Packaging device and quantum computer

Abstract

The utility model discloses a packaging device and a quantum computer, and the packaging device comprises a packaging box which is used for placing a to-be-packaged quantum chip, and also comprises a first flexible strip line and a first multi-channel signal connector. The first flexible strip line is arranged on the packaging box bottom plate; a plurality of first transmission lines are integrated in the first flexible strip line, and the first ends of the first transmission lines are electrically connected to the control lines on the quantum chip in a one-to-one correspondence manner; the second end of each first transmission line is electrically connected to each signal channel of the first multi-channel signal connector in a one-to-one correspondence manner; the packaging box is provided with a through hole for the first multi-channel signal connector to pass through. According to the packaging device, the first flexible strip line integrated with the plurality of first transmission lines and the first multi-channel signal connector are adopted, one first multi-channel signal connector can realize electric connection between the quantum chip and the plurality of quantum measurement and control lines, and the use number of signal joints is reduced so as to improve the integration level of the packaging device.

Description

Technical Field

[0001] The utility model relates to the technical field of quantum computers, in particular to a packaging device and a quantum computer. Background Art

[0002] The state of quantum bits in quantum chips is very fragile. If not effectively protected, they are easily disturbed by the environment and cause decoherence. In order to ensure the high performance and stable operation of quantum chips, it is necessary to design reliable packaging boxes to provide special protection for quantum chips to prevent quantum chips from being affected by external environmental noise.

[0003] The existing packaging box usually uses a single-channel signal connector, one end of which is electrically connected to the control line of each quantum bit on the quantum chip, and the other end of the signal connector is electrically connected to the quantum measurement and control circuit that controls the quantum bit. As the number of quantum bits continues to increase, the number of signal connectors integrated on the packaging box also increases, which results in a large proportion of the total volume of the signal interface, which is not conducive to integration.

[0004] It should be noted that the information disclosed in the background technology section of this application is only intended to deepen the understanding of the general background technology of this application, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Utility Model Content

[0005] The purpose of the utility model is to provide a packaging device and a quantum computer with high integration.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] The utility model provides a packaging device according to a first aspect, comprising a packaging box for placing a quantum chip to be packaged, and also comprising a first flexible strip line and a first multi-channel signal connector; the first flexible strip line is arranged on a bottom plate of the packaging box; a plurality of first transmission lines are integrated in the first flexible strip line, and a first end of each first transmission line is electrically connected to a control line on the quantum chip in a one-to-one correspondence; a second end of each first transmission line is electrically connected to each signal channel of the first multi-channel signal connector in a one-to-one correspondence; and a through hole is arranged on the packaging box for the first multi-channel signal connector to pass through.

[0008] As for the packaging device as described above, further, the through holes are arranged in a one-to-one correspondence with the first multi-channel signal connectors and the through holes are arranged on the bottom plate and / or the top plate of the packaging box.

[0009] As described above, in the packaging device, further, the through holes are arranged in one-to-one correspondence with the first multi-channel signal connectors and the through holes are arranged on the side plate of the packaging box.

[0010] In the packaging device as described above, further, the quantum chip is arranged in the central position area of ​​the bottom plate, a plurality of the first flexible strip lines are provided, and the plurality of the first flexible strip lines are laid flat on the bottom plate and arranged around the quantum chip.

[0011] As described above, the packaging device, further, the quantum chip is arranged in the central position area of ​​the bottom plate, the first flexible strip lines have a plurality of groups, and the plurality of groups of first flexible strip lines are stacked and arranged along the height direction of the packaging box; each group of first flexible strip lines includes a plurality of first flexible strip lines laid flat on the bottom plate and arranged around the quantum chip.

[0012] As described above, in the packaging device, further, the first flexible strip line is fixed to the bottom plate by a heat-conducting adhesive.

[0013] As described above, in the packaging device, further, the first transmission line in the first flexible strip line is connected to the control line in the quantum chip via a bonding wire.

[0014] The second aspect of the utility model provides a quantum computer, comprising: the above-mentioned packaging device; a quantum chip, which is packaged in the packaging device; a quantum measurement and control system, including a quantum measurement and control circuit and a quantum measurement and control device, the quantum measurement and control circuit comprising a second flexible strip line and a second multi-channel signal connector, a plurality of second transmission lines are integrated in the second flexible strip line, a first end of each second transmission line is electrically connected to the quantum measurement and control device, and a second end of each second transmission line is electrically connected to each signal channel of the second multi-channel signal connector in a one-to-one correspondence; the first multi-channel signal connector is plugged and matched with the second multi-channel signal connector.

[0015] In the quantum computer as described above, further, the quantum chip includes multiple layers of wafers, and the quantum state control lines and quantum frequency control lines in the quantum chip are respectively located on different layers of wafers.

[0016] In the quantum computer as described above, further, a thermally conductive adhesive layer is provided on the contact surface between the quantum chip and the packaging box.

[0017] The beneficial effects of the utility model are:

[0018] The packaging device in the present application adopts a first flexible strip line integrated with several first transmission lines and a first multi-channel signal connector. One first multi-channel signal connector can realize the electrical connection between the quantum chip and multiple quantum measurement and control circuits, thereby reducing the number of signal connectors used to improve the integration of the packaging device.

[0019] The quantum computer provided by the utility model includes the above-mentioned packaging device, and therefore has the same beneficial effects, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A first structural schematic diagram of a packaging device provided by an embodiment of the utility model, Figure 1 Only the bottom plate of the packaging box is shown;

[0021] Figure 2 A second structural schematic diagram of the packaging device provided by an embodiment of the utility model, Figure 2 Only the bottom plate of the packaging box is shown;

[0022] Figure 3 A schematic diagram of a first structure of a packaging device provided by an embodiment of the utility model connected to a second flexible strip line, Figure 3 The middle package box only illustrates a second flexible strip line;

[0023] Figure 4 A second structural schematic diagram of the connection between the packaging device provided by the embodiment of the utility model and the second flexible strip line, Figure 4 The middle package box only illustrates a second flexible strip line;

[0024] 10. packaging box; 11. bottom plate; 20. first flexible strip line; 30. first multi-channel signal connector; 40. quantum chip; 50. second flexible strip line; 60. second multi-channel signal connector; 70. gasket. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this application. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application, and cannot be interpreted as limitations on the present application.

[0026] In the description of the present invention, it should be understood that the terms "center", "up", "down", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0028] Figure 1 A first structural schematic diagram of a packaging device provided by an embodiment of the utility model, Figure 1 Only the bottom plate 11 of the packaging box is shown schematically. Figure 1 As shown: The embodiment of the present application discloses a packaging device, including a packaging box for placing a quantum chip 40 to be packaged, and also including a first flexible strip line 20 and a first multi-channel signal connector 30; the first flexible strip line 20 is arranged on the bottom plate 11 of the packaging box; a plurality of first transmission lines are integrated in the first flexible strip line 20, and the first end of each first transmission line is electrically connected to the control line on the quantum chip 40 in a one-to-one correspondence; the second end of each first transmission line is electrically connected to each signal channel of the first multi-channel signal connector 30 in a one-to-one correspondence; the packaging box 10 is provided with a through hole for the first multi-channel signal connector 30 to pass through.

[0029] The packaging device in the present application adopts a first flexible strip line 20 and a first multi-channel signal connector 30 that integrate a plurality of first transmission lines. One first multi-channel signal connector 30 can realize the electrical connection between the quantum chip 40 and a plurality of quantum measurement and control circuits, thereby improving the integration of the packaging device by reducing the number of signal connectors used.

[0030] In this embodiment, the structure of the packaging box 10 is not specifically limited. Exemplarily, the packaging box 10 may include a base and a cover plate connected by bolts, and the base and the cover plate are connected and matched to form a sealed cavity for accommodating the quantum chip 40.

[0031] In this embodiment, the first flexible stripline 20 is generally a layered structure, and illustratively, it at least includes a central conductor layer and a first dielectric layer and a second dielectric layer respectively arranged on the upper and lower surfaces of the central conductor layer (illustratively, the first dielectric layer and the second dielectric layer can be polyimide layers or polytetrafluoroethylene layers), the central conductor layer integrates a plurality of central conductors, and the material of the central conductor can be gold, silver, copper or NbT i; further, the first flexible stripline 20 also includes a first metal layer (forming a first ground plane) arranged on the first dielectric layer and a second metal layer (forming a second ground plane) arranged below the second dielectric layer; further, the first flexible stripline 20 also includes a first insulating layer arranged on the first metal layer and a second insulating layer arranged below the second metal layer.

[0032] In this embodiment, there is no specific restriction on the arrangement position and number of the through holes on the packaging box 10. According to the different types of the first multi-channel signal connector 30, the positions of the signal interfaces are different, and the positions of the through holes are also different, so as to ensure that the signal interfaces are exposed. Preferably, in some implementations of this embodiment, the through holes are arranged one-to-one with the first multi-channel signal connector 30 and the through holes are arranged on the bottom plate 11 and / or the top plate of the packaging box 10; this arrangement is suitable for the case where the signal channel of the first multi-channel signal connector 30 is arranged perpendicular to the first flexible strip line 20. Since the length and width dimensions of the quantum chip 40 are greater than the thickness dimension, the dimensions of the bottom plate 11 and the top plate are usually greater than the side plate. By arranging the through holes on the bottom plate 11 and / or the top plate of the packaging box 10, it is possible to ensure that more first multi-channel signal connectors 30 are integrated without changing the size of the packaging box 10, thereby improving the integration of the packaging device.

[0033] In some other implementations of this embodiment, the through holes are arranged in one-to-one correspondence with the first multi-channel signal connector 30 and the through holes are arranged on the side panel of the packaging box 10; this arrangement is suitable for the case where the signal channel of the first multi-channel signal connector 30 is arranged parallel to the first flexible strip line 20.

[0034] In this embodiment, the arrangement of the first flexible strip line 20 on the bottom plate 11 is not specifically limited. For example, it can be arranged on a certain side of the quantum chip 40 and arranged along the length, width or height direction of the quantum chip 40, or it can be arranged on several sides of the quantum chip 40. Preferably, in some implementations of this embodiment, continue as follows Figure 1 As shown: the quantum chip 40 is arranged in the central position area of ​​the base plate 11, and the first flexible strip lines 20 are provided with a plurality of strip lines, and the plurality of first flexible strip lines 20 are laid flat on the base plate 11 and arranged around the quantum chip 40; this arrangement further improves the integration of the packaging device; exemplarily, Figure 1 In the embodiment, the quantum chip 40 is arranged in the central area of ​​the base plate 11 , and eight first flexible strip lines 20 are provided. The eight first flexible strip lines 20 are laid flat on the base plate 11 and arranged around the quantum chip 40 .

[0035] Figure 2 A second structural schematic diagram of the packaging device provided by an embodiment of the utility model, Figure 2 Only the bottom plate 11 of the packaging box 10 is shown; preferably, in some other implementations of this embodiment, such as Figure 2As shown: the quantum chip 40 is arranged in the central area of ​​the bottom plate 11, and there are several groups of the first flexible strip lines 20, which are stacked along the height direction of the packaging box 10; each group of the first flexible strip lines 20 includes several first flexible strip lines 20 laid flat on the bottom plate 11 and arranged around the quantum chip 40. This arrangement further improves the integration of the packaging device. For example, Figure 2 There are two groups of first flexible strip lines 20, which are stacked along the height direction of the packaging box 10. Each group of first flexible strip lines 20 includes four first flexible strip lines 20. The four first flexible strip lines 20 in each group are laid flat on the bottom plate 11 and arranged around the quantum chip 40. Each of the two stacked first flexible strip lines 20 is arranged with a first high-density signal connector. Of course, the two stacked first flexible strip lines 20 can also be integrated and electrically connected to a high-density signal connector with higher integration, which can further improve the integration.

[0036] When two stacked first flexible strip lines 20 are each provided with a first high-density signal connector, if the thickness of the first high-density signal connector is greater than the thickness of the first flexible strip line 20, at this time, in order to facilitate the arrangement of the first high-density signal connector, a gasket 70 can be arranged between the two stacked first flexible strip lines 20. Preferably, the gasket 70 is made of thermally conductive adhesive, which not only fixes the two stacked first flexible strip lines 20 together at intervals, but also facilitates the arrangement of the first high-density signal connector and facilitates heat conduction to transfer heat to the packaging box 10.

[0037] In this embodiment, the fixing method of the first flexible strip line 20 and the bottom plate 11 is not specifically limited. The first flexible strip line 20 can be bonded to the bottom plate 11 by bonding; the first flexible strip line 20 can also be fixed to the bottom plate 11 by clamping the flexible strip line with a clamp; the first flexible strip line 20 can also be fixed to the bottom plate 11 by screws, nails or other mechanical fasteners; the first flexible strip line 20 can also be fixed to the bottom plate 11 by crimping: a pressure plate is pressed on the first flexible strip line 20, and then the pressure plate is fixed to the bottom plate 11. In some implementation methods of this embodiment, the first flexible strip line 20 is fixed to the bottom plate 11 by a thermally conductive adhesive, which facilitates the fixation between the first flexible strip line 20 and the bottom plate 11, and at the same time, the heat of the first flexible strip line 20 can be timely conducted to the bottom plate 11 of the packaging box 10.

[0038] In some implementations of this embodiment, the first transmission line in the first flexible strip line 20 is connected to the control line in the quantum chip 40 via a bonding wire.

[0039] Based on the same application concept, an embodiment of the present application also proposes a quantum computer, including: the above-mentioned packaging device; a quantum chip 40, which is packaged in the packaging device; a quantum measurement and control system, including a quantum measurement and control circuit and a quantum measurement and control device, the quantum measurement and control circuit includes a second flexible strip line 50 and a second multi-channel signal connector 60, a plurality of second transmission lines are integrated in the second flexible strip line 50, a first end of each second transmission line is electrically connected to the quantum measurement and control device, and a second end of each second transmission line is electrically connected one-to-one to each signal channel of the second multi-channel signal connector 60; the first multi-channel signal connector 30 is plugged into and matched with the second multi-channel signal connector 60.

[0040] In this embodiment, the quantum computer includes the above-mentioned packaging device, and thus has the same beneficial effects as the above-mentioned packaging device, which will not be described in detail here.

[0041] In this embodiment, the connection position between the second multi-channel signal connector 60 and the packaging device depends on the arrangement position of the first multi-channel signal connector 30 in the packaging device. For example, Figure 3 A schematic diagram of a first structure of the connection between the packaging device provided by the embodiment of the utility model and the second flexible strip line 50, Figure 3 Only one second flexible strip line 50 is shown; Figure 3 It can be seen that the through hole through which the first multi-channel signal connector 30 in the packaging device passes is arranged on the top plate of the packaging box 10. At this time, the second multi-channel signal connector 60 is plugged and matched with the first multi-channel signal connector 30 at the top plate.

[0042] For example, Figure 4 A second structural schematic diagram of the connection between the packaging device provided by the embodiment of the utility model and the second flexible strip line 50 is shown. Figure 4 Only one second flexible strip line 50 is shown; Figure 4 It can be seen that the through hole through which the first multi-channel signal connector 30 in the packaging device passes is arranged on the side plate of the packaging box 10. At this time, the second multi-channel signal connector 60 is plugged and matched with the first multi-channel signal connector 30 at the side plate.

[0043] Generally, as the number of quantum bits increases, the number of control lines in the quantum chip 40 also increases, among which the number of quantum state control lines for manipulating the quantum state and the quantum frequency control lines for manipulating the quantum frequency also increases significantly. Since the quantum state control lines and the quantum frequency control lines are connected to different functional boards in the quantum measurement and control device, in order to avoid wiring errors and for the convenience of wiring, in some implementations of this embodiment, the quantum chip 40 includes a multi-layer wafer, and the quantum state control lines and quantum frequency control lines in the quantum chip 40 are respectively located on different layers of wafers.

[0044] Furthermore, in some implementations of this embodiment, a thermally conductive adhesive layer is provided on the contact surface between the quantum chip 40 and the packaging box 10. By providing the thermally conductive adhesive layer, not only the quantum chip 40 is adhered to the packaging box 10, but also the heat on the quantum chip 40 is conducted to the packaging box 10, which is convenient for heat dissipation.

[0045] In the description of this specification, the description with reference to the terms "some embodiments" or "examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification.

[0046] The above are only preferred embodiments of the present invention and do not limit the present invention in any way. Any technician in the relevant technical field, without departing from the scope of the technical solution of the present invention, may make any equivalent replacement or modification to the technical solution and technical content disclosed in the present invention, which shall be deemed as the content of the technical solution of the present invention and still fall within the protection scope of the present invention.

Claims

1. A packaging device, comprising a packaging box for placing a quantum chip to be packaged, characterized in that: Also included is a first flexible stripline and a first multi-channel signal connector; The first flexible strip line is arranged on the bottom plate of the packaging box; a plurality of first transmission lines are integrated in the first flexible strip line, and the first end of each first transmission line is electrically connected to the control line on the quantum chip one by one; the second end of each first transmission line is electrically connected to each signal channel of the first multi-channel signal connector one by one; and a through hole is provided on the packaging box for the first multi-channel signal connector to pass through.

2. The packaging device according to claim 1, characterized in that: The through holes are arranged in a one-to-one correspondence with the first multi-channel signal connectors and the through holes are arranged on the bottom plate and / or the top plate of the packaging box.

3. The packaging device according to claim 1, characterized in that: The through holes are arranged in a one-to-one correspondence with the first multi-channel signal connectors and the through holes are arranged on the side plate of the packaging box.

4. The packaging device according to claim 1, characterized in that: The quantum chip is arranged in the central area of ​​the bottom plate, and a plurality of first flexible strip lines are provided. The plurality of first flexible strip lines are laid flat on the bottom plate and arranged around the quantum chip.

5. The packaging device according to claim 1, characterized in that: The quantum chip is arranged in the central position area of ​​the bottom plate, and the first flexible strip lines have a plurality of groups, and the plurality of groups of first flexible strip lines are stacked and arranged along the height direction of the packaging box; Each group of first flexible strip lines includes a plurality of first flexible strip lines laid on the bottom plate and arranged around the quantum chip.

6. The packaging device according to claim 1, characterized in that: The first flexible strip line is fixed to the bottom plate by means of heat-conducting glue.

7. The packaging device according to claim 1, characterized in that: The first transmission line in the first flexible strip line is connected to a control line in the quantum chip through a bonding wire.

8. A quantum computer, characterized in that: include: The packaging device according to any one of claims 1 to 7; A quantum chip is packaged in the packaging device; A quantum measurement and control system comprises a quantum measurement and control circuit and a quantum measurement and control device, wherein the quantum measurement and control circuit comprises a second flexible strip line and a second multi-channel signal connector, wherein a plurality of second transmission lines are integrated in the second flexible strip line, wherein a first end of each second transmission line is electrically connected to the quantum measurement and control device, and a second end of each second transmission line is electrically connected to each signal channel of the second multi-channel signal connector in a one-to-one correspondence; and the first multi-channel signal connector is plugged and matched with the second multi-channel signal connector.

9. The quantum computer according to claim 8, characterized in that The quantum chip comprises a multi-layer wafer, and the quantum state control lines and quantum frequency control lines in the quantum chip are respectively located on different layers of wafers.

10. The quantum computer according to claim 8, characterized in that A thermal conductive adhesive layer is provided on the contact surface between the quantum chip and the packaging box.

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