Multi-layer circuit board for power supply

Abstract

The utility model provides a multilayer circuit board for a power supply, which relates to the technical field of circuit boards and comprises a first conducting layer, a first insulating layer, a second conducting layer, a second insulating layer and a third conducting layer which are sequentially arranged from top to bottom. The circuit board further comprises a soaking layer, the soaking layer is arranged between the first conducting layer and the third conducting layer, a conducting hole is further formed in the circuit board and penetrates through the circuit board, a heat conduction layer is further arranged on the surface of the conducting hole, and heat is conducted to the soaking layer through the heat conduction layer. By arranging the soaking layer in the multi-layer circuit board, heat generated by the first conducting layer and the third conducting layer can be more effectively dispersed and conducted. And the soaking layer is used as a heat conduction medium, so that local hot spots are reduced, and the heat dissipation efficiency of the whole circuit board is improved. And elements can be kept to work at a proper temperature, so that the working efficiency and the overall performance of the power supply are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a multilayer circuit board for power supply. Background Art

[0002] A multilayer printed circuit board (MLB) is an electronic component that achieves complex electronic circuit design by embedding a conductive layer between multiple insulating layers. Multilayer printed circuit boards have higher circuit density and more complex design capabilities than single-layer or double-layer printed circuit boards.

[0003] The multi-layer circuit boards in the power supply are prone to heating problems. The power supply usually needs to handle higher currents. The components installed on the multi-layer circuit boards, such as power transistors, diodes, resistors, etc., are more likely to have heating problems, resulting in excessively high local temperatures on the circuit board. When the heat accumulates to a certain extent, it will cause the working efficiency of the components to decrease, and even damage the components or circuit boards.

[0004] Therefore, it is necessary to improve the existing multi-layer circuit board for power supply to overcome the problem of poor heat dissipation of the multi-layer circuit board for power supply in the prior art. Utility Model Content

[0005] In order to overcome the problems existing in the related art, the purpose of the utility model is to provide a multi-layer circuit board for a power supply to solve the problem of poor heat dissipation of the multi-layer circuit board existing in the prior art.

[0006] A multilayer circuit board for power supply includes a first conductive layer, a first insulating layer, a second conductive layer, a second insulating layer, and a third conductive layer which are sequentially arranged from top to bottom.

[0007] The circuit board also includes a heat-spreading layer, which is arranged between the first conductive layer and the third conductive layer. The circuit board is also provided with a via hole, which passes through the circuit board. A heat-conducting layer is also provided on the surface of the via hole, and the heat-conducting layer conducts heat to the heat-spreading layer.

[0008] In some embodiments, the heat dissipation layer is a ceramic material.

[0009] In some embodiments, the heat conductive layer and the heat dissipation layer form an integral structure.

[0010] In some embodiments, the heat conductive layer is a heat conductive silicone material.

[0011] In some embodiments, the heat-dissipating layer is disposed between the first insulating layer and the second conductive layer.

[0012] In some embodiments, the heat-dissipating layer is disposed between the second conductive layer and the second insulating layer.

[0013] In some embodiments, the circuit board further includes an elastic heat-conducting block, which is disposed between the first conductive layer and the heating element, and the elastic heat-conducting block wraps the bottom of the heating element.

[0014] In some embodiments, the elastic thermally conductive block extends toward the via and fills the via.

[0015] In some embodiments, the elastic thermally conductive block is made of thermally conductive silicone material.

[0016] In some embodiments, the thickness of the heat-dissipating layer is between 0.2 mm and 1.2 mm, and the diameter of the via hole is between 0.5 mm and 5 mm.

[0017] The beneficial effects of the utility model are:

[0018] The utility model provides a multilayer circuit board for power supply, which can more effectively disperse and conduct the heat generated by the first conductive layer and the third conductive layer by setting a heat-saturating layer in the multilayer circuit board. The heat-saturating layer, as a medium for heat conduction, helps to reduce local hot spots, thereby improving the heat dissipation efficiency of the entire circuit board. It can keep the components working at a suitable temperature, thereby improving their working efficiency and the overall performance of the power supply. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic diagram of a multilayer circuit board for power supply provided in Example 1 of the present application;

[0020] Figure 2 is a schematic diagram of a multilayer circuit board for power supply provided in Example 2 of the present application;

[0021] Figure 3 It is a schematic diagram of another multilayer circuit board for power supply provided in Example 1 of the present application.

[0022] Reference numerals:

[0023] 100, first conductive layer; 200, first insulating layer; 300, second conductive layer; 400, second insulating layer; 500, third conductive layer; 600, heat-dissipating layer; 700, via hole; 710, thermal conductive layer; 800, elastic thermal conductive block; 900, heating element. DETAILED DESCRIPTION

[0024] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art. Example 1

[0025] like Figure 1-Figure 3 As shown, this embodiment provides a multilayer circuit board for power supply, which includes a first conductive layer 100, a first insulating layer 200, a second conductive layer 300, a second insulating layer 400, and a third conductive layer 500 arranged in sequence from top to bottom.

[0026] The circuit board also includes a heat-balancing layer 600, which is arranged between the first conductive layer 100 and the third conductive layer 500. The circuit board is also provided with a via 700, which passes through the circuit board. A heat-conducting layer 710 is also provided on the surface of the via 700, which conducts heat to the heat-balancing layer 600.

[0027] Specifically, the heat-absorbing layer 600 is made of ceramic material.

[0028] More specifically, the heat conducting layer 710 covers the inner wall of the via hole 700 and is an alumina ceramic integrally formed with the heat balancing layer 600 .

[0029] More specifically, the heat-base layer 600 is disposed between the first insulating layer 200 and the second conductive layer 300 .

[0030] More specifically, the thickness of the heat-base layer 600 is 1.2 mm, and the diameter of the via hole 700 is 5 mm.

[0031] More specifically, the circuit board further includes an elastic heat-conducting block 800 , which is disposed between the first conductive layer 100 and the heating element 900 , and the elastic heat-conducting block 800 wraps the bottom of the heating element 900 .

[0032] More specifically, the elastic heat-conducting block 800 extends to the conductive via 700 and fills the conductive via 700 .

[0033] More specifically, the power supply in this embodiment uses a multi-layer circuit board, which is suitable for scenarios with low volume requirements and high heat dissipation requirements, such as server power supply, communication power supply, LED lighting power supply, automotive power supply, etc.

[0034] In this embodiment, the ceramic material heat-dissipating layer 600 placed between the first insulating layer 200 and the second conductive layer 300 is matched with the integrally formed alumina ceramic heat-conducting layer 710, which not only accelerates the conduction of heat, but also forms a heat dissipation duct through the optimized configuration of 1.2mm thickness and 5mm aperture, thereby achieving efficient heat dissipation. In addition, the elastic heat-conducting block 800 not only enhances the thermal contact with the heating element 900, but also further improves the heat dissipation efficiency by filling the through hole 700, effectively extending the life of the component and reducing maintenance costs. Example 2

[0035] like Figure 1-Figure 3 As shown, this embodiment provides a multilayer circuit board for power supply, which includes a first conductive layer 100, a first insulating layer 200, a second conductive layer 300, a second insulating layer 400, and a third conductive layer 500 arranged in sequence from top to bottom.

[0036] The circuit board also includes a heat-balancing layer 600, which is arranged between the first conductive layer 100 and the third conductive layer 500. The circuit board is also provided with a via 700, which passes through the circuit board. A heat-conducting layer 710 is also provided on the surface of the via 700, which conducts heat to the heat-balancing layer 600.

[0037] Specifically, the heat-absorbing layer 600 is made of ceramic material.

[0038] More specifically, the heat conductive layer 710 covers the inner wall of the via hole 700 , and the heat conductive layer 710 is a heat conductive silicone material.

[0039] More specifically, thermally conductive silicone material is a thermally conductive medium material that is synthesized through a special process with silicone as the base material and various auxiliary materials such as metal oxides added.

[0040] More specifically, the heat-base layer 600 is disposed between the second conductive layer 300 and the second insulating layer 400 .

[0041] More specifically, the thickness of the heat-base layer 600 is 0.2 mm, and the diameter of the via hole 700 is 0.5 mm.

[0042] More specifically, the circuit board further includes an elastic heat-conducting block 800 , which is disposed between the first conductive layer 100 and the heating element 900 , and the elastic heat-conducting block 800 wraps the bottom of the heating element 900 .

[0043] More specifically, the multi-layer circuit board for the power supply in this embodiment is suitable for scenarios with high volume requirements and relatively low heat dissipation requirements, such as portable electronic device chargers, small motor drive power supplies, etc.

[0044] In this embodiment, by integrating the ceramic material heat-sinking layer 600 and the heat-conducting silicone material heat-conducting layer 710 in the key heat dissipation area, efficient thermal management is achieved in a compact space. It is suitable for application scenarios with strict requirements on volume and relatively low heat dissipation requirements. The 0.2mm thickness of the heat-sinking layer 600 combined with the 0.5mm aperture of the through hole 700 provides a fine and effective heat conduction path. At the same time, the addition of the elastic heat-conducting block 800 further ensures the rapid transfer of heat energy between the heating element 900 and the conductive layer, enhancing the heat dissipation effect. Example 3

[0045] like Figure 1-Figure 3 As shown, this embodiment provides a multilayer circuit board for power supply, which includes a first conductive layer 100, a first insulating layer 200, a second conductive layer 300, a second insulating layer 400, and a third conductive layer 500 arranged in sequence from top to bottom.

[0046] The circuit board also includes a heat-balancing layer 600, which is arranged between the first conductive layer 100 and the third conductive layer 500. The circuit board is also provided with a via 700, which passes through the circuit board. A heat-conducting layer 710 is also provided on the surface of the via 700, which conducts heat to the heat-balancing layer 600.

[0047] Specifically, the heat-absorbing layer 600 is made of ceramic material.

[0048] More specifically, the heat conducting layer 710 covers the inner wall of the via hole 700 and is an alumina ceramic integrally formed with the heat balancing layer 600 .

[0049] More specifically, the heat-base layer 600 is disposed between the first insulating layer 200 and the second conductive layer 300 and between the second conductive layer 300 and the second insulating layer 400 .

[0050] More specifically, the thickness of the heat-base layer 600 is 0.6 mm, and the diameter of the via hole 700 is 2 mm.

[0051] More specifically, the circuit board further includes an elastic heat-conducting block 800 , which is disposed between the first conductive layer 100 and the heating element 900 , and the elastic heat-conducting block 800 wraps the bottom of the heating element 900 .

[0052] In this embodiment, a more uniform heat distribution and a more efficient heat dissipation effect are achieved by arranging a heat-saturating layer 600 of ceramic material at two key positions, namely between the first insulating layer 200 and the second conductive layer 300 and between the second conductive layer 300 and the second insulating layer 400. It is suitable for power applications with high requirements for heat dissipation efficiency, such as high power density power modules, while maintaining the compactness and cost-effectiveness of the structure, which helps to improve the stability and performance of the power system.

[0053] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the application. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a restriction. Therefore, other examples of exemplary embodiments can have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in the subsequent accompanying drawings.

[0054] In addition, it should be noted that the use of terms such as "first" and "second" to limit is only for the convenience of distinction. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0055] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A multilayer circuit board for power supply, the circuit board comprising a first conductive layer (100), a first insulating layer (200), a second conductive layer (300), a second insulating layer (400), and a third conductive layer (500) arranged in sequence from top to bottom, characterized in that: The circuit board further comprises a heat-balancing layer (600), wherein the heat-balancing layer (600) is arranged between the first conductive layer (100) and the third conductive layer (500), and the circuit board is further provided with a via hole (700), wherein the via hole (700) passes through the circuit board, and a heat-conducting layer (710) is further provided on the surface of the via hole (700), wherein the heat-conducting layer (710) conducts heat to the heat-balancing layer (600).

2. The multilayer wiring board for power supply according to claim 1, characterized in that: The heat-dissipating layer (600) is made of ceramic material.

3. The multilayer wiring board for power supply according to claim 2, characterized in that: The heat conducting layer (710) and the heat balancing layer (600) form an integral structure.

4. The multilayer wiring board for power supply according to claim 2, characterized in that: The heat-conducting layer (710) is made of heat-conducting silicone material.

5. The multilayer wiring board for power supply according to any one of claims 1 to 4, characterized in that: The heat-balancing layer (600) is disposed between the first insulating layer (200) and the second conductive layer (300).

6. The multilayer circuit board for power supply according to any one of claims 1 to 4, characterized in that: The heat-balancing layer (600) is disposed between the second conductive layer (300) and the second insulating layer (400).

7. The multilayer wiring board for power supply according to claim 5, characterized in that: The circuit board further comprises an elastic heat-conducting block (800), wherein the elastic heat-conducting block (800) is arranged between the first conductive layer (100) and the heating element (900), and the elastic heat-conducting block (800) wraps the bottom of the heating element (900).

8. The multilayer wiring board for power supply according to claim 7, characterized in that: The elastic heat-conducting block (800) extends toward the conducting hole (700) and fills the conducting hole (700).

9. The multilayer wiring board for power supply according to claim 8, characterized in that: The elastic heat-conducting block (800) is made of heat-conducting silicone material.

10. The multilayer wiring board for power supply according to claim 9, characterized in that: The thickness of the heat-dissipating layer (600) is between 0.2 mm and 1.2 mm, and the diameter of the via hole (700) is between 0.5 mm and 5 mm.

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