Photoresist cleaning equipment and nanoimprint equipment

Abstract

The utility model provides a photoresist cleaning device and a nanoimprint device. The photoresist cleaning equipment is used for cleaning uncured photoresist in a nanoimprint process, and comprises a vacuum adsorption assembly which is configured to perform vacuum adsorption on the uncured photoresist on the surface of a substrate; and a transmission wiping assembly. And the wiping assembly is configured to wipe the uncured photoresist on the surface of the substrate while the vacuum adsorption assembly performs vacuum adsorption.

Description

Technical Field

[0001] The utility model relates to the technical field of nano-imprinting, and more specifically to a photoresist cleaning device and a nano-imprinting device. Background Art

[0002] Nano-Imprinting technology is a micro-nanoelectronic manufacturing technology that uses molds and photoresists to achieve high resolution, low cost and high efficiency. Its basic principle is to process the required structural pattern as a mold on a substrate of silicon or other materials by means of electron beam etching; press the mold onto the material to be processed whose surface is coated with photoresist, and transfer the pattern of the mold to the photoresist by applying pressure; then cure the photoresist and remove the mold, and then further process it by methods such as chemical etching to finally obtain a high-precision processed material.

[0003] In the nanoimprint process, the photoresist processing technology can be divided into dry photoresist and wet photoresist. Dry photoresist refers to curing all the photoresist after molding, and then cutting to obtain the required structure pattern; wet photoresist refers to curing only the photoresist part with the required pattern after molding, and removing the unnecessary wet photoresist part. Therefore, a device that can effectively remove wet photoresist is needed. Utility Model Content

[0004] The utility model provides a photoresist cleaning device and a nano-imprinting device, which can adopt a vacuum adsorption combined with a physical wiping method to efficiently and environmentally remove uncured photoresist in the nano-imprinting process.

[0005] According to the embodiment of the utility model, the photoresist cleaning equipment can be used to clean the uncured photoresist in the nanoimprint process, including: a vacuum adsorption component, which is configured to vacuum adsorb the uncured photoresist on the surface of the substrate; and a transmission wiping component; which is configured to wipe the uncured photoresist on the surface of the substrate while the vacuum adsorption component is performing vacuum adsorption.

[0006] In one example, the vacuum adsorption assembly includes a vacuum pump and a vacuum adsorption head, and the vacuum adsorption head performs vacuum adsorption on the uncured photoresist on the surface of the substrate under the action of the pressure difference generated by the vacuum pump.

[0007] In one example, the vacuum adsorption assembly further includes a storage tank configured to store uncured photoresist adsorbed by the vacuum adsorption head.

[0008] In one example, the transmission wiping assembly includes a transmission wiping belt and a wiping head, and the transmission wiping belt is configured to wipe the surface of the substrate under the pressure of the wiping head.

[0009] In one example, the transmission wiping assembly further includes a wiping tape feeder and a wiping tape reclaimer, and the transmission wiping tape is uniformly driven from the wiping tape feeder to the wiping tape reclaimer at a predetermined speed.

[0010] In one example, the transmission wiping assembly further includes a cleaning agent spraying assembly configured to spray cleaning agent onto the wiping head.

[0011] In one example, the cleaning agent includes pure water or a chemical wipe.

[0012] In one example, the photoresist includes at least one of ultraviolet photoresist, deep ultraviolet photoresist, extreme ultraviolet photoresist, electron beam photoresist, ion beam photoresist, and X-ray photoresist.

[0013] According to an embodiment of the utility model, the nanoimprinting device may include: a substrate carrying table, configured to carry a substrate to be nanoimprinted, the surface of the substrate being coated with photoresist; a nanoimprinting component, configured to perform nanoimprinting on the substrate coated with photoresist; a curing component, configured to cure the photoresist on the surface of the substrate after nanoimprinting; a vacuum adsorption component, configured to perform vacuum adsorption on the uncured photoresist on the surface of the substrate; and a transmission wiping component; configured to wipe the uncured photoresist on the surface of the substrate while the vacuum adsorption component is performing vacuum adsorption.

[0014] In one example, the curing component is configured to cure the nano-imprinted photoresist on the surface of the substrate by at least one of ultraviolet irradiation, thermal curing, plasma curing, or laser curing. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the following is a brief introduction to the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. The following drawings are not deliberately scaled according to the actual size, and the focus is on illustrating the main purpose of the utility model.

[0016] Figure 1 A schematic structural diagram of a photoresist cleaning device according to an embodiment of the utility model is shown.

[0017] Figure 2 A schematic structural diagram of a nanoimprint device according to an embodiment of the utility model is shown. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical scheme and advantages of the utility model clearer, the utility model is further described in detail with reference to the following embodiments. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] As used herein, unless the context clearly indicates an exception, the words "a", "an", "a kind" and / or "the" do not specifically refer to the singular, but may also include the plural, unless the context clearly indicates an exception. The words "first", "second" and similar words used in the present utility model do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0020] In the nanoimprint process, the processing technology of photoresist can be divided into dry glue and wet glue, wherein dry glue refers to curing all the photoresist after molding, and then obtaining the required structural pattern by cutting; wet glue refers to curing only the photoresist part with the required pattern after molding, and removing the unnecessary wet glue part. The existing wet glue removal method is usually a solvent cleaning method, for example, first using chemical reagents such as diacetone alcohol (DAA), isopropyl alcohol (IPA) to clean the wet glue, and then using pure water to further clean it. However, chemical reagents are dangerous and environmentally unfriendly, and this method requires the use of a large amount of pure water, resulting in serious waste of water resources.

[0021] To this end, the utility model proposes a photoresist cleaning device, which uses vacuum adsorption combined with physical wiping to remove uncured photoresist in the nanoimprint process, and can efficiently and environmentally friendly remove unnecessary photoresist, greatly reducing pollution to the environment and waste of water resources.

[0022] Refer to the following Figure 1 The photoresist cleaning device according to the utility model is described. Figure 1 FIG. 1 shows a schematic structural diagram of a photoresist cleaning device 100 according to an embodiment of the present utility model. Figure 1As shown, the photoresist cleaning device 100 may include a vacuum adsorption component 110 and a transmission wiping component 120. It should be noted that in addition to these two components, the photoresist cleaning device 100 may also include other components according to actual application requirements, but since these other components are not related to the technical solution of the utility model, their illustration and description are omitted here. In addition, Figure 1 The sizes, shapes, positions and structural relationships of the vacuum adsorption assembly 110 and the transmission wiping assembly 120 and their respective sub-components are merely examples and do not have any limiting effect in any sense.

[0023] Figure 1 A substrate 130 is also shown, on the surface of which a photoresist is coated. The photoresist may be, for example, ultraviolet photoresist, deep ultraviolet photoresist, extreme ultraviolet photoresist, electron beam photoresist, ion beam photoresist, X-ray photoresist or any other colloidal material, and the present invention does not impose any specific limitation on this. After nanoimprinting the substrate with the photoresist coated on the surface, the photoresist after nanoimprinting may be cured. For example, only the photoresist portion having the desired pattern may be cured. In the present invention, for the uncured photoresist (or wet glue) that is not needed, the vacuum adsorption component 110 may be used to vacuum adsorb the uncured photoresist. As shown in FIG. Figure 1 As shown, the vacuum adsorption assembly 110 may include a vacuum pump 111 and a vacuum adsorption head 112, wherein the vacuum pump 111 may use mechanical, physical, chemical, physical and chemical methods to evacuate air to generate a pressure difference, and the vacuum adsorption head 112 vacuum adsorbs the uncured photoresist on the surface of the substrate 130 under the action of the pressure difference generated by the vacuum pump 111. In addition, the vacuum adsorption assembly 110 may also include a storage tank 113, which is configured to store the uncured photoresist adsorbed by the vacuum adsorption head 112 of the vacuum adsorption assembly 110.

[0024] The transmission wiping assembly 120 is configured to wipe the uncured photoresist on the surface of the substrate while the vacuum adsorption assembly 110 is performing vacuum adsorption. Figure 1 As shown, the transmission wiping assembly 120 may include a transmission wiping tape 121 and a wiping head 122, and the transmission wiping tape 121 wipes and cleans the substrate surface under the pressure of the wiping head 122. In addition, the transmission wiping assembly 120 may also include a wiping tape feeder 123 and a wiping tape reclaimer 124, and the transmission wiping tape 121 is uniformly driven from the wiping tape feeder 123 to the wiping tape reclaimer 124 at a predetermined speed. In this way, it can be ensured that a clean wiping tape from the wiping tape feeder 123 is always used to clean the substrate surface, and the used wiping tape is transferred to the wiping tape reclaimer 124 for recycling, so that the photoresist cleaning can be achieved more effectively.

[0025] The transmission wiping assembly 120 may also include a detergent spraying assembly 125, which is configured to spray a detergent to the wiping head 122. For example, the detergent may include pure water or a chemical reagent such as DAA, IPA, etc. Using the wiping head sprayed with the detergent to wipe the substrate surface can more effectively remove the uncured photoresist. Since the vacuum adsorption assembly 110 is used to adsorb most of the uncured photoresist on the substrate surface during wiping, less detergent can be used here to clean a small amount of residual wet glue on the substrate surface, thereby greatly reducing the pollution to the environment and the waste of water resources.

[0026] The utility model also provides a nano-imprinting device. Figure 2 FIG. 2 shows a schematic structural diagram of a nanoimprinting device 200 according to an embodiment of the present invention. Figure 2 As shown, the nanoimprinting device 200 includes a substrate carrier 210, a substrate 220 coated with a photoresist 230, a nanoimprinting assembly 240, a mold 250, a curing assembly 260, a vacuum adsorption assembly 270, and a transmission wiping assembly 280. The curing assembly 260, the vacuum adsorption assembly 270, and the transmission wiping assembly 280 are briefly shown in dashed lines to avoid using Figure 2 The structure of is too complicated, but it does not mean that these components are insignificant or can be omitted. In addition to these components, the nanoimprint device 200 may also include other components, but since these other components are not related to the technical solution of the utility model, their illustration and description are omitted here. In addition, Figure 2 The sizes, shapes, positions and structural relationships of the various components of the nanoimprinting apparatus 200 shown are merely examples and are not limiting in any sense.

[0027] The substrate carrier 210 is used to carry the substrate 220 to be nano-imprinted, which can also be called a workbench, an operating table, etc. The substrate 220 refers to the material to be processed, for example, it can be a semiconductor material, quartz glass, a polymer compound, etc., and the utility model does not make specific restrictions on this. A photoresist 230 is coated on the upper surface of the substrate, and the photoresist can be, for example, an ultraviolet photoresist, a deep ultraviolet photoresist, an extreme ultraviolet photoresist, an electron beam photoresist, an ion beam photoresist, an X-ray photoresist or any other colloidal material, and the utility model does not make specific restrictions on this.

[0028] The nanoimprint assembly 240 is used to perform nanoimprinting on a substrate coated with photoresist. Specifically, it presses a mold 250 having a specific structural pattern onto the photoresist 230 on the surface of the substrate to transfer the pattern of the mold 250 to the photoresist 230 .

[0029] The curing component 260 is used to cure the photoresist on the substrate surface after nanoimprinting. For example, only the photoresist portion with the desired pattern can be cured. In the present invention, the curing component 260 can cure the photoresist by ultraviolet irradiation, thermal curing, plasma curing, laser curing or any other curing method, and the embodiments of the present invention do not impose specific restrictions on this.

[0030] The vacuum adsorption assembly 270 is configured to vacuum adsorb the uncured photoresist on the substrate surface, and the transmission wiping assembly 280 is configured to wipe the uncured photoresist on the substrate surface while the vacuum adsorption assembly 270 is vacuum adsorbing. The composition and functional details of the vacuum adsorption assembly 270 and the transmission wiping assembly 280 are similar to those described above with reference to Figure 1 The vacuum adsorption assembly 110 and the transmission wiping assembly 120 are described above, so for the sake of brevity, they are not repeated here.

[0031] According to the nanoimprinting device of the utility model, during the nanoimprinting process, the uncured photoresist is removed by a method of vacuum adsorption combined with physical wiping, which can remove unnecessary photoresist efficiently and environmentally friendly, greatly reducing pollution to the environment and waste of water resources.

[0032] In the present invention, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those skilled in the art to which the present invention belongs. It should also be understood that terms such as those defined in common dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined as such herein.

[0033] The above is an explanation of the utility model and should not be considered as a limitation thereof. Although several exemplary embodiments of the utility model are described, it will be readily understood by those skilled in the art that many modifications can be made to the exemplary embodiments without departing from the novel teachings and advantages of the utility model. Therefore, all of these modifications are intended to be included within the scope of the utility model as defined in the claims. It should be understood that the above is an explanation of the utility model and should not be considered to be limited to the specific embodiments disclosed, and modifications to the disclosed embodiments and other embodiments are intended to be included within the scope of the appended claims. The utility model is defined by the claims and their equivalents.

Claims

1. A photoresist cleaning device for cleaning uncured photoresist in a nanoimprint process, comprising: A vacuum adsorption assembly, comprising a vacuum pump and a vacuum adsorption head, wherein the vacuum adsorption head is configured to perform vacuum adsorption on the uncured photoresist on the surface of the substrate under the action of the pressure difference generated by the vacuum pump; and Transmission wiper assembly; The device is configured to wipe the uncured photoresist on the surface of the substrate while the vacuum adsorption component performs vacuum adsorption.

2. The photoresist cleaning device according to claim 1, characterized in that: The vacuum adsorption assembly further includes a storage tank configured to store uncured photoresist adsorbed by the vacuum adsorption head.

3. The photoresist cleaning device according to claim 1, characterized in that: The transmission wiping assembly comprises a transmission wiping belt and a wiping head, and the transmission wiping belt is configured to wipe the surface of the substrate under the pressure of the wiping head.

4. The photoresist cleaning device according to claim 3, characterized in that: The transmission wiping assembly further comprises a wiping tape feeder and a wiping tape reclaimer, and the transmission wiping tape is uniformly driven from the wiping tape feeder to the wiping tape reclaimer at a predetermined speed.

5. The photoresist cleaning device according to claim 3, characterized in that: The transmission wiping assembly further includes a detergent spraying assembly, and the detergent spraying assembly is configured to spray detergent to the wiping head.

6. The photoresist cleaning device according to claim 5, characterized in that: The cleaning agent includes pure water or a chemical wiper.

7. The photoresist cleaning device according to claim 1, characterized in that: The photoresist includes at least one of ultraviolet photoresist, deep ultraviolet photoresist, extreme ultraviolet photoresist, electron beam photoresist, ion beam photoresist, and X-ray photoresist.

8. A nanoimprinting device comprising: A substrate carrying table configured to carry a substrate to be nano-imprinted, the surface of the substrate being coated with photoresist; a nanoimprint assembly configured to perform nanoimprinting on the substrate coated with the photoresist; A curing component configured to cure the nano-imprinted photoresist on the surface of the substrate; A vacuum adsorption assembly, comprising a vacuum pump and a vacuum adsorption head, wherein the vacuum adsorption head is configured to perform vacuum adsorption on the uncured photoresist on the surface of the substrate under the action of the pressure difference generated by the vacuum pump; and Transmission wiper assembly; The device is configured to wipe the uncured photoresist on the surface of the substrate while the vacuum adsorption component performs vacuum adsorption.

9. The nanoimprinting device according to claim 8, characterized in that: The curing component is configured to cure the nano-imprinted photoresist on the surface of the substrate by at least one of ultraviolet irradiation, thermal curing, plasma curing or laser curing.

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