In-mold label and article having label

Abstract

The utility model provides an in-mold label and an article with the same. The in-mold label comprises a plane material, an RFID (Radio Frequency Identification) layer and a substrate, the RFID layer is positioned between the surface material and the substrate; the RFID layer is directly connected with the plane material, and the substrate is connected with at least part of the RFID layer and part of the plane material; the plane material comprises at least one layer of structural coating and a base material. The structure of the label can be used as an in-mold sticker, the substrate and the label can be fused into a whole during blow molding and injection molding of an object, and meanwhile, the RFID layer in the label can be effectively protected from being damaged by high temperature and pressure. The utility model has the advantages of simple structure and thinner thickness, and can effectively save the cost.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging and anti-counterfeiting labels, in particular to an in-mold label and an article with the label. Background Art

[0002] In today's society, people's lives are inseparable from plastic products, especially in the packaging industry, where plastic products are more widely used, such as food packaging boxes, washing and care packaging, etc. In order to pursue a more exquisite appearance and a more perfect packaging experience, in-mold labeling (IML) has begun to be used. In-mold labeling is mainly used for blow molding and injection molding products of materials such as PP, PE, and PET. That is, before blow molding and injection molding, the printed in-mold label is placed in the blow molding and injection mold cavity. When the mold is closed for blowing and injection, the special adhesive on the in-mold label is melted by the high temperature and high pressure in the mold, and is integrated with the bottle body or injection molded part surface. When the mold is opened, a beautifully printed bottle body or injection part is completed at one time.

[0003] However, ordinary IML packaging used in luxury goods is also subject to counterfeiting, and IML with anti-counterfeiting properties has begun to attract the attention of major brands and consumers. However, the existing technology only pastes the RFID inside the IML. In order to ensure the normal use of the IML, the structure of the entire label is complicated and the appearance of the label becomes thicker, which brings great inconvenience to the subsequent processes. Utility Model Content

[0004] In view of the defects in the prior art, the purpose of the utility model is to provide an in-mold label and an article with the label.

[0005] According to the utility model, an in-mold label is provided, comprising a surface material, an RFID layer, and a base material;

[0006] The RFID layer is located between the surface material and the base material. The RFID layer is directly connected to the surface material, and the base material is connected to at least part of the RFID layer and part of the surface material.

[0007] The surface material comprises a structural coating and a substrate, wherein the structural coating comprises a combination of one or more of an optical coating and a printed coating.

[0008] The optical coating is a coating that uses one or more principles of light refraction, reflection, interference and diffraction to present an effect that changes with the observation line of sight. The printed coating is a coating that presents a preset pattern effect.

[0009] The structural coating is located on one side or both sides of the substrate and is connected to the substrate.

[0010] The structural coating layer is at least one layer.

[0011] The structural coating is multi-layered.

[0012] The projection of the structural coating is located in the projection of the substrate or is the same size as the projection of the substrate.

[0013] The structural coating is connected to a side of the substrate close to the RFID layer.

[0014] When the optical coating includes a metal layer, the metal layer is located on the outermost side of the optical coating, and the metal layer and the RFID layer are located on the same side of the substrate:

[0015] The metal layer does not overlap or contact the RFID layer; or, a projection of the metal layer at least partially overlaps with a projection of the RFID layer, an insulating coating is provided between the metal layer and the RFID layer, and the projection of the insulating coating at least covers the area of ​​the overlapping portion.

[0016] The insulating coating is a full-plate insulating coating or a partial insulating coating. The RFID layer is at least partially located on the insulating coating.

[0017] The RFID layer includes an antenna and a chip, the antenna is a printed antenna, and the chip is electrically connected to the antenna through a pad structure. The RFID layer is a high-frequency RFID or an ultra-high-frequency RFID.

[0018] The material of the insulating coating is cured insulating ink.

[0019] The material of the printed antenna is solidified conductive silver paste, solidified conductive copper paste, conductive graphite and conductive graphene.

[0020] The substrate is a base film, a resin coating, or a structure in which a base film and a resin coating are connected.

[0021] When the substrate is a base film, the base film is connected and fixed in the in-mold label by a composite adhesive;

[0022] When the substrate is a resin coating, the resin coating is fixed in the in-mold label by a composite adhesive or directly connected and fixed;

[0023] When the substrate is a structure in which a base film is connected to a resin coating, the resin coating is connected to a side of the base film away from the RFID layer, and the base film is connected and fixed in the in-mold label by a composite adhesive; or, the resin coating is connected to a side of the base film close to the RFID layer, and the resin coating is connected and fixed in the in-mold label by a composite adhesive, or is directly connected and fixed.

[0024] When the substrate is a base film, no metal layer is provided on the side of the outermost side of the structural coating close to the RFID layer, and the surface material is directly connected to the RFID layer, the base film is connected to the RFID layer and the surface material through a composite adhesive;

[0025] When the base material is a resin coating, no metal layer is provided on the side of the outermost side of the structural coating close to the RFID layer, and the surface material is directly connected to the RFID layer, the resin coating is connected to the RFID layer and the surface material through a composite adhesive, or the resin coating is directly connected to the RFID layer and the surface material;

[0026] When the substrate is a structure in which a base film is connected to a resin coating, a metal layer is not provided on the side of the outermost side of the structural coating close to the RFID layer, and the surface material is directly connected to the RFID layer, the resin coating is connected to the side of the base film away from the RFID layer, and the base film is connected to the RFID layer and the surface material through a composite adhesive; or, the resin coating is connected to the side of the base film close to the RFID layer, and the resin coating is connected to the RFID layer and the surface material through a composite adhesive, or is directly connected to the RFID layer and the surface material;

[0027] When the substrate is a base film, a metal layer is provided on the outermost side of the structural coating near the RFID layer, and the surface material is directly connected to the RFID layer, the base film is connected to the RFID layer and the surface material through a composite adhesive;

[0028] When the base material is a resin coating, a metal layer is provided on the outermost side of the structural coating near the RFID layer, and the surface material is directly connected to the RFID layer, the resin coating is connected to the RFID layer, the metal layer and the surface material through a composite adhesive, or the resin coating is directly connected to the RFID layer, the metal layer and the surface material;

[0029] When the substrate is a structure in which a base film is connected to a resin coating, a metal layer is provided on the outermost side of the structural coating near the RFID layer, and the surface material is directly connected to the RFID layer, the resin coating is connected to the side of the base film away from the RFID layer, and the base film is connected to the RFID layer, the metal layer and the surface material through a composite adhesive; or, the resin coating is connected to the side of the base film close to the RFID layer, and the resin coating is connected to the RFID layer, the metal layer and the surface material through a composite adhesive, or is directly connected to the RFID layer, the metal layer and the surface material;

[0030] When the substrate is a base film, a metal layer is provided on the outermost side of the structural coating near the RFID layer, and a full-cover insulation coating is provided between the surface material and the RFID layer, the base film is connected to the RFID layer and the insulation coating by a composite adhesive;

[0031] When the base material is a resin coating, a metal layer is provided on the outermost side of the structural coating near the RFID layer, and a full-plate insulating coating is provided between the surface material and the RFID layer, the resin coating is connected to the RFID layer and the insulating coating through a composite adhesive, or the resin coating is directly connected to the RFID layer and the insulating coating;

[0032] When the substrate is a structure in which a base film is connected to a resin coating, a metal layer is provided on the outermost side of the structural coating near the RFID layer, and a full-plate insulating coating is provided between the surface material and the RFID layer, the resin coating is connected to the side of the base film away from the RFID layer, and the base film is connected to the RFID layer and the insulating coating through a composite adhesive; or, the resin coating is connected to the side of the base film close to the RFID layer, and the resin coating is connected to the RFID layer and the insulating coating through a composite adhesive, or is directly connected to the RFID layer and the insulating coating;

[0033] When the substrate is a base film, a metal layer is provided on the outermost side of the structural coating near the RFID layer, and a local insulating coating is provided between the surface material and the RFID layer, the base film is connected to the RFID layer, the surface material and the insulating coating by a composite adhesive;

[0034] When the base material is a resin coating, a metal layer is provided on the outermost side of the structural coating near the RFID layer, and a local insulating coating is provided between the surface material and the RFID layer, the resin coating is directly connected to the RFID layer, the surface material and the insulating coating;

[0035] When the substrate is a structure in which a base film is connected to a resin coating, a metal layer is provided on the side of the outermost side of the structural coating close to the RFID layer, and a partial insulating coating is provided between the surface material and the RFID layer, the resin coating is connected to the side of the base film away from the RFID layer, and the base film is connected to the RFID layer, the surface material and the insulating coating through a composite adhesive; or, the resin coating is connected to the side of the base film close to the RFID layer, and the resin coating is connected to the RFID layer, the surface material and the insulating coating through a composite adhesive, or the resin coating is directly connected to the RFID layer, the surface material and the insulating coating;

[0036] The composite adhesive mainly plays the role of bonding the base material, the surface material and the RFID layer, or plays the role of bonding the base material, the surface material, the metal layer and the RFID layer, such as polyurethane cured adhesive.

[0037] The base film protects the RFID layer and the surface material to prevent the surface material and the RFID layer from being damaged during injection molding. At the same time, the base film also plays a role in bonding with the injection molding material. The base film is selected to be the same as or compatible with the injection molding material, such as polyethylene (PE), polypropylene (PP), polyester (PET) or polyvinyl chloride (PVC).

[0038] The resin coating protects the RFID layer and the surface material to prevent the surface material and the RFID layer from being damaged during injection molding. The resin coating also serves to bond with the injection molding material. The resin coating is selected to be the same as the injection molding material or a material that is compatible and soluble, such as ABS coating, polyethylene (PE) coating or EVA coating.

[0039] An article with a label comprises the in-mold label.

[0040] The in-mold label is formed on the article.

[0041] Compared with the prior art, the utility model has the following beneficial effects:

[0042] The structure of the label of the utility model can be used as an in-mold sticker, and the base material can be bonded with the blow molding or injection molding material of the object, and can be integrated with the object during blow molding or injection molding, and can effectively protect the RFID layer in the label from damage by high temperature and pressure.

[0043] The utility model has a simple structure and a thin thickness, and can effectively save costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0045] Figure 1 This is a schematic diagram of the structure of an embodiment of the utility model;

[0046] Figure 2 is a schematic diagram of an embodiment of a surface material;

[0047] Figure 3 is a schematic diagram of a first embodiment of a substrate;

[0048] Figure 4 is a schematic diagram of a second embodiment of a substrate;

[0049] Figure 5 is a schematic diagram of a third embodiment of a substrate;

[0050] Figure 6 It is a schematic diagram of the connection of the surface material including the metal layer, the RFID layer and the base material when no insulating coating is provided;

[0051] Figure 7 A schematic diagram of the connection of the surface material including the metal layer, the insulating coating, the RFID layer and the base material when setting a local insulating coating;

[0052] Figure 8 A schematic diagram of the connection of the surface material including the metal layer, the insulating coating, the RFID layer and the base material when setting a full-plate insulating coating.

[0053] In the figure: 1-surface material; 101-substrate; 102-first structural coating; 103-second structural coating; 104-third structural coating; 105-metal layer; 106-other surface materials except the metal layer; 2-RFID layer; 3-base material; 301-base film; 302-resin coating; 4-composite adhesive; 5-insulating coating. DETAILED DESCRIPTION

[0054] The utility model is described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the utility model, but do not limit the utility model in any form. It should be pointed out that for those of ordinary skill in the art, several changes and improvements can be made without departing from the concept of the utility model. These all belong to the protection scope of the utility model.

[0055] Example 1

[0056] like Figure 1 As shown, the utility model provides an in-mold label, the label includes a surface material 1, an RFID layer 2, a base material 3 and a composite adhesive 4. Among them, the RFID layer 2 is located between the surface material 1 and the base material 3, and the RFID layer 2 is directly connected to the surface material 1, that is, the RFID layer 2 can be directly set on the surface material 1 by printing. The base material 3 is connected to at least part of the RFID layer and part of the surface material 1 through the composite adhesive 4.

[0057] The surface material 1 includes a structural coating and a substrate, wherein the structural coating is connected to the substrate. The structural coating can be one layer or multiple layers. Figure 2 The multilayer shown. When the structural coating is multilayer, the multilayer structural coating can be all arranged on one side of the substrate, or the multilayer structural coating can be divided into two parts, that is, one or more layers are arranged on one side of the substrate, and the remaining one or more layers are arranged on the other side. In the present utility model, "multiple" means the number is two or more. The following is an explanation through some specific cases:

[0058] exist Figure 2In the embodiment, the multi-layer structural coating is disposed on both sides of the substrate 101, namely, the first structural coating 102 is located on the upper side of the substrate 101, and the second structural coating 103 and the third structural coating 104 are located on the lower side of the substrate 101. However, in other embodiments, the multi-layer structural coating may also be located on one side of the substrate 101, and the present invention does not limit this.

[0059] Among them, the structural coating can be a full-screen coating like the first structural coating 102 and the third structural coating 104, that is, the projection of the structural coating is the same size as the projection of the substrate 101, or it can be a partial coating like the second structural coating 103, that is, the projection of the structural coating can be located within the projection of the substrate.

[0060] The structural coating includes one or more combinations of optical coatings and printed coatings, and technicians can design them according to actual needs. Optical coatings are coatings that use one or more principles of light refraction, reflection, interference and diffraction to make the pattern change with the observation line of sight, such as laser holographic layers, which use the principle of white light diffraction grating to make the image effect changeable and colorful; it can also be a combination of a lens layer and a micro-graphic layer, and the micro-graphic layer can show the desired visual effect through the refraction of the lens layer; it can also be a reflective layer formed by materials such as aluminum, zinc sulfide, silicon dioxide, and titanium dioxide. Printed coatings are coatings that make the film show a certain pattern effect through the reflection of light, such as graphic layers. In other embodiments, the optical coating can also be designed according to the desired effect, and the utility model does not limit this.

[0061] The material of the substrate may be a composite material of one or more materials such as polyester material (PET), polypropylene material (Bopp), polyethylene material (PE), polycarbonate material (PC), polyvinyl chloride material (PVC), etc.

[0062] Preferably, in order to prevent the pattern on the surface material 1 from being damaged due to friction, the structural coating is connected to the side of the substrate 101 close to the RFID layer 2, so that the substrate 101 protects the pattern from friction.

[0063] When the optical coating has a metal layer 105, the metal layer 105 is located at the outermost side of the optical coating, and the metal layer 105 and the RFID layer 2 are located on the same side of the substrate 101. Figure 6 As shown, the metal layer 105 does not overlap or contact the RFID layer 2, and the RFID layer 2 can be directly connected to other surface materials 106 except the metal layer; or, as shown in FIG. Figure 7 and Figure 8 As shown, the projection of the metal layer 105 overlaps at least partially with the projection of the RFID layer 2. In order to avoid short circuit, an insulating coating 5 needs to be provided between the metal layer 105 and the RFID layer 2. The insulating coating can be Figure 8The full-plate insulating coating shown can also be Figure 7 The local insulating coating shown, the projection of the local insulating coating 5 needs to at least cover the area of ​​the above-mentioned overlapping part. The RFID layer 2 is at least partially located on the insulating coating to avoid short circuit of the RFID layer 2. The material of the insulating coating 5 is cured insulating ink. For details, please refer to the UV transparent insulating ink EMS DI-7502C of Dongguan Honghao Electronics Co., Ltd.; UV insulating ink YH-JY600 of Shenzhen Yunhui New Materials Technology Co., Ltd., etc. It should be noted that the projection here refers to the projection in the longitudinal direction with reference to the direction in the figure.

[0064] The RFID layer 2 includes an antenna and a chip. To reduce the thickness, the antenna may be a printed antenna, and the chip is electrically connected to the antenna via a pad structure. The RFID layer may be a high frequency RFID or an ultra high frequency RFID.

[0065] In this embodiment, the material of the printed antenna is solidified conductive silver paste, solidified conductive copper paste, conductive graphite and conductive graphene.

[0066] The material of the substrate 3 needs to be the same as the material used for subsequent injection molding, or have good compatibility and be easily dissolved to achieve a bonding effect with the subsequent material. Since the subsequent process is completed at a higher temperature and pressure, the substrate 3 can also protect the RFID layer 2.

[0067] The substrate 3 may be a base film, a resin coating, or a composite structure of a base film and a resin coating. When the substrate 3 is a base film, the base film is connected and fixed in the in-mold label by a composite adhesive. When the substrate 3 is a resin coating, the resin coating is connected and fixed in the in-mold label by a composite adhesive, or is directly connected and fixed. When the substrate is a composite structure of a base film and a resin coating, the resin coating is connected to the side of the base film away from the RFID layer, and the base film is connected and fixed in the in-mold label by a composite adhesive; or, the resin coating is connected to the side of the base film close to the RFID layer, and the resin coating is connected and fixed in the in-mold label by a composite adhesive, or is directly connected and fixed.

[0068] like Figure 1 As shown, when the substrate 3 is a base film 301, no metal layer is provided on the outermost side of the structural coating close to the RFID layer, and the surface material 1 is directly connected to the RFID layer 2, the base film 301 is connected to the RFID layer 2 and the surface material 1 through the composite adhesive 4.

[0069] like Figure 6 As shown, when the substrate 3 is a base film 301, a metal layer is provided on the outermost side of the structural coating near the RFID layer, and the surface material 1 is directly connected to the RFID layer 2, the metal layer is not in contact with the RFID layer 2, and the base film is connected to the RFID layer, the metal layer and the surface material 1 through a composite adhesive.

[0070] like Figure 8 As shown, when the substrate 3 is a base film 301, a metal layer is provided on the outermost side of the structural coating close to the RFID layer, and a full-plate insulating coating 5 is provided between the surface material 1 and the RFID layer, the base film 301 is connected to the RFID layer 2 and the insulating coating 5 through the composite adhesive 4.

[0071] like Figure 7 As shown, when the substrate 3 is a base film 301, a metal layer is provided on the outermost side of the structural coating close to the RFID layer, and a local insulating coating 5 is provided between the surface material 1 and the RFID layer, the base film 301 is connected to the RFID layer 2, the surface material 1 and the insulating coating 5 through the composite adhesive 4.

[0072] like Figure 3 As shown, when the substrate 3 is a resin coating 302, no metal layer is provided on the outermost side of the structural coating close to the RFID layer, and the surface material 1 is directly connected to the RFID layer 2, the resin coating 302 can be connected to the RFID layer 2 and the surface material 1 through the composite adhesive 4.

[0073] When the substrate 3 is a resin coating 302, a metal layer is provided on the outermost side of the structural coating close to the RFID layer, and the surface material 1 is directly connected to the RFID layer 2, the metal layer is not in contact with the RFID layer 2, and the resin coating 302 can be connected to the RFID layer 2, the metal layer and the surface material 1 through the composite adhesive 4.

[0074] When the substrate is a resin coating 302, a metal layer is provided on the outermost side of the structural coating close to the RFID layer, and a full-page insulating coating 5 is provided between the surface material 1 and the RFID layer 2, the resin coating 302 is connected to the RFID layer 2 and the insulating coating 5 through the composite adhesive 4, or the resin coating 302 is directly connected to the RFID layer 2 and the insulating coating 5.

[0075] When the substrate is a resin coating 302, a metal layer is provided on the outermost side of the structural coating close to the RFID layer, and a local insulating coating 5 is provided between the surface material 1 and the RFID layer 2, the resin coating 302 is directly connected to the RFID layer 2, the surface material 1 and the insulating coating 5.

[0076] like Figure 5As shown, when the substrate 3 is a composite structure of a base film 301 and a resin coating 302, a metal layer is not provided on the side of the outermost side of the structural coating close to the RFID layer, and the surface material 1 is directly connected to the RFID layer 2, the resin coating 302 is connected to the side of the base film 301 away from the RFID layer 2, and the base film 301 is connected to the RFID layer 2 and the surface material 1 through the composite adhesive 4, or, the resin coating 302 is connected to the side of the base film 301 close to the RFID layer 2, and the resin coating 302 can be connected to the RFID layer 2 and the surface material 1 through the composite adhesive 4, or directly connected to the RFID layer 2 and the surface material 1.

[0077] When the substrate 3 is a composite structure of a base film 301 and a resin coating 302, a metal layer is provided on the outermost side of the structural coating near the RFID layer, and the surface material 1 is directly connected to the RFID layer 2, the metal layer is not in contact with the RFID layer 2. The resin coating 302 is connected to the side of the base film 301 away from the RFID layer 2, and the base film 301 is connected to the RFID layer 2, the metal layer and the surface material 1 through the composite adhesive 4, or the resin coating 302 is connected to the side of the base film 301 close to the RFID layer 2, and the resin coating 302 can be connected to the RFID layer 2, the metal layer and the surface material 1 through the composite adhesive 4, or directly connected to the RFID layer 2, the metal layer and the surface material 1.

[0078] When the substrate 3 is a composite structure of a base film 301 and a resin coating 302, a metal layer is provided on the outermost side of the structural coating close to the RFID layer, and a full-plate insulating coating is provided between the surface material 1 and the RFID layer 2, the resin coating 302 is connected to the side of the base film 301 away from the RFID layer 2, and the base film 301 is connected to the RFID layer 2 and the insulating coating 5 through the composite adhesive 4; or, the resin coating 302 is connected to the side of the base film 301 close to the RFID layer 2, and the resin coating 302 is connected to the RFID layer 2 and the insulating coating 5 through the composite adhesive 4, or is directly connected to the RFID layer 2 and the insulating coating 5.

[0079] When the substrate 3 is a composite structure of a base film 301 and a resin coating 302, a metal layer is provided on the outermost side of the structural coating close to the RFID layer, and a local insulating coating is provided between the surface material 1 and the RFID layer 2, the resin coating 302 is connected to the side of the base film 301 away from the RFID layer 2, and the base film 301 is connected to the RFID layer 2, the surface material 1 and the insulating coating 5 through the composite adhesive 4; or, the resin coating 302 is connected to the side of the base film 301 close to the RFID layer 2, the resin coating 302 is connected to the RFID layer 2, the surface material 1 and the insulating coating 5 through the composite adhesive 4, or the resin coating 302 is directly connected to the RFID layer 2, the surface material 1 and the insulating coating 5.

[0080] In this embodiment, the composite adhesive 4 mainly plays the role of bonding the base material 3 with the surface material 1 and the RFID layer 2, or plays the role of bonding the base material 3 with the surface material 1, the metal layer 105 and the RFID layer 2, such as polyurethane aging adhesive. The base film 301 mainly plays the role of protecting the RFID layer and the surface material, preventing the surface material and the RFID layer from being damaged under the high temperature and high pressure conditions during injection molding. At the same time, the base film also plays the role of bonding with the injection molding material. Generally, the material that is the same as the injection molding material or has good compatibility is selected, such as polyethylene (PE), polypropylene (PP), polyester (PET) or polyvinyl chloride (PVC), etc. The resin coating 302 mainly plays the role of protecting the RFID layer and the surface material, preventing the surface material and the RFID layer from being damaged under the high temperature and high pressure conditions during injection molding. At the same time, the resin coating 302 also plays the role of bonding with the injection molding material. Generally, the material that is the same as the injection molding material or has good compatibility and is easier to dissolve is selected, such as ABS coating, polyethylene (PE) coating or EVA coating, etc. The material selection of the base film 301 and the resin coating 302 needs to be selected according to the blow molding and injection molding materials of the article, and the present utility model does not impose any restrictions on this.

[0081] Example 2

[0082] like Figure 4 As shown, this embodiment is based on the embodiment 1, and the composite glue 4 is removed, thereby reducing the thickness of the label. Specifically, when the substrate 3 is a resin coating 302, the composite glue 4 can be omitted, and the substrate 3 can be directly connected to the RFID layer 2 and the surface material 1, further reducing the thickness.

[0083] The in-mold label of the utility model can be directly formed on the article, for example, in the process of blow molding or injection molding of the article, so that the base material and the article are melted into one. The article can be a packaging container, such as a wine bottle, a packaging box, etc. The surface material 1 forms the required visual effect, the RFID layer 2 can realize the anti-counterfeiting function, and the base material 3 is combined with the article and plays a role in protecting the RFID layer 2.

[0084] In the description of the present application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0085] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the essence of the present invention. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other at will.

Claims

1. An in-mold label, characterized in that: include: Face material, RFID layer, and base material; The RFID layer is located between the surface material and the base material; The RFID layer is directly connected to the surface material, and the base material is connected to at least a portion of the RFID layer and a portion of the surface material; The surface material comprises a structural coating and a substrate, and the structural coating is at least one layer.

2. The in-mold label according to claim 1, characterized in that: The structural coating includes an optical coating, a printed coating, or a combination of one or more.

3. The in-mold label according to claim 2, characterized in that: The optical coating is a coating that utilizes one or more principles of light refraction, reflection, interference and diffraction to present an effect that changes with the observation line of sight; And / or, the printed coating is a coating that presents a preset pattern effect.

4. The in-mold label according to claim 1, characterized in that: The structural coating is multi-layered; And / or, the RFID layer is a high frequency RFID, or an ultra high frequency RFID; And / or, the structural coating is connected to a side of the substrate close to the RFID layer.

5. The in-mold label according to claim 1, characterized in that: The structural coating is located on one side or both sides of the substrate and is connected to the substrate; And / or, the projection of the structural coating is located in the projection of the substrate, or is the same size as the projection of the substrate.

6. The in-mold label according to claim 2, characterized in that: When the optical coating includes a metal layer, the metal layer is located on the outermost side of the optical coating, and the metal layer and the RFID layer are located on the same side of the substrate: The metal layer does not overlap or contact the RFID layer; or, a projection of the metal layer at least partially overlaps with a projection of the RFID layer, an insulating coating is provided between the metal layer and the RFID layer, and the projection of the insulating coating at least covers the area of ​​the overlapping portion.

7. The in-mold label according to claim 6, characterized in that: The insulating coating is a full-plate insulating coating or a partial insulating coating; and / or, the RFID layer is at least partially located on the insulating coating; And / or, the insulating coating is made of cured insulating ink.

8. The in-mold label according to claim 1, characterized in that: The RFID layer includes an antenna and a chip, and the chip is electrically connected to the antenna through a pad structure.

9. The in-mold label according to claim 8, characterized in that: The antenna is a printed antenna.

10. The in-mold label according to claim 9, characterized in that: The material of the printed antenna is solidified conductive silver paste, solidified conductive copper paste, conductive graphite or conductive graphene.

11. The in-mold label according to claim 1 or 6, characterized in that: The substrate is a base film, a resin coating, or a structure in which a base film and a resin coating are connected.

12. The in-mold label according to claim 11, characterized in that: When the substrate is a base film, the base film is connected and fixed in the in-mold label by a composite adhesive; When the substrate is a resin coating, the resin coating is fixed in the in-mold label by a composite adhesive or directly connected and fixed; When the substrate is a structure in which a base film is connected to a resin coating, the resin coating is connected to a side of the base film away from the RFID layer, and the base film is connected and fixed in the in-mold label by a composite adhesive; or, the resin coating is connected to a side of the base film close to the RFID layer, and the resin coating is connected and fixed in the in-mold label by a composite adhesive, or is directly connected and fixed.

13. The in-mold label according to claim 12, characterized in that: When the substrate is a base film, no metal layer is provided on the side of the outermost side of the structural coating close to the RFID layer, and the surface material is directly connected to the RFID layer, the base film is connected to the RFID layer and the surface material through a composite adhesive; When the base material is a resin coating, no metal layer is provided on the side of the outermost side of the structural coating close to the RFID layer, and the surface material is directly connected to the RFID layer, the resin coating is connected to the RFID layer and the surface material through a composite adhesive, or the resin coating is directly connected to the RFID layer and the surface material; When the substrate is a structure in which a base film is connected to a resin coating, a metal layer is not provided on the side of the outermost side of the structural coating close to the RFID layer, and the surface material is directly connected to the RFID layer, the resin coating is connected to the side of the base film away from the RFID layer, and the base film is connected to the RFID layer and the surface material through a composite adhesive; or, the resin coating is connected to the side of the base film close to the RFID layer, and the resin coating is connected to the RFID layer and the surface material through a composite adhesive, or is directly connected to the RFID layer and the surface material; When the substrate is a base film, a metal layer is provided on the outermost side of the structural coating near the RFID layer, and the surface material is directly connected to the RFID layer, the base film is connected to the RFID layer and the surface material through a composite adhesive; When the base material is a resin coating, a metal layer is provided on the outermost side of the structural coating near the RFID layer, and the surface material is directly connected to the RFID layer, the resin coating is connected to the RFID layer, the metal layer and the surface material through a composite adhesive, or the resin coating is directly connected to the RFID layer, the metal layer and the surface material; When the substrate is a structure in which a base film is connected to a resin coating, a metal layer is provided on the outermost side of the structural coating near the RFID layer, and the surface material is directly connected to the RFID layer, the resin coating is connected to the side of the base film away from the RFID layer, and the base film is connected to the RFID layer, the metal layer and the surface material through a composite adhesive; or, the resin coating is connected to the side of the base film close to the RFID layer, and the resin coating is connected to the RFID layer, the metal layer and the surface material through a composite adhesive, or is directly connected to the RFID layer, the metal layer and the surface material; When the substrate is a base film, a metal layer is provided on the outermost side of the structural coating near the RFID layer, and a full-cover insulation coating is provided between the surface material and the RFID layer, the base film is connected to the RFID layer and the insulation coating by a composite adhesive; When the base material is a resin coating, a metal layer is provided on the outermost side of the structural coating near the RFID layer, and a full-plate insulating coating is provided between the surface material and the RFID layer, the resin coating is connected to the RFID layer and the insulating coating through a composite adhesive, or the resin coating is directly connected to the RFID layer and the insulating coating; When the substrate is a structure in which a base film is connected to a resin coating, a metal layer is provided on the outermost side of the structural coating near the RFID layer, and a full-plate insulating coating is provided between the surface material and the RFID layer, the resin coating is connected to the side of the base film away from the RFID layer, and the base film is connected to the RFID layer and the insulating coating through a composite adhesive; or, the resin coating is connected to the side of the base film close to the RFID layer, and the resin coating is connected to the RFID layer and the insulating coating through a composite adhesive, or is directly connected to the RFID layer and the insulating coating; When the substrate is a base film, a metal layer is provided on the outermost side of the structural coating near the RFID layer, and a local insulating coating is provided between the surface material and the RFID layer, the base film is connected to the RFID layer, the surface material and the insulating coating by a composite adhesive; When the base material is a resin coating, a metal layer is provided on the outermost side of the structural coating near the RFID layer, and a local insulating coating is provided between the surface material and the RFID layer, the resin coating is directly connected to the RFID layer, the surface material and the insulating coating; When the substrate is a structure in which a base film is connected to a resin coating, a metal layer is provided on the side of the outermost side of the structural coating close to the RFID layer, and a partial insulating coating is provided between the surface material and the RFID layer, the resin coating is connected to the side of the base film away from the RFID layer, and the base film is connected to the RFID layer, the surface material and the insulating coating through a composite adhesive; or, the resin coating is connected to the side of the base film close to the RFID layer, and the resin coating is connected to the RFID layer, the surface material and the insulating coating through a composite adhesive, or the resin coating is directly connected to the RFID layer, the surface material and the insulating coating; And / or, the base film plays a role in protecting the RFID layer and the surface material, preventing the surface material and the RFID layer from being damaged during injection molding, and the base film also plays a role in bonding with the injection molding material, and the base film is selected to be the same as or compatible with the injection molding material; And / or, the resin coating protects the RFID layer and the surface material to prevent the surface material and the RFID layer from being damaged during injection molding. At the same time, the resin coating also serves to bond with the injection molding material, and a material that is the same as the injection molding material or is compatible and soluble is selected.

14. The in-mold label according to claim 13, characterized in that: The composite adhesive plays a role in bonding the base material, the surface material and the RFID layer, or plays a role in bonding the base material, the surface material, the metal layer and the RFID layer.

15. An article with a label, characterized in that: The invention comprises the in-mold label according to any one of claims 1 to 14.

16. The labeled article according to claim 15, characterized in that: The in-mold label is formed on the article.

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