Electronic equipment

Abstract

The utility model relates to the technical field of electronic equipment, in particular to electronic equipment, which comprises a bottom plate, a magnet assembly and a shielding assembly, and magnet accommodating grooves arranged in a rectangular array are arranged on the bottom plate; the magnet assembly comprises at least two first magnets and at least two second magnets which are distributed in a rectangular array mode, each first magnet is located between the two second magnets, each second magnet is located between the two first magnets, and the magnetism of the first magnets is opposite to that of the second magnets. The first magnet and the second magnet are arranged in the magnet accommodating groove; the at least four magnets are arranged in the array, so that the magnets on the diagonal lines have the same magnetic field direction in space, and every two adjacent magnets have opposite magnetic field directions in space, so that the magnetism of the magnets is enhanced, and the falling risk after the electronic equipment is adsorbed with the metal surface is reduced. The shielding assembly is connected above the magnet assembly to isolate a magnetic field generated by the magnet assembly, so that the interference of the magnetic field generated by the magnet on surrounding electronic equipment is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment, in particular to an electronic equipment. Background Art

[0002] Existing magnetic attraction technologies usually use magnetic materials to achieve the magnetic attraction function. These magnetic materials are usually permanent magnets, such as neodymium iron boron magnets or cobalt magnets. The magnetic material is usually embedded on one side of the product, and the metal adsorbent is embedded on the other side. When the two are close to each other, the magnetic field generated by the magnetic material will attract the metal adsorbent, thereby achieving the magnetic attraction effect. This design allows the product to be easily adsorbed on the metal surface.

[0003] Most magnets currently have an integrated design, which results in a positive correlation between the magnetic field strength of the magnet and its material and volume. Normally, if a single magnet and a metal adsorbent are to achieve the desired magnetic attraction, the magnet needs to be larger. Small electronic devices cannot use larger magnets due to limited space structures. If multiple magnets are used, the magnetic attraction will be weakened due to their small size, and the magnetic field generated by multiple magnets may interfere with surrounding electronic devices or magnetic storage media, resulting in device performance degradation or data loss, and even burning components in severe cases.

[0004] Therefore, an electronic device is urgently needed to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide an electronic device, which can enhance the magnetic attraction of small electronic devices and shield the interference of the magnetic field to the surrounding environment and other devices.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] An electronic device is provided, comprising: a base plate, the base plate being provided with magnet receiving grooves arranged in a rectangular array; a magnet assembly, the magnet assembly comprising at least two first magnets and at least two second magnets distributed in a rectangular array, each of the first magnets being located between two of the second magnets, each of the second magnets being located between two of the first magnets, the magnetism of the first magnet being opposite to that of the second magnet, and the first magnet and the second magnet being both arranged in the magnet receiving groove; and a shielding assembly, the shielding assembly being connected above the magnet assembly to isolate the magnetic field generated by the magnet assembly.

[0008] As an optional solution for the electronic device, the shielding component is a magnetic metal sheet, and the magnetic metal sheet is adsorbed above the magnet component.

[0009] As an optional solution for the electronic device, the electronic device further includes a circuit board, which is connected above the base plate, electronic devices are connected to the circuit board, and an insulating structure is provided between the circuit board and the base plate to protect the electronic devices.

[0010] As an optional solution for the electronic device, the insulating structure is bonded above the shielding component.

[0011] As an optional solution for electronic equipment, the insulating structure is a polyimide tape.

[0012] As an optional solution for the electronic device, the circuit board is detachably connected to the base plate.

[0013] As an optional solution for the electronic equipment, the base plate is an aluminum alloy base plate.

[0014] As an optional solution for the electronic device, the electronic device also includes a conductive structure, and a laser engraving area used in conjunction with the conductive structure is provided on the bottom plate at a position corresponding to the shielding component and at a position corresponding to the copper-clad area of ​​the circuit board.

[0015] As an optional solution for the electronic device, the conductive structure is conductive foam.

[0016] As an optional solution for the electronic device, the magnet assembly is bonded to the bottom plate.

[0017] Beneficial effects of the utility model:

[0018] The utility model provides an electronic device, including a bottom plate, a magnet assembly and a shielding assembly, wherein the bottom plate is provided with magnet receiving slots arranged in a rectangular array; the magnet assembly includes at least two first magnets and at least two second magnets distributed in a rectangular array, each first magnet is located between two second magnets, each second magnet is located between two first magnets, the magnetism of the first magnet is opposite to the magnetism of the second magnet, and the first magnet and the second magnet are both arranged in the magnet receiving slot; by arranging at least four magnets in an array, at least two magnets on a diagonal line have the same magnetic field direction in space, and two adjacent magnets have opposite magnetic field directions in space, thereby enhancing the magnetism of the magnet and reducing the risk of the electronic device falling off after being adsorbed on a metal surface. The shielding assembly is connected above the magnet assembly to isolate the magnetic field generated by the magnet assembly, so that the magnetic field generated by the magnet reduces interference with surrounding electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is an exploded diagram of an electronic device provided by an embodiment of the utility model.

[0020] In the figure:

[0021] 1. Bottom plate; 101. Magnet receiving groove;

[0022] 2. Magnet assembly; 21. First magnet; 22. Second magnet;

[0023] 3. Shielding components;

[0024] 4. Circuit board;

[0025] 5. Insulation structure;

[0026] 6. Conductive structure. DETAILED DESCRIPTION

[0027] The technical solution of the utility model is further described below in conjunction with the accompanying drawings and implementation methods. It is understood that the specific embodiments described herein are only used to explain the utility model, rather than to limit the utility model. It should also be noted that, for the convenience of description, only the parts related to the utility model are shown in the accompanying drawings, rather than all.

[0028] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0030] like Figure 1As shown, the electronic device of this embodiment includes a bottom plate 1, a magnet assembly 2 and a shielding assembly 3, and the bottom plate 1 is provided with a magnet receiving groove 101 arranged in a rectangular array; the magnet assembly 2 includes at least two first magnets 21 and at least two second magnets 22 distributed in a rectangular array, each first magnet 21 is located between two second magnets 22, each second magnet 22 is located between two first magnets 21, the magnetism of the first magnet 21 is opposite to the magnetism of the second magnet 22, and the first magnet 21 and the second magnet 22 are both arranged in the magnet receiving groove 101; by arranging at least two first magnets 21 and at least two second magnets 22 in an array, the magnetic field directions of at least two first magnets 21 or at least two second magnets 22 on the diagonal are the same in space, and the magnetic fields of two adjacent first magnets 21 and second magnets 22 are opposite in space, thereby enhancing the magnetism of the magnet assembly 2 and reducing the risk of the electronic device falling off after being adsorbed on the metal surface. The shielding assembly 3 is connected above the magnet assembly 2 to isolate the magnetic field generated by the magnet assembly 2, so that the magnetic field generated by the magnet reduces the interference of the surrounding electronic equipment. By distributing the first magnet 21 and the second magnet 22 in an array, a magnet assembly 2 with a smaller volume can meet the suction force requirement of the electronic device, thereby reducing the accommodation space required for the magnet and further improving the utilization rate of the internal space of the electronic device.

[0031] In this embodiment, the magnet assembly 2 includes two first magnets 21 and two second magnets 22. Four magnet receiving grooves 101 are provided on the bottom plate 1. The two first magnets 21 and the two second magnets 22 are arrayed and distributed in the four magnet receiving grooves 101, so that the first magnets 21 and the second magnets 22 are placed stably and are not easily misplaced. In other embodiments, the magnet assembly 2 may include three first magnets 21 or three second magnets 22 to enhance the magnetic attraction of the magnet assembly 2, which is not specifically limited here.

[0032] Preferably, the magnet assembly 2 is bonded to the base plate 1 by glue, and the bonding connection simplifies the manufacturing process, reduces production costs and production time; at the same time, the bonding connection helps to improve the lightweight level of the electronic device.

[0033] Furthermore, the electronic device further includes a circuit board 4, which is connected to the top of the bottom plate 1, and an electronic device (not shown in the figure) is connected to the wall of the circuit board 4 facing the bottom plate 1, and an insulating structure 5 is also provided between the circuit board 4 and the bottom plate 1 to protect the electronic device. The insulating structure 5 can prevent the shielding component 3 from contacting with the electronic device on the circuit board 4 and causing other hazards such as short circuit.

[0034] Preferably, the insulating structure 5 is bonded above the shielding component 3, such as Figure 1As shown, the insulating structure 5 is arranged between the shielding component 3 and the circuit board 4, and the shape of the insulating structure 5 is the same as that of the shielding component 3, thereby improving the space utilization inside the electronic device; the bonding method is simple in process and can reduce production costs and production time.

[0035] In this embodiment, the insulating structure 5 is a polyimide tape. The polyimide tape is based on a polyimide film and uses an imported silicone pressure-sensitive adhesive. It has the properties of high and low temperature resistance, acid and alkali resistance, solvent resistance, electrical insulation (H grade), and radiation protection. At the same time, the polyimide tape has high quality stability, good surface flatness, and strong adhesive reliability. In other embodiments, the insulating structure 5 may also be a polyvinyl chloride or polyethylene tape, or other insulating tape, which is not specifically limited here.

[0036] Preferably, in this embodiment, the shielding component 3 includes a magnetic conductive metal sheet, which is adsorbed on the top of the magnet component 2. The shielding component 3 is a whole piece of magnetic conductive metal sheet, so that it can be directly adsorbed on the two first magnets 21 and the two second magnets 22, so as to isolate the magnetic field generated by the array-distributed magnet component 2 and reduce the influence of the magnetic field generated by the magnet component 2 on the electronic devices on the circuit board 4; at the same time, the magnetic conductive metal sheet can enhance the magnetic attraction of the array-distributed first magnets 21 and the second magnets 22.

[0037] Furthermore, the circuit board 4 is detachably connected to the base plate 1. In the present embodiment, the circuit board 4 is provided with a plurality of first connection holes, the base plate 1 is provided with a plurality of second connection holes, and a plurality of connectors are provided through the plurality of first connection holes and the plurality of second connection holes in a one-to-one correspondence. In the present embodiment, the first connection hole and the second connection hole are both threaded holes, and the connectors are bolts. In other embodiments, the first connection hole and the second connection hole may be through holes, and the connectors may be pins. The circuit board 4 is detachably connected to the base plate 1, so that the electronic equipment can be easily disassembled and assembled, and the electronic components on the circuit board 4 can be replaced in a timely manner.

[0038] Furthermore, the bottom plate 1 is an aluminum alloy bottom plate. The aluminum alloy bottom plate has good corrosion resistance and plasticity, and can be processed into products of various specifications; and the aluminum alloy plate is highly lightweight, has a low production cost, and is easy to process and transport.

[0039] Preferably, in this embodiment, the bottom plate 1 is a surface-treated aluminum alloy bottom plate. Aluminum alloy will form a hard and dense oxide film with good corrosion resistance in the atmosphere. The corrosion resistance of aluminum can be further improved by surface treatment such as electrophoretic painting, anodizing, powder spraying, etc.

[0040] In this embodiment, the electronic device further includes a conductive structure 6, and a laser engraving area (not shown in the figure) used in conjunction with the conductive structure 6 is provided at a position on the bottom plate 1 corresponding to the shielding component 3 and at a position corresponding to the copper-clad area of ​​the circuit board 4. During the laser engraving process, the laser beam will cause high-temperature burning and gasification on the surface of the bottom plate 1, changing the physical and chemical properties of the original material, thereby forming a layer of polymer microcrystalline area on the surface. The formation of such a microcrystalline area will significantly increase the conductive properties of the material surface, and the conductive structure 6 is mounted in the laser engraving area, so that the bottom plate 1 and the magnetic component 2 and the shielding component 3 connected to the bottom plate 1 are connected to the electronic devices on the circuit board 4, so that the entire electronic device has an electrostatic protection function.

[0041] Specifically, in this embodiment, there are three laser engraving areas, and correspondingly, there are three conductive structures 6, and the three conductive structures 6 correspond to the three laser engraving areas one by one. Among them, the two ends of two conductive structures 6 are respectively abutted and connected with the copper-clad area (i.e., the electronic device connection area) on the circuit board 4 and two of the laser engraving areas on the bottom plate 1, and the two ends of another conductive structure 6 are respectively abutted with another laser engraving area on the bottom plate 1 and the shielding component 3, and make them conductive. It is worth noting that the magnet component 2 and the shielding component 3 can be directly adsorbed, and the two are already conductive, so no special treatment is required.

[0042] Preferably, the conductive structure 6 is conductive foam. Conductive foam has good compression resistance and dimensional stability, can withstand a certain pressure without losing its original shape and performance, and has strong plasticity and processability, and can be made into conductive foam of different shapes and specifications according to different needs.

[0043] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. An electronic device, characterized in that: The electronic device includes: A bottom plate (1), wherein the bottom plate (1) is provided with magnet receiving grooves (101) arranged in a rectangular array; A magnet assembly (2), the magnet assembly (2) comprising at least two first magnets (21) and at least two second magnets (22) distributed in a rectangular array, each of the first magnets (21) being located between two of the second magnets (22), each of the second magnets (22) being located between two of the first magnets (21), the magnetism of the first magnet (21) being opposite to the magnetism of the second magnet (22), and the first magnet (21) and the second magnet (22) being both arranged in the magnet receiving groove (101); A shielding component (3) is connected above the magnet component (2) to isolate the magnetic field generated by the magnet component (2).

2. The electronic device according to claim 1, characterized in that: The shielding component (3) is a magnetic metal sheet, and the magnetic metal sheet is adsorbed on top of the magnet component (2).

3. The electronic device according to claim 1, characterized in that: The electronic device further comprises a circuit board (4), the circuit board (4) being connected above the base plate (1), the circuit board (4) being connected to electronic devices, and an insulating structure (5) being provided between the circuit board (4) and the base plate (1) to protect the electronic devices.

4. The electronic device according to claim 3, characterized in that: The insulating structure (5) is bonded onto the shielding component (3).

5. The electronic device according to claim 3, characterized in that: The insulating structure (5) is a polyimide tape.

6. The electronic device according to claim 3, characterized in that: The circuit board (4) is detachably connected to the base plate (1).

7. The electronic device according to claim 1, characterized in that: The bottom plate (1) is an aluminum alloy bottom plate.

8. The electronic device according to claim 3, characterized in that: The electronic device further comprises a conductive structure (6), and a laser engraving area for use with the conductive structure (6) is also provided on the bottom plate (1) at a position corresponding to the shielding component (3) and at a position corresponding to the copper-clad area of ​​the circuit board (4).

9. The electronic device according to claim 8, characterized in that: The conductive structure (6) is conductive foam.

10. The electronic device according to any one of claims 1 to 9, characterized in that: The magnet assembly (2) is bonded to the base plate (1).

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