Control circuit board

Abstract

The utility model discloses a control circuit board, which comprises a plurality of substrates arranged at intervals, at least two of the plurality of substrates are provided with power supply positive electrode laid copper and power supply negative electrode laid copper, at least two of the plurality of substrates are provided with a plurality of groups of three-phase output laid copper, and the three-phase output laid copper is connected with the power supply positive electrode laid copper and the power supply negative electrode laid copper. Each group of three-phase output laid copper is electrically connected with the power supply positive electrode laid copper and the power supply negative electrode laid copper, and the plurality of groups of three-phase output laid copper are electrically connected with the plurality of motors in a one-to-one correspondence manner. Therefore, a plurality of groups of three-phase output laid copper are arranged in the control circuit board and are electrically connected with the plurality of motors in a one-to-one correspondence manner, and each group of three-phase output laid copper is electrically connected with the power supply positive electrode laid copper and the power supply negative electrode laid copper, so that a group of power supplies can be shared by the plurality of motors on the control circuit board; at least two of the plurality of substrates are provided with a plurality of groups of three-phase output laid copper, so that the area of the three-phase output laid copper can be increased, the current-carrying capability of the control circuit board can be enhanced, and the problem of overlarge current of the control circuit board is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a control circuit board. Background Art

[0002] With the development of new energy vehicles, the product types of pure electric vehicles and hybrid vehicles are becoming more and more diverse, among which, there are control systems that use brushless DC motors to provide driving force for vehicles. Brushless DC motors use electronic commutation, and the controller on the integrated circuit board adjusts the frequency and voltage of the power supply to output three-phase current to control the speed and direction of the motor.

[0003] In the prior art, only one set of three-phase circuits is provided on the circuit board, which can only provide three-phase current for one brushless DC motor, and it is impossible to use multiple motors at the same time, and the integration is low. In addition, the circuit board has limited current carrying capacity, which makes it difficult to cope with the situation of three-phase high current output, and it is also impossible to ensure the stability and reliability of the circuit. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a control circuit board, which can pass a large current.

[0005] According to the control circuit board of the embodiment of the utility model, it includes: a plurality of substrates, the plurality of substrates are arranged at intervals, at least two of the plurality of substrates are provided with a positive copper plating of a power supply and a negative copper plating of a power supply, the positive copper plating of the power supply and the negative copper plating of the power supply are respectively used for corresponding connection with the positive and negative poles of a power supply, at least two of the plurality of substrates are provided with a plurality of groups of three-phase output copper platings, each group of the three-phase output copper platings is electrically connected to the positive copper plating of the power supply and the negative copper plating of the power supply, and the plurality of groups of three-phase output copper platings are electrically connected to a plurality of motors one by one.

[0006] Therefore, by arranging multiple groups of three-phase output copper pads in the control circuit board and electrically connecting them to multiple motors one by one, and each group of three-phase output copper pads is electrically connected to the positive copper pads and the negative copper pads of the power supply, it is possible to achieve a group of power supplies for multiple motors on the control circuit board. In addition, at least two of the multiple substrates are provided with multiple groups of three-phase output copper pads, which can increase the area of ​​the three-phase output copper pads, thereby enhancing the current-carrying capacity of the control circuit board and solving the problem of excessive current in the control circuit board.

[0007] According to some embodiments of the utility model, the power supply positive electrode copper plating is composed of multiple groups, the power supply negative electrode copper plating is composed of multiple groups, and each group of the three-phase output copper plating is electrically connected to multiple groups of the power supply positive electrode copper plating and multiple groups of the power supply negative electrode copper plating.

[0008] According to some embodiments of the present utility model, the power positive electrode copper plating is divided into three groups, the power negative electrode copper plating is divided into three groups, and the three-phase output copper plating is divided into three groups.

[0009] According to some embodiments of the present invention, each group of the three-phase output copper pads includes a plurality of sub-three-phase output copper pads, and the plurality of sub-three-phase output copper pads are spaced apart on a plurality of substrates and are electrically connected to each other.

[0010] According to some embodiments of the utility model, at least two of the multiple substrates are provided with a supporting capacitor positive electrode copper plating and a supporting capacitor negative electrode copper plating, the supporting capacitor positive electrode copper plating and the supporting capacitor negative electrode copper plating are respectively used to electrically connect to the negative electrode of the supporting capacitor, the supporting capacitor positive electrode copper plating includes a plurality of mutually electrically connected sub-supporting capacitor positive electrode copper platings, and the supporting capacitor negative electrode copper plating includes a plurality of mutually electrically connected sub-supporting capacitor negative electrode copper platings.

[0011] According to some embodiments of the present invention, at least one of the plurality of substrates is provided with a control signal copper patch.

[0012] According to some embodiments of the utility model, there are five substrates, and the five substrates are respectively a first substrate, a second substrate, a third substrate, a fourth substrate and a fifth substrate which are spaced apart in the up and down directions, a first positive power supply copper plating and a first negative power supply copper plating which are spaced apart are provided on a side of the first substrate away from the second substrate, a second positive power supply copper plating is provided on a side of the first substrate facing the second substrate, a third positive power supply copper plating is provided on a side of the third substrate facing the fourth substrate, a second negative power supply copper plating is provided on a side of the fourth substrate facing the fifth substrate, and a third negative power supply copper plating is provided on a side of the fifth substrate away from the fourth substrate.

[0013] According to some embodiments of the utility model, each group of the three-phase output copper potting includes four sub-three-phase output copper pottings, one sub-three-phase output copper potting is respectively arranged on the upper and lower sides of the first substrate, one sub-three-phase output copper potting is respectively arranged on the upper and lower sides of the third substrate, and the four sub-three-phase output copper pottings are electrically connected.

[0014] According to some embodiments of the utility model, a first sub-support capacitor positive copper plating and a first sub-support capacitor negative copper plating are respectively provided on both sides of the second substrate, a second sub-support capacitor positive copper plating and a second sub-support capacitor negative copper plating are respectively provided on both sides of the fifth substrate, the first sub-support capacitor positive copper plating and the second sub-support capacitor positive copper plating are electrically connected, and the first sub-support capacitor negative copper plating and the second sub-support capacitor negative copper plating are electrically connected.

[0015] According to some embodiments of the utility model, a supporting capacitor is provided on the side of the first substrate away from the second substrate, and a control ground copper plating and a driving ground copper plating are provided on the side of the first substrate adjacent to the supporting capacitor. The control ground copper plating and the driving ground copper plating are spaced apart and electrically connected by a short line.

[0016] According to some embodiments of the utility model, a sampling resistor copper plating and a sampling resistor ground copper plating are provided on at least one of the plurality of substrates, the sampling resistor ground copper plating is arranged around the periphery of the sampling resistor copper plating and is spaced apart from the sampling resistor copper plating, extension portions are respectively provided on both sides of a first direction of the sampling resistor copper plating, extension portions are respectively provided on both sides of a second direction of the sampling resistor copper plating, the extension portions are electrically connected to the sampling resistor ground copper plating, wherein the first direction and the second direction are perpendicular to each other.

[0017] According to some embodiments of the utility model, a sampling resistor signal collection copper plating is provided on at least one of the multiple substrates, the sampling resistor signal collection copper plating is arranged on the outside of the sampling resistor copper plating and is connected to the sampling resistor copper plating, and the sampling resistor signal collection copper plating is arranged at intervals from the sampling resistor ground copper plating.

[0018] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0020] Figure 1 is a top view schematic diagram of a control circuit board according to an embodiment of the utility model;

[0021] Figure 2 is a bottom schematic diagram of a control circuit board according to an embodiment of the utility model;

[0022] Figure 3 is a schematic diagram of the structure of a control circuit board according to an embodiment of the utility model;

[0023] Figure 4 is a schematic diagram of the first layer of a control circuit board according to an embodiment of the utility model;

[0024] Figure 5 is a schematic diagram of the second layer of the control circuit board according to an embodiment of the utility model;

[0025] Figure 6 is a schematic diagram of the third layer of the control circuit board according to an embodiment of the utility model;

[0026] Figure 7 is a schematic diagram of the fourth layer of the control circuit board according to an embodiment of the utility model;

[0027] Figure 8 is a schematic diagram of the fifth layer of the control circuit board according to an embodiment of the utility model;

[0028] Fig. 9 is a schematic diagram of the sixth layer of the control circuit board according to an embodiment of the utility model;

[0029] Fig.10 It is a partial schematic diagram of the first layer of the control circuit board according to an embodiment of the utility model;

[0030] Fig.11 is a partial schematic diagram of the second layer of the control circuit board according to an embodiment of the utility model;

[0031] Fig.12 is a partial schematic diagram of the sixth layer of the control circuit board according to an embodiment of the utility model;

[0032] Fig.13 It is a partial schematic diagram of the sixth layer of the control circuit board according to an embodiment of the utility model.

[0033] Reference numerals:

[0034] 100. Control circuit board;

[0035] 1. substrate; 101. first substrate; 102. second substrate; 103. third substrate; 104. fourth substrate; 105. fifth substrate; 106. first layer; 107. second layer; 108. third layer; 109. fourth layer; 110. fifth layer; 111. sixth layer;

[0036] 2. Copper plating of the positive electrode of the power supply; 201. Copper plating of the positive electrode of the first power supply; 202. Copper plating of the positive electrode of the second power supply; 203. Copper plating of the positive electrode of the third power supply;

[0037] 3. Copper plating of the negative electrode of the power supply; 301. Copper plating of the negative electrode of the first power supply; 302. Copper plating of the negative electrode of the second power supply; 303. Copper plating of the negative electrode of the third power supply;

[0038] 4. Three-phase output copper plating; 401. Sub-three-phase output copper plating;

[0039] 5. Support the copper plating of the positive electrode at the front end of the capacitor; 6. Support the copper plating of the negative electrode at the front end of the capacitor; 7. Support the copper plating of the positive electrode at the back end of the capacitor; 8. Support the copper plating of the negative electrode at the back end of the capacitor; 9. Control signal copper plating; 10. Support capacitor; 11. Control ground wire copper plating; 12. Drive ground wire copper plating; 13. Short line;

[0040] 14. Copper plating of sampling resistor; 141. Extension part;

[0041] 15. Sampling resistor ground wire copper; 16. Sampling resistor signal collection copper; 17. MOSFET; 18. Control chip power supply copper; 19. MOSFET power supply copper; 20. Filter components; 21. Control chip;

[0042] 22, pin; 221, positive pin; 222, negative pin; 223, three-phase output pin;

[0043] 23. Protection circuit;

[0044] 24, copper plating of the positive electrode of the supporting capacitor; 241, copper plating of the positive electrode of the sub-supporting capacitor; 2411, copper plating of the positive electrode of the first sub-supporting capacitor; 2412, copper plating of the positive electrode of the second sub-supporting capacitor;

[0045] 25. Copper plating of the negative electrode of the supporting capacitor; 251. Copper plating of the negative electrode of the sub-supporting capacitor; 2511. Copper plating of the negative electrode of the first sub-supporting capacitor; 2512. Copper plating of the negative electrode of the second sub-supporting capacitor;

[0046] 26. Power supply routing. DETAILED DESCRIPTION

[0047] The embodiments of the present utility model are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The embodiments of the present utility model are described in detail below.

[0048] See the figure below for reference Figure 1-Figure 13 The control circuit board 100 according to the embodiment of the utility model is described. The control circuit board 100 in the utility model can be used to be connected to a motor, and the motor is, for example, a brushless DC motor.

[0049] In the prior art, a control circuit board is connected to the positive and negative electrodes of a power source and inputs a low-voltage power supply voltage. The frequency and voltage of the power source can be changed through adjustment by a controller on the control circuit board to control the speed and direction of the brushless DC motor.

[0050] Combination Figure 3-Figure 9 As shown, the control circuit board 100 according to the embodiment of the utility model may mainly include: a plurality of substrates 1, wherein the plurality of substrates 1 are arranged at intervals, and at least two of the plurality of substrates 1 are provided with a positive copper plating 2 of a power supply and a negative copper plating 3 of a power supply, and the positive copper plating 2 of the power supply and the negative copper plating 3 of the power supply are respectively used for corresponding connection with the positive and negative poles of a power supply, and at least two of the plurality of substrates 1 are provided with a plurality of groups of three-phase output copper plating 4, and each group of three-phase output copper plating 4 is electrically connected to the positive copper plating 2 of the power supply and the negative copper plating 3 of the power supply, and the plurality of groups of three-phase output copper plating 4 are electrically connected to a plurality of motors one by one.

[0051] Specifically, in the embodiment of the utility model, a plurality of substrates 1 are arranged at intervals, and the control circuit board 100 can be separated into a multi-layer structure, so as to facilitate the arrangement of electronic control components on the control circuit board 100. At least two substrates 1 among the plurality of substrates 1 are provided with a positive copper plating 2 of the power supply and a negative copper plating 3 of the power supply, so that the area of ​​the positive copper plating 2 of the power supply and the negative copper plating 3 of the power supply can be increased, and the current carrying capacity of the control circuit board 100 can be improved. The positive copper plating 2 of the power supply and the negative copper plating 3 of the power supply are respectively used to be connected to the positive and negative electrodes of the power supply, and a current loop can be formed between the control circuit board 100 and the power supply, so that the power supply can be connected to the control circuit board 100, and then the control circuit board 100 can work normally.

[0052] Furthermore, at least two of the multiple substrates 1 are provided with multiple groups of three-phase output copper paving 4, and each group of three-phase output copper paving 4 is electrically connected to the positive copper paving 2 and the negative copper paving 3 of the power supply, so that multiple groups of three-phase output copper paving 4 can be connected to a power supply together. After the current flows into the control circuit board 100, the frequency and voltage of the power supply are adjusted by the controller on the control circuit board 100, and the controller is electrically connected to the three-phase output copper paving 4, and then output to the brushless DC motor through the three-phase output copper paving 4, so that the stator winding in the brushless DC motor can generate a rotating magnetic field, thereby driving the rotor of the brushless DC motor to rotate, and realizing the electronic commutation of the brushless DC motor. The three-phase output copper paving 4 can output three-phase current to the brushless DC motor, and the three-phase current is a current with a phase difference of three components that is one-third of a cycle or a phase angle of 120°, which can generate a rotating magnetic field in the brushless DC motor, and then drive the brushless DC motor to rotate.

[0053] Furthermore, multiple groups of three-phase output copper pads 4 are provided on the control circuit board 100 and are electrically connected to multiple motors in a one-to-one correspondence, so that multiple motors can share a power supply through one control circuit board 100, and the control circuit board 100 can drive multiple brushless DC motors at the same time, and multiple brushless DC motors can be used at the same time, thereby improving the competitiveness of the product. In addition, at least two substrates 1 among the multiple substrates 1 are provided with multiple groups of three-phase output copper pads 4, which can increase the area of ​​the three-phase output copper pads 4, and then enhance the overcurrent capacity of the three-phase output copper pads 4 in the control circuit board 100, which can solve the problem of the control circuit board 100 dealing with large currents.

[0054] In an embodiment of the utility model, a plurality of vias are provided on the positive copper plating 2 of the power supply, the negative copper plating 3 of the power supply and the three-phase output copper plating 4. These vias can not only realize the electrical connection between the positive copper plating 2 of the power supply, the negative copper plating 3 of the power supply and the three-phase output copper plating 4, but also increase the current capacity of the positive copper plating 2 of the power supply, the negative copper plating 3 of the power supply and the three-phase output copper plating 4 by setting the number of vias, thereby enabling the control circuit board 100 in the utility model to input a low-voltage power supply voltage and output a three-phase high current.

[0055] Combination Figure 3 As shown, there are multiple groups of power positive copper plating 2, multiple groups of power negative copper plating 3, and each group of three-phase output copper plating 4 is electrically connected to multiple groups of power positive copper plating 2 and multiple groups of power negative copper plating 3. Specifically, in the embodiment of the utility model, multiple groups of power positive copper plating 2 and multiple groups of power negative copper plating are provided, so that the control circuit board 100 in the utility model can drive multiple brushless DC motors to work at the same time, which can improve the integration of the control circuit board 100, and further improve the working efficiency of the control circuit board 100. Each group of three-phase output copper plating 4 can be electrically connected to multiple groups of power positive copper plating 2 and multiple groups of power negative copper plating 3, so that not only can the control circuit board 100 integrate multiple groups of control circuits to drive multiple brushless DC motors, but also can ensure that multiple groups of control circuits are independent of each other, and can realize individual control of each brushless DC motor, so as to improve the control effect of the control circuit board 100, and further improve the competitiveness of the product.

[0056] Combination Figure 3 As shown, there are three groups of power positive copper plating 2, three groups of power negative copper plating 3, and three groups of three-phase output copper plating 4. Specifically, in the embodiment of the utility model, three groups of power positive copper plating 2 and three groups of power negative copper plating 3 are provided, which can increase the area of ​​the positive power copper plating and the power negative copper plating 3 accordingly, so as to improve the current carrying capacity of the control circuit board 100. In addition, three groups of three-phase output copper plating 4 are provided, so that the three-phase current output circuits of three brushless DC motors can be integrated on the control circuit board 100, which can not only improve the integration of the control circuit board 100, but also improve the competitiveness of the product.

[0057] Combination Figure 3As shown, each group of three-phase output copper pads 4 includes a plurality of sub-three-phase output copper pads 401, and the plurality of sub-three-phase output copper pads 401 are arranged at intervals on a plurality of substrates 1 and are electrically connected to each other. Specifically, the motor current commonly used in the vehicle control system is relatively large, and a plurality of sub-three-phase output copper pads 401 are arranged in each group of three-phase output copper pads 4, and the plurality of sub-three-phase output copper pads 401 are electrically connected to each other, which can increase the current capacity of the three-phase output copper pads 4. Further, when a large current is input into the control circuit board 100, the arrangement of the plurality of sub-three-phase output copper pads 401 can enhance the carrying capacity of the control circuit board 100 when facing a large current working condition, thereby facilitating the improvement of the working reliability of the control circuit board 100 under a large current working condition.

[0058] Furthermore, multiple sub-three-phase output copper pads 401 are arranged at intervals on multiple substrates 1, so that the multiple sub-three-phase output copper pads 401 can be arranged separately in layers, and the multiple sub-three-phase output copper pads 401 are electrically connected to each other, which can not only improve the current carrying capacity of the three-phase output copper pad 4 and enable the control circuit board 100 to cope with large current conditions, but also enable the multiple sub-three-phase output copper pads 401 to be routed independently of each other, which can prevent the multiple sub-three-phase output copper pads 401 from being disturbed under large current and high-frequency harmonic conditions, thereby improving the working reliability of the control circuit board 100.

[0059] In an embodiment of the present invention, a plurality of sub-three-phase output copper pads 401 are provided with a plurality of via holes, which can not only realize the electrical connection between the plurality of sub-three-phase output copper pads 401, but also increase the current carrying capacity of the plurality of sub-three-phase output copper pads 401 by setting the number of via holes, thereby improving the current carrying capacity of the control circuit board 100 in the present invention for carrying large currents.

[0060] Combination Figure 3-Figure 9 As shown, at least two substrates 1 among the multiple substrates 1 are provided with a support capacitor positive electrode copper plating 24 and a support capacitor negative electrode copper plating 25, the support capacitor positive electrode copper plating 24 and the support capacitor negative electrode copper plating 25 are respectively used to electrically connect with the positive and negative electrodes of the support capacitor 10, the support capacitor positive electrode copper plating 24 includes a plurality of mutually electrically connected sub-support capacitor positive electrode copper platings 241, and the support capacitor negative electrode copper plating 25 includes a plurality of mutually electrically connected sub-support capacitor negative electrode copper platings 251. Specifically, the support capacitor positive electrode copper plating 24 is provided on at least two substrates 1 in the control circuit board 100, which can increase the area of ​​the support capacitor positive electrode copper plating 24 and improve the current carrying capacity of the support capacitor positive electrode copper plating 24. In an embodiment of the utility model, the controller positive electrode in the control circuit board 100 is electrically connected to the support capacitor positive electrode copper plating 24, and the support capacitor positive electrode copper plating 24 is electrically connected to the positive electrode of the support capacitor 10, which can ensure the power supply capacity of the support capacitor 10.

[0061] Furthermore, at least two substrates 1 in the control circuit board 100 are provided with a supporting capacitor negative electrode copper plating 25, which can increase the area of ​​the supporting capacitor negative electrode copper plating 25 and improve the current carrying capacity of the supporting capacitor negative electrode copper plating 25. In an embodiment of the utility model, the negative electrode of the controller in the control circuit board 100 is electrically connected to the supporting capacitor negative electrode copper plating 25, and the supporting capacitor negative electrode copper plating 25 is electrically connected to the negative electrode of the supporting capacitor 10, which can ensure the power supply capacity of the supporting capacitor 10.

[0062] Furthermore, the supporting capacitor positive electrode copper plating 24 includes a plurality of mutually electrically connected sub-supporting capacitor positive electrode copper platings 241, and the plurality of sub-supporting capacitor positive electrode copper platings 241 are layered on the plurality of substrates 1 of the control circuit board 100, which can not only increase the area of ​​the supporting capacitor positive electrode copper plating 24, but also improve the integration of the plurality of sub-supporting capacitor positive electrode copper platings 241 in the control circuit board 100, which is conducive to reducing the size of the control circuit board 100. A plurality of supporting capacitor positive electrode copper platings 24 are provided with a plurality of vias, which can not only realize the electrical connection between the plurality of supporting capacitor positive electrode copper platings 24, but also increase the current carrying capacity of the plurality of supporting capacitor positive electrode copper platings 24 by setting the number of vias, thereby improving the current carrying capacity of the control circuit board 100 of the utility model for carrying large currents.

[0063] Furthermore, the supporting capacitor negative electrode copper plating 25 includes a plurality of mutually electrically connected sub-supporting capacitor negative electrode copper platings 251, and the plurality of supporting capacitor negative electrode copper platings 251 are layered on the plurality of substrates 1 of the control circuit board 100, so that not only the area of ​​the supporting capacitor negative electrode copper plating 25 can be increased, but also the integration of the plurality of sub-supporting capacitor negative electrode copper platings 251 in the control circuit board 100 can be improved, which is beneficial to reducing the size of the control circuit board 100. A plurality of supporting capacitor negative electrode copper platings 25 are provided with a plurality of vias, which can not only realize the electrical connection between the plurality of supporting capacitor negative electrode copper platings 25, but also increase the current carrying capacity of the plurality of supporting capacitor negative electrode copper platings 25 by setting the number of vias, thereby improving the current carrying capacity of the control circuit board 100 of the utility model for carrying large currents.

[0064] According to the embodiment of the utility model, combined with Figure 3-Figure 9 As shown, the support capacitor positive electrode copper plating 24 includes a support capacitor front end positive electrode copper plating 5 and a support capacitor rear end positive electrode copper plating 7, and the support capacitor negative electrode copper plating 25 includes a support capacitor front end negative electrode copper plating 6 and a support capacitor rear end negative electrode copper plating 8. In the embodiment of the utility model, the support capacitor front end positive electrode copper plating 5 and the support capacitor front end negative electrode copper plating 6 are electrically connected to the positive and negative electrodes of the power supply, respectively, and the support capacitor rear end positive electrode copper plating 7 and the support capacitor rear end negative electrode copper plating 8 are electrically connected to the positive and negative electrodes of the controller of the control circuit board 100, respectively.

[0065] Specifically, in an embodiment of the utility model, a connector is provided on the control circuit board 100, and positive and negative terminals are provided on the connector, which can be connected to the positive and negative poles of the power supply accordingly. When current flows into the control circuit board 100 through the connector, a supporting capacitor 10 can be connected between the controller of the control circuit board 100 and the connector, and the positive copper plating 5 at the front end of the supporting capacitor and the negative copper plating 6 at the front end of the supporting capacitor are electrically connected to the positive and negative poles of the terminals, so that the positive and negative poles of the power supply are connected to the positive copper plating 5 at the front end of the supporting capacitor and the negative copper plating 6 at the front end of the supporting capacitor accordingly, so that a loop can be formed between the power supply and the supporting capacitor 10.

[0066] Furthermore, the positive copper plating 7 at the rear end of the support capacitor and the negative copper plating 8 at the rear end of the support capacitor are electrically connected to the positive and negative electrodes of the controller on the control circuit board 100, so that a loop can be formed between the controller on the control circuit board 100 and the support capacitor 10. During the operation of the control circuit board 100, the current flows along the path of the positive electrode of the power supply-the positive electrode of the connector-the positive copper plating 5 at the front end of the support capacitor-the positive copper plating 7 at the rear end of the support capacitor-the positive electrode of the controller-the negative electrode of the controller-the negative electrode of the support capacitor-the negative copper plating 8 at the rear end of the support capacitor-the negative copper plating 6 at the front end of the support capacitor-the negative electrode of the connector-the negative electrode of the power supply. In this way, with the support capacitor 10 as a node, the positive and negative electrode wiring of the controller can be separated, and the positive and negative currents between the power supply and the controller can be routed independently, which can reduce interference under high current conditions and help enhance the robustness of the control circuit board 100 system.

[0067] Combination Figure 3 and Figure 6 As shown, at least one of the multiple substrates 1 is provided with a control signal copper plating 9. Specifically, the control signal copper plating 9 is provided in the substrate 1, which can be used to receive and transmit electrical signals to monitor the speed and direction of the brushless DC motor. In an embodiment of the utility model, the control signal copper plating 9 is provided in one of the multiple substrates, so that the control signal copper plating 9 can be concentratedly routed on the control circuit board 100. Such a setting can not only ensure the integrity of the transmission signal in the control circuit board 100, but also improve the integration of the control signal copper plating 9, which is beneficial to save the routing space of the control circuit board 100, and can save space for the power supply wiring 26 and the output wiring on the control circuit board 100, thereby improving the integration of the control circuit board 100.

[0068] Combination Figure 3As shown, there are five substrates 1, which are respectively a first substrate 101, a second substrate 102, a third substrate 103, a fourth substrate 104 and a fifth substrate 105 which are spaced apart in the vertical direction; a first power positive copper plating 201 and a first power negative copper plating 301 which are spaced apart are arranged on the side of the first substrate 101 away from the second substrate 102; a second power positive copper plating 202 is arranged on the side of the first substrate 101 facing the second substrate 102; a third power positive copper plating 203 is arranged on the side of the third substrate 103 facing the fourth substrate 104; a second power negative copper plating 302 is arranged on the side of the fourth substrate 104 facing the fifth substrate 105; and a third power negative copper plating 303 is arranged on the side of the fifth substrate 105 away from the fourth substrate 104.

[0069] Specifically, in the embodiment of the utility model, five substrates 1 are provided, and the control circuit board 100 can be divided into a six-layer structure, wherein the side of the first substrate 101 away from the second substrate 102 is the top of the control circuit board 100, which is the first layer 106, the second layer 107 is between the first substrate 101 and the second substrate 102, the third layer 108 is between the second substrate 102 and the third substrate 103, the fourth layer 109 is between the third substrate 103 and the fourth substrate 104, the fifth layer 110 is between the fourth substrate 104 and the fifth substrate 105, and the side of the fifth substrate 105 away from the fourth substrate 104 is the bottom of the control circuit board 100, which is the sixth layer 111.

[0070] Furthermore, a first power supply positive copper plating 201 and a first power supply negative copper plating 301 are provided on the first layer 106, and the first power supply positive copper plating 201 and the first power supply negative copper plating 301 are arranged at intervals, so that the first power supply positive copper plating 201 and the first power supply negative copper plating 301 can be independently routed on the first substrate 101, and crosstalk between the first power supply positive copper plating 201 and the first power supply negative copper plating 301 can be prevented, and stable input and output between the first power supply positive copper plating 201 and the first power supply negative copper plating 301 and the power supply can be ensured, and stable power supply to the control circuit board 100 can be ensured. In an embodiment of the utility model, a protection circuit 23 is also provided in the first layer 106 for protecting the circuit safety of the control circuit board 100.

[0071] Furthermore, a second power supply positive copper plating 202 is arranged on the second layer 107, and a second power supply negative copper plating 302 is arranged on the fifth layer 110. The second power supply positive copper plating 202 and the second power supply negative copper plating 302 are arranged in layers on the control circuit board 100, which can prevent crosstalk between the second power supply positive copper plating 202 and the second power supply negative copper plating 302, and can ensure stable input and output between the second power supply positive copper plating 202 and the second power supply negative copper plating 302 and the power supply, so as to ensure stable power supply to the control circuit board 100.

[0072] Further, a third power supply positive electrode copper plating 203 is arranged on the fourth layer 109, and a third power supply negative electrode copper plating 303 is arranged on the sixth layer 111. The third power supply positive electrode copper plating 203 and the third power supply negative electrode copper plating 303 are arranged in layers on the control circuit board 100, which can prevent the third power supply positive electrode copper plating 203 and the third power supply negative electrode copper plating 303 from crosstalk, and can ensure that the third power supply positive electrode copper plating 203 and the third power supply negative electrode copper plating 303 have stable input and output with the power supply, and can ensure that the power supply supplies stable power to the control circuit board 100. Further, the sixth layer 111 is also provided with a control chip 21 and a controller in the control circuit board 100.

[0073] Combination Figure 3 , Figure 4 , Figure 5 , Figure 7 , Figure 8 and Fig. 9 As shown, the positive copper plating 7 at the rear end of the supporting capacitor is arranged on the first layer 106, the second layer 107 and the fourth layer 109, and the negative copper plating 8 at the rear end of the supporting capacitor is arranged on the first layer 106, the fifth layer 110 and the sixth layer 111. The positive copper plating 7 at the rear end of the supporting capacitor and the negative copper plating 8 at the rear end of the supporting capacitor both adopt a large-area design, which can ensure the reflux capacity of the supporting capacitor 10.

[0074] Combination Figure 3 As shown, each group of three-phase output copper pads 4 includes four sub-three-phase output copper pads 401, and one sub-three-phase output copper pad 401 is respectively arranged on the upper and lower sides of the first substrate 101, and one sub-three-phase output copper pad 401 is respectively arranged on the upper and lower sides of the third substrate 103, and the four sub-three-phase output copper pads 401 are electrically connected. Specifically, in the control circuit board 100 of the embodiment of the utility model, each group of three-phase output copper pads 4 is provided with four sub-three-phase output copper pads 401, and are respectively arranged on the upper and lower sides of the first substrate 101 and the upper and lower sides of the third substrate 103, that is, the four sub-three-phase output copper pads 401 are respectively arranged on the first layer 106, the second layer 107, the third layer 108 and the fourth layer 109 of the control circuit board 100. Among them, the three-phase output copper pad 4 on the surface of the first layer 106 is covered with a group welding layer, and is covered with solder after opening a window, so that the overcurrent capacity of the three-phase output copper pad 4 can be increased.

[0075] Furthermore, the first power supply positive electrode copper plating 201 and the first power supply negative electrode copper plating 301 can make way for the sub-three-phase output copper plating 401 on the first layer 106 , and the second power supply positive electrode copper plating 202 can make way for the sub-three-phase output copper plating 401 on the second layer 107 . A control signal copper plating 9 is provided on the side of the second substrate 102 facing the third substrate 103, that is, the control signal copper plating 9 is provided on the third layer 108. Since the control signal copper plating 9 is centrally provided, the control signal copper plating 9 can make way for the sub-three-phase output copper plating 401 on the third layer 108, and the second power supply negative electrode copper plating 302 can make way for the sub-three-phase output copper plating 401 on the fourth layer 109. Such a configuration can not only enable the three-phase output copper plating 4 to be arranged in multiple layers in the control circuit board 100, which is beneficial to improving the current passing capacity of the three-phase output copper plating 4, but also can make the arrangement of the three-phase output copper plating 4 in the control circuit board 100 more compact, which is beneficial to saving power supply and wiring space, thereby improving the structural integration of the control circuit board 100.

[0076] Combination Figure 3 As shown, the first sub-support capacitor positive electrode copper plating 2411 and the first sub-support capacitor negative electrode copper plating 2511 are respectively provided on both sides of the second substrate 102, and the second sub-support capacitor positive electrode copper plating 2412 and the second sub-support capacitor negative electrode copper plating 2512 are respectively provided on both sides of the fifth substrate 105, the first sub-support capacitor positive electrode copper plating 2411 and the second sub-support capacitor positive electrode copper plating 2412 are electrically connected, and the first sub-support capacitor negative electrode copper plating 2511 and the second sub-support capacitor negative electrode copper plating 2512 are electrically connected. Specifically, in the embodiment of the utility model, the first sub-support capacitor positive electrode copper plating 2411 and the second sub-support capacitor positive electrode copper plating 2412 are both the support capacitor front end positive electrode copper plating 5, and the first sub-support capacitor negative electrode copper plating 2511 and the second sub-support capacitor negative electrode copper plating 2512 are both the support capacitor front end negative electrode copper plating 6.

[0077] Furthermore, the first sub-support capacitor positive electrode copper plating 2411 and the first sub-support capacitor negative electrode copper plating 2511 are separately arranged by the second substrate 102, which can prevent the first sub-support capacitor positive electrode copper plating 2411 and the first sub-support capacitor negative electrode copper plating 2511 from crosstalk, and ensure that the first sub-support capacitor positive electrode copper plating 2411 and the first sub-support capacitor negative electrode copper plating 2511 are independently routed. The second sub-support capacitor positive electrode copper plating 2412 and the second sub-support capacitor negative electrode copper plating 2512 are separately arranged by the fifth substrate 105, which can prevent the second sub-support capacitor positive electrode copper plating 2412 and the second sub-support capacitor negative electrode copper plating 2512 from crosstalk, and ensure that the second sub-support capacitor positive electrode copper plating 2412 and the second sub-support capacitor negative electrode copper plating 2512 are independently routed.

[0078] Further, the first sub-support capacitor positive electrode copper plating 2411 and the second sub-support capacitor positive electrode copper plating 2412 are electrically connected, which can increase the area of ​​the support capacitor positive electrode copper plating 24, and the first sub-support capacitor positive electrode copper plating 2411 and the second sub-support capacitor positive electrode copper plating 2412 are both provided with a plurality of vias, thereby improving the overcurrent capacity of the support capacitor positive electrode copper plating 24, and improving the reliability of the power supply of the support capacitor 10. The first sub-support capacitor negative electrode copper plating 2511 and the second sub-support capacitor negative electrode copper plating 2512 are electrically connected, which can increase the area of ​​the support capacitor negative electrode copper plating 25, and the first sub-support capacitor negative electrode copper plating 2511 and the second sub-support capacitor negative electrode copper plating 2512 are both provided with a plurality of vias, thereby improving the overcurrent capacity of the support capacitor negative electrode copper plating 25, and improving the reflux reliability of the support capacitor 10.

[0079] Combination Figure 1 , Figure 4 and Fig.10 As shown, a support capacitor 10 is provided on one side of the first substrate 101 away from the second substrate 102, and a control ground copper 11 and a drive ground copper 12 are provided on one side of the first substrate 101 adjacent to the support capacitor 10, and the control ground copper 11 and the drive ground copper 12 are arranged at intervals and electrically connected through a short line 13. Specifically, the support capacitor 10 is arranged in the first layer 106 structure, and the first layer 106 structure also includes a control ground copper 11 and a drive ground copper 12 arranged at intervals, wherein the control ground copper 11 is connected to the control chip 21 on the control circuit board 100, and the drive ground copper 12 is connected to the controller on the control circuit board 100. Because the three-phase output copper 4 connected to the controller needs to output a large current, the potential fluctuation on the drive ground copper 12 is large. Compared with the drive ground copper 12, the potential fluctuation on the control ground copper 11 is small and more stable. In the utility model, a short wire 13 is arranged between the control ground copper porosity 11 and the driving ground copper porosity 12 to electrically connect the control ground copper porosity 11 and the driving ground copper porosity 12. When the potential on the driving ground copper porosity 12 increases or decreases, the potential on the driving ground copper porosity 12 can be adjusted by the potential on the control ground copper porosity 11, so that the potential on the driving ground copper porosity 12 and the potential on the control ground copper porosity 11 can be balanced, thereby preventing the circuit in the control circuit board 100 from being abnormal.

[0080] Furthermore, the control ground copper plating 11 is arranged on a side adjacent to the supporting capacitor 10, and the control ground copper plating 11 connects the negative electrode of the control chip 21 to the negative electrode of the supporting capacitor 10 through the short line 13 structure, and then connects to the negative electrode of the supporting capacitor 10 through the negative electrode of the supporting capacitor 10 to the negative electrode at the rear end of the supporting capacitor 10. In this way, the control ground copper plating 11 and the driving ground copper plating 12 can be routed separately, which is beneficial to ensure the power supply quality of the control chip 21 and the controller.

[0081] In an embodiment of the utility model, the connection sequence of the control ground copper 11 connected to the control chip 21 is to first connect the capacitors and resistors around the control chip 21 to connect the control ground copper 11, then connect the ground copper defined by the pin 22 of the control chip 21, and finally connect the control ground copper 11 defined under the control chip 21. The connection method uses a via to connect the control ground copper 11. Such a setting can ensure the efficiency of the filtering reflux of the control chip 21.

[0082] Combination Fig.12 and Fig.13 As shown, a sampling resistor copper plating 14 and a sampling resistor ground copper plating 15 are provided on at least one of the multiple substrates 1. The sampling resistor ground copper plating 15 is arranged around the outer periphery of the sampling resistor copper plating 14 and is spaced apart from the sampling resistor copper plating 14. The sampling resistor copper plating 14 is provided with extension portions 141 on both sides of the first direction, and the sampling resistor copper plating 14 is provided with extension portions 141 on both sides of the second direction. The extension portions 141 are electrically connected to the sampling resistor ground copper plating 15, wherein the first direction and the second direction are perpendicular to each other.

[0083] Specifically, in the control circuit board 100 in the embodiment of the utility model, the sampling resistor ground wire copper is surrounded and spaced around the outer periphery of the sampling resistor copper 14, and extensions 141 are provided on both sides of the first direction and the second direction of the sampling resistor copper 14, so as to facilitate the electrical connection between the sampling resistor copper 14 and the sampling resistor ground wire copper 15, which can not only ensure the overcurrent capacity between the sampling resistor copper 14 and the sampling resistor ground wire copper 15, but also increase the connection position of the sampling resistor copper 14 and the sampling resistor ground wire copper 15. The sampling resistor copper 14 and the sampling resistor ground wire copper 15 are electrically connected by welding through the extension 141, and the first direction and the second direction are perpendicular to each other. Such an arrangement can ensure the welding reliability between the sampling resistor copper 14 and the sampling resistor ground wire copper 15, thereby facilitating the improvement of the structural reliability of the control circuit board 100 and the working reliability of the control circuit board 100.

[0084] Combination Fig.12 and Fig.13 As shown, at least one of the multiple substrates 1 is provided with a sampling resistor signal collection copper plating 16, which is arranged outside the sampling resistor copper plating 14 and is connected to the sampling resistor copper plating 14, and the sampling resistor signal collection copper plating 16 is arranged at intervals from the sampling resistor ground copper plating 15. Specifically, the sampling resistor signal collection copper plating 16 can collect the current signal to be measured and transmit it to the sampling resistor, and form a voltage, so that the control circuit board 100 can adjust and control the output voltage and frequency.

[0085] In an embodiment of the utility model, the sampling resistor signal acquisition copper plating 16 is arranged on the outside of the sampling resistor copper plating 14, so that the sampling resistor signal acquisition copper plating 16 and the sampling resistor copper plating 14 can be arranged to be routed separately and independently, which can prevent the sampling resistor signal acquisition copper plating 16 and the sampling resistor network from being doped, thereby reducing the interference on the signal on the sampling resistor signal acquisition copper plating 16, which is beneficial to improving the accuracy of the sampling resistor signal acquisition copper plating 16 in collecting the power supply signal in the control circuit board 100, thereby facilitating improving the control accuracy of the control circuit board 100 on the output voltage and frequency.

[0086] Combination Figure 4-Figure 9 As shown, at least one of the multiple substrates 1 is provided with a MOSFET 17, and the MOSFET 17 is adjacent to the three-phase output copper 4 and electrically connected to the three-phase output copper 4. Specifically, in the utility model, the controller on the control circuit board 100 includes a MOSFET 17. The three-phase output copper 4 connects the MOSFET 17 and the output end of the three-phase current, adjusts the frequency and voltage of the power supply through the MOSFET 17, and then outputs a large current to the brushless DC motor through the three-phase output copper 4 to drive the brushless DC motor to work. By arranging the MOSFET 17 adjacent to the three-phase output copper 4, the distance between the MOSFET 17 and the output end of the three-phase output copper 4 can be shortened, and the three-phase output copper 4 can be shortened, which can not only reduce the high-frequency interference of the three-phase output copper 4, but also help to reduce the copper cost. In an embodiment of the utility model, the three-phase output copper pad 4 can be widened to increase the load capacity of the three-phase output copper pad 4 for large currents, enhance the thermal load capacity of the three-phase output copper pad 4, and improve the current carrying capacity of the control circuit board 100 for carrying low-voltage and large currents of the brushless DC motor while controlling costs.

[0087] In the embodiment of the present utility model, combined with Figure 4-Figure 9 As shown, a plurality of pins 22 are provided at a position connected to the connector on the control circuit board 100, and the plurality of pins 22 include a positive pin 221, a negative pin 222 and a three-phase output pin 223, wherein the three-phase output corner is provided at the periphery of the connector connection position, and a plurality of the three-phase output pins 223 are provided, and the positive pin 221 and the negative pin 222 are provided at the inner side of the connector connection position, and a plurality of the three-phase output pins 223 are provided.

[0088] Furthermore, the copper pad on the control circuit board 100 is connected to the pin 22, so that the current can flow along the copper pad to the pin 22, and then connected to the positive and negative poles of the power supply or the input end of the brushless DC motor through the connector. The three-phase output copper pad 4 is connected to the three-phase output pin 223, which can further shorten the three-phase output copper pad 4, which is beneficial to further improve the anti-interference ability of the control circuit board 100 when outputting three-phase current. The power supply line 26 from the power supply to the control circuit board 100 is connected to the inner positive pin 221 and the negative pin 222 of the connector, which can avoid crosstalk between the power supply line 26 and the three-phase output copper pad 4. The connection between the connector and the control circuit board 100 includes but is not limited to welding.

[0089] Combination Figure 5 and Fig.11 As shown, at least one of the multiple substrates 1 is provided with a control chip power supply copper 18 and a metal oxide semi-field effect transistor power supply copper 19, and the control chip power supply copper 18 and the metal oxide semi-field effect transistor power supply copper 19 are arranged at intervals. Specifically, in the embodiment of the utility model, the control circuit board 100 also includes a filter device 20, and the filter device 20 can filter the positive electrode at the front end of the support capacitor 10, and the positive electrode after filtering is connected to the positive electrode at the front end of the support capacitor 10, so that part of the current flows directly to the control chip 21 to power the control chip 21, and the other part of the current flows to the metal oxide semi-field effect transistor 17 through the copper at the rear end of the support capacitor 10 to power the metal oxide semi-field effect transistor 17. In the embodiment of the utility model, the control chip power supply copper 18 is used to supply power to the control chip 21 to ensure the normal operation of the control chip 21, and the metal oxide semi-field effect transistor power supply copper 19 is used to supply power to the metal oxide semi-field effect transistor 17 to ensure the normal operation of the metal oxide semi-field effect transistor 17.

[0090] Furthermore, the control chip power supply copper 18 and the MOSFET power supply copper 19 are arranged at intervals, so that the control chip power supply copper 18 and the MOSFET power supply copper 19 can be routed separately to independently power the control chip 21 and the MOSFET 17. In this way, the load on the power supply circuit of the control chip 21 can be effectively decoupled from the load on the power supply circuit of the MOSFET 17, and the power supply of the control chip 21 can be prevented from fluctuating when the load on the power supply circuit of the MOSFET 17 changes, thereby reducing the problem of interference of the MOSFET 17 in the case of high current and high frequency harmonics, so as to improve the working reliability of the MOSFET 17.

[0091] In the description of the present invention, it needs to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "circumferential", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0092] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example.

[0093] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A control circuit board, characterized in that: include: A plurality of substrates (1), wherein the plurality of substrates (1) are arranged at intervals, wherein at least two of the plurality of substrates (1) are provided with a power supply positive electrode copper plating (2) and a power supply negative electrode copper plating (3), wherein the power supply positive electrode copper plating (2) and the power supply negative electrode copper plating (3) are respectively used for correspondingly connecting to the positive and negative electrodes of a power supply, and at least two of the plurality of substrates (1) are provided with a plurality of groups of three-phase output copper plating (4), wherein each group of the three-phase output copper plating (4) is electrically connected to the power supply positive electrode copper plating (2) and the power supply negative electrode copper plating (3), and the plurality of groups of the three-phase output copper plating (4) are electrically connected to a plurality of motors in a one-to-one correspondence.

2. The control circuit board according to claim 1, characterized in that: The power supply positive electrode copper plating (2) is composed of a plurality of groups, the power supply negative electrode copper plating (3) is composed of a plurality of groups, and each group of the three-phase output copper plating (4) is electrically connected to the plurality of groups of the power supply positive electrode copper plating (2) and the plurality of groups of the power supply negative electrode copper plating (3).

3. The control circuit board according to claim 2, characterized in that: The power supply positive electrode copper plating (2) is composed of three groups, the power supply negative electrode copper plating (3) is composed of three groups, and the three-phase output copper plating (4) is composed of three groups.

4. The control circuit board according to claim 3, characterized in that: Each group of the three-phase output copper pads (4) comprises a plurality of sub-three-phase output copper pads (401), and the plurality of sub-three-phase output copper pads (401) are arranged at intervals on a plurality of substrates (1) and are electrically connected to each other.

5. The control circuit board according to claim 4, characterized in that: At least two of the plurality of substrates (1) are provided with a support capacitor positive electrode copper plating (24) and a support capacitor negative electrode copper plating (25), the support capacitor positive electrode copper plating (24) and the support capacitor negative electrode copper plating (25) being respectively used to electrically connect to the positive and negative electrodes of the support capacitor (10), the support capacitor positive electrode copper plating (24) comprising a plurality of mutually electrically connected sub-support capacitor positive electrode copper platings (241), and the support capacitor negative electrode copper plating (25) comprising a plurality of mutually electrically connected sub-support capacitor negative electrode copper platings (251).

6. The control circuit board according to claim 5, characterized in that: At least one of the plurality of substrates (1) is provided with a control signal copper plating (9).

7. The control circuit board according to claim 6, characterized in that: There are five substrates (1), and the five substrates (1) are respectively a first substrate (101), a second substrate (102), a third substrate (103), a fourth substrate (104), and a fifth substrate (105) which are arranged at intervals in the vertical direction; a first power positive electrode copper plating (201) and a first power negative electrode copper plating (301) which are arranged at intervals are arranged on a side of the first substrate (101) away from the second substrate (102); a second power positive electrode copper plating (202) is arranged on a side of the first substrate (101) facing the second substrate (102); a third power positive electrode copper plating (203) is arranged on a side of the third substrate (103) facing the fourth substrate (104); a second power negative electrode copper plating (302) is arranged on a side of the fourth substrate (104) facing the fifth substrate (105); and a third power negative electrode copper plating (303) is arranged on a side of the fifth substrate (105) away from the fourth substrate (104).

8. The control circuit board according to claim 7, characterized in that: Each group of the three-phase output copper pads (4) comprises four sub-three-phase output copper pads (401), one sub-three-phase output copper pad (401) is respectively arranged on the upper and lower sides of the first substrate (101), one sub-three-phase output copper pad (401) is respectively arranged on the upper and lower sides of the third substrate (103), and the four sub-three-phase output copper pads (401) are electrically connected.

9. The control circuit board according to claim 8, characterized in that: The first sub-support capacitor positive electrode copper plating (2411) and the first sub-support capacitor negative electrode copper plating (2511) are respectively arranged on both sides of the second substrate (102), and the second sub-support capacitor positive electrode copper plating (2412) and the second sub-support capacitor negative electrode copper plating (2512) are respectively arranged on both sides of the fifth substrate (105), the first sub-support capacitor positive electrode copper plating (2411) and the second sub-support capacitor positive electrode copper plating (2412) are electrically connected, and the first sub-support capacitor negative electrode copper plating (2511) and the second sub-support capacitor negative electrode copper plating (2512) are electrically connected.

10. The control circuit board according to claim 7, characterized in that: A support capacitor (10) is provided on a side of the first substrate (101) away from the second substrate (102), and a control ground copper (11) and a drive ground copper (12) are provided on a side of the first substrate (101) adjacent to the support capacitor (10). The control ground copper (11) and the drive ground copper (12) are spaced apart and electrically connected via a short line (13).

11. The control circuit board according to claim 1, characterized in that: A sampling resistor copper plating (14) and a sampling resistor ground copper plating (15) are provided on at least one of the plurality of substrates (1); the sampling resistor ground copper plating (15) is arranged around the periphery of the sampling resistor copper plating (14) and is arranged at a distance from the sampling resistor copper plating (14); extension portions (141) are respectively provided on both sides of a first direction of the sampling resistor copper plating (14); extension portions (141) are respectively provided on both sides of a second direction of the sampling resistor copper plating (14); the extension portions (141) are electrically connected to the sampling resistor ground copper plating (15); wherein the first direction and the second direction are perpendicular to each other.

12. The control circuit board according to claim 11, characterized in that: A sampling resistor signal acquisition copper plating (16) is provided on at least one of the plurality of substrates (1); the sampling resistor signal acquisition copper plating (16) is provided outside the sampling resistor copper plating (14) and is connected to the sampling resistor copper plating (14); the sampling resistor signal acquisition copper plating (16) is spaced apart from the sampling resistor ground copper plating (15).

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