Wafer comb
By setting grooves and tapered tooth structures on the top of the comb of the wafer comb, the problems of uncertain wafer position and poor drying effect in the prior art are solved, and stable alignment and efficient drying of the wafer on the carrier are achieved.
Patent Information
- Application Number
- CN202421262557.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-04
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-06-04
AI Technical Summary
The flat contact surface design of existing wafer combs results in uncertainty in the position of the wafer in the carrier, affecting the drying effect and possibly causing wafer damage.
Design a wafer comb with several grooves on the top of the comb body along the length direction. The inclined surface of the groove forms a tapered tooth structure to ensure that the wafer is fixed and aligned in the bracket groove, and reduce the contact surface through the V-shaped groove to improve the Drying efficiency.
Through the design of groove and tapered tooth structures, the wafer is ensured to be stable in alignment on the carrier, reducing the risk of drying unevenness and wafer damage, and improving drying efficiency and overall performance of the wafer.
Smart Images
Figure CN222462858U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor cleaning, in particular to a wafer comb. Background Art
[0002] In the semiconductor manufacturing industry, cleaning engineering is a crucial link, and its purpose is to remove various impurities, particles and organic pollutants generated on the surface of the wafer in the previous process to ensure the yield and device performance of the subsequent processing. After cleaning, the wafer usually needs to be effectively dried by a dryer to prevent adverse effects such as electrochemical reactions and metal ion diffusion caused by residual moisture. In this process, the wafer support structure, namely the wafer comb, plays a key role. It not only ensures the stability of the wafer during the drying process, but also avoids uneven drying or wafer damage caused by improper contact.
[0003] The wafer support structure widely used in the market is usually designed with a flat surface in contact with the wafer. However, this design has obvious limitations. Since the position of the wafer in the carrier is not constant, a slight shift may occur each time it is loaded, resulting in the actual contact surface between the wafer and the carrier slot being not fixed. This uncertainty in the contact surface has a significant impact on the drying effect. Utility Model Content
[0004] To this end, an embodiment of the present invention provides a wafer comb to solve the problems existing in the above-mentioned technology.
[0005] In order to achieve the above purpose, the embodiment of the utility model provides the following technical solutions:
[0006] A chip comb comprises a sheet-like comb body and a mounting seat, wherein the bottom of the comb body is fixedly mounted on the mounting seat, and the comb body is mounted on a chip carrier through the mounting seat, and the top of the comb body is continuously provided with a plurality of grooves along its length direction, and both sides of the grooves along the length direction of the comb body are inclined surfaces, and the inclined surfaces of two adjacent grooves form a conical tooth structure; the top is inclined along its width direction, and the starting point and end point of the inclined surface are respectively two side edges of the comb body width, and the top of the conical tooth is an arc surface.
[0007] Optionally, the groove is a V-shaped groove.
[0008] Optionally, the comb body and the mounting seat are detachably mounted and fixed via a bolt assembly.
[0009] Optionally, the comb body is provided with a strip groove from its bottom toward one side of the groove, the strip groove runs through the front and rear sides of the comb body, and the comb body is connected and fixed to the mounting seat by installing a bolt assembly in the strip groove.
[0010] Optionally, the comb body is made of high-performance polymer material.
[0011] Optionally, the comb body is made of polyetheretherketone.
[0012] The utility model has at least the following beneficial effects:
[0013] The utility model arranges a comb body connected to a mounting seat, and the mounting seat is fixedly mounted on a carrier. A groove formed on the contact surface of the comb body with the wafer can fix and align the wafer in the bracket groove. In addition, according to the shape of the groove, a lot of wafer jitters will be generated in the bracket groove. The wafers are arranged at a certain interval and fixed on the contact surface with the carrier groove for easy drying. In order to dry the contact surface with the carrier groove, the wafer shakes greatly in the groove, which is convenient for removing water from the contact surface of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] In order to more clearly explain the prior art and the present invention, the following briefly introduces the drawings required for describing the prior art and the present invention. Obviously, the drawings described below are only exemplary, and for ordinary technicians in this field, other drawings can be derived from the provided drawings without creative work.
[0015] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so that people familiar with this technology can understand and read them. They are not used to limit the conditions under which the present invention can be implemented. Any structural modification, change in proportion or adjustment of size should still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.
[0016] Figure 1 This is a schematic diagram of the structure of an embodiment of the utility model from a first viewing angle (front view);
[0017] Figure 2 A schematic diagram of the structure of an embodiment of the utility model from a second viewing angle (side view);
[0018] Figure 3 The figure is a schematic diagram of a groove structure of an embodiment of the utility model.
[0019] Description of reference numerals:
[0020] 1. Comb body; 2. Groove; 3. Strip groove. DETAILED DESCRIPTION
[0021] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0022] In the description of the present invention, unless otherwise specified, "plurality" means two or more. The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present invention and the above-mentioned drawings are intended to distinguish the objects referred to. For schemes with a sequential flow, this terminology does not have to be understood as describing a specific order or sequence. For schemes with device structures, this terminology does not distinguish between importance, positional relationships, etc.
[0023] In addition, the terms "comprises", "has" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that have been explicitly listed, but may also include other steps or units that are not explicitly listed but are inherent to these processes, methods, products or apparatuses, or steps or units that are added based on further optimization schemes conceived by the present invention.
[0024] like Figure 1-Figure 3 As shown, a chip comb disclosed by the utility model comprises a sheet-like comb body 1 and a mounting seat, wherein the bottom of the comb body 1 is fixedly mounted on the mounting seat, and the comb body 1 is mounted on a chip carrier through the mounting seat, and the top of the comb body 1 is continuously provided with a plurality of grooves 2 along its length direction, and both sides of the grooves 2 along the length direction of the comb body 1 are inclined surfaces, and the inclined surfaces of two adjacent grooves 2 form a conical tooth structure; the top is inclined along its width direction, and the starting point and the end point of the inclined surface are respectively the two side edges of the width of the comb body 1, and the top of the conical tooth is an arc surface.
[0025] The above-mentioned chip comb is used as an instrument structure between and on chips in a semiconductor wet scrubber. For example, for thin chips like SiC chips, the wet cleaning is to place the chips in a carrier for cleaning, and then dry them in a dryer to remove moisture on the surface of the chips.
[0026] The wafer is mounted on a carrier and moved to a dryer for drying. During the drying process, a wafer comb is set to separate the wafer from the carrier to a certain height. During the drying process, the part where the wafer contacts the carrier is very difficult to dry. The contact surface must be minimized to keep the contact surface that is inevitably in contact constant. Its function is to fit the wafer placed at the bottom of the carrier to each wafer through the continuous groove 2 on the top of the comb body 1, separate the wafers, and facilitate drying. Make a V-shaped groove on the surface to align the wafers at a certain interval to reduce other contact surfaces except the contact surface that is inevitably in contact, and improve the efficiency of drying.
[0027] The groove 2 is a V-shaped groove.
[0028] By setting the V-groove, the wafer can be fixed and aligned in the bracket groove. In addition, due to the shape of the V-groove, a lot of wafer shaking will occur in the bracket groove. The wafers are arranged at a certain interval and the contact surface with the carrier groove is fixed, which is convenient for drying. In order to dry the contact surface with the carrier groove, the wafer shakes more in the groove, which is convenient for removing water from the contact surface of the wafer.
[0029] The comb body 1 and the mounting seat are detachably mounted and fixed via a bolt assembly.
[0030] The comb body 1 and the mounting seat are detachably mounted via a bolt assembly. The mounting seat and the comb body 1 can be disassembled. According to different installation positions, corresponding mounting seats are set, and then the comb body 1 is installed via the mounting seat, thereby improving the compatibility of the comb body 1 with different carriers.
[0031] The comb body 1 is provided with a strip groove 3 from its bottom toward one side of the groove 2 , and the strip groove 3 runs through the front and rear sides of the comb body 1 . The comb body 1 is connected and fixed to the mounting seat by installing a bolt assembly in the strip groove 3 .
[0032] The arrangement of the strip groove 3 is used to adjust the installation position of the mounting seat and the comb body 1 according to different carrier conditions, so that the position of the comb body 1 can be adjusted according to the wafer to be combed, which is convenient for use.
[0033] The comb body 1 is made of high-performance polymer material.
[0034] The comb body 1 is made of polyetheretherketone.
[0035] The above specific embodiments may be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.
[0036] The technical features of the above embodiments may be arbitrarily combined (as long as there is no contradiction in the combination of these technical features). To make the description concise, not all possible combinations of the technical features in the above embodiments are described; these embodiments that are not explicitly written should also be considered to be within the scope of this specification.
[0037] The above is a relatively specific and detailed description of the utility model through general description and specific embodiments. It should be pointed out that, without departing from the concept of the utility model, it is obvious that several variations and improvements can be made to these specific embodiments, which all belong to the protection scope of this application. Therefore, the protection scope of the patent of this application shall be based on the attached claims.
Claims
1. A wafer comb, characterized in that: The invention comprises a sheet-shaped comb body and a mounting seat, wherein the bottom of the comb body is fixedly mounted on the mounting seat, and the comb body is mounted on a wafer carrier through the mounting seat, and the top of the comb body is continuously provided with a plurality of grooves along its length direction, and both sides of the grooves along the length direction of the comb body are inclined surfaces, and the inclined surfaces of two adjacent grooves form a conical tooth structure; the top of the comb body is inclined along its width direction, and the starting point and the end point of the inclined surface are respectively the two side edges of the width of the comb body, and the top of the conical tooth is an arc surface.
2. A wafer comb according to claim 1, characterized in that: The groove is a V-shaped groove.
3. A wafer comb according to claim 1, characterized in that: The comb body and the mounting seat are detachably mounted and fixed via a bolt assembly.
4. A wafer comb according to claim 1, characterized in that: The comb body is provided with a strip groove from the bottom toward one side of the groove, and the strip groove runs through the front and rear sides of the comb body. The comb body and the mounting seat are connected and fixed by mounting bolt assemblies in the strip groove.
5. A wafer comb according to claim 1, characterized in that: The comb body is made of high-performance polymer material.
6. A wafer comb according to claim 4, characterized in that: The comb body is made of polyetheretherketone.