Core outgoing line structure of low-temperature-rise direct-current support capacitor

Abstract

The utility model provides a low temperature rise direct current support capacitor core leading-out wire structure, comprising a capacitor element assembly, the capacitor element assembly comprises a plurality of capacitor core rods, the middle of each capacitor core rod is provided with a through hole, a metallized film with a plurality of lengths is wound outside the core rod, and then the end face is sprayed with metal to form an element. Copper plates are arranged on two sides of the capacitor element assembly, and a plurality of outgoing line structures are arranged on the copper plates in a penetrating manner; each leading-out wire structure extends inwards along the periphery and is provided with a plurality of connecting parts, and the capacitor element assemblies and the copper plates are connected at the connecting parts. According to the low-temperature-rise direct-current supporting capacitor core outgoing line structure, the size of an existing metalized capacitor shell does not need to be increased, and through the novel capacitor core outgoing line structure, the area of the copper plate is increased, the heat dissipation speed is increased, and the internal temperature rise of the metalized capacitor core is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of capacitors, and in particular relates to a low-temperature rise DC support capacitor core lead-out wire structure. Background Art

[0002] Existing metallized capacitors generally have internal capacitor elements that are mostly made of braided wire plus copper foil or entirely braided wire leads and a converging welding structure. Regardless of which of these two structures, the conductor surface area and heat dissipation area are small, the loss is relatively large, and the capacitor generates more heat during operation, resulting in excessive attenuation of the capacitance value and early damage, shortened life, and poor stability and safety. Summary of the invention

[0003] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a low-temperature rise DC support capacitor core lead wire structure, which can increase the heat dissipation area of ​​the capacitor core components, make the capacitor equivalent series inductance Ls and resistance Rs smaller, and reduce product losses, thereby reducing the overall temperature rise of the capacitor core and extending the service life of the capacitor.

[0004] In order to achieve the above technical objectives, the technical solution adopted by the utility model is:

[0005] A low-temperature rise DC support capacitor core lead wire structure, comprising a capacitor element assembly, the capacitor element assembly comprising a capacitor core rod, each of the capacitor core rods having a through hole in the middle; copper plates are arranged on both sides of the capacitor element assembly, and a plurality of lead wire structures are arranged through the copper plates;

[0006] Each of the lead wire structures is provided with a plurality of connection parts extending inwardly along the outer circumference, and the capacitor element assembly and the copper plate are connected at the connection parts.

[0007] Preferably, the lead wire structure of the low-temperature rise DC support capacitor core is in a shape of a rectangle, a square, a circle or a polygon.

[0008] Preferably, in the lead wire structure of the low-temperature rise DC support capacitor core, when the shape of the lead wire structure is a rectangle or a square, a plurality of connection parts are symmetrically arranged on both sides of the lead wire structure, and the lead wire structure has arc transitions around it.

[0009] Preferably, in the lead wire structure of the low-temperature rise DC support capacitor core, when the shape of the lead wire structure is circular, a plurality of connection parts are arranged at intervals on the periphery of the lead wire structure.

[0010] Preferably, the low-temperature rise DC support capacitor core lead-out structure comprises four lead-out pieces, the four lead-out pieces are symmetrically arranged with respect to the central axis of the lead-out structure, a connecting portion is arranged on a side of each lead-out piece away from the horizontal central axis, and a glue injection hole matching the through hole is arranged in the center of the lead-out structure.

[0011] Preferably, in the low-temperature rise DC support capacitor core lead-out wire structure, the capacitor element assembly and the copper plate are welded at the connecting portion.

[0012] Preferably, in the low-temperature rise DC support capacitor core lead-out wire structure, the thickness of the copper plate is 0.5-2.0 mm, and the surface of the copper plate is tin-plated.

[0013] Preferably, in the low-temperature rise DC support capacitor core lead wire structure, a busbar copper plate is provided on one side of the capacitor element assembly, and a plurality of lead wires are provided on the busbar copper plate.

[0014] The beneficial effects brought by the technical solution provided by the embodiment of the utility model are:

[0015] The low-temperature-rise DC support capacitor core lead-out structure of the utility model does not need to increase the size of the existing metallized capacitor shell. Through the new capacitor core lead-out structure, the area of ​​the copper plate is increased, the heat dissipation speed is accelerated, and the temperature rise inside the metallized capacitor core is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the copper plate of the utility model.

[0017] Figure 2 It is a schematic diagram of various lead-out wire structures of the utility model.

[0018] Figure 3 This is a schematic diagram of the matching structure of the capacitor element and the copper plate of the utility model.

[0019] Figure 4 The utility model is a structural schematic diagram of the capacitor core rod assembly and the copper plate combined.

[0020] Figure 5 for Figure 4 Partial schematic diagram of A in the figure.

[0021] Figure 6 It is a schematic diagram of the lead wire structure of the low temperature rise DC support capacitor core of the utility model. DETAILED DESCRIPTION

[0022] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "inside, outside", "up, down", "front, back", etc. are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise stated, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention.

[0023] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0024] like Figure 1-6 A low-temperature rise DC support capacitor core lead wire structure, comprising a capacitor element assembly 1, wherein the capacitor element assembly 1 comprises a plurality of capacitor core rods, each of which has a through hole in the middle; copper plates 2 are arranged on both sides of the capacitor element assembly, and a plurality of lead wire structures 3 are arranged through the copper plates 2;

[0025] Each of the lead wire structures 3 is provided with a plurality of connection portions 4 extending inwardly along the outer circumference, and the capacitor element assembly and the copper plate 2 are connected at the connection portions 4 .

[0026] The lead wire structure 3 is in a rectangular, square, circular or polygonal shape; when the lead wire structure 3 is in a rectangular or square shape, a plurality of connection portions 4 are symmetrically arranged on both sides of the lead wire structure 3, and the lead wire structure 3 is in a circular arc transition shape on all sides; when the lead wire structure 3 is in a circular shape, a plurality of connection portions 4 are arranged at intervals on the outer periphery of the lead wire structure 3; the lead wire structure 3 comprises four lead-out pieces 31, and the four lead-out pieces 31 are symmetrically arranged with respect to the central axis of the lead wire structure 3, and a connection portion 4 is arranged on a side of each lead-out piece 31 away from the horizontal central axis, and a glue injection hole 32 matching the through hole is arranged in the center of the lead wire structure 3; the capacitor element assembly and the copper plate 2 are welded at the connection portion 4; the thickness of the copper plate 2 is 0.5 to 2.0 mm, and the surface of the copper plate 2 is tin-plated; a busbar copper plate 5 is arranged on one side of the capacitor element assembly, and a plurality of lead wires 6 are arranged on the busbar copper plate 5.

[0027] The two copper plates 2 are respectively connected to the front and back sides of the metallized capacitor element by welding, and the lead wire structure of the low temperature rise DC support capacitor core is connected with other accessories to form the internal structure of the capacitor.

[0028] During the operation of the metallized capacitor, the heat of the capacitor element is quickly transferred to the capacitor case through the copper plates on both sides and dissipated to the outside. Compared with the welding structure of braided wire plus copper skin or the single braided wire structure, it has the advantages of larger heat dissipation area, smaller equivalent series resistance, smaller thermal resistance and longer life.

[0029] Finally, it should be noted that the above specific implementation methods are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to examples, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. A low temperature rise DC support capacitor core lead wire structure, characterized in that: The capacitor element assembly (1) comprises a plurality of capacitor core rods, each of which has a through hole in the middle; copper plates (2) are arranged on both sides of the capacitor element assembly (1), and a plurality of lead wire structures (3) are arranged through the copper plates (2); Each of the lead wire structures (3) is provided with a plurality of connection portions (4) extending inwardly along the outer circumference, and the capacitor element assembly and the copper plate (2) are connected at the connection portions (4).

2. The low-temperature rise DC support capacitor core lead-out structure according to claim 1, characterized in that: The lead wire structure (3) is in a rectangular, square, circular or polygonal shape.

3. The low temperature rise DC support capacitor core lead wire structure according to claim 1, characterized in that: When the lead wire structure (3) is in the shape of a rectangle or a square, a plurality of connection portions (4) are symmetrically arranged on both sides of the lead wire structure (3), and the lead wire structure (3) has an arc transition around its periphery.

4. The low-temperature rise DC support capacitor core lead-out structure according to claim 1, characterized in that: When the lead wire structure (3) is circular in shape, a plurality of connection portions (4) are arranged at intervals on the outer circumference of the lead wire structure (3).

5. The low temperature rise DC support capacitor core lead wire structure according to claim 1, characterized in that: The lead wire structure (3) comprises four lead wires (31), the four lead wires (31) being symmetrically arranged about the central axis of the lead wire structure (3), a connecting portion (4) being arranged on a side of each lead wire (31) away from the horizontal central axis, and a glue injection hole (32) cooperating with the through hole being arranged at the center of the lead wire structure (3).

6. The low-temperature rise DC support capacitor core lead-out structure according to claim 1, characterized in that: The capacitor element assembly (1) and the copper plate (2) are welded at a connection portion (4).

7. The low-temperature rise DC support capacitor core lead-out structure according to claim 1, characterized in that: The copper plate (2) has a thickness of 0.5 to 2.0 mm, and the surface of the copper plate (2) is tin-plated.

8. The low-temperature rise DC support capacitor core lead-out structure according to claim 1, characterized in that: A busbar copper plate (5) is provided on one side of the capacitor element assembly (1), and a plurality of lead wires (6) are provided on the busbar copper plate (5).

Images