to move up and down.

[0011] The above one or more technical solutions in the high-precision IC substrate test fixture provided by the embodiment of the utility model have at least the following technical effects:

[0012] In this design, the upper die seat moves the pressure plate down along the guide rod, and the probe of the pressure plate contacts the IC carrier placed in the cavity to start the test. The test fixture adopts a chimeric connection design of the alignment groove group and the alignment convex groove group, which can effectively reduce the limit deviation caused by factors such as friction, and cooperate with the clamping component to clamp the IC carrier, thereby improving the accuracy of the test and ensuring that the test results of the IC carrier are more accurate and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0014] Figure 1 A front view of a high-precision IC substrate testing fixture provided in an embodiment of the utility model.

[0015] Figure 2 A three-dimensional diagram of a lower mold base of a high-precision IC substrate testing fixture provided in an embodiment of the utility model.

[0016] Figure 3 A three-dimensional diagram of an upper mold of a high-precision IC substrate testing fixture provided in an embodiment of the utility model.

[0017] Description of main reference numerals: 100, upper die base; 120, lower die base; 130, guide rod; 140, pressing plate; 150, probe; 160, placement cavity;

[0018] 200, alignment groove group; 201, first groove; 202, second groove; 203, spacing convex groove; 210, alignment convex groove group; 211, first convex groove; 212, second convex groove; 213, spacing groove;

[0019] 300, clamping assembly; 310, handle; 320, connecting rod; 330, spring; 340, connecting body; 350, limiting member;

[0020] 400, anti-slip layer;

[0021] 500. Lifting cylinder. DETAILED DESCRIPTION

[0022] The following describes the embodiments of the present invention in detail. Figures 1 to 3 , wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. Figures 1 to 3 The described embodiments are exemplary and are intended to be used to explain the embodiments of the present invention, but should not be construed as limiting the present invention.

[0023] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0024] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0025] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0026] In an embodiment of the utility model, this case provides a high-precision IC carrier test fixture for testing IC carriers, including an upper mold base 100, a lower mold base 120 and one end of a guide rod 130 evenly arranged at the lower end of the upper mold base 100, a pressure plate 140 is slidably arranged on the guide rod 130, and a probe 150 for power-on testing is provided at the lower end of the pressure plate 140; the lower mold base 120 is connected to the other end of the guide rod 130, and the lower mold base 120 is provided with an inwardly concave placement cavity 160, and the IC carrier is located in the placement cavity 160; an alignment groove group 200 is provided around the placement cavity 160, and an alignment convex groove group 210 is also provided at the lower end of the pressure plate 140, and the alignment convex groove group 210 is engaged and connected with the alignment groove group 200; the lower mold base 120 is also provided with a clamping assembly 300 for clamping the IC carrier.

[0027] Specifically, the upper die seat 100 moves the pressing plate 140 downward along the guide rod 130, and the probe 150 of the pressing plate 140 contacts the IC carrier placed in the cavity 160, and the test begins. The test fixture adopts a chimeric connection design of the alignment groove group 200 and the alignment convex groove group 210, which can effectively reduce the limit deviation caused by factors such as the friction of the pressing plate 140, and cooperates with the clamping assembly 300 to clamp the IC carrier, thereby improving the accuracy of the test and ensuring that the test results of the IC carrier are more accurate and reliable.

[0028] In another embodiment of the utility model, the alignment groove group 200 is set as two groups and is located at the front end and the rear end of the placement cavity 160. The alignment groove group 200 includes a first groove 201 and a second groove 202. The second groove 202 is arranged on the periphery of the first groove 201, and a spacing convex groove 203 is provided between the two. The alignment convex groove group 210 is set as two groups and is correspondingly located at the front end and the rear end of the pressure plate 140. The alignment convex groove group 210 includes a first convex groove 211 and a second convex groove 212. A spacing groove 213 is provided between the first convex groove 211 and the second convex groove 212. The alignment groove group 200 and the alignment convex groove group 210 are interlocked, specifically, the first groove 201 is embedded in the first convex groove 211, the second groove 202 is embedded in the second convex groove 212, and the spacing convex groove 203 is embedded in the spacing groove 213. The precise clamping and the tight connection between the multiple grooves strengthen the stability of the front and rear ends of the pressure plate 140, improve the accuracy of the test, and effectively reduce the problem of displacement of the limit of the IC carrier caused by the downward pressure test fixture due to factors such as friction.

[0029] In another embodiment of the utility model, the clamping assembly 300 includes a handle 310, a connecting rod 320 and a spring 330. The lower mold base 120 is provided with a hollow connecting body 340, and the spring 330 is fixed in the connecting body 340. One end of the connecting rod 320 extends into one end of the connecting body 340 and passes through the spring 330 and extends from the other end of the connecting body 340. The other end of the connecting rod 320 is connected to a stopper 350. The clamping assembly 300 is provided with four groups, and the stopper 350 is provided with two groups of clamping assemblies 300 connected with one group of stoppers 350, and the two groups of stoppers 350 are respectively provided at the left end and the right end of the placement cavity 160. Specifically, the spring 330 is arranged in the connecting body 340, one end of which is connected to the inner side of the connecting body 340, and the other end is connected to the connecting rod 320. Initially, the spring 330 pushes the connecting rod 320 outwards first, and the user stretches the connecting rod 320 in the opposite direction through the handle 310, and the stopper 350 at the other end of the connecting rod 320 moves toward the edge end of the lower mold base 120. Similarly, another set of stoppers 350 is pulled open, and the IC carrier is placed in the placement cavity 160. Press down the pressing plate 140, and the alignment convex groove group 210 and the alignment groove group 200 cooperate to fix the pressing plate 140. Then, the connecting rod 320 is released, and the stopper 350 rebounds under the elastic force of the spring 330. The two sets of stoppers 350 clamp the IC carrier to fix its left and right ends, thereby enhancing the stability of the electrical connection during the test.

[0030] In another embodiment of the utility model, the topmost point of the IC carrier is lower than the topmost point of the stopper 350 , so that the stoppers 350 at the left and right ends can be pressed against the IC carrier.

[0031] In another embodiment of the utility model, the stopper 350 is in a downwardly inclined slot structure, and the width of the uppermost end of the stopper 350 is smaller than the width of the lowermost end. The user can not pull the stoppers 350 apart by the handles 310 at both ends, but can push the stoppers 350 out by slowly applying downward pressure on the slot structure when placing the IC carrier. This loading method is more convenient.

[0032] In another embodiment of the utility model, a non-slip layer 400 is provided on the side of the stopper 350 that is in contact with the IC carrier. The non-slip layer 400 is used to prevent the IC carrier from sliding out from between the two sets of stoppers 350 .

[0033] In another embodiment of the utility model, a lifting cylinder 500 is provided at the upper end of the upper mold base 100, and the driving end of the lifting cylinder 500 is connected to the pressure plate 140 and drives it to move up and down. The rapid response and precise control of the lifting cylinder 500 enable the test fixture to adapt to dynamic testing requirements.

[0034] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-precision IC substrate test fixture for testing IC substrates, characterized in that: It includes an upper die base, a lower die base and one end of a guide rod evenly arranged at the lower end of the upper die base, a pressure plate is slidably arranged on the guide rod, and a probe for power-on test is arranged at the lower end of the pressure plate; the lower die base is connected to the other end of the guide rod, and the lower die base is provided with an inwardly concave placement cavity, and the IC carrier is located in the placement cavity; an alignment groove group is arranged around the placement cavity, and an alignment convex groove group is also arranged at the lower end of the pressure plate, and the alignment convex groove group is engaged and connected with the alignment groove group; the lower die base is also provided with a clamping assembly for clamping the IC carrier.

2. The high-precision IC substrate test fixture according to claim 1, characterized in that: The alignment groove groups are set into two groups and are located at the front end and the rear end of the placement cavity. The alignment groove groups include a first groove and a second groove. The second groove is arranged on the periphery of the first groove, and a spacing convex groove is arranged between the two. The alignment convex groove groups are set into two groups and are correspondingly located at the front end and the rear end of the pressure plate. The alignment convex groove groups include a first convex groove and a second convex groove, and a spacing groove is arranged between the first convex groove and the second convex groove.

3. The high-precision IC substrate test fixture according to claim 1, characterized in that: The clamping assembly includes a handle, a connecting rod and a spring. The lower mold base is provided with a hollow connecting body, in which a spring is fixed. One end of the connecting rod extends into one end of the connecting body and passes through the spring and extends from the other end of the connecting body. The other end of the connecting rod is connected to a limit piece.

4. The high-precision IC substrate test fixture according to claim 3, characterized in that: There are four groups of clamping components, and the limiting parts are provided with two groups of clamping components connected with one group of limiting parts, and the two groups of limiting parts are respectively arranged at the left end and the right end of the placement cavity.

5. The high-precision IC substrate test fixture according to claim 4, characterized in that: The topmost point of the IC carrier is lower than the topmost point of the stopper.

6. The high-precision IC substrate test fixture according to claim 4, characterized in that: The limiting member is in the form of a downwardly inclined inclined slot structure, and the width of the uppermost end of the limiting member is smaller than the width of the lowermost end.

7. The high-precision IC substrate test fixture according to claim 4, characterized in that: A non-slip layer is provided on the side where the limiting member is in contact with the IC carrier board.

8. The high-precision IC substrate test fixture according to any one of claims 1 to 7, characterized in that: A lifting cylinder is arranged at the upper end of the upper die seat, and a driving end of the lifting cylinder is connected to the pressing plate and drives it to move up and down.

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