Chip capacitor assembling chip mounting base device

Abstract

The utility model discloses a chip capacitor assembly chip mounting base device which comprises a base, the upper surface of the base is fixedly connected with a working platform, the upper surface of the base is fixedly connected with a supporting rod, the upper surface of the supporting rod is fixedly connected with a support, the upper surface of the support is fixedly connected with a first hydraulic cylinder, and the upper surface of the first hydraulic cylinder is fixedly connected with a second hydraulic cylinder. A first hydraulic cylinder is fixedly connected to the lower surface of the base, a first telescopic rod is fixedly connected to the output end of the first hydraulic cylinder, a pressing plate is fixedly connected to the other end of the first telescopic rod, a sliding groove is formed in the working platform, and a push rod is slidably connected to the inner surface of the sliding groove. The output end of the second hydraulic cylinder is fixedly connected with a second telescopic rod, the other end of the second telescopic rod is fixedly connected to the side surface of the push rod, and through the components, the chip capacitor located on the working platform can be centered and accurately positioned, and it is ensured that the chip capacitor is aligned with other components or welding points.

Description

Technical Field

[0001] The utility model relates to the technical field of patch capacitors, in particular to a patch base device for assembling a patch capacitor. Background Art

[0002] Chip capacitors are a type of capacitor material. The full name of chip capacitors is: multi-layer (laminated, stacked) chip ceramic capacitors. When producing chip capacitors, the chip capacitors need to be clamped.

[0003] The existing assembly chip base device is to place the chip capacitor on the workbench and clamp the chip capacitor with the lower pressure plate. However, when it is used, the chip capacitor on the workbench cannot be centered, and there may be an offset between the capacitor and the pad, resulting in loose welding. For example, a Chinese patent discloses a "chip capacitor high-speed assembly chip base device", and its application number is "202223172464.X". This device includes a support table, a side plate is fixed to one end of the top of the support table, a mounting table is fixed to the top of the support table, a mounting groove is opened inside the mounting table, and a pressing mechanism is installed on the side plate. The pressing mechanism includes a pressure rod and a pressure head installed at the front end of the pressure rod, which can realize rapid clamping and release of the chip capacitor, and the clamping has buffer protection, the clamping is safer, and the chip capacitor will not be damaged. However, when it is used, the capacitor on the workbench cannot be centered, and there may be an offset between the capacitor and the pad, resulting in loose welding, thereby affecting the connection reliability and electrical performance of the capacitor. Utility Model Content

[0004] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art, and to provide a patch capacitor assembly patch base device. The second hydraulic cylinder drives the second telescopic rod to push the push rod forward, so that the patch capacitor located on the work platform can be centered and accurately positioned. The push rod can accurately push the patch capacitor on the workbench to the center position to ensure that it is aligned with other components or welding points, which helps to improve the accuracy and consistency of assembly, reduce welding or connection problems caused by position offset, and reduce errors. The precise push rod device can reduce the possibility of human errors, ensure that each patch capacitor can be accurately pushed to the center position, and reduce problems that may occur in subsequent processes. The first hydraulic cylinder drives the telescopic rod to make the pressing plate descend to press the patch capacitor. The patch capacitor is usually very small and light, and is easily disturbed by external forces and moves. The pressing plate provides stable support by applying an appropriate amount of pressure, so that the patch capacitor is kept in the correct position and prevented from shaking or losing stability during the assembly process. The pressing plate driven by the hydraulic cylinder can reduce the labor intensity of the operator and reduce the physical exertion and labor intensity of the operator.

[0005] The utility model also provides a chip base device for assembling a chip capacitor as mentioned above, including: a base, the upper surface of the base is fixedly connected to a working platform, the upper surface of the base is fixedly connected to a support rod, the upper surface of the support rod is fixedly connected to a bracket, the upper surface of the bracket is fixedly connected to a hydraulic cylinder 1, the output end of the hydraulic cylinder 1 is fixedly connected to a telescopic rod 1, the other end of the telescopic rod 1 is fixedly connected to a pressing plate, a slide groove is provided on the working platform, the inner surface of the slide groove is slidably connected to a push rod, the lower surface of the base is fixedly connected to a hydraulic cylinder 2, the output end of the hydraulic cylinder 2 is fixedly connected to a telescopic rod 2, and the other end of the telescopic rod 2 is fixedly connected to the side surface of the push rod. Through the above components, the chip capacitor located on the working platform can be centered and accurately positioned to ensure that it is aligned with other components or welding points.

[0006] According to the chip capacitor assembly chip base device described in the utility model, the lower surface of the pressing plate and the upper surface of the working platform are fixedly connected with a protection pad, and the material of the protection pad is an ESD foam pad. Through the above components, the chip capacitor can be protected and prevented from being scratched.

[0007] According to the chip capacitor assembly chip base device described in the utility model, the upper surface of the base is fixedly connected with a support rod, and the above components are used to facilitate the installation of a fixed shield.

[0008] According to the chip capacitor assembly chip base device described in the utility model, the side surface of the support rod is fixedly connected with a protective cover, and the working platform, support rod and bracket are all located inside the protective cover. The above components are convenient for protecting the internal components and preventing them from being disturbed during operation.

[0009] According to the chip capacitor assembly chip base device described in the utility model, a handle is fixedly connected to the side surface of the base, and an anti-slip strip is fixedly connected to the side surface of the handle. The above components facilitate the operator to move the equipment.

[0010] According to the chip capacitor assembly chip base device described in the utility model, the lower surface of the base is fixedly connected with a support leg, and the side surface of the support leg is fixedly connected with a reinforcement plate. The above components are used to facilitate supporting and fixing the device.

[0011] According to the chip capacitor assembly chip base device described in the utility model, the lower surface of the support leg is fixedly connected with an anti-skid pad, and the material of the anti-skid pad is rubber. The above components are used to prevent the equipment from slipping and easy displacement.

[0012] According to the chip capacitor assembly chip base device described in the utility model, the lower surface of the base is fixedly connected to a bottom protective shell, and the second hydraulic cylinder and the second telescopic rod are both located inside the bottom protective shell. The above components are used to facilitate the protection of the second hydraulic cylinder and the second telescopic rod located at the bottom.

[0013] Beneficial Effects

[0014] 1. Compared with the prior art, the chip capacitor assembly chip base device drives the telescopic rod 2 through the hydraulic cylinder 2 to push the push rod forward, so that the chip capacitor located on the work platform can be centered and accurately positioned. The chip capacitor on the workbench can be accurately pushed to the center position through the push rod to ensure that it is aligned with other components or welding points, which helps to improve the accuracy and consistency of assembly, reduce welding or connection problems caused by position offset, and reduce errors. The precise push rod device can reduce the possibility of human errors, ensure that each chip capacitor can be accurately pushed to the center position, and reduce possible problems in subsequent processes.

[0015] 2. Compared with the prior art, the chip capacitor assembly chip base device uses a hydraulic cylinder to drive the telescopic rod to lower the pressing plate to press the chip capacitor. The chip capacitor is usually very small and light, and is easily moved by external interference. The pressing plate provides stable support by applying an appropriate amount of pressure to keep the chip capacitor in the correct position and prevent it from shaking or losing stability during the assembly process. The pressing plate driven by the hydraulic cylinder can reduce the labor intensity of manual labor and reduce the physical exertion and labor intensity of the operator. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0017] Figure 1 This is a front view structural diagram of the chip base device for assembling the chip capacitor of the utility model;

[0018] Figure 2 This is a cross-sectional structural diagram of a chip base device for assembling a chip capacitor of the utility model;

[0019] Figure 3 This is a bottom view of the structure of the chip base device for assembling the chip capacitor of the utility model;

[0020] Figure 4 This is a left view of the structure of the chip base device for assembling the chip capacitor of the utility model.

[0021] Legend:

[0022] 1. Hydraulic cylinder 1; 2. Bracket; 3. Telescopic rod 1; 4. Support rod; 5. Working platform; 6. Base; 7. Support leg; 8. Anti-skid pad; 9. Protective cover; 10. Support rod; 11. Press plate; 12. Protective pad; 13. Push rod; 14. Slide; 15. Handle; 16. Anti-skid strip; 17. Reinforcement plate; 18. Hydraulic cylinder 2; 19. Telescopic rod 2; 20. Bottom protective shell. DETAILED DESCRIPTION

[0023] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0024] Reference Figure 1-4 The utility model embodiment of a patch capacitor assembly patch base device includes: a base 6 for carrying components, the upper surface of the base 6 is fixedly connected with a support rod 10 for supporting a fixed shield, the side surface of the support rod 10 is fixedly connected with a shield 9, the working platform 5, the support rod 4, and the bracket 2 are all located inside the shield 9 for protecting internal components, the side surface of the base 6 is fixedly connected with a handle 15, the side surface of the handle 15 is fixedly connected with an anti-slip strip 16, the lower surface of the base 6 is fixedly connected with a support leg 7, the side surface of the support leg 7 is fixedly connected with a reinforcement plate 17 for supporting a fixed device, the lower surface of the support leg 7 is fixedly connected with an anti-slip pad 8, the material of the anti-slip pad 8 is rubber, and the lower surface of the base 6 is fixedly connected with a bottom protective shell 20, the hydraulic cylinder 2 18 and the telescopic rod 2 19 are all located inside the bottom protective shell 20 for protecting the internal hydraulic cylinder 2 and the telescopic rod 2.

[0025] A working platform 5 is fixedly connected to the upper surface of the base 6 for operating and installing the chip capacitor thereon; a support rod 4 is fixedly connected to the upper surface of the base 6 for supporting the fixed support; a support rod 4 is fixedly connected to the upper surface of the support rod 4 for supporting the fixed support; a support 2 is fixedly connected to the upper surface of the support rod 4 for carrying a hydraulic cylinder 1 and a telescopic rod 1; a hydraulic cylinder 1 is fixedly connected to the upper surface of the support 2; a telescopic rod 3 is fixedly connected to the output end of the hydraulic cylinder 1; a pressing plate 11 is fixedly connected to the other end of the telescopic rod 3 for pressing and fixing the chip capacitor; a protective pad 12 is fixedly connected to the lower surface of the pressing plate 11 and the upper surface of the working platform 5; the protective pad 12 is made of an ESD foam pad for protecting the chip capacitor from being scratched; a slide groove 14 is provided on the working platform 5 for a push rod to slide therein; a push rod 13 is slidably connected to the inner surface of the slide groove 14 for pushing the chip capacitor; a hydraulic cylinder 2 18 is fixedly connected to the lower surface of the base 6; a telescopic rod 2 19 is fixedly connected to the output end of the hydraulic cylinder 2 18; and the other end of the telescopic rod 2 19 is fixedly connected to the side surface of the push rod 13.

[0026] Working principle: When in use, place the chip capacitor on the surface of the working platform 5, open the hydraulic cylinder 2 18 to drive the telescopic rod 2 19 to make the push rod 13 push the chip capacitor forward and center the chip capacitor to ensure that it is aligned with other components or welding points, open the hydraulic cylinder 11 to drive the telescopic rod 3 to make the pressing plate 11 move downward to press the chip capacitor, and by applying an appropriate amount of pressure, provide stable support to keep the chip capacitor in the correct position, and by setting the protective pad 12 on the pressing plate 11 and the surface of the working platform 5, the surface of the chip capacitor can be prevented from being scratched.

[0027] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A chip capacitor assembly chip base device, characterized in that: include: A base (6), the upper surface of the base (6) is fixedly connected to a working platform (5), the upper surface of the base (6) is fixedly connected to a support rod (4), the upper surface of the support rod (4) is fixedly connected to a bracket (2), the upper surface of the bracket (2) is fixedly connected to a hydraulic cylinder (1), the output end of the hydraulic cylinder (1) is fixedly connected to a telescopic rod (3), the other end of the telescopic rod (3) is fixedly connected to a pressing plate (11), a slide groove (14) is provided on the working platform (5), the inner surface of the slide groove (14) is slidably connected to a push rod (13), the lower surface of the base (6) is fixedly connected to a hydraulic cylinder (18), the output end of the hydraulic cylinder (18) is fixedly connected to a telescopic rod (19), the other end of the telescopic rod (19) is fixedly connected to the side surface of the push rod (13).

2. A chip capacitor assembly chip base device according to claim 1, characterized in that: The lower surface of the pressing plate (11) and the upper surface of the working platform (5) are both fixedly connected with a protection pad (12), and the material of the protection pad (12) is an ESD foam pad.

3. A chip capacitor assembly chip base device according to claim 1, characterized in that: A support rod (10) is fixedly connected to the upper surface of the base (6).

4. A chip capacitor assembly chip base device according to claim 3, characterized in that: A protective cover (9) is fixedly connected to the side surface of the support rod (10), and the working platform (5), the support rod (4) and the bracket (2) are all located inside the protective cover (9).

5. A chip capacitor assembly chip base device according to claim 1, characterized in that: A handle (15) is fixedly connected to the side surface of the base (6), and an anti-slip strip (16) is fixedly connected to the side surface of the handle (15).

6. A chip capacitor assembly chip base device according to claim 1, characterized in that: The lower surface of the base (6) is fixedly connected to a support leg (7), and the side surface of the support leg (7) is fixedly connected to a reinforcement plate (17).

7. A chip capacitor assembly chip base device according to claim 6, characterized in that: The lower surface of the support leg (7) is fixedly connected with an anti-skid pad (8), and the material of the anti-skid pad (8) is rubber.

8. The chip capacitor assembly chip base device according to claim 1, characterized in that: The lower surface of the base (6) is fixedly connected with a bottom protective shell (20), and the second hydraulic cylinder (18) and the second telescopic rod (19) are both located inside the bottom protective shell (20).

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