Loudspeaker module and electronic equipment

Abstract

The utility model provides a loudspeaker module and electronic equipment. The loudspeaker module comprises a cavity, a loudspeaker installed in the cavity and a flexible circuit board for communication. After at least one of the first electrode and the second electrode of the loudspeaker is fixed and electrically connected with the flexible circuit board through the heightening part, at least part of the flexible circuit board covers the first surface of the loudspeaker in the thickness direction of the loudspeaker, penetrates through the surface where the first side face of the loudspeaker is located, and extends out of the cavity through a mounting hole formed in the cavity. The flexible circuit board is arranged on the inner side of the circumferential direction of the loudspeaker in a stacked mode, the circumferential size of the loudspeaker module is effectively reduced, miniaturization of the electronic equipment is facilitated, or larger space can be provided for arrangement of other structural parts in the electronic equipment.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a speaker module and electronic equipment. Background Art

[0002] In recent years, the technology of electronic equipment has been updated faster and faster, and miniaturization has become an important direction for the development of electronic equipment. Reducing the size of each module in electronic equipment plays a vital role in the miniaturization of electronic equipment. Therefore, reducing the size of the speaker module has a great positive impact on the miniaturization of electronic equipment.

[0003] As an important component of electronic equipment, the speaker module includes an upper cavity and a lower cavity constituting the speaker module cavity, and a speaker and a flexible circuit board contained in the speaker module cavity. After the flexible circuit board is fixed and electrically connected to the first electrode and the second electrode on the speaker, it is arranged along a suitable path in the cavity, and extends to the outside of the cavity through the mounting hole opened on the cavity to be fixed and electrically connected to the auxiliary circuit board of the electronic equipment, so as to realize the communication of electrical signals between the speaker and the auxiliary circuit board.

[0004] Among them, the surface of the speaker is irregular, and the plane where the first electrode and the second electrode of the speaker are located is concave relative to the first surface of the speaker along its thickness direction. The first surface is the surface of the speaker away from the vibrator in the two surfaces arranged opposite to each other along its thickness direction. That is to say, in the thickness direction of the speaker, the first surface is located on the side of the speaker's voice coil away from the vibrator. In the prior art, the flexible circuit board is usually arranged on one side of the speaker's circumference (or it can be understood that the flexible circuit board is arranged on the outer peripheral side of the speaker), and the flexible circuit board is fixedly connected to the lower cavity. In addition, the plane in the lower cavity that is connected to the flexible circuit board is flush with the plane where the first electrode and the second electrode are arranged on the speaker, and the flexible circuit board is fixed and electrically connected to the first electrode and the second electrode on the speaker through the extended branch part. However, the flexible circuit board is arranged on one side of the speaker's circumference, which will cause the circumferential size of the speaker module (which can be understood as the size on the surface perpendicular to the thickness direction of the speaker module, for example, the size in the length direction or width direction of the speaker module) to become larger, which is not conducive to the miniaturization of electronic equipment.

[0005] In one exemplary scenario, the flexible circuit board is fixed to the first electrode and the second electrode and electrically connected, and then arranged at the periphery of the speaker along the length direction of the speaker, and the flexible circuit board overlaps the wall surface of the lower cavity along its width direction, resulting in the size of the speaker module in the width direction becoming larger, which is not conducive to the miniaturization of the electronic device. In another exemplary scenario, the branch part of the flexible circuit board is fixed to the first electrode and the second electrode and electrically connected, and then arranged at the periphery of the speaker along the width direction of the speaker, and the flexible circuit board overlaps the wall surface of the lower cavity along its length direction, resulting in the size of the speaker module in the length direction becoming larger, which is not conducive to the miniaturization of the electronic device.

[0006] It can be seen that in the prior art, the flexible circuit board is arranged on one side of the speaker in the circumferential direction, which causes the circumferential dimension (for example, the dimension in the length direction or the width direction) of the speaker module to become larger, which is not conducive to the miniaturization of the electronic device. Utility Model Content

[0007] The speaker module and electronic device provided in the embodiments of the present application solve the problem in the prior art that the flexible circuit board is arranged on one side of the speaker circumference, which causes the circumferential size of the speaker module (for example, the size in the length direction or the width direction) to become larger, which is not conducive to the miniaturization of the electronic device.

[0008] The embodiment of the present application provides a speaker module, including a cavity, a speaker and a flexible circuit board. The speaker is installed in the cavity, and the speaker has a first electrode and a second electrode. The cavity is provided with a mounting hole, and the mounting hole is located on a side of a first side of the speaker away from a second side in a first direction, and the first side and the second side of the speaker are arranged opposite to each other in the first direction, and the first direction is perpendicular to the thickness direction of the speaker.

[0009] After the flexible circuit board is fixed and electrically connected to the first electrode and the second electrode respectively, at least part of the flexible circuit board is covered on the first surface of the speaker along the thickness direction thereof, and passes through the surface where the first side surface of the speaker is located, and the flexible circuit board extends out of the cavity through the mounting hole. In addition, the first electrode and / or the second electrode are fixed and electrically connected to the flexible circuit board respectively through the padding portion.

[0010] The speaker module in the present application is provided with a raised portion at the position of the first electrode and / or the second electrode of the speaker, and the first electrode and / or the second electrode is fixed and electrically connected to the surface of one end of the raised portion, so that the surface of the other end of the raised portion is close to the height of the first surface of the speaker in the thickness direction of the speaker. The flexible circuit board is fixed and electrically connected to the surface of the other end of the raised portion, and is covered on the first surface of the speaker (the first surface is the surface of the speaker that is away from the vibrator among the two surfaces of the speaker that are arranged opposite to each other in the thickness direction, that is, in the thickness direction of the speaker, the first surface is located on the side of the speaker's voice coil that is away from the vibrator), or it can be understood that the flexible circuit board is located on the inner side of the speaker in the circumference, and is stacked with the speaker in the thickness direction of the speaker; and passes through the surface where the first side surface of the speaker is located, and then extends to the outside of the cavity through the mounting hole. The area corresponding to the speaker in the flexible circuit board (which can be understood as the area in the flexible circuit board close to the speaker) is stacked on the inner side of the speaker in the circumferential direction, so that the speaker module does not need to reserve a size for arranging the flexible circuit board in the circumferential direction of the speaker, thereby reducing the circumferential size of the speaker module, for example, the size in the first direction (for example, the length direction), or the size in the second direction perpendicular to the first direction (for example, the width direction). On the one hand, when the internal structure of the electronic device remains unchanged, it is conducive to the miniaturization of the electronic device. On the other hand, when the size of the electronic device remains unchanged, it can provide more space for the arrangement of other structural parts inside the electronic device, for example, it can provide more layout space for the battery, which is conducive to increasing the battery capacity, or it can provide more layout space for the main circuit board and / or the auxiliary circuit board, etc.

[0011] For example, in one exemplary scenario, the branch portion of the flexible circuit board is fixed to the first electrode and the second electrode and electrically connected, and then stacked along the first direction on the first surface of the speaker, so that the speaker module does not need to reserve a size for arranging the flexible circuit board in the second direction of the speaker, thereby reducing the size of the speaker module in the second direction. In another exemplary scenario, the branch portion of the flexible circuit board is fixed to the first electrode and the second electrode and electrically connected, and then stacked along the second direction on the first surface of the speaker, so that the speaker module does not need to reserve a size for arranging the flexible circuit board in the first direction of the speaker, thereby reducing the size of the speaker module in the first direction.

[0012] Therefore, in the speaker module provided in the embodiment of the present application, the first electrode and / or the second electrode are respectively fixed and electrically connected to the flexible circuit board through the padding portion, so that the flexible circuit board is stacked and arranged on the inner side of the speaker circumference, effectively reducing the circumferential size of the speaker module, which is conducive to the miniaturization of electronic equipment, or can provide more space for the arrangement of other structural parts inside the electronic equipment. The problem that the flexible circuit board is arranged on one side of the speaker circumference (or it can be understood that the flexible circuit board is arranged on the outer side of the speaker) in the prior art, resulting in the increase of the circumferential size of the speaker module, which is not conducive to the miniaturization of electronic equipment, is solved.

[0013] In some embodiments, the flexible circuit board includes a first connection portion and a second connection portion.

[0014] The first connecting part includes a first branch part and a second branch part; one end of the first branch part is fixed and electrically connected to the first electrode through a corresponding raised part, and at least part of the first branch part is covered on the first surface of the speaker; and / or one end of the second branch part is fixed and electrically connected to the second electrode through a corresponding raised part, and at least part of the second branch part is covered on the first surface of the speaker.

[0015] The second connecting part is located as a whole on the side of the first side of the speaker away from the second side, one end of the second connecting part is connected to the other end of the first branch part and the other end of the second branch part, and the other end of the second connecting part passes through the mounting hole and extends out of the cavity.

[0016] With the above solution, each branch part in the first connection part is fixed and electrically connected to the first electrode and / or the second electrode through the corresponding padding part, and at least part of the first branch part and / or the second branch part is covered on the first surface of the speaker. In addition, one end of the second connection part is connected to each branch part of the first connection part, and the other end extends to the outside of the cavity through the mounting hole. This makes the arrangement of the flexible circuit board in the cavity more diversified, the assembly of the flexible circuit board and the padding part is simpler, and it is beneficial to improve the connection reliability when the flexible circuit board is connected to the first surface of the speaker.

[0017] In some embodiments, the first electrode and the second electrode are both disposed on an edge portion of a side where the third side of the speaker is located, and in the first direction, the first electrode, the second electrode, and the mounting hole are sequentially spaced apart. The third side of the speaker is disposed adjacent to the first side and is disposed opposite to the fourth side in the second direction, and the second direction is perpendicular to the thickness direction of the speaker and perpendicular to the first direction. In addition, in the second direction, the first branch portion and the second branch portion are located on the side of the third side of the speaker facing the fourth side.

[0018] With such a design, the first electrode, the second electrode and the mounting hole are spaced apart along the first direction, and the first branch portion and the second branch portion are located inside the speaker along the second direction, which effectively reduces the size of the speaker module in the second direction (e.g., the width direction), thereby facilitating the reduction of the size of the electronic device in the direction corresponding to the second direction (e.g., the length direction), thereby facilitating the miniaturization of the electronic device.

[0019] In some embodiments, the first branch portion is fixed and electrically connected to the first electrode through the corresponding raised portion, and then covered on the first surface of the speaker, and the second branch portion is fixed and electrically connected to the second electrode through the corresponding raised portion, and then covered on the first surface of the speaker, and the other end of the first branch portion and the other end of the second branch portion intersect and connect on the first surface of the speaker, and then pass through the surface where the first side surface of the speaker is located.

[0020] With such a design, each branch portion in the first connection portion is fixed and electrically connected to the first electrode and the second electrode respectively through the corresponding padding portion, and passes through the first side surface of the speaker after intersecting and connecting on the first surface of the speaker. The arrangement of the flexible circuit board in the cavity is more convenient, and the flexible circuit board does not need to be bent at a large angle during the arrangement process, which can effectively improve the electrical connection reliability of the speaker module. In addition, the circumferential size of the speaker module is effectively reduced, which is conducive to increasing the battery capacity, increasing the layout space of the main circuit board, or facilitating the miniaturization of electronic equipment.

[0021] In some possible embodiments, after the first branch portion is fixed and electrically connected to the first electrode through the corresponding raised portion, it is covered on the first surface of the speaker and passes through the surface where the first side surface of the speaker is located; after the second branch portion is fixed and electrically connected to the second electrode, it passes through the surface where the first side surface of the speaker is located; the other end of the first branch portion and the other end of the second branch portion intersect and connect on the side of the first side surface of the speaker away from the second side surface.

[0022] With such a design, the first branch portion is fixed and electrically connected to the first electrode through the pad portion, and the second branch portion is directly fixed and electrically connected to the second electrode, and the two meet and connect after passing through the first side surface of the speaker. This effectively reduces the size of the speaker module in the second direction (e.g., the width direction), thereby reducing the size of the electronic device in the length direction, which is more conducive to the miniaturization of the electronic device.

[0023] In some embodiments, the first electrode is welded to one end of the corresponding raised portion, and the other end of the raised portion is welded to one end of the first branch portion, so that one end of the first branch portion is fixed and electrically connected to the first electrode through the corresponding raised portion. The second electrode is welded to one end of the corresponding raised portion, and the other end of the raised portion is welded to one end of the second branch portion, so that one end of the second branch portion is fixed and electrically connected to the second electrode through the corresponding raised portion.

[0024] By adopting the above solution, the raised portion and each branch portion of the first connecting portion and each electrode are connected by welding, and the connection method is simple.

[0025] In some embodiments, the first electrode and the second electrode are both located on a side edge portion where the first side surface of the speaker is located. After the first branch portion is fixed and electrically connected to the first electrode through the corresponding raised portion, it is covered on the first surface of the speaker along the second direction and passes through the surface where the first side surface of the speaker is located. After the second branch portion is fixedly connected to the second electrode, it passes through the surface where the first side surface of the speaker is located and is arranged on the periphery of the speaker along the second direction. The other end of the first branch portion and the other end of the second branch portion intersect and connect on a side of the first side surface of the speaker away from the second side surface. The second direction is perpendicular to the thickness direction of the speaker and perpendicular to the first direction.

[0026] With the above solution, the first electrode and the second electrode are both located on the edge of one side where the first side of the speaker is located. The first branch portion is fixed and electrically connected to the first electrode through the pad portion, and the second branch portion is directly fixed and electrically connected to the second electrode, and the two meet and connect after passing through the first side of the speaker. The size of the speaker module in the first direction (for example, the length direction) is effectively reduced, thereby reducing the size of the electronic device in the width direction, which is more conducive to the miniaturization of the electronic device.

[0027] In some embodiments, the raised portion extends along the thickness direction of the speaker and is arranged in a block structure, and the material of the raised portion is a conductive material. This has a simple structure, is conducive to processing and manufacturing, and reduces costs.

[0028] In some embodiments, the surface of the flexible circuit board close to the speaker is fixedly connected to the first surface of the speaker by bonding, which is simple and convenient for assembly.

[0029] In some embodiments, the speaker includes a fixed bracket, a vibrator, and a voice coil, wherein the outer peripheral edge of the vibrator is fixedly disposed at one end of the fixed bracket, the voice coil is disposed in the fixed bracket, the coil of the voice coil is electrically connected to the first electrode and the second electrode, and the voice coil is connected to a side surface of the vibrator, and drives the vibrator to vibrate when power is turned on. In the thickness direction of the speaker, the first surface of the speaker is located on the side of the voice coil away from the vibrator.

[0030] In some embodiments, the cavity includes an upper cavity and a lower cavity that cover each other, the other side of the vibrator surrounds the lower cavity to form a front sound cavity, and a sound hole is opened on the side wall of the lower cavity, and the sound hole connects the front sound cavity with the outside of the cavity. One side of the vibrator surrounds the fixed bracket, the upper cavity and the lower cavity to form a rear sound cavity.

[0031] In some embodiments, the upper cavity includes an upper main body and an upper protrusion protruding from one side of the upper main body, the lower cavity includes a lower main body and a lower protrusion protruding from one side of the lower main body, the lower main body and the upper main body overlap each other to form a main cavity, the lower protrusion and the upper protrusion overlap each other to form a sub-cavity, the speaker is installed in the main cavity as a whole, the sub-cavity is located on the side of the first side of the speaker away from the second side, and the mounting hole is provided on a side wall of the sub-cavity away from the speaker. After the flexible circuit board passes through the surface where the first side of the speaker is located, it extends from the mounting hole to the outside of the cavity through the sub-cavity. Among them, the other side of the vibrator and the lower main body of the main cavity are surrounded to form a front sound cavity, the sound hole is located on the side wall of the lower main body, and one side of the vibrator and the fixed bracket, the main cavity and the sub-cavity are surrounded to form a rear sound cavity.

[0032] With the above solution, the cavity includes a main cavity and a sub-cavity formed by the upper protrusion and the lower protrusion, the speaker is accommodated in the main cavity, and the space surrounded by the sub-cavity constitutes a part of the rear sound cavity. The space of the rear sound cavity is increased, which is conducive to improving the sound quality of the speaker module.

[0033] The embodiment of the present application also provides an electronic device, including a housing and a speaker module provided by any of the above embodiments, wherein the speaker module is fixedly connected to the housing through a cavity, and a sound outlet hole for the speaker to emit sound is provided on the housing. The speaker module provided by any of the above embodiments is used in the electronic device of the present application to solve the problem in the prior art that the flexible circuit board is arranged on one side of the speaker circumference, resulting in an increase in the circumferential size of the speaker module, which is not conducive to the miniaturization of the electronic device.

[0034] In some embodiments, the electronic device further comprises a secondary circuit board, a battery and a main circuit board, and one end of the flexible circuit board extending outside the cavity is fixed to and electrically connected to the secondary circuit board. The speaker module and the secondary circuit board are arranged in parallel along the width direction of the electronic device. The main circuit board, the battery and the speaker module are arranged in sequence along the length direction of the electronic device, and the speaker module is located at the bottom of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 is a schematic diagram of the structure of the first speaker module, wherein the upper cavity is not shown in the figure;

[0036] Figure 2 for Figure 1 Schematic cross-sectional view along the AA direction;

[0037] Figure 3 is a schematic diagram of the structure of a second speaker module, wherein the upper cavity is not shown in the figure;

[0038] Figure 4 This is a schematic diagram of the structure of an electronic device according to an embodiment of the present application, wherein a rear cover is not shown in the figure;

[0039] Figure 5 for Figure 4 Schematic diagram of the cross-sectional structure along the BB direction;

[0040] Figure 6 This is a schematic diagram of the three-dimensional structure of the speaker module according to an embodiment of the present application;

[0041] Figure 7a A schematic diagram of the stereoscopic structure of the speaker module of the embodiment of the present application from another perspective;

[0042] Figure 7b for Figure 6 A schematic cross-sectional view along the CC direction;

[0043] Figure 8a This is a schematic diagram of the three-dimensional structure of the speaker module according to an embodiment of the present application, wherein the upper cavity is not shown in the figure;

[0044] Figure 8b This is a schematic diagram of the exploded structure of the speaker module according to an embodiment of the present application;

[0045] Figure 8c This is a schematic diagram of a first arrangement of a flexible circuit board in a speaker module according to an embodiment of the present application;

[0046] Fig. 9 for Figure 6 Schematic cross-sectional view along the DD direction;

[0047] Fig.10 This is a schematic diagram of a second arrangement of a flexible circuit board in a speaker module according to an embodiment of the present application;

[0048] Fig.11 This is a schematic diagram of a third arrangement of a flexible circuit board in a speaker module according to an embodiment of the present application;

[0049] Fig.12 This is a schematic diagram of a fourth arrangement of a flexible circuit board in a speaker module according to an embodiment of the present application;

[0050] Fig.13a This is a schematic diagram of the three-dimensional structure of an implementation of a raised portion in a speaker module according to an embodiment of the present application;

[0051] Fig.13bIt is a schematic diagram of the three-dimensional structure of another implementation of the raised portion in the speaker module of the embodiment of the present application;

[0052] Fig.13c This is a schematic diagram of the three-dimensional structure of another implementation of the padding portion in the speaker module of the embodiment of the present application;

[0053] Fig.14 This is a schematic diagram of an exemplary structure of a speaker in a speaker module according to an embodiment of the present application.

[0054] Description of reference numerals:

[0055] The first option:

[0056] 110', speaker module; 22', lower cavity; 3', flexible circuit board; 5', speaker; 52', first electrode; 53', second electrode.

[0057] Second option:

[0058] 22", lower cavity; 3", flexible circuit board; 5", speaker; 52", first electrode; 53", second electrode.

[0059] This application:

[0060] 10. Electronic equipment;

[0061] 101. Display screen;

[0062] 102, housing; 103, back cover; 104, middle frame; 105, bottom plate; 106, outer frame; 107, sound outlet;

[0063] 108, main circuit board; 109, auxiliary circuit board; 110, speaker module; 111, battery;

[0064] 2. Cavity; 21. Upper cavity; 21A. Upper main body; 21B. Upper protrusion; 22. Lower cavity; 22A. Lower main body; 22B. Lower protrusion; 23. Sound hole; 24. Mounting platform; 25. Protrusion; 26. Main cavity; 27. Sub-cavity; 28. Mounting hole; 29. ​​Front sound cavity; 210. Rear sound cavity;

[0065] 3. Flexible circuit board; 31. First connection part; 32. First branch part; 33. Second branch part; 34. Second connection part; 35. Through hole; 36. One end;

[0066] 4. Raised part;

[0067] 5. Speaker; 51. First surface; 52. First electrode; 53. Second electrode; 54. First side surface; 55. Second side surface; 56. Third side surface; 57. Fourth side surface; 58. Vibrating member; 59. Voice coil; 510. Fixed bracket; 511. Magnetic circuit assembly; 512. Connecting hole;

[0068] 6. Double-sided tape;

[0069] X, first direction; Y, second direction; Z, thickness direction. DETAILED DESCRIPTION

[0070] The following specific embodiments illustrate the implementation of the present application, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the implementation. On the contrary, the purpose of introducing the application in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present application. In order to provide a deep understanding of the present application, the following description will include many specific details. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0071] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0072] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "top", "bottom", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0073] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0074] In the description of the present application, it should be understood that "electrical connection" in the present application can be understood as physical contact and electrical conduction between components; it can also be understood as a form in which different components in a circuit structure are connected through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals.

[0075] In the description of the present application, it should be noted that the mutual perpendicularity in the present application is not absolute perpendicularity, and the approximate perpendicularity caused by processing errors and assembly errors (for example, the angle between the two structural features is 89.9°) is also within the scope of mutual perpendicularity in the present application. The mutual parallelism in the present application is also not absolute parallelism, and the approximate parallelism caused by processing errors and assembly errors (for example, the angle between the two structural features is 0.1°) is also within the scope of mutual parallelism in the present application. The axisymmetry in the present application is not absolute axisymmetry, and the approximate axisymmetry caused by processing errors and assembly errors (for example, part of the structure is offset by a certain distance or angle relative to the axis of symmetry) is also within the scope of axisymmetry in the present application. The central symmetry in the present application is not absolute central symmetry, and the approximate central symmetry caused by processing errors and assembly errors (for example, part of the structure is offset by a certain distance or angle relative to the axis of symmetry) is also within the scope of central symmetry in the present application. This application does not make specific restrictions on this.

[0076] In order to better illustrate the technical solution of the present application and the technical effects that can be achieved by the technical solution of the present application, the implementation method of the present application will be further described in detail below with reference to the accompanying drawings.

[0077] As the technology of electronic devices is updated faster and faster, miniaturization has become an important direction for the development of electronic devices. Reducing the size of each module in electronic devices plays a vital role in the miniaturization of electronic devices. Therefore, reducing the size of the speaker module has a great positive impact on the miniaturization of electronic devices.

[0078] As an important component of electronic equipment, the speaker module includes an upper cavity and a lower cavity constituting the speaker module cavity, and a speaker and a flexible circuit board contained in the speaker module cavity. After the flexible circuit board is fixed and electrically connected to the first electrode and the second electrode on the speaker, it is arranged along a suitable path in the cavity, and extends to the outside of the cavity through the mounting hole opened on the cavity to be fixed and electrically connected to the auxiliary circuit board of the electronic equipment, so as to realize the communication of electrical signals between the speaker and the auxiliary circuit board.

[0079] Among them, the surface of the speaker is irregular, and the plane where the first electrode and the second electrode of the speaker are located is recessed relative to the first surface of the speaker along its thickness direction. The first surface is the surface away from the vibrator among the two surfaces of the speaker arranged opposite to each other along its thickness direction. That is to say, in the thickness direction of the speaker, the first surface is located on the side of the speaker's voice coil away from the vibrator.

[0080] However, in the prior art, the flexible circuit board is usually arranged on one side of the speaker circumference (or it can be understood that the flexible circuit board is arranged on the outer side of the speaker), and the flexible circuit board is fixedly connected to the lower cavity. In addition, the plane in the lower cavity that is connected to the flexible circuit board is flush with the plane on which the first electrode and the second electrode are arranged on the speaker, and the flexible circuit board is fixed and electrically connected to the first electrode and the second electrode on the speaker through the extended branch part. However, the flexible circuit board is arranged on one side of the speaker circumference, which will cause the circumferential size of the speaker module (which can be understood as the size on the surface perpendicular to the thickness direction of the speaker module, for example, the size in the length direction or width direction of the speaker module) to become larger, which is not conducive to the miniaturization of the electronic device.

[0081] It should be noted that the length direction and width direction of the speaker module can be defined according to the corresponding structural shape. For example, when the speaker module is a rectangular structure, its length direction is the direction corresponding to the extension of the longer side, and the width direction is the direction corresponding to the extension of the shorter side; when the speaker module is an elliptical structure, its length direction is the direction corresponding to the extension of the semi-major axis, and its width direction is the direction corresponding to the extension of the semi-minor axis; when the speaker module is a circular structure, its length direction can be the direction corresponding to the extension of any diameter, and its width direction is the extension direction perpendicular to the diameter corresponding to its length direction. Those skilled in the art can define it according to specific circumstances. It should be noted that the understanding of the length direction and width direction of the speaker module is also applicable to the embodiments of the present application and will not be elaborated in the following text.

[0082] The above problems existing in the speaker modules in some solutions are described in detail below with reference to the accompanying drawings.

[0083] See also Figures 1 to 3 , Figure 1is a schematic diagram of the structure of the first speaker module, wherein the upper cavity is not shown in the figure; Figure 2 for Figure 1 Schematic cross-sectional view along the AA direction; Figure 3 This is a schematic diagram of the structure of a second speaker module, wherein the upper cavity is not shown in the figure.

[0084] like Figure 1 and Figure 2 As shown, in the first solution, the flexible circuit board 3' is fixed to the first electrode 52' and the second electrode 53' and electrically connected along the length direction of the speaker 5' ( Figure 1 The plane in the lower cavity 22' that is connected to the flexible circuit board 3' is flush with the plane on which the first electrode 52' and the second electrode 53' are set on the speaker 5'. The flexible circuit board 3' is directly fixed and electrically connected to the first electrode 52' and the second electrode 53' on the speaker 5' through the extended branch part, and the flexible circuit board 3' is overlapped with the lower cavity 22' along its width direction ( Figure 1 The distance between the side of the speaker 5' close to the flexible circuit board 3' along the width direction and the outer wall surface of the lower cavity 22' close to the flexible circuit board 3' along the width direction is: the sum of the wall thickness A of the lower cavity 22', the assembly margin B between the flexible circuit board 3' and the lower cavity 22', the dimension C of the flexible circuit board 3' overlapped on the lower cavity 22', and the assembly margin D between the speaker 5' and the flexible circuit board 3'. In general, in this scheme, the area of ​​the flexible circuit board 3' corresponding to the speaker 5' (it can be understood that the area of ​​the flexible circuit board close to the speaker, such as Figure 1 The area shown in Q1 in the figure is arranged on the outer peripheral side of the speaker (for example, outside one side along its width direction), so that the speaker module reserves a size for arranging the flexible circuit board in the width direction of the speaker, resulting in a larger size of the speaker module 110' in the width direction, which is not conducive to the miniaturization of the electronic device.

[0085] like Figure 3 As shown in the second solution, the branch portion of the flexible circuit board 3" is fixed to the first electrode 52" and the second electrode 53" and electrically connected along the width direction of the speaker 5" ( Figure 3 The flexible circuit board 3" is arranged on the outer periphery of the speaker 5" and the flexible circuit board 3" is overlapped with the lower cavity 22" along its length direction ( Figure 3 In general, in this solution, the area of ​​the flexible circuit board 3" corresponding to the speaker 5" (which can be understood as the area of ​​the flexible circuit board close to the speaker, such as Figure 3The area shown in Q2 in the figure is arranged on the outer peripheral side of the speaker (for example, outside one side along its length direction), so that the speaker module reserves a size for arranging the flexible circuit board in the length direction of the speaker, which causes the size of the speaker module in the length direction to become larger, which is not conducive to the miniaturization of the electronic device.

[0086] Based on this, the present application provides a speaker module, in which at least one of the first electrode and the second electrode is fixed and electrically connected to the flexible circuit board through a pad, and the flexible circuit board is stacked and arranged on the inner side of the speaker circumference, which effectively reduces the circumferential size of the speaker module, which is conducive to the miniaturization of electronic equipment, or can provide more space for the arrangement of other structural parts inside the electronic equipment. The problem that the flexible circuit board is arranged on one side of the speaker circumference in the prior art (or it can be understood that the flexible circuit board is arranged on the outer side of the speaker), resulting in the increase of the circumferential size of the speaker module, which is not conducive to the miniaturization of electronic equipment, is solved.

[0087] The present application also provides an electronic device, which uses the above-mentioned speaker module. It should be noted that the electronic device is a type of electronic device equipped with a speaker module, specifically including but not limited to electronic products such as displays, notebooks, tablet personal computers, personal digital assistants (PDAs), personal computers (PCs), smart phones, smart wearable devices, and vehicle-mounted devices. This does not limit the scope of protection of the present application. The following uses the example of a mobile phone as an example to illustrate the application scenario of the speaker module.

[0088] See also Figure 4 and Figure 5 , Figure 4 This is a schematic diagram of the structure of an electronic device according to an embodiment of the present application, wherein a rear cover is not shown in the figure; Figure 5 for Figure 4 Schematic diagram of the cross-sectional structure along the BB direction.

[0089] like Figure 4 and Figure 5 As shown, the electronic device 10 further includes a housing 102, a display screen 101 mounted on the housing 102, a main circuit board 108 (i.e., a main board), a battery 111, and a sub-circuit board 109 (i.e., a sub-board). The housing 102 plays a role in protecting the electronic device 10 and supporting the entire device, and a storage space is formed inside the housing for accommodating components of the electronic device 10. The display screen 101, the main circuit board 108, the battery 111, and the sub-circuit board 109 are arranged in the storage space of the housing 102 and connected to the housing 102.

[0090] It can be understood by those skilled in the art that the specific structure of the housing 102 is not limited. In one embodiment, the housing 102 includes a middle frame 104 and a back cover 103, the middle frame 104 includes a bottom plate 105 and an outer frame 106 arranged around and connected to the outer peripheral side of the bottom plate 105, and in the thickness direction Z of the electronic device 10, the display screen 101 and the back cover 103 are respectively installed at both ends of the outer frame 106, so that the display screen 101 and the back cover 103 are respectively located on both sides of the bottom plate 105. An installation cavity is formed between the back cover 103 and the bottom plate 105 for installing internal components such as a battery 111, a main circuit board 108, a camera (not shown in the figure), a speaker module 110, and a sub-circuit board 109. In one embodiment, the speaker module 110, the main circuit board 108, the battery 111, and the sub-circuit board 109 are installed in the installation cavity between the back cover 103 and the bottom plate 105. The speaker module 110 and the auxiliary circuit board 109 are arranged side by side along the width direction of the electronic device 10. The flexible circuit board 3 in the speaker module 110 extends to one end 36 outside the cavity 2 (see Figure 8a ) is fixed and electrically connected to the auxiliary circuit board 109. The main circuit board 108, the battery 111 and the speaker module 110 are arranged in sequence along the length direction of the electronic device 10, and the speaker module 110 is located at the bottom of the electronic device 10. The auxiliary circuit board 109 is electrically connected to the main circuit board 108.

[0091] Furthermore, the speaker module 110 is fixedly connected to the housing 102 through the cavity 2, specifically, fixedly connected to the bottom plate 105 of the housing 102. A sound outlet 107 for the speaker 5 to emit sound is provided on the housing 102 (for example, at the position where the outer frame 106 of the middle frame 104 corresponds to the speaker).

[0092] Furthermore, the angle at which the speaker module 110 is fixedly connected to the housing 102 of the electronic device 10 is not limited, and the length direction of the speaker module 110 can be parallel to the length direction of the electronic device 10, or the length direction of the speaker module 110 can be inclined to the length direction of the electronic device 10. In one example, the length direction of the speaker module 110 is inclined 90° to the length direction of the electronic device 10, or it can be understood that the length direction of the speaker module 110 and the width direction of the electronic device 10 are parallel to each other.

[0093] It should be noted that the portion of the cavity 2 that is fixedly connected to the bottom plate 105 of the electronic device 10 may be the upper cavity 21 of the speaker module 110 or the lower cavity 22 of the speaker module 110, and those skilled in the art may set it according to specific circumstances. In one example, the speaker module 110 is fixedly connected to the bottom plate 105 of the electronic device 10 through the lower cavity 22.

[0094] Those skilled in the art will appreciate that the bottom plate 105 is a support frame located inside the electronic device 10. The outer frame 106 is a structure surrounding the outer periphery of the electronic device 10. Figure 5 As shown, the outer frame 106 can extend around the periphery of the electronic device 10 and the display screen 101, and specifically can surround the four sides of the display screen 101 to help fix the display screen 101. In some embodiments, the outer frame 106 can be a metal frame, and the metal frame is made of metal materials such as copper, magnesium alloy, stainless steel, etc. In other embodiments, the outer frame 106 can also be a non-metal frame (i.e., an insulating frame), and the non-metal frame includes a plastic frame, a glass frame, a ceramic frame, etc., and can also be a structure combining a metal frame and a non-metal frame.

[0095] The bottom plate 105 and the outer frame 106 can be a split structure or an integrated structure, which is not limited in the embodiments of the present application. When the bottom plate 105 and the outer frame 106 are split structures, the bottom plate 105 and the outer frame 106 are two different components of the housing 102, and the two can be assembled together by means of snap connection, buckling, etc., and the two can be separated when disassembly is required. When the bottom plate 105 and the outer frame 106 are an integrated structure, the connection relationship between the bottom plate 105 and the outer frame 106 cannot be separated, for example, the bottom plate 105 and the outer frame 106 are processed and made by an integrated molding method, or assembled by a permanent connection method such as welding, etc.

[0096] Among them, the back cover 103 is a structure arranged on the electronic device 10 opposite to the display screen 101, which is used to seal the components of the electronic device 10 inside the electronic device 10, and can also prevent dust, collision, and hardware scratches. The back cover 103 can be a back cover 103 made of a metal material (i.e., a metal back cover), or a back cover 103 made of a non-conductive material (i.e., a non-metal back cover), such as a glass back cover, a plastic back cover, etc. In some embodiments, the electronic device 10 may not include a separately arranged back cover 103, but use the bottom plate 105 of the middle frame 104 as the back cover 103, and this application does not limit this. The above is a detailed introduction to the housing 102 of the electronic device 10, and the other components will be described below.

[0097] It should be noted that the size of the main circuit board 108 and its position in the electronic device 10 are not limited, and the figure is only for illustration and does not limit the scope of the embodiments of the present application. The main circuit board 108 includes multiple functional modules (not shown in the figure) connected to each other to achieve corresponding functions, such as a charging management module, a power management module, wireless communication, an audio module, etc., and the present application does not limit this.

[0098] In one embodiment, the electronic device 10 further includes a processor (not shown in the figure). The processor can implement functions such as running an operating system, processing various data, running application programs, and controlling multiple hardware connected to the processor.

[0099] Furthermore, the display screen 101 of the electronic device 10 is used to display images, and its specific type is not limited. The user can interact with the electronic device 10 through the display screen 101 and use the speaker 5 to play sounds, adjust the volume, and so on.

[0100] The above is an introduction to the structure of electronic equipment and the functions of its components. The following will continue to explain the structural composition and principles of the speaker.

[0101] A speaker is an electronic device that converts electrical signals into sound signals and is widely used in electronic devices 10 that can produce sound, such as smart phones, headphones, tablets, laptops, and car-mounted devices.

[0102] The core components of the loudspeaker include a vibrating member, a magnetic circuit assembly and a voice coil, wherein the voice coil can vibrate relative to the magnetic circuit assembly, and the voice coil is connected to the vibrating member and can drive the vibrating member to vibrate.

[0103] In some embodiments, the magnetic circuit assembly can be composed of an electromagnet or a permanent magnet and form a stable magnetic field, and the voice coil can be configured as an electromagnet wound with a coil, and at least a portion of the voice coil is located in the magnetic field formed by the magnetic circuit assembly. At this time, when the electrical signal passes through the coil in the voice coil, the voice coil can form a magnetic field that repel or attract the magnetic circuit assembly, thereby vibrating in the magnetic field formed by the magnetic circuit assembly, and then the voice coil drives the vibrator to vibrate and make a sound, so as to convert the electrical signal into a sound signal.

[0104] The structure of the electronic device and the functions of its components are described in detail above with reference to the accompanying drawings. The structure of the speaker module and the connection method between the flexible circuit board and the first electrode and the second electrode are described in detail below with reference to the accompanying drawings.

[0105] See also Figures 6 to 8b , Figure 6 This is a schematic diagram of the three-dimensional structure of the speaker module according to an embodiment of the present application; Figure 7a A schematic diagram of the stereoscopic structure of the speaker module of the embodiment of the present application from another perspective; Figure 7b for Figure 6 A schematic cross-sectional view along the CC direction;

[0106] Figure 8a This is a schematic diagram of the three-dimensional structure of the speaker module according to an embodiment of the present application, wherein the upper cavity is not shown in the figure; Figure 8b This is a schematic diagram of the exploded structure of the speaker module according to an embodiment of the present application.

[0107] like Figures 6 to 8b As shown, the speaker module 110 includes a cavity 2, a speaker 5 and a flexible circuit board 3. The cavity 2 includes an upper cavity 21 and a lower cavity 22 that cover each other. The speaker 5 is installed in the cavity 2, and the speaker 5 has a first electrode 52 and a second electrode 53. The cavity 2 is provided with a mounting hole 28, and the mounting hole 28 is located on a side of the first side 54 of the speaker 5 away from the second side 55 in the first direction X. The first side 54 and the second side 55 of the speaker 5 are arranged opposite to each other in the first direction X, and the first direction X is perpendicular to the thickness direction Z of the speaker 5.

[0108] After the flexible circuit board 3 is fixed and electrically connected to the first electrode 52 and the second electrode 53 respectively, part of the flexible circuit board 3 is covered on the first surface 51 of the speaker 5 along the thickness direction Z thereof, and passes through the surface where the first side surface 54 of the speaker 5 is located, and the flexible circuit board 3 extends to the outside of the cavity 2 through the mounting hole 28. In addition, at least one of the first electrode 52 and the second electrode 53 (i.e., the first electrode 52 and / or the second electrode 5) can be fixed and electrically connected to the flexible circuit board 3 through the corresponding padding portion 4.

[0109] It should be noted that if Figure 5 As shown, the portion where the cavity 2 is connected to the bottom plate 105 of the electronic device 10 can adopt an integrated structure (or it can be understood that part of the structure of the housing 102 of the electronic device 10 constitutes the upper cavity 21 or the lower cavity 22 of the cavity 2), or a split structure. In addition, the upper cavity 21 can be fixedly connected to the bottom plate 105 of the electronic device 10, or the lower cavity 22 can be fixedly connected to the bottom plate 105 of the electronic device 10. Those skilled in the art can make arrangements according to specific circumstances. In one example, the lower cavity 22 is fixedly connected to the bottom plate 105 of the electronic device 10, and the lower cavity 22 and the bottom plate 105 of the electronic device 10 adopt a split structure.

[0110] Among them, Figure 8b As shown, the first electrode 52 can be the positive electrode of the speaker 5 or the negative electrode of the speaker 5, and the second electrode 53 is an electrode with a polarity opposite to that of the first electrode 52, which can be set by a person skilled in the art according to specific circumstances. In one example, the first electrode 52 close to the second side surface 55 of the speaker 5 is the positive electrode, and the second electrode 53 close to the first side surface 54 of the speaker 5 is the negative electrode.

[0111] Furthermore, if Figure 7a and Figure 7b As shown, the mounting hole 28 provided on the cavity 2 for passing the flexible circuit board 3 is sealed to achieve sealing of the cavity and prevent dust, water vapor, etc. from entering the interior of the speaker module 110 .

[0112] It should be noted that if Figure 8a and Figure 8bAs shown, the first direction X of the speaker 5 (for example, the length direction of the speaker) corresponds to the length direction of the speaker module 110 and the width direction of the electronic device 10; wherein, the first direction X of the speaker 5 can be parallel to the length direction of the corresponding speaker module 110 and the width direction of the corresponding electronic device 10, or it can be slightly tilted or tilted at a certain angle. In one embodiment, the first direction X of the speaker 5 is parallel to the length direction of the corresponding speaker module 110 and the width direction of the corresponding electronic device 10. In addition, the thickness direction Z of the speaker 5 corresponds to the thickness direction of the speaker module 110 and the thickness direction of the electronic device 10; wherein, the thickness direction Z of the speaker 5 can be parallel to the thickness direction of the corresponding speaker module 110 and the thickness direction of the corresponding electronic device 10, or it can be slightly tilted or tilted at a certain angle. In one embodiment, the thickness direction X of the speaker 5 is slightly tilted to the thickness direction of the corresponding speaker module 110 and the thickness direction of the corresponding electronic device 10. Or it can be understood that the speaker 5 rotates slightly in the cavity 2 along the length direction of the speaker module 110.

[0113] like Figure 8a and Figure 8b As shown, the speaker module 110 in the present application is provided with a raised portion 4 at at least one position of the first electrode 52 and the second electrode 53 of the speaker 5, and at least one of the first electrode 52 and the second electrode 53 is fixed and electrically connected to the surface of one end of the raised portion 4, so that the surface of the other end of the raised portion 4 is close to the height of the first surface 51 of the speaker 5 in the thickness direction Z of the speaker 5. The flexible circuit board 3 is fixed and electrically connected to the surface of the other end of the raised portion 4, and is covered on the first surface 51 of the speaker 5 (the first surface 51 is the surface of the speaker 5 that is far away from the vibration element among the two surfaces of the speaker 5 that are arranged opposite to each other along the thickness direction Z, that is, in the thickness direction Z of the speaker 5, the first surface 51 is located on the side of the voice coil of the speaker 5 that is far away from the vibration element), or it can be understood that the flexible circuit board 3 is located on the inner side of the speaker 5 in the circumferential direction, and is stacked with the speaker 5 in the thickness direction Z of the speaker 5; and passes through the surface where the first side surface 54 of the speaker 5 is located, and then extends to the outside of the cavity 2 through the mounting hole 28. The area of ​​the flexible circuit board 3 corresponding to the speaker 5 (which can be understood as the area of ​​the flexible circuit board 3 close to the speaker 5, for example, Figure 8aThe speaker module 110 (shown in the area Q3 in FIG) is stacked on the inner side of the speaker 5 in the circumferential direction, so that the speaker module 110 does not need to reserve a size for arranging the flexible circuit board 3 in the circumferential direction of the speaker 5, thereby reducing the circumferential size of the speaker module 110, for example, the size in the first direction X (for example, the length direction), or the size in the second direction Y (for example, the width direction) perpendicular to the first direction X. On the one hand, when the internal structure of the electronic device 10 remains unchanged, it is conducive to the miniaturization of the electronic device 10. On the other hand, when the size of the electronic device 10 remains unchanged, it can provide more space for the arrangement of other structural parts inside the electronic device 10, for example, it can provide more layout space for the battery, which is conducive to increasing the battery capacity, or it can provide more layout space for at least one of the main circuit board and the auxiliary circuit board, etc.

[0114] For example, in one exemplary scenario, the branch portion of the flexible circuit board 3 is fixed to the first electrode 52 and the second electrode 53 and electrically connected, and then stacked on the first surface 51 of the speaker 5 along the first direction X, so that the speaker module 110 does not need to reserve a size for arranging the flexible circuit board 3 in the second direction Y of the speaker 5, thereby reducing the size of the speaker module 110 in the second direction Y. In another exemplary scenario, the branch portion of the flexible circuit board is fixed to the first electrode and the second electrode and electrically connected, and then stacked on the first surface of the speaker along the second direction, so that the speaker module does not need to reserve a size for arranging the flexible circuit board in the first direction of the speaker, thereby reducing the size of the speaker module in the first direction.

[0115] It should be noted that the second direction Y of the speaker 5 corresponds to the width direction of the speaker module 110 and the length direction of the electronic device 10; wherein the second direction Y of the speaker 5 may be parallel to the width direction of the speaker module 110 and the length direction of the electronic device 10, or may be slightly inclined or inclined at a certain angle. In one embodiment, the second direction Y of the speaker 5 is slightly inclined to the width direction of the speaker module 110 and the length direction of the electronic device 10.

[0116] Therefore, in the speaker module 110 provided by the present application, at least one of the first electrode 52 and the second electrode 53 is fixed and electrically connected to the flexible circuit board 3 through the padding portion 4, so that the flexible circuit board 3 is stacked and arranged on the inner side of the speaker 5 in the circumferential direction, effectively reducing the circumferential size of the speaker module 110, which is conducive to the miniaturization of the electronic device 10, or can provide more space for the arrangement of other structural parts inside the electronic device 10. The problem that the flexible circuit board 3 is arranged on one side of the circumference of the speaker 5 (or it can be understood that the flexible circuit board 3 is arranged on the outer side of the speaker 5) in the prior art, resulting in the enlargement of the circumferential size of the speaker module 110, which is not conducive to the miniaturization of the electronic device 10, is solved.

[0117] like Figure 8a As shown, the flexible circuit board 3 includes a first connecting portion 31 and a second connecting portion 34 .

[0118] The first connection portion 31 includes a first branch portion 32 and a second branch portion 33. One end of the first branch portion 32 can be fixed and electrically connected to the first electrode 52 through the corresponding padding portion 4, and a portion of the structure of the first branch portion 32 is covered on the first surface 51 of the speaker 5. One end of the second branch portion 33 can also be fixed and electrically connected to the second electrode 53 through the corresponding padding portion 4, and a portion of the structure of the second branch portion 33 is covered on the first surface 51 of the speaker 5.

[0119] The second connecting part 34 is located as a whole on the side of the first side 54 of the speaker 5 away from the second side 55, and one end of the second connecting part 34 is connected to the other end of the first branch part 32 and the other end of the second branch part 33, and the other end of the second connecting part 34 passes through the mounting hole 28 and extends to the outside of the cavity (only the lower cavity 22 is shown in the figure).

[0120] Each branch portion in the first connection portion 31 can be fixed and electrically connected to at least one of the first electrode 52 and the second electrode 53 through the corresponding padding portion 4, and a portion of the first branch portion 32 and the second branch portion 33 is covered on the first surface 51 of the speaker 5. In addition, one end of the second connection portion 34 is connected to each branch portion of the first connection portion 31, and the other end extends to the outside of the cavity through the mounting hole 28. The arrangement of the flexible circuit board 3 in the cavity is more diversified, the assembly of the flexible circuit board 3 and the padding portion 4 is simpler, and it is beneficial to improve the connection reliability when the flexible circuit board 3 is connected to the first surface 51 of the speaker 5.

[0121] The structure of the speaker module and the connection between the flexible circuit board and the first electrode and the second electrode are described in detail above with reference to the accompanying drawings. The arrangement of the flexible circuit board on the first surface of the speaker is described in detail below with reference to the accompanying drawings.

[0122] See also Figures 8c to 13c As shown, Figure 8c This is a schematic diagram of a first arrangement of a flexible circuit board in a speaker module according to an embodiment of the present application; Fig. 9 for Figure 6 Schematic cross-sectional view along the DD direction; Fig.10 This is a schematic diagram of a second arrangement of a flexible circuit board in a speaker module according to an embodiment of the present application; Fig.11 This is a schematic diagram of a third arrangement of a flexible circuit board in a speaker module according to an embodiment of the present application; Fig.12 This is a schematic diagram of a fourth arrangement of a flexible circuit board in a speaker module according to an embodiment of the present application; Fig.13a This is a schematic diagram of the three-dimensional structure of an implementation of a raised portion in a speaker module according to an embodiment of the present application; Fig.13b It is a schematic diagram of the three-dimensional structure of another implementation of the raised portion in the speaker module of the embodiment of the present application; Fig.13c It is a schematic diagram of the three-dimensional structure of another implementation of the raised portion in the speaker module of the embodiment of the present application.

[0123] It should be noted that if Figure 8b and Figure 8c As shown, the positions of the first electrode 52 and the second electrode 53 in the speaker 5 are not limited, and they can be arranged on the same side of the periphery of the speaker 5, or at diagonal positions of the periphery of the speaker 5, or at other positions of the periphery of the speaker 5. Those skilled in the art can design according to specific needs.

[0124] like Figure 8c As shown, the first electrode 52 and the second electrode 53 are both arranged on the edge of one side where the third side 56 of the speaker 5 is located. In the first direction X, the first electrode 52, the second electrode 53 and the mounting hole 28 are arranged in sequence and spaced apart. The third side 56 of the speaker 5 is arranged adjacent to the first side 54 and is arranged opposite to the fourth side 57 in the second direction Y. The second direction Y is perpendicular to the thickness direction of the speaker 5 and perpendicular to the first direction X. In addition, in the second direction Y, the first branch portion 32 and the second branch portion 33 are located on the side of the third side 56 of the speaker 5 facing the fourth side 57.

[0125] The first electrode 52, the second electrode 53 and the mounting hole 28 are arranged at intervals along the first direction X, and the first branch portion 32 and the second branch portion 33 are located inside the speaker 5 along the second direction Y. The size of the speaker module in the second direction Y (for example, the width direction) is effectively reduced, which is conducive to reducing the size of the electronic device 10 in the direction corresponding to the second direction Y (for example, the length direction), and further conducive to miniaturization of the electronic device 10.

[0126] Furthermore, the first electrode 52 and the second electrode 53 can both be fixed and electrically connected to the corresponding branch parts in the first connecting part 31 through the raising part 4, or one of the first electrode 52 and the second electrode 53 can be fixed and electrically connected to the corresponding branch part in the first connecting part 31 through the raising part 4, and the other electrode can be directly fixed and electrically connected to the corresponding branch part in the first connecting part 31 without passing through the raising part 4.

[0127] In one embodiment, if Figure 8c As shown, the first branch portion 32 is fixed and electrically connected to the first electrode 52 through the corresponding raised portion 4, and then covered on the first surface 51 of the speaker 5, and the second branch portion 33 is fixed and electrically connected to the second electrode 53 through the corresponding raised portion 4, and then covered on the first surface 51 of the speaker 5, and the other end of the first branch portion 32 and the other end of the second branch portion 33 intersect and connect on the first surface 51 of the speaker 5, and then pass through the surface where the first side surface 54 of the speaker 5 is located.

[0128] Each branch portion in the first connection portion 31 is fixed and electrically connected to the first electrode 52 and the second electrode 53 through the corresponding pad 4, and then passes through the first side surface 54 of the speaker 5 after being intersected and connected on the first surface 51 of the speaker 5. The circumferential size (for example, the size in the width direction) of the speaker module is effectively reduced, which is beneficial to increasing the battery capacity, increasing the layout space of the main circuit board, or facilitating the miniaturization of the electronic device 10.

[0129] like Fig. 9 As shown, the distance between the third side surface 56 of the speaker 5 and the outer wall surface of the lower cavity 22 close to the third side surface 56 along the second direction Y is: the sum of the wall thickness A of the lower cavity 22 (which can be understood as the wall thickness at the position corresponding to the first electrode 52 and the second electrode 53 in the lower cavity 22) and the assembly margin B between the flexible circuit board 3 and the lower cavity 22. Figure 2 The flexible circuit board 3' shown in the figure is arranged on the outer peripheral side of the speaker 5'. The present application reduces the size of the flexible circuit board 3' overlapped on the lower cavity 22' (for example, Figure 2 Dimension C shown in FIG. 1 ) and the assembly margin dimension between the speaker 5 ′ and the flexible circuit board 3 ′ (eg, Figure 2 The dimension D shown in FIG. 1 ) is thus effectively reduced in the present application by the circumferential dimension of the speaker module 110 , which is beneficial to the miniaturization of the electronic device 10 .

[0130] In another embodiment, Fig.10As shown, after the first branch portion 32 is fixed and electrically connected to the first electrode 52 through the corresponding raised portion 4, it is covered on the first surface 51 of the speaker 5 and passes through the surface where the first side surface 54 of the speaker 5 is located. After the second branch portion 33 is fixed and electrically connected to the second electrode 53, it passes through the surface where the first side surface 54 of the speaker 5 is located. The other end of the first branch portion 32 and the other end of the second branch portion 33 meet and connect at the side of the first side surface 54 of the speaker 5 away from the second side surface 55.

[0131] The first branch portion 32 is fixed and electrically connected to the first electrode 52 through the pad 4, and the second branch portion 33 is directly fixed and electrically connected to the second electrode 53, and the two meet and connect after passing through the first side surface 54 of the speaker 5. The size of the speaker module in the second direction Y (for example, the width direction) is effectively reduced, thereby reducing the size of the electronic device 10 in the length direction, which is more conducive to the miniaturization of the electronic device 10.

[0132] In yet another embodiment, Fig.11 As shown, the first electrode 52 and the second electrode 53 are both located on the edge of the side where the first side 54 of the speaker 5 is located. After the first branch portion 32 is fixed and electrically connected to the first electrode 52 through the corresponding pad 4, it is covered on the first surface 51 of the speaker 5 along the second direction Y and passes through the surface where the first side 54 of the speaker 5 is located. After the second branch portion 33 is fixedly connected to the second electrode 53, it passes through the surface where the first side 54 of the speaker 5 is located and is arranged on the periphery of the speaker 5 along the second direction Y. The other end of the first branch portion 32 and the other end of the second branch portion 33 meet and connect at the side of the first side 54 of the speaker 5 away from the second side 55.

[0133] The first electrode 52 and the second electrode 53 are both located on the edge of one side where the first side 54 of the speaker 5 is located. The first branch portion 32 is fixed and electrically connected to the first electrode 52 through the pad 4, and the second branch portion 33 is directly fixed and electrically connected to the second electrode 53, and the two meet and connect after passing through the first side 54 of the speaker 5. The size of the speaker module in the first direction X (for example, the length direction) is effectively reduced, thereby reducing the size of the electronic device 10 in the width direction, which is more conducive to the miniaturization of the electronic device 10.

[0134] In other embodiments, Fig.12As shown, the first electrode 52 and the second electrode 53 are both located on the edge of one side where the first side surface 54 of the speaker 5 is located. After the first branch portion 32 is fixed and electrically connected to the first electrode 52 through the corresponding padding portion 4, it is covered on the first surface 51 of the speaker 5, and after the second branch portion 33 is fixed and electrically connected to the second electrode 53 through the corresponding padding portion 4, it is covered on the first surface 51 of the speaker 5. After the other end of the first branch portion 32 and the other end of the second branch portion 33 meet and connect on the first surface 51 of the speaker 5, they pass through the surface where the first side surface 54 of the speaker 5 is located. The size of the speaker module in the first direction X (for example, the length direction) is effectively reduced, thereby reducing the size of the electronic device 10 in the width direction, which is more conducive to the miniaturization of the electronic device 10.

[0135] It should be noted that if Figure 8c and Fig. 9 As shown, the first electrode 52 and the second electrode 53 are fixed and electrically connected to one end of the raised portion 4, and the other end of the raised portion 4 is fixed and electrically connected to one end of each branch portion of the flexible circuit board 3. For example, welding, conductive adhesive bonding, etc. can be used.

[0136] In one embodiment, if Figure 8c and Fig. 9 As shown, the first electrode 52 is welded to one end of the corresponding raised portion 4, and the other end of the raised portion 4 is welded to one end of the first branch portion 32, so that one end of the first branch portion 32 is fixed and electrically connected to the first electrode 52 through the corresponding raised portion 4. The second electrode 53 is welded to one end of the corresponding raised portion 4, and the other end of the raised portion 4 is welded to one end of the second branch portion 33, so that one end of the second branch portion 33 is fixed and electrically connected to the second electrode 53 through the corresponding raised portion 4. The raised portion 4 is connected to each branch portion and each electrode of the first connecting portion 31 by welding, and the connection method is simple.

[0137] Furthermore, the connection methods between the raised portion 4 and each branch portion and each electrode of the first connection portion 31 can be the same or different. In one example, the raised portion 4 is fixed and electrically connected to the first branch portion 32 and the first electrode 52 by welding, and the raised portion 4 is fixed and electrically connected to the second branch portion 33 and the second electrode 53 by conductive adhesive bonding. In another example, the raised portion 4 is fixed and electrically connected to each branch portion and each electrode of the first connection portion 31 by welding.

[0138] It should be noted that the flexible circuit board 3 is covered on the first surface 51 of the speaker 5 in any manner. For example, it can be bonded, embedded, etc. In one example, the surface of the flexible circuit board 3 close to the speaker 5 and the first surface 51 of the speaker 5 are fixedly connected by bonding. This connection method is simple and easy to assemble. Specifically, Fig. 9 As shown, the surface of the flexible circuit board 3 close to the speaker 5 and the first surface 51 of the speaker 5 are bonded and fixed by double-sided adhesive 6 .

[0139] It is further necessary to explain that if Figures 13a to 13c As shown, the structure of the raised portion 4 is not limited. For example, it can be a solid block structure (see Fig.13a The cross-section can be rectangular, circular, etc.) or annular (see Fig.13b The cross-section may be in the form of a closed ring) or a groove structure (see Fig.13c , the cross-section of which may be U-shaped). In one example, Fig.13a As shown, the raised portion 4 extends along the thickness direction Z of the speaker 5 and is arranged in a block structure. This structure is simple, is conducive to processing and manufacturing, and reduces costs.

[0140] The material of the raised portion 4 is a conductive material (or it can be understood that the raised portion 4 is made of a conductive material as a whole), so that the corresponding electrode of the speaker 5 is electrically connected to the flexible circuit board 3. In other alternative embodiments, part of the structure of the raised portion 4 may be made of a conductive material. For example, the raised portion may include a raised member (not shown in the figure) and a conductive member disposed on the raised member (not shown in the figure, the conductive member may be a metal layer coated on the surface of the raised member, etc.), the conductive member is made of a conductive material, so that the corresponding electrode of the speaker 5 is electrically connected to the flexible circuit board 3, and the raised member is made of a non-conductive material to support the flexible circuit board 3.

[0141] It should be noted that the above-mentioned conductive material can be, for example, copper, stainless steel, alloy, carbon fiber, graphene, etc. In one example, the entire raised portion 4 is made of a conductive material, and the conductive material is copper.

[0142] The arrangement of the flexible circuit board on the first surface of the speaker is described in detail above with reference to the accompanying drawings. The structure of the speaker is exemplarily described below with reference to the accompanying drawings.

[0143] See also Fig.14 , Fig.14 This is a schematic diagram of an exemplary structure of a speaker in a speaker module according to an embodiment of the present application.

[0144] like Fig.14As shown, the speaker 5 includes a vibrating member 58, a magnetic circuit assembly 511, a voice coil 59 and a fixed bracket 510. The outer peripheral edge of the vibrating member 58 is fixedly arranged at one end of the fixed bracket 510. The voice coil 59 is arranged in the fixed bracket 510. The coil of the voice coil 59 is connected to the first electrode 52 and the second electrode 53 (see Figure 8b ) is electrically connected, and the voice coil 59 is connected to one side of the vibrating member 58, and drives the vibrating member 58 to vibrate when power is turned on. In the thickness direction Z of the speaker 5, the first surface 51 of the speaker 5 is located on the side of the voice coil 59 away from the vibrating member 58.

[0145] It should be noted that the fixing bracket 510 can play a supporting and protective role, preventing the voice coil 59 from being squeezed or collided by external forces, and can also prevent dust, water vapor, etc. from entering the interior of the speaker 5. In addition, the specific structure of the fixing bracket 510 is not limited, and it only needs to play a supporting and fixing role. For example, the fixing bracket 510 can also be set as an integrally formed annular structure, can also be set as an integrally formed cylindrical structure, can also be set as a plurality of annular structures stacked, etc.

[0146] In one embodiment, the vibrating member 58 includes a diaphragm. In addition, the vibrating member 58 may also include a dome, which may be understood as a mass block and may be used to increase the weight of the vibrating member 58, thereby adjusting the frequency of the sound emitted by the vibrating member 58. The dome may be made of a rigid material, so that the dome itself is not easily deformed or twisted during the vibration process, and the vibration stability is maintained, thereby improving the sound quality of the vibration member 58 and reducing the distortion rate of the sound emitted by the speaker 5.

[0147] It should be noted that the magnetic circuit assembly 511 in the speaker 5 is installed inside the fixed bracket 510. In one embodiment, the vibrator 58 and the magnetic circuit assembly 511 are relatively spaced apart in the thickness direction Z of the speaker 5, and the voice coil 59 is fixedly connected to the vibrator 58 at one end facing the vibrator 58 in the thickness direction Z. The other end of the voice coil 59 is located in the magnetic field formed by the magnetic circuit assembly 511, and can vibrate under the magnetic force of the magnetic circuit assembly 511.

[0148] Those skilled in the art will appreciate that the specific structure and layout of the voice coil 59 and the magnetic circuit assembly 511 are not limited. For example, the voice coil 59 may be arranged around the outer periphery of the magnetic circuit assembly 511, or the magnetic circuit assembly 511 may be arranged around the outer periphery of the voice coil 59. Alternatively, the voice coil 59 may be arranged in the accommodation space of the magnetic circuit assembly 511 (it can be understood that the magnetic circuit assembly 511 includes a central portion and a side portion, an accommodation space is formed between the central portion and the side portion, the voice coil 59 surrounds the central portion of the magnetic circuit assembly 511, and the side portion of the magnetic circuit assembly 511 surrounds the voice coil 59).

[0149] Furthermore, if Fig.14 As shown, combined with Figure 7b It is understood that the other side of the vibrating member 58 and the lower cavity 22 surround the front sound cavity 29, and the side wall of the lower cavity 22 is provided with a sound hole 23 (see Fig. 9 ), the sound hole 23 connects the front sound cavity 29 with the outside of the cavity 2. One side of the vibrating member 58 and the fixing bracket 510, the upper cavity 21 and the lower cavity 22 surround to form the rear sound cavity 210. The sound hole 23 is not limited to the position in the cavity 2, and can be set on each wall surface of the upper cavity 21 or each wall surface of the lower cavity 22. Those skilled in the art can design it according to actual needs.

[0150] It should be noted that the specific structures of the upper cavity 21 and the lower cavity 22 are not limited and may include or not include the protrusions. Figure 7b As shown, in one example, the upper cavity 21 includes an upper main body 21A and an upper protruding portion 21B protruding from one side of the upper main body 21A, the lower cavity 22 includes a lower main body 22A and a lower protruding portion 22B protruding from one side of the lower main body 22A, the lower main body 22A and the upper main body 21A overlap each other to form a main cavity 26, the lower protruding portion 22B and the upper protruding portion 21B overlap each other to form a sub-cavity 27, the speaker 5 is installed in its entirety in the main cavity 26, the sub-cavity 27 is located in its entirety on a side of the first side 54 of the speaker 5 away from the second side 55, and the mounting hole 28 is provided on a side wall of the sub-cavity 27 away from the speaker 5. After the flexible circuit board 3 passes through the surface where the first side 54 of the speaker 5 is located, it passes through the sub-cavity 27 and extends from the mounting hole 28 to the outside of the cavity 2.

[0151] Among them, Figure 7b As shown, combined with Fig.14 It is understood that the other side of the vibration member 58 and the lower main body 22A of the main cavity 26 surround the front sound cavity 29, the sound hole 23 (see Fig. 9 ) is located on the side wall of the lower main body 22A, and one side of the vibrating member 58 is surrounded by the fixing bracket 510, the main cavity 26 and the sub-cavity 27 to form the rear sound cavity 210. The cavity 2 includes the main cavity 26 and the sub-cavity 27 formed by the upper protrusion 21B and the lower protrusion 22B. The speaker 5 is accommodated in the main cavity 26, and the space surrounded by the sub-cavity 27 constitutes a part of the rear sound cavity 210. In addition, the fixing bracket 510 is provided with a connecting hole 512 connecting the inner cavity of the main cavity 26 and the inner cavity of the speaker 5, and the inner cavity of the speaker 5 is also a part of the rear sound cavity 210. Increasing the space of the rear sound cavity 210 is conducive to improving the sound quality of the speaker module 110.

[0152] Furthermore, if Figure 8aAs shown, a mounting platform 24 is provided at one end of the lower protrusion 22B away from the first side surface 54 , and one end of the flexible circuit board 3 close to the mounting hole 28 is fixedly connected to the mounting platform 24 .

[0153] It should be noted that the fixed connection method between the flexible circuit board 3 and the mounting platform 24 of the lower protrusion 22B is not limited, and can be a fixed connection method such as clamping, bonding, etc. In one example, a protrusion 25 extending toward the direction close to the flexible circuit board 3 is provided on the mounting platform 24, and a through hole 35 corresponding to the protrusion 25 is provided on the flexible circuit board 3. The flexible circuit board 3 realizes the position constraint through the cooperation between the through hole 35 and the protrusion 25 on the mounting platform 24.

[0154] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A speaker module, characterized in that: include: Cavity; A speaker, the speaker is installed in the cavity, and the speaker has a first electrode and a second electrode; A flexible circuit board, wherein the cavity is provided with a mounting hole, wherein the mounting hole is located on a side of the first side of the speaker away from the second side in a first direction, wherein the first side and the second side of the speaker are arranged opposite to each other in the first direction, and the first direction is perpendicular to a thickness direction of the speaker; After the flexible circuit board is respectively fixed and electrically connected to the first electrode and the second electrode, at least a portion of the flexible circuit board is covered on the first surface of the speaker along the thickness direction thereof, passes through the surface where the first side surface of the speaker is located, and the flexible circuit board extends to the outside of the cavity through the mounting hole; Furthermore, the first electrode and / or the second electrode are fixed and electrically connected to the flexible printed circuit board via the raised portion.

2. The speaker module according to claim 1, wherein: The flexible circuit board comprises: a first connecting portion, the first connecting portion comprising a first branch portion and a second branch portion; one end of the first branch portion is fixed and electrically connected to the first electrode via the corresponding raised portion, and at least a portion of the first branch portion is covered on the first surface of the speaker; and / or one end of the second branch portion is fixed and electrically connected to the second electrode via the corresponding raised portion, and at least a portion of the second branch portion is covered on the first surface of the speaker; The second connecting part is located as a whole on the side of the first side of the speaker away from the second side, one end of the second connecting part is connected to the other end of the first branch part and the other end of the second branch part, and the other end of the second connecting part passes through the mounting hole and extends outside the cavity.

3. The speaker module according to claim 2, characterized in that: The first electrode and the second electrode are both arranged on an edge portion of a side where the third side surface of the speaker is located, and in the first direction, the first electrode, the second electrode and the mounting hole are arranged in sequence and spaced apart; wherein the third side surface of the speaker is arranged adjacent to the first side surface and is arranged opposite to the fourth side surface in the second direction, and the second direction is perpendicular to the thickness direction of the speaker and perpendicular to the first direction; Furthermore, in the second direction, the first branch portion and the second branch portion are located on a side of the third side surface of the speaker facing the fourth side surface.

4. The speaker module according to claim 3, characterized in that: The first branch portion is fixed and electrically connected to the first electrode through the corresponding raised portion, and then covered on the first surface of the speaker, and the second branch portion is fixed and electrically connected to the second electrode through the corresponding raised portion, and then covered on the first surface of the speaker, and the other end of the first branch portion and the other end of the second branch portion meet and connect on the first surface of the speaker, and then pass through the surface where the first side surface of the speaker is located; Alternatively, after the first branch portion is fixed and electrically connected to the first electrode through the corresponding raised portion, it is covered on the first surface of the speaker and passes through the surface where the first side surface of the speaker is located; after the second branch portion is fixed and electrically connected to the second electrode, it passes through the surface where the first side surface of the speaker is located; the other end of the first branch portion and the other end of the second branch portion intersect and connect on the side of the first side surface of the speaker away from the second side surface.

5. The speaker module according to claim 3, characterized in that: The first electrode is welded to one end of the corresponding raised portion, and the other end of the raised portion is welded to one end of the first branch portion, so that one end of the first branch portion is fixed and electrically connected to the first electrode through the corresponding raised portion; The second electrode is welded to one end of the corresponding raised portion, and the other end of the raised portion is welded to one end of the second branch portion, so that one end of the second branch portion is fixed and electrically connected to the second electrode through the corresponding raised portion.

6. The speaker module according to claim 2, wherein: The first electrode and the second electrode are both located on an edge portion of a side where the first side of the speaker is located; After the first branch portion is fixed and electrically connected to the first electrode through the corresponding raised portion, it is covered on the first surface of the speaker along the second direction and passes through the surface where the first side surface of the speaker is located; after the second branch portion is fixedly connected to the second electrode, it passes through the surface where the first side surface of the speaker is located and is arranged on the periphery of the speaker along the second direction; the other end of the first branch portion and the other end of the second branch portion meet and connect at a side of the first side surface of the speaker away from the second side surface; The second direction is perpendicular to the thickness direction of the speaker and perpendicular to the first direction.

7. The speaker module according to claim 1, wherein: The raised portion extends along the thickness direction of the speaker and is arranged in a block structure, and the raised portion is made of a conductive material.

8. The speaker module according to claim 1, wherein: The surface of the flexible circuit board close to the speaker is fixedly connected to the first surface of the speaker by bonding.

9. The loudspeaker module according to any one of claims 1 to 8, characterized in that: The speaker includes a fixed bracket, a vibrator and a voice coil, wherein the outer peripheral edge of the vibrator is fixedly arranged at one end of the fixed bracket, the voice coil is arranged in the fixed bracket, the coil of the voice coil is electrically connected to the first electrode and the second electrode, and the voice coil is connected to a side surface of the vibrator and drives the vibrator to vibrate when power is turned on; wherein, in the thickness direction of the speaker, the first surface of the speaker is located on the side of the voice coil away from the vibrator.

10. The speaker module according to claim 9, characterized in that: The cavity includes an upper cavity and a lower cavity covering each other, the other side of the vibrator and the lower cavity surround to form a front sound cavity, and a sound hole is opened on the side wall of the lower cavity, and the sound hole connects the front sound cavity with the outside of the cavity; one side of the vibrator and the fixed bracket, the upper cavity and the lower cavity surround to form a rear sound cavity.

11. The speaker module according to claim 10, wherein: The upper cavity comprises an upper main body and an upper protruding portion protruding from one side of the upper main body, the lower cavity comprises a lower main body and a lower protruding portion protruding from one side of the lower main body, the lower main body and the upper main body are overlapped with each other to form a main cavity, the lower protruding portion and the upper protruding portion are overlapped with each other to form a sub-cavity, the speaker is installed in the main cavity as a whole, the sub-cavity is located in the first side of the speaker away from the second side, the mounting hole is arranged on a side wall of the sub-cavity away from the speaker; after the flexible circuit board passes through the surface where the first side of the speaker is located, it passes through the sub-cavity and extends from the mounting hole to the outside of the cavity; Among them, the other side surface of the vibration part and the lower main body of the main cavity are surrounded to form the front sound cavity, the sound hole is located on the side wall of the lower main body, and one side surface of the vibration part and the fixed bracket, the main cavity and the auxiliary cavity are surrounded to form the rear sound cavity.

12. An electronic device, characterized in that: It comprises a shell and a speaker module as claimed in any one of claims 1 to 11, wherein the speaker module is fixedly connected to the shell through the cavity, and the shell is provided with a sound outlet hole for the speaker to emit sound.

13. The electronic device according to claim 12, characterized in that: The electronic device also includes a sub-circuit board, a battery and a main circuit board, and one end of the flexible circuit board extending outside the cavity is fixed to and electrically connected to the sub-circuit board; wherein the speaker module and the sub-circuit board are arranged in parallel along the width direction of the electronic device; the main circuit board, the battery and the speaker module are arranged in sequence along the length direction of the electronic device, and the speaker module is located at the bottom of the electronic device.

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