PCB (Printed Circuit Board) packaging structure capable of reducing tin connection risk of solder ball during BGA (Ball Grid Array) welding

Abstract

The utility model discloses a PCB packaging structure capable of reducing solder ball tin connection risk during BGA welding, which comprises a BGA packaging area arranged on a circuit board, a plurality of bonding pads are arranged in the BGA packaging area, a silk screen layer is arranged in the BGA packaging area, the bonding pads and the silk screen layer are not overlapped in the orthographic projection direction of the BGA packaging area, and the bonding pads and the silk screen layer are not overlapped in the orthographic projection direction of the BGA packaging area. According to the invention, silk screen is arranged between two adjacent bonding pads, the problem that tin connection is easy to occur during manual welding of the BGA packaging device is effectively solved, the resistance welding height is increased, and the risk of tin connection during welding is further reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board component packaging, and more specifically to a PCB packaging structure capable of reducing the risk of solder ball bridging during BGA welding. Background Art

[0002] In the design and manufacturing process of electronic products, the design of PCB (printed circuit board) files is a crucial link. Among them, BGA (Ball Grid Array) packaging devices are widely used in various electronic projects due to their high integration, small size and excellent electrical performance. BGA packaging devices integrate a large number of PINs (pins) inside, and these PINs are connected to the pads on the PCB through tiny solder balls to achieve circuit conduction.

[0003] In the normal machine placement process, due to the high-precision positioning and control system of the equipment, the placement accuracy of BGA devices is very high, which can ensure that each solder ball is accurately aligned with the corresponding pad, so there is basically no risk of solder bridging (i.e. short circuit between adjacent solder balls due to improper soldering). However, during the repair or upgrade of electronic products, BGA devices need to be reworked, and manual soldering is usually used at this time.

[0004] During manual soldering, due to various reasons such as the operator's skill level, the performance of the soldering tools, and environmental factors, problems such as solder ball position deviation and excessive melting of the solder balls due to long soldering time are very likely to occur during the manual soldering process, thereby increasing the risk of bridging, which will not only affect the electrical performance of the product, but may also cause irreversible damage to the circuit board. Utility Model Content

[0005] In order to overcome the deficiencies of the prior art, the utility model provides a PCB packaging structure that reduces the risk of solder ball bridging during BGA welding, so as to solve the problem of solder bridging that easily occurs when manually soldering BGA package components during the maintenance or upgrade of electronic products.

[0006] The technical solution of the utility model is as follows: A PCB packaging structure that reduces the risk of solder ball bridging during BGA welding, including a BGA packaging area arranged on a circuit board, a plurality of solder pads arranged in the BGA packaging area, a silk screen layer arranged in the BGA packaging area, and in the orthographic projection direction of the BGA packaging area, the solder pads and the silk screen layer do not overlap.

[0007] Furthermore, the pads include a first pad and a second pad, a plurality of the first pads and a plurality of the second pads are arrayed in the BGA packaging area, and the first pads are distributed at four corners of the BGA packaging area.

[0008] Furthermore, the first pad and the second pad are both circular in shape.

[0009] Further, a diameter of the first pad is greater than a diameter of the second pad.

[0010] Furthermore, the diameter of the first pad is 18 mil.

[0011] Furthermore, the diameter of the second pad is 16 mil.

[0012] Furthermore, 24 second solder pads are provided, and the 24 second solder pads are evenly distributed at the four corners of the BGA packaging area, and the center points of the six second solder pads located at any corner of the BGA packaging area are located on a right-angled triangle.

[0013] The utility model according to the above scheme has the beneficial effect that: the utility model provides a PCB packaging structure that reduces the risk of solder ball bridging during BGA welding, including a BGA packaging area arranged on the circuit board, a plurality of solder pads arranged in the BGA packaging area, and a silk screen layer arranged in the BGA packaging area. In the orthographic projection direction of the BGA packaging area, the solder pads and the silk screen layer do not overlap, which not only allows silk screen to be provided between two adjacent solder pads, effectively solving the problem of solder ball bridging that is prone to occur when manually soldering BGA packaging devices, but also increases the height of the solder resist, further reducing the risk of solder bridging during welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 This is a structural schematic diagram of a PCB packaging structure for reducing the risk of solder ball soldering during BGA soldering in an embodiment of the utility model;

[0016] Figure 2 for Figure 1 A is a partial enlarged schematic diagram.

[0017] In the figure, 1, BGA packaging area; 2, silk screen layer; 31, first solder pad; 32, second solder pad; D1, diameter of the first solder pad; D2, diameter of the second solder pad. DETAILED DESCRIPTION

[0018] The following detailed description and drawings of the embodiments of the present invention are used to illustrate the principle of the present invention, but cannot be used to limit the scope of the present invention, that is, the present invention is not limited to the embodiments described.

[0019] In order to better understand the present invention, the present invention is further described below in conjunction with the accompanying drawings and embodiments:

[0020] Ball Grid Array (BGA) packaging technology is a surface mounting technology used on integrated circuits. This technology is often used to permanently fix devices such as microprocessors. BGA packaging can provide more pins than other packages such as dual in-line packages or quad flat packages. The entire bottom surface of the device can be used as pins instead of only the periphery. It can also have a shorter average wire length than the surrounding limited package type, so as to have better high-speed performance. Secondly, BGA packaging technology shortens the average wire length. Since the pins are spread over the entire bottom surface instead of being limited to the periphery of the device, the wires can be connected to each pin more directly, thereby reducing the length of the wire. Shorter wire length helps to reduce signal transmission delay and energy loss, and improves the high-speed performance of integrated circuits. In addition, BGA packaging technology also improves the stability and reliability of the device. Because the pins are evenly distributed and dense, the device can better maintain stability when subjected to external shock or vibration. At the same time, the shorter wire length also reduces the risk of failure caused by bending or loosening of the wire, further improving the reliability of the device. Therefore, BGA packaging technology has broad prospects and advantages in the application of high-performance devices such as microprocessors.

[0021] In the normal machine patch process, due to the high-precision positioning and control system of the equipment, the patch accuracy of BGA devices is very high, which can ensure that each solder ball is accurately aligned with the corresponding pad, so there is basically no risk of bridging (i.e. short circuit between adjacent solder balls due to improper welding). However, in the process of repairing or upgrading electronic products, BGA devices need to be reworked. Since it is necessary to process solder joints in specific positions or special layouts, and most repair sites do not have enough space or conditions to use large-scale welding equipment, manual welding is usually used at this time. During manual welding, due to various reasons such as the skill level of the operator, the performance of the welding tools, and environmental factors, the manual welding process is prone to problems such as solder ball position deviation and excessive melting of the solder ball due to long welding time, thereby increasing the risk of bridging, which will not only affect the electrical performance of the product, but may also cause irreversible damage to the circuit board.

[0022] Based on this, the present invention provides a PCB packaging structure that reduces the risk of solder ball soldering during BGA soldering. Figure 1 As shown, the PCB packaging structure includes a BGA packaging area 1 arranged on the circuit board, a plurality of solder pads are arranged in the BGA packaging area 1, a silk screen layer 2 is arranged in the BGA packaging area 1, and in the orthographic projection direction of the BGA packaging area 1, the solder pads and the silk screen layer 2 do not overlap.

[0023] Specifically, the embodiment of the utility model provides a PCB packaging structure that reduces the risk of solder ball bridging during BGA welding. A plurality of solder pads are arranged in the BGA packaging area 1 on the circuit board, and the plurality of solder pads are used to connect with the solder balls of the BGA device. At the same time, a silk screen layer 2 is also arranged in the BGA packaging area 1, and the solder pads and the silk screen layer 2 do not overlap in the positive projection direction of the BGA packaging area 1. This design not only allows a silk screen mark to be provided between two adjacent solder pads, which facilitates operators to identify the solder pad positions and improves the accuracy and efficiency of welding, but also allows a silk screen to be provided between two adjacent solder pads, effectively solving the problem of bridging that is easy to occur during manual soldering of BGA packaged devices. In addition, the silk screen layer 2 also increases the solder resist height, wherein the solder resist height refers to the vertical distance between the solder pad and the silk screen layer 2. Due to the existence of the solder resist height, the flow range of the solder ball is limited during the melting process, and it is not easy to contact with other solder balls to form bridging, thereby further reducing the contact probability between solder balls during welding and reducing the risk of bridging during welding. It should be noted that the embodiment of the utility model provides a PCB packaging structure that reduces the risk of solder ball bridging during BGA soldering. The structure is suitable for equipment soldering as well as manual soldering, and can greatly reduce the risk of solder bridging.

[0024] Preferably, the pads include a first pad 31 and a second pad 32, and a plurality of first pads 31 and a plurality of second pads 32 are arranged in an array in the BGA package area 1, and the first pads 31 are distributed at the four corners of the BGA package area 1. This design helps to ensure that each PIN (pin) on the BGA package device can be accurately connected to the corresponding pad, which facilitates positioning and alignment during welding, reduces the difficulty of operation, and improves welding efficiency.

[0025] In the present embodiment, the first pad 31 and the second pad 32 are both circular. Specifically, since the edges of the circular pads are smooth and can fully contact with the solder balls, during the welding process, the contact between the solder balls and the circular pads is stable, and it is not easy to cause problems such as poor contact or cold soldering, thereby improving the reliability and stability of welding and facilitating the formation of good electrical connections. Secondly, during the welding process, the solder balls need to melt and form a firm connection with the pads. The shape of the circular pads allows the heat to be evenly distributed on the pads, which is beneficial to the heat transfer during the welding process, so that the solder balls can be evenly melted, avoiding welding defects caused by uneven heat distribution.

[0026] In this embodiment, since a silk screen layer 2 is provided in the BGA packaging area 1, the silk screen layer 2 is raised to change the relative position between the solder ball and the pad. This raising will cause the gap between the solder ball and the pad to increase. The increase in the gap may cause insufficient contact between the solder ball and the pad during the welding process, thereby affecting the firmness and stability of the welding, directly affecting the heat conduction during welding and the contact area between the solder ball and the pad, and further affecting the welding quality. The decline in welding quality may lead to problems such as loose welding and incomplete solder joints, resulting in electrical connection failure, component falling off and other problems, thereby affecting the performance and reliability of the entire electronic product.

[0027] Based on this, the embodiment of the utility model provides a PCB packaging structure that reduces the risk of solder ball bridging during BGA welding, and increases the diameter D1 of the first pad so that the diameter D1 of the first pad is greater than the diameter D2 of the second pad. The diameter of the first pad 31 increases, so that the contact area between the solder ball and the first pad 31 also increases, thereby providing a stronger bonding force, making the connection between the solder ball and the pad more firm and stable, even if the gap becomes larger due to the silk screen pad, due to the increase in the contact area between the solder ball and the first pad 31, the solder ball and the pad can still maintain sufficient bonding force, thereby ensuring that the welding quality is not affected, which helps to reduce the probability of cold soldering. Among them, cold soldering refers to the situation where an effective connection is not formed between the solder ball and the pad during the welding process, which may cause the electrical connection to be unstable or fail. By increasing the diameter D1 of the first pad, the present application can effectively reduce the risk of cold soldering and improve the reliability and stability of welding even in the case of silk screen padding.

[0028] Specifically, the diameter D1 of the first pad is 18 mil, and the diameter D2 of the second pad is 16 mil.

[0029] Specifically, 24 second solder pads 32 are provided, and the 24 second solder pads 32 are evenly distributed at the four corners of the BGA packaging area 1, and the center points of the six second solder pads 32 located at any corner of the BGA packaging area 1 are located on a right triangle.

[0030] The indicated orientation or position relationship is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the product of the application is usually placed when used, or the orientation or position relationship commonly understood by technical personnel in this field, or the orientation or position relationship in which the product of the application is usually placed when used. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0031] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

[0032] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A PCB packaging structure that reduces the risk of solder ball soldering during BGA soldering, characterized in that: The invention comprises a BGA packaging area (1) arranged on a circuit board, wherein a plurality of solder pads are arranged in the BGA packaging area (1), and a silk screen layer (2) is arranged in the BGA packaging area (1), and in the orthographic projection direction of the BGA packaging area (1), the solder pads and the silk screen layer (2) do not overlap.

2. A PCB packaging structure for reducing the risk of solder ball bonding during BGA soldering as claimed in claim 1, characterized in that: The solder pads comprise a first solder pad (31) and a second solder pad (32); a plurality of the first solder pads (31) and a plurality of the second solder pads (32) are arranged in an array in the BGA packaging area (1), and the first solder pads (31) are distributed at the four corners of the BGA packaging area (1).

3. A PCB packaging structure for reducing the risk of solder ball bonding during BGA soldering as claimed in claim 2, characterized in that: The first pad (31) and the second pad (32) are both circular in shape.

4. A PCB packaging structure for reducing the risk of solder ball bonding during BGA soldering as claimed in claim 3, characterized in that: The diameter of the first pad (31) is greater than the diameter of the second pad (32).

5. A PCB packaging structure for reducing the risk of solder ball bonding during BGA soldering as claimed in claim 3, characterized in that: The diameter of the first pad (31) is 18 mil.

6. A PCB packaging structure for reducing the risk of solder ball bonding during BGA soldering as claimed in claim 3, characterized in that: The diameter of the second pad (32) is 16 mil.

7. A PCB packaging structure for reducing the risk of solder ball bonding during BGA soldering as claimed in claim 2, characterized in that: There are 24 second solder pads (32), which are evenly distributed at the four corners of the BGA packaging area (1), and the center points of the six second solder pads (32) located at any corner of the BGA packaging area (1) are located on a right triangle.

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