Wafer baking device

Abstract

The wafer baking device comprises a housing, and a heating mechanism and an air duct uniformizing disc which are arranged in the housing, the housing comprises a top surface, the air duct uniformizing disc is arranged between the top surface and the heating mechanism, and a buffer space is formed between the air duct uniformizing disc and the top surface. The middle part of the top surface is provided with a first air outlet communicated with the buffer space, the air duct uniformizing disc is provided with a reference position corresponding to the first air outlet and a plurality of air duct holes, and the diameters of the air duct holes have a trend of increasing in a direction diverging outwards from the reference position; the air duct uniformizing disc is more uniform in air outlet, and the temperature uniformizing performance in the shell is better.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor manufacturing, in particular to a wafer baking device. Background Art

[0002] In the prior art, the wafer needs to be baked when it is formed into a base film, soft-baked after glue coating, baked after exposure, and hard-baked after development. In the wafer manufacturing process, baking is required in almost every step. Although the purpose of baking is different, the gas solvent needs to be discharged during the baking process. If the gas solvent cannot be discharged in a timely and uniform manner, it will affect the process, causing solvent dripping, or poor coating, poor development, etc.

[0003] Among them, the shell of the current wafer baking device is mostly directly connected to the exhaust device, or a uniformly arranged buffer tray is set. However, it is understandable that the gas in the shell space facing the exhaust device will be exhausted more and faster, which will affect the uniformity of the temperature in the shell and affect the yield of the baking process. Utility Model Content

[0004] One of the purposes of the utility model is to provide a wafer baking device to solve the technical problem of uneven temperature in a shell in the prior art.

[0005] To achieve one of the purposes of the utility model mentioned above, an embodiment of the utility model provides a wafer baking device including a shell and a heating mechanism and an air duct uniformizing plate arranged inside the shell, the shell including a top surface, the air duct uniformizing plate is located between the top surface and the heating mechanism, and a buffer space is formed between the air duct uniformizing plate and the top surface, the middle portion of the top surface has a first air outlet connected to the buffer space, the air duct uniformizing plate has a reference position corresponding to the first air outlet and a plurality of air duct holes, and the diameter of the air duct hole tends to increase in a direction radiating outward from the reference position.

[0006] As a further improvement of an embodiment of the utility model, a plurality of the air duct holes are arranged in a linear divergent manner from the reference position outward.

[0007] As a further improvement of an embodiment of the utility model, a plurality of the air duct holes are arranged in a circular ring shape with a plurality of different diameters with the reference position as the center.

[0008] As a further improvement of an embodiment of the utility model, the diameters of the air duct holes located in the same circular ring are equal, and the diameters of the air duct holes located in different circular rings from the inside to the outside increase successively and then remain equal.

[0009] As a further improvement of an embodiment of the utility model, the number of air duct holes located in different circular rings from the inside to the outside is consistent, and the arrangement density of the air duct holes decreases from the inside to the outside.

[0010] As a further improvement of an embodiment of the utility model, it includes a first air outlet, a pressure sensor for detecting the wind pressure of the first air outlet, and a first regulating valve for adjusting the air outlet speed of the first air outlet; the first air outlet is connected to the first air outlet.

[0011] As a further improvement of an implementation mode of the utility model, the first air outlet is arranged at the center position of the top surface of the shell, and the reference position is the center position of the air duct uniformity disk.

[0012] As a further improvement of an embodiment of the utility model, the shell includes two side surfaces located on both sides of the top surface of the shell, and the wafer baking device includes a second air outlet arranged in the middle of the side surfaces, and the second air outlet is higher than the heating mechanism.

[0013] As a further improvement of an embodiment of the utility model, the air duct uniformity plate is further arranged between the side surface and the heating mechanism, and the reference position of the air duct uniformity plate is opposite to the second air outlet.

[0014] As a further improvement of one embodiment of the utility model, it includes a liquid-gas separation device connected to the first air outlet, the liquid-gas separation device includes a primary separation device and a secondary separation device, and the shell, the primary separation device and the secondary separation device are connected in sequence.

[0015] Compared with the prior art, the utility model provides a wafer baking device having an air duct uniformity plate, wherein the air duct uniformity plate has a reference position corresponding to a first air outlet and a plurality of air duct holes, and the diameter of the air duct holes tends to increase in a direction radiating outward from the reference position; in this way, the diameter of the air duct holes corresponding to the first air outlet is small and the air outlet is small, while the diameter of the air duct holes offset from the first air outlet is large and the air outlet is large, so as to improve the uniformity of the air outlet and improve the temperature uniformity inside the shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of a wafer baking device in one embodiment of the present invention.

[0017] Figure 2 This is a schematic diagram of a wafer baking device with a door removed in one embodiment of the utility model.

[0018] Figure 3 It is a schematic diagram showing the internal structure of a wafer baking device in one embodiment of the present invention.

[0019] Figure 4 yes Figure 3 Top view shown.

[0020] Figure 5It is a schematic diagram of an exploded view of a wafer baking device in one embodiment of the utility model.

[0021] Figure 6 It is a schematic diagram of an air duct uniform plate in one embodiment of the utility model.

[0022] Figure 7 It is a schematic diagram of a liquid-gas separation device in one embodiment of the utility model.

[0023] Figure 8 It is a schematic diagram of a liquid-gas separation device in another embodiment of the present invention. DETAILED DESCRIPTION

[0024] The present invention will be described in detail below in conjunction with the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological, or functional changes made by a person skilled in the art based on these embodiments are all within the scope of protection of the present invention.

[0025] It should be noted that the term "comprises" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In addition, the terms "first", "second", "third", "fourth", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0026] The terms "connected", "connected to" or any other variants are intended to cover various relative positions in a connection relationship, so as to include direct connection or indirect connection. Among them, the direct connection can be formed by a gas pipeline, the indirect connection can be a connection relationship established by a device such as a valve body, a sensor, etc., can be a connection relationship established by a gas circuit component such as a brake control unit, or can be a connection relationship established by any other medium such as air.

[0027] See also Figure 1 , is a schematic structural diagram of a wafer baking device 100 provided in one embodiment of the utility model. In a specific embodiment, the wafer baking device 100 can be used for hard baking after development.

[0028] Combination Figure 2-3 As shown, the wafer baking device 100 includes a housing 10 , a heating mechanism 30 and an air duct uniform plate 50 disposed inside the housing 10 .

[0029] The housing 10 forms a heating space, and the wafer is located in the heating space and is heated and baked by the heating mechanism 30. In order to conveniently place the wafer, a door 15 is provided at the front end of the housing 10 for opening to put in or take out the wafer, or to take in and put in other devices. In other embodiments, the top wall and / or side wall of the housing 10 can also be set to be detachable to facilitate the placement, installation, cleaning, etc. of the internal devices.

[0030] The heating mechanism 30 is arranged at the bottom of the shell 10 to support the wafer. The heating mechanism 30 includes a carrier plate 31 for supporting the wafer and a heating unit for heating the wafer. The carrier plate 31 is a metal part. The heating unit heats the wafer by radiating heat outward by heating the carrier plate. The carrier plate 31 can be a copper plate.

[0031] In other embodiments, the carrier plate 31 may be a heating plate as a whole, and the wafer is placed on the heating plate and then heated.

[0032] The heating mechanism 30 includes a plurality of adjusting parts 32 and ejector pins 33 arranged on the supporting plate 31. The adjusting parts 32 can adjust the height in the vertical direction relative to the supporting plate 31 to adjust the height of the wafer from the supporting plate 31 after the wafer is supported and positioned; in this way, timely adjustments can be made according to the actual heating conditions of different parts of the wafer to make the wafer heated more evenly, thereby avoiding subsequent process defects.

[0033] Furthermore, at least three of the adjusting members 32 are equidistant from the center of the carrier plate 31 , and at least three of the adjusting members 32 are arranged in an equilateral triangle; thus, efficient adjustment of the plane where the wafer is located can be achieved.

[0034] Specifically, in order to conveniently realize the movable adjustment of the adjusting member 32, the adjusting member 32 includes an adjusting screw, and a threaded hole adapted to the adjusting screw is provided on the carrier plate 31. The adjusting screw is used to adjust the height of the adjusting member 32 relative to the carrier plate 31, thereby adjusting the position of the supporting surface where the wafer is located.

[0035] Specifically, the ejector pin 33 has an ejection state protruding from the carrier plate 31 and a reception state received in the carrier plate 31; at least three ejector pins 33 are provided, and the ejector pins 33 and the adjusting member 32 are arranged in an alternating manner along the circumferential direction, and the ejector pins 33 and the adjusting member 32 are used to alternately support the wafer.

[0036] The ejector pin 33 is used to lift the wafer after heating is completed. After the wafer is lifted up, it is convenient to take out and operate the wafer. At the same time, in the process of placing the wafer, the wafer is first placed on the ejector pin 33 in the ejection state, and then the ejector pin 33 is slowly accommodated in the threaded hole, so that the wafer is lowered to the heating position. After lowering to the heating position, the wafer is supported by the adjustment member 32.

[0037] The heating mechanism 30 includes a fence 34 disposed on the outer periphery of the carrier plate 31 . The wafer is located in the fence 34 . The shape of the circular fence 34 adapts to the outer periphery of the wafer to prevent the wafer from drifting and causing abnormalities.

[0038] Combination Figure 4-6 As shown, the shell 10 includes a top surface 11, the air duct uniform disk 50 is located between the top surface 11 and the heating mechanism 30, and a buffer space is formed between the air duct uniform disk 50 and the top surface 11, and the middle part of the top surface 11 has a first air outlet 110 connected to the buffer space, and the air duct uniform disk 50 has a reference position corresponding to the first air outlet 110 and a plurality of air duct holes 51, and in the direction of diverging outward from the reference position, the diameter of the air duct hole 51 has a tendency to increase.

[0039] It is understandable that if the air duct uniformity plate 50 is not provided, the gas in the shell 10 is discharged directly through the first air outlet 110. Then, the gas at the position opposite to or close to the first air outlet 110 in the shell leaves faster and more than the gas at the position far away from the first air outlet 110. The uneven air outlet from the shell will cause uneven temperature in the shell 10.

[0040] When the air duct uniformity plate 50 is provided, a buffer space is formed between the air duct uniformity plate 50 and the top surface of the shell 10. When the first air outlet 110 discharges air, the direct impact on the heating mechanism 30 can be reduced, thereby ensuring the temperature uniformity of the space where the heating mechanism 30 is located.

[0041] More importantly, the diameter of the air duct hole 51 at the position directly opposite to the first air outlet 110 is the smallest, thereby reducing the air outlet volume and the air outlet speed, while the diameter of the air duct hole offset from the first air outlet 110 is increased, thereby increasing the air outlet volume and the air outlet speed, so that the air outlet volume and the air outlet speed of the air duct hole 51 directly opposite to or adjacent to the first air outlet 110 are balanced with the air outlet volume and the air outlet speed of the air duct hole far from the first air outlet 110, so as to improve the uniformity of the air outlet and improve the temperature uniformity inside the shell.

[0042] In a specific embodiment, a plurality of the air duct holes 51 are arranged in a linear divergent manner outward from the reference position, and a plurality of the air duct holes 51 are arranged in a circular ring shape with a plurality of different diameters with the reference position as the center, similar to the trend that the peripheral gas simultaneously converges to the center to discharge air from the first air outlet, which is conducive to uniform air outlet and more efficient realization of the efficiency of gas discharge outward.

[0043] In a specific embodiment, the diameters of the air duct holes 51 located in the same circular ring are equal, and the diameters of the air duct holes 51 located in different circular rings from the inside to the outside are increased successively and then remain equal. The number of air duct holes located in different circular rings from the inside to the outside is the same, and the arrangement density of the air duct holes 51 decreases from the inside to the outside. In this way, the air duct holes 51 close to the reference position area are denser, and the air duct holes 51 relatively far from the reference position area are sparser, so that air can be discharged more efficiently.

[0044] Specifically, the first air outlet 110 is disposed at the center of the shell top surface 11 , and the reference position is the center of the air duct uniform plate 50 , which is conducive to efficient exhaust.

[0045] The wafer baking device 100 includes a first air outlet duct 12 , a pressure sensor 121 for detecting the wind pressure of the first air outlet duct 12 , and a first regulating valve 122 for adjusting the air outlet speed of the first air outlet duct 12 ; the first air outlet duct 12 is connected to the first air outlet 110 .

[0046] Specifically, the gas in the housing 10 enters the first air outlet 12 through the first air outlet 110 , and then enters the liquid-gas separation device 60 or enters the external plant service system.

[0047] The pressure sensor 121 is used to monitor the wind pressure of the air outlet, has a real-time alarm function, and monitors the pressure stabilization state. The first regulating valve 122 can also adjust the air outlet speed according to the data detected by the pressure sensor 121 to ensure that the exhaust speed of the shell 10 is normal.

[0048] The housing 10 includes two side surfaces 13 located at both sides of the housing top surface 11 . The wafer baking device 100 includes a second air outlet 130 disposed in the middle of the side surfaces. The second air outlet 130 is higher than the heating mechanism 30 .

[0049] The wafer baking device 100 includes a second air outlet 14 connected to a second air outlet 130, and the second air outlet 14 is configured the same as the first air outlet 12. Thus, three groups of air outlets are configured, and the wind pressures and wind speeds are respectively measurable and adjustable, which is beneficial for efficient exhaust. Furthermore, by adjusting the wind speeds of the three groups of air outlets, the overall temperature of the space where the wafer is located can be adjusted to keep the wafer evenly heated, thereby improving process abnormalities such as local overheating.

[0050] Similarly, the air duct uniform plate 50 can also be arranged between the side surface 13 and the heating mechanism 30, and the center position of the air duct uniform plate 50 is also opposite to the second air outlet 130 to improve the temperature uniformity of the space where the wafers of the housing 10 are located.

[0051] Combination Figure 7-8As shown, the wafer baking device 100 includes a liquid-gas separation device 60 connected to the first air outlet 110, the liquid-gas separation device 60 includes a primary separation device 70 and a secondary separation device 80, and the shell 10, the primary separation device 70 and the secondary separation device 80 are connected in sequence.

[0052] In this way, the gas from the shell 10 can be discharged to the primary separation device 70 and the secondary separation device 80 for sufficient liquid-gas separation, and then discharged to the plant service, thereby reducing the burden on the plant service system.

[0053] The primary separation device 70 includes a primary separation cavity 71 and a first connecting pipe 72 connecting the shell 10 and the primary separation cavity 71. Specifically, the first connecting pipe 72 can be connected to the first air outlet 110 by connecting to the first air outlet 12; it can also be directly connected to the first air outlet 110 and / or the second air outlet 130.

[0054] Combination Figure 7 As shown, in an application scenario that only includes one baking module, the primary separation device 70 includes a first connecting pipe 72, which is connected to the first air outlet 110 on the top surface of the shell 10 to discharge the gas in the shell; it can also be connected to the second air outlet 130 on the side.

[0055] Combination Figure 8 As shown, in an application scenario including a plurality of baking modules arranged in a stacked manner, a plurality of shells 10 are stacked and a top surface 11 of the shell located at the highest point is exposed, so that the first connecting pipe 72 can be directly connected to the first air outlet 110, or connected to the first air outlet duct 12; and the top surface 11 of the shell located below is blocked, so the liquid-gas separation device 60 can be directly connected to the second air outlet 130 located on the side, or connected to the second air outlet duct 14.

[0056] The outer circumference of the first connecting tube 72 is wrapped with a heat-insulating material. In this way, the temperature of the gaseous solvent volatilized from the housing 10 is relatively high. If the heat-insulating material is not provided, the gaseous solvent will be directly cooled and liquefied in the first connecting tube 72. Since the high-viscosity photoresist solvent has poor fluidity, it may accumulate in the first connecting tube 72, affecting the further discharge of the volatilized gaseous solvent and causing insufficient liquid-gas separation.

[0057] After the first connecting tube 72 is wrapped with the insulation material, the gaseous solvent coming out of the heating chamber 11 will not be liquefied immediately, but will enter the first-stage separation chamber 71 through the first connecting tube 72. The first-stage separation chamber 71 is a rectangular or cylindrical chamber with a large volume. The first-stage separation chamber 71 is made of metal, such as aluminum or stainless steel, and has good thermal conductivity. It can quickly cool down after heat exchange with the high-temperature gaseous solvent, which is beneficial to sufficient liquid-gas separation of the high-temperature gaseous solvent.

[0058] The first connecting pipe 72 includes a first section 721 connected to the shell 10 , a third section 723 connected to the primary separation chamber 71 , and a second section 722 connecting the first section 721 and the third section 723 . The first section 721 is higher than the third section 723 .

[0059] The first section 721 and the third section 723 are horizontal sections, and the second section 722 is a vertical section. The gaseous solvent passes through the first section 721, the second section 722 and the third section 723 in sequence. Although the first connecting pipe 72 is provided with a heat-insulating material, a small amount of gaseous solvent will still be liquefied in the first connecting pipe 72. The first section is set high and the third section is set low, which is conducive to the liquid flowing down. In other embodiments, the first section 721, the second section 722 and the third section 723 can also be set to be inclined downward, which is more conducive to the liquid flowing down.

[0060] If the first-level separation device 70 is directly connected to the first air outlet 110, a pressure sensor for detecting wind pressure and a regulating valve for adjusting wind speed may be provided; if the first-level separation device 70 is connected to the first air outlet duct, and the first air outlet duct 12 is provided with a pressure sensor and a regulating valve, then the first-level separation device 70 may not need to be repeatedly provided.

[0061] The primary separation device 70 further includes a first collecting tank 73 disposed at the bottom of the primary separation chamber 71 and a liquid level sensor disposed in the first collecting tank 73 for collecting the liquefied solvent and reminding the user to replace the solvent in time when the stored solvent is excessive.

[0062] The secondary separation device 80 includes a second connecting pipe 81 connected to the primary separation chamber 71 and a second collecting tank 82 connected to the second connecting pipe 81. The top of the primary separation chamber 71 is provided with an opening connected to the second connecting pipe 81. After the gaseous solvent passes through the primary separation device 70, some gaseous solvent will still remain. The gaseous solvent continues to flow upward, undergoes secondary liquid-gas separation in the second connecting pipe 81, and then flows into the second collecting tank 82.

[0063] The secondary separation device 80 also includes an exhaust system 83 connected to the second connecting pipe 81, and the exhaust system 83 can be an exhaust valve body. The exhaust system 83 can accelerate the efficiency of liquid-gas separation. The exhaust system of the present application is arranged on the second connecting pipe 81, and is separated from the shell 10 by the primary separation device 70. In this way, the exhaust system 83 has little effect on the shell 10 when exhausting. If the exhaust system 83 is directly arranged on the first connecting pipe 81, the exhaust valve directly exhausts the shell 10, which may cause uneven local temperature and abnormal baking process.

[0064] The beneficial effects of the utility model are as follows: a buffer space is formed between the air duct uniform disk 50 and the top surface of the shell 10, and when the first air outlet 110 discharges air, the direct impact on the heating mechanism 30 can be reduced, thereby ensuring the temperature uniformity of the space where the heating mechanism 30 is located; the diameter of the air duct hole 51 tends to increase from the inside to the outside, balancing the air volume and air speed of the inner and outer air duct holes 51, improving the uniformity of the air outlet, and improving the temperature uniformity in the shell; a liquid-gas separation system 60 is provided to allow the gaseous solvent to be fully separated into liquid and gas before being collected, thereby reducing the burden on factory affairs, and will not directly evacuate the shell, thereby ensuring the stability of the temperature of the shell 10.

[0065] It can be formed by referring to any of the technical solutions provided above, and will not be described in detail here.

[0066] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0067] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the utility model. They are not intended to limit the protection scope of the utility model. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A wafer baking device, characterized in that: include: The invention comprises a shell and a heating mechanism and an air duct uniformizing plate arranged inside the shell. The shell comprises a top surface. The air duct uniformizing plate is located between the top surface and the heating mechanism, and a buffer space is formed between the air duct uniformizing plate and the top surface. A first air outlet connected to the buffer space is provided in the middle of the top surface. The air duct uniformizing plate has a reference position corresponding to the first air outlet and a plurality of air duct holes. In the direction of diverging outward from the reference position, the diameter of the air duct hole tends to increase.

2. The wafer baking device according to claim 1, characterized in that: The plurality of air duct holes are arranged in a linear divergent manner from the reference position outwards.

3. The wafer baking device according to claim 1, characterized in that: The plurality of air duct holes are arranged in a circular shape with a plurality of different diameters with the reference position as the center.

4. The wafer baking device according to claim 3, characterized in that: The diameters of the air duct holes located in the same circular ring are equal, and the diameters of the air duct holes located in different circular rings from the inside to the outside increase successively and then remain equal.

5. The wafer baking device according to claim 4, characterized in that: The number of air duct holes located in different circular rings from the inside to the outside is the same, and the arrangement density of the air duct holes decreases from the inside to the outside.

6. The wafer baking device according to claim 1, characterized in that: It includes a first air outlet, a pressure sensor for detecting the wind pressure of the first air outlet, and a first regulating valve for adjusting the air outlet speed of the first air outlet; the first air outlet is connected to the first air outlet.

7. The wafer baking device according to claim 1, characterized in that: The first air outlet is arranged at the center position of the top surface of the shell, and the reference position is the center position of the air duct uniform plate.

8. The wafer baking device according to claim 1, characterized in that: The shell includes two side surfaces located at both sides of the top surface of the shell, and the wafer baking device includes a second air outlet arranged in the middle of the side surfaces, and the second air outlet is higher than the heating mechanism.

9. The wafer baking device according to claim 8, characterized in that: The air duct uniformity plate is also arranged between the side surface and the heating mechanism, and the reference position of the air duct uniformity plate is opposite to the second air outlet.

10. The wafer baking device according to claim 1, characterized in that: Including connecting the first The liquid-gas separation device of the tuyere comprises a primary separation device and a secondary separation device, The shell, the primary separation device and the secondary separation device are connected in sequence.

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