Packaging box, packaging structure and quantum computer

Abstract

The utility model discloses a packaging box, a packaging structure and a quantum computer, and belongs to the field of superconducting quantum chip packaging. And a packaging box. The packaging box comprises a box body and a bundling connector which are matched with each other. Wherein the cluster connector is provided with a plurality of connecting wires, each connecting wire is provided with a contact part, and each contact part comprises a telescopic probe. When the superconducting quantum chip is configured in the packaging box, the probe can be directly or indirectly electrically connected with the signal port of the superconducting quantum chip in an extrusion contact mode. By using the packaging box, the signal port of the superconducting quantum chip can be rapidly led out through the connecting line, and the connecting line can be conveniently disassembled or replaced when needed.

Description

Technical Field

[0001] The present application belongs to the field of superconducting quantum computers, especially the field of superconducting quantum chip packaging. In particular, the present application relates to a packaging box, a packaging structure and a quantum computer. Background Art

[0002] The number of qubits is an important indicator for measuring the performance of quantum computers in performing quantum computing. Therefore, there has been research in the industry to increase the number of qubits integrated in quantum computers.

[0003] The quantum chip realized in the superconducting system mainly relies on Josephson junction devices for construction, and the superconducting quantum bits need to be configured with corresponding reading and control circuits, etc. Therefore, as the number of superconducting quantum bits continues to increase, it will mean that the number of these circuits and components will also increase significantly. It can be known that when packaging superconducting quantum chips, the external connection ports used to introduce signals and connect the chip's reading and control circuits will also increase significantly. Considering that superconducting quantum chips need to undergo a variety of tests, the convenience and connection stability of these connection ports need to be balanced and improved. Utility Model Content

[0004] The examples of the present application provide a packaging box, a packaging structure, and a quantum computer, which can be used to quickly complete the line lead-out of the signal port of the superconducting quantum chip, and are also convenient for disassembly and assembly of the line.

[0005] The solution of this application example is implemented through the following contents.

[0006] In a first aspect, an example of the present application discloses a packaging box for packaging a superconducting quantum chip.

[0007] The package includes:

[0008] The box body comprises a base and a top cover which are matched and connected to form a base for fixing the superconducting quantum chip, and the top cover is provided with a connection hole;

[0009] A cluster connector configured to be detachably connected to a connection hole, comprising a body connected to each other, and a plurality of connection wires, each of which has a contact portion, and the contact portion comprises a probe configured telescopically;

[0010] The probe is configured to be directly or indirectly electrically connected to the signal port of the superconducting quantum chip retained in the accommodation cavity in a compressed contact manner at the contact portion in a compressed state.

[0011] According to some examples of the present application, the connecting wires are detachably connected to the body, several connecting wires are grouped into multiple wire groups, and each wire group consists of at least two connecting wires fixed as a whole, and an optional number of wire groups in all the wire groups are connected to the body.

[0012] According to some examples of the present application, the number of connecting wires in each wire group is different.

[0013] According to some examples of the present application, the contact portion is used to directly contact a signal port of the superconducting quantum chip;

[0014] And / or, the packaging box further includes a column, and the column passes through the base, the circuit board and the top cover in sequence along its extension direction;

[0015] And / or, the base and the top cover are respectively flat plate structures.

[0016] According to some examples of the present application, the packaging box further includes a stud, which passes through the base and the top cover in sequence along its own extension direction, and the base and the top cover are respectively provided with threaded sleeves that cooperate with the stud.

[0017] According to some examples of the present application, the contact portion is used to indirectly contact a signal port of the superconducting quantum chip;

[0018] The packaging box also includes a circuit board arranged between the base and the top cover. The circuit board is provided with a lead-out port and a bonding port. The lead-out port is used for direct contact with the probe, and the bonding port is used for connecting with the signal port of the superconducting quantum chip.

[0019] According to some examples of the present application, the packaging box further includes a column, which passes through the base, the circuit board and the top cover in sequence along its extension direction;

[0020] And / or, the circuit board is provided with a groove for accommodating the superconducting quantum chip;

[0021] And / or, the base and the top cover are respectively flat plate structures.

[0022] In a second aspect, an example of the present application discloses a packaging structure, including:

[0023] Superconducting quantum chip and packaging box.

[0024] The superconducting quantum chip is arranged on the base and the top cover, and the contact part of the probe is pressed and contacted with the signal port of the superconducting quantum chip.

[0025] According to some examples of the present application, the superconducting quantum chip is a flip chip and includes at least a first chip layer configured with a signal port and a second chip layer configured with a superconducting quantum bit, and the contact portion of the probe is pressed into contact with the signal port of the first chip layer.

[0026] In a third aspect, an example of the present application discloses a packaging structure, including:

[0027] Superconducting quantum chip; and the above-mentioned packaging box; the superconducting quantum chip is arranged on the base and the top cover, and the contact part of the probe is pressed and contacted with the lead-out port of the circuit board.

[0028] In a fourth aspect, an example of the present application discloses a quantum computer, comprising the aforementioned packaging structure or packaging box.

[0029] The packaging box of the disclosed example has a clustered connector, so it can be used as a single connection line, which is convenient for operation. That is, when there are many connection lines, it is not necessary to operate each connection line one by one, so that the lead-out speed of the signal port of the chip is greatly improved.

[0030] Furthermore, since the cluster connector is directly or indirectly matched with the signal port of the chip by means of extrusion contact (i.e. non-fixed connection, such as welding) through the probes in the contact part of its connecting wire, it can be easily disassembled or replaced if the connecting line is damaged or needs to be disassembled.

[0031] Furthermore, the probe of the contact part in the connecting line is of telescopic design. Therefore, when it cooperates with the signal port of the chip through extrusion contact, a stable connection can be formed between the probe and the corresponding contact point, which is less likely to loosen, thereby ensuring that the signal path remains unobstructed. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] For a clearer explanation, the following briefly introduces the drawings required for the description.

[0033] Figure 1 A schematic diagram of the packaging structure in the example of this application;

[0034] Figure 2 for Figure 1 Schematic diagram of the exploded structure of the packaging structure;

[0035] Figure 3 This is a schematic diagram of the structure of a box body in a packaging box according to an example of this application;

[0036] Figure 4 This is a schematic diagram of the structure of the circuit board and chip used in this application example;

[0037] Figure 5 This is a schematic diagram of the structure of the base and the column in the packaging box of the present application example;

[0038] Figure 6 This is a schematic diagram of the structure of a cluster connector in a packaging box according to an example of the present application;

[0039] Figure 7 for Figure 6 A schematic diagram of the structure of the cluster connector from another perspective;

[0040] Figure 8 for Figure 7 A schematic diagram of a partially enlarged structure of the A portion of the cluster connector;

[0041] Fig. 9 This is a functional block diagram of the probe used as an example in this application.

[0042] Explanation of the reference numerals: 100 - packaging structure; 10 - cluster connector; 11 - box body; 12 - column; 14 - circuit board; 15 - superconducting quantum chip; 111 - base; 112 - top cover; 141 - groove; 113 - connection hole; 101 - internal terminal; 102 - external terminal; 103 - connection line; 1031 - probe. DETAILED DESCRIPTION

[0043] As the number of superconducting quantum bits in superconducting quantum chips continues to increase, the packaging of superconducting quantum chips is also showing an increasingly high-density development trend. In particular, considering that superconducting quantum bits require various signals such as radio frequency signals for quantum computing, many signal lines are also required accordingly. At the same time, given the numerous testing requirements for superconducting quantum chips, frequent connections to external signal source devices and disconnection operations are involved.

[0044] The existing packaging solutions for superconducting quantum chips have low signal line connection efficiency, which cannot meet the display requirements when a large number of tests are required in a short period of time. In addition, the line connection method is fixed and cannot be changed once the design is completed, which makes it lack of flexibility in use.

[0045] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 .

[0046] In view of this, in the present disclosure, a packaging box for packaging a superconducting quantum chip 15 is proposed. After the superconducting quantum chip 15 is packaged with the packaging box, the cluster connector 10 can be used to conveniently and quickly connect the signal with the signal port of the superconducting quantum chip 15, so as to connect with an external signal source device through the cluster connector 10. And when the port needs to be connected with an external signal source device, the cluster connector 10 can also be quickly disassembled.

[0047] In short, the signal source can be connected and disconnected by conveniently plugging and unplugging the cluster connector 10. In particular, due to the design of the telescopic probe 1031 in the cluster connector 10, the connection stability of the signal line can be higher, which can significantly reduce the occurrence of false connection.

[0048] For example, Figure 1 and Figure 2 As shown, the packaging box includes a box body 11 and a cluster connector 10 that are mutually matched and connected. The cluster connector 10 is detachably matched with the box body 11 to facilitate disassembly and assembly.

[0049] Since the cluster connector 10 is respectively connected to the chip connection signal and to the external signal source, it can be understood that the cluster connector 10 can be set as a double-head structure, and one end is connected to the superconducting quantum chip 15 signal, and the other end is connected to the external signal source device signal.

[0050] The following is a detailed description of each component in the packaging box.

[0051] The box body 11 is a structure for fixing the superconducting quantum chip 15, and is used to increase the space for fixing the chip. Figure 1 , Figure 2 and Figure 3 The box body 11 includes a base 111 and a top cover 112. The base 111 and the top cover 112 are connected to each other to fix the superconducting quantum chip 15.

[0052] Considering that the superconducting quantum chip 15 is sensitive to various external signals, in order to prevent the quantum operation from being disturbed by these noise signals, the base 111 and the top cover 112 can be selected to be implemented as conventional metals such as aluminum alloy and copper, or can also be metal materials with aluminum, copper, gold, indium and other coatings on the surface; but the specific materials are not particularly limited. The box body 11 is constructed as a metal structure, or a structure with a metal coating, which can form an approximate metal cavity, preventing various external interference electromagnetic wave signals from entering the interior of the box body 11, thereby preventing the superconducting quantum chip 15 from being disturbed.

[0053] It is worth pointing out that the packaging box in the present disclosure can be used to package various semiconductor chips in addition to the superconducting quantum chip 15. Therefore, since the semiconductor chip does not have the high sensitivity to various electromagnetic signals like the superconducting quantum chip 15, the box body 11 can also be made of non-metallic materials, such as organic materials.

[0054] Structurally, the base 111 and the top cover 112 in the box body 11 can be designed as a flat plate structure, or one of them is a flat plate structure and the other is a groove structure. Alternatively, both are groove structures. In some examples, the results show that the base 111 and the top cover 112 of the box body 11 are respectively selected to be manufactured as flat plate structures or can alleviate the cavity mode of the packaging box, thereby avoiding potential interference between the cavity frequency and the chip bit frequency, and further reducing the design work that needs to be performed to increase the cavity frequency in order to prevent frequency interference so that the detuning with the bit frequency is large enough.

[0055] Further, on this basis, the matching connection method of the base 111 and the top cover 112 can also be designed in different examples. For example, the two can be bonded at the butt surfaces of the two by an adhesive. Alternatively, the two can also be connected by a bolt, or matched by using a stud connection.

[0056] The latch or stud may be independently configured in the packaging box, or may be configured by having one end fixedly connected to the base 111 and the other end being a free end, or by having one end fixedly connected to the top cover 112 and the other end being a free end. Simply put, the aforementioned latch and stud may be collectively described as a column 12 (or may be described as a positioning pin in other examples). Therefore, in some examples, the packaging box may also include a column 12, see Figure 1 , Figure 2 and Figure 5 In the package box after assembly (packaged chip), the pillar 12 passes through the base 111 and the top cover 112 in sequence along its own extension direction. Or further, it can also pass through the circuit board 14 (which will be mentioned and described in detail later) provided in the package box for bonding with the chip, that is, the pillar 12 passes through the base 111, the circuit board 14 and the top cover 112 in sequence along its own extension direction.

[0057] Take a stud as an example; the stud can be a cylinder with a smooth surface, with threads made at both ends, and in order to facilitate threaded connection, a structure such as a slot or a cross slot can be opened on the two end faces of the stud (used as an operating part for rotating the stud for threaded connection), and it can be a double-headed stud. Corresponding to the stud, the connection method of the base 111 and the top cover 112 can be designed as follows. Screw holes (such as at least one of which is a through hole) are respectively set at the alignment positions of the base 111 and the top cover 112 (avoiding the area where the chip is set). When the base 111 and the top cover 112 need to be connected, the stud is rotated through the aforementioned slot, so that one end of the stud is threadedly connected to one of them, and then the other end is threadedly connected to the other one.

[0058] When the number of bits is large, the box body 11 may need to be larger, and considering that the box body 11 is made of metal, a threaded sleeve can be provided at the connection between the stud and the base 111 and the top cover 112. The threaded sleeve can increase the strength of the connection between the stud and the base 111 and the top cover 112, and prevent the stud from slipping.

[0059] In addition to the above structure, the top cover 112 of the box body 11 is penetrated by a connection hole 113. The connection hole 113 is used for the cluster connector 10 to be connected with the top cover 112 in a coordinated manner, such as by snapping or plugging, or can also be reinforced with screws or bolts. The shape and structure of the connection hole 113 are designed according to the shape and structure of the cluster connector 10 and are not particularly limited. In the illustrated structure of the present disclosure, the connection hole 113 is constructed as a structure with a rectangular cross-section, such as a quadrangular prism structure.

[0060] The above content mainly discusses the structure of the box body 11 in the packaging box, and the following text will mainly focus on the cluster connector 10.

[0061] As described above, the cluster connector 10 is configured and constructed in the packaging box in a manner of being detachably connected to the connecting hole 113 of the top cover 112 .

[0062] See also Figure 1 , Figure 2 , Figure 6 and Figure 7 The cluster connector 10 has a body connected to each other, and a plurality of connecting wires 103; the connecting wires 103 and the body can be fixedly connected or detachably connected. These connecting wires 103 can be connected to the body as a whole; or, in other words, these connecting wires 103 are constrained by the body as a whole. The body includes two terminals, one of which (such as described as an internal terminal 101) is in the box body 11, and the other terminal (such as described as an external terminal 102) is connected to an external signal source device, a test circuit, etc.

[0063] Alternatively, in order to facilitate maintenance according to the situation, all the connecting wires 103 in the cluster connector 10 can be designed to be grouped. For example, the connecting wires 103 are detachably connected to the body, and the connecting wires 103 of the cluster connector 10 are grouped into multiple wire groups (can be at least two groups. Each wire group is composed of at least two connecting wires 103 fixed as a whole, for example, the connecting wires 103 in the same group are tied together or glued together; these connecting wires 103 are directly connected to the body. Alternatively, the connecting wires 103 in each wire group are fixed together by a sub-fixing head and then connected to the body of the cluster connector 10 through the sub-fixing head. In this example, the connecting wires 103 are indirectly connected to the body through the sub-fixing head.

[0064] The design of grouping the connecting wires 103 in the cluster connector 10 can enable each group of connecting wires 103 to be combined as needed. For example, the cluster connector 10 can be configured with one, two, three, or more groups of wires (the number of connecting wires 103 in each wire group can be the same, or more beneficially different); that is, any number of wire groups among all the wire groups are connected to the body.

[0065] Therefore, corresponding connecting wires 103 can be configured for signal ports of chips of different forms, thereby providing flexibility in use; and if some connecting wires 103 are faulty or damaged, they can also be conveniently replaced individually.

[0066] The above content discusses the distribution method of the connection lines 103 of a single cluster connector 10. In other examples, the number of cluster connectors 10 in the packaging box can also be configured as one, two, or three as needed; that is, the number of the cluster connector 10 is at least one.

[0067] Each of the connecting wires 103 has a contact portion, and the contact portion includes a probe 1031 (eg, a central conductor spring needle; eg, Figure 8 As shown); the arrangement may be in the form of a pressing structure. Since the probe 1031 is a telescopic structure, the probe 1031 can be configured to be directly or indirectly electrically connected to the signal port of the superconducting quantum chip 15 retained in the accommodation cavity in a compressive contact manner at the contact portion in the compressed state.

[0068] The specific structure of the contact part can be various devices on sale, or various devices known to the inventor, or a structure designed and manufactured by the user according to needs. Fig. 9 As shown, for example, the contact portion may include a housing 1033 and a telescopic structure in a sliding channel of the housing, wherein the telescopic structure includes an elastic structure (such as a spring 1032) that can slide in the sliding channel, and conductors may be respectively configured at both ends thereof (one conductor may be fixedly connected to the connecting line, and the other conductor may be a free end as the spring expands and contracts). Furthermore, one end of the probe 1031 is slidably sleeved in the sliding channel and contacts with one end conductor of the spring; the other end of the probe is outside the housing and can move along with the expansion and contraction of the spring. In this way, by making the other end of the probe contact the port of the signal and making the spring in a compressed state, the probe is in a stressed state, and thus the probe can stably and firmly form and maintain contact with the corresponding port. In particular, the end of the probe outside the housing may form a sharp portion, which can make contact with the port more firmly and less prone to slippage.

[0069] For an example in which the probe 1031 directly contacts the signal port of the superconducting quantum chip 15, the probe 1031 is directly pressed onto the signal port of the superconducting quantum chip 15. When the superconducting quantum chip 15 is a flip-chip chip including a bottom chip and an upper chip, the probe 1031 can directly contact the bottom chip.

[0070] In some other examples, the probe 1031 may also be configured to indirectly contact the signal port of the superconducting quantum chip 15. Figure 2 and Figure 4 The packaging box may further include a circuit board 14 (such as a printed circuit board, pcb; or a ceramic circuit board 14) disposed between the base 111 and the top cover 112. The circuit board 14 may be an independent component, or may be welded (or conductively bonded) to the base 111 in advance.

[0071] As a structure that provides a signal transmission position for the circuit board 14, the circuit board 14 is correspondingly provided with an extraction port and a bonding port, and the two are interconnected by, for example, copper wires in the circuit board 14. In terms of function, the extraction port is used to directly contact the probe 1031, and the bonding port is used to connect to the signal port of the superconducting quantum chip 15.

[0072] On the premise of providing the circuit board 14, in the packaging box, the circuit board 14 can be provided between the base 111 and the cover plate by clamping and fixing. For example, the base 111 and the cover plate are fixed by clamping the opposing surfaces (the surfaces can be in contact with each other in the example where the circuit board 14 is not provided); wherein the base 111 and the top cover 112 can be respectively constructed as flat plate structures.

[0073] Alternatively, the aforementioned pillars 12 may be used for fixing. For example, the circuit board 14 is provided with through holes, and the pillars 12 pass through the through holes of the circuit board 14 (i.e., the pillars 12 pass through the base 111, the circuit board 14, and the top cover 112 in sequence along their own extension direction) to limit the circuit board 14, and optionally, a more stable fixing and limiting effect may be achieved by further clamping the aforementioned base 111 and the cover plate.

[0074] Regardless of whether the column 12 is provided, in the example of the packaging box with the circuit board 14, the circuit board 14 can be provided with a groove 141 for accommodating the superconducting quantum chip 15. Therefore, the superconducting quantum chip 15 can be set in the groove 141, and the chip can be limited by the cooperation of the circuit board 14 and the bottom cover. And the signal port of the chip is connected to the port (such as the aforementioned bonding port) provided on the circuit board 14 by wire bonding. Alternatively, in other examples, it can be selected to provide a through hole in the circuit board 14, for example, the aforementioned groove 141 is formed by passing through the circuit board 14. In this example, the chip is limited by the base 111 and the top cover 112.

[0075] The above content mainly describes the packaging box as an example of its application. In the example of the present disclosure, a packaging structure 100 is recorded. The packaging structure 100 includes a superconducting quantum chip 15 and a packaging box. The superconducting quantum chip 15 is arranged between the base 111 and the top cover 112 of the box body 11 in the packaging box, and the contact portion of the probe 1031 of the cluster connector 10 in the packaging box is pressed and contacted with the signal port of the superconducting quantum chip 15.

[0076] The superconducting chip can be selected to be constructed in the form of flip-chip soldering. That is, the superconducting quantum chip 15 is a flip-chip, which can include two layers, or three layers, or more layers of sub-chip layers. That is, the flip-chip at least includes a first chip layer for configuring a signal port, and a second chip layer for configuring a superconducting quantum bit. On this basis, the contact portion of the probe 1031 is pressed and contacted with the signal port of the first chip layer.

[0077] In the above flip chip example of two layers of chips, the matching mode between the cluster connector 10 and the signal port in the packaging box can be constructed in different ways according to the size of the first chip layer.

[0078] For example, when the first chip layer in the superconducting quantum chip 15 is relatively large, the probe 1031 in the cluster connector 10 may be pressed and contacted to the signal port on the first chip layer; the signal port of the chip is directly connected to the probe 1031 of the cluster connector 10. In this example, the packaging box may not be configured with the circuit board 14.

[0079] For another example, when the first chip layer in the superconducting quantum chip 15 is small in size, the probe 1031 in the cluster connector 10 may be pressed and contacted to the signal port on the first chip layer. In this example, the packaging box may be configured with a circuit board 14. The signal port of the chip is indirectly connected to the probe 1031 of the cluster connector 10, that is, the chip signal port (located in the first chip layer) is connected to the bonding port of the circuit board 14, such as wire bonding, and the lead-out port of the circuit board 14 is pressed and contacted to the probe of the cluster connector 10.

[0080] Furthermore, based on the packaging structure 100, a quantum computer can be constructed by configuring a refrigeration device, various signal source devices, and measurement and control devices.

[0081] The embodiments described above with reference to the accompanying drawings are exemplary and are only used to explain the present application, but should not be construed as limiting the present application.

[0082] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the foregoing describes one or more embodiments with reference to the accompanying drawings. Wherein, similar reference numerals throughout the text are used to refer to similar components. In the above description, for the purpose of explanation, many specific details are set forth in order to provide a more thorough understanding of one or more embodiments. However, it is obvious that in various cases, one or more embodiments can be practiced without these specific details, and each embodiment can be combined with each other and referenced to each other without contradiction.

[0083] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0084] In addition, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus that includes a series of steps or elements is not necessarily limited to those steps or elements explicitly listed, but may include other steps or elements not explicitly listed or inherent to such process, method, product, or apparatus.

[0085] The above describes in detail the structure, features and effects of the present application based on the embodiments shown in the drawings. The above are only preferred embodiments of the present application, but the present application does not limit the scope of implementation to what is shown in the drawings. Any changes made in accordance with the concept of the present application, or modifications to equivalent embodiments with equivalent changes, which still do not exceed the spirit covered by the description and drawings, should be within the protection scope of the present application.

Claims

1. A packaging box for packaging a superconducting quantum chip, characterized in that: The packaging box comprises: The box body comprises a base and a top cover which are matched and connected to form a base for fixing the superconducting quantum chip, and the top cover is provided with a connection hole; A cluster connector configured to be detachably connected to a connection hole, comprising a body connected to each other, and a plurality of connection wires, each of which has a contact portion, wherein the contact portion comprises a probe configured telescopically; The probe is configured to be directly or indirectly electrically connected to the signal port of the superconducting quantum chip retained in the accommodation cavity in a compressed contact manner at the contact portion in a compressed state.

2. The packaging box according to claim 1, characterized in that: The connecting wires are detachably connected to the body, the connecting wires are grouped into a plurality of wire groups, and each wire group is composed of at least two connecting wires fixed as a whole, and any number of wire groups among all the wire groups are connected to the body.

3. The packaging box according to claim 2, characterized in that: The number of connecting lines in each line group is different.

4. The packaging box according to any one of claims 1 to 3, characterized in that: The contact portion is used to directly contact the signal port of the superconducting quantum chip; And / or, the packaging box further comprises a column, and the column passes through the base and the top cover in sequence along its own extension direction; And / or, the base and the top cover are respectively flat plate structures.

5. The packaging box according to claim 1, characterized in that: The packaging box also includes a stud, which passes through the base and the top cover in sequence along its own extension direction. The base and the top cover are respectively provided with screw sleeves that match the stud.

6. The packaging box according to any one of claims 1 to 3, characterized in that: The contact portion is used to indirectly contact the signal port of the superconducting quantum chip. The packaging box also includes a circuit board arranged between the base and the top cover. The circuit board is provided with an extraction port and a bonding port. The extraction port is used to directly contact the probe, and the bonding port is used to connect to the signal port of the superconducting quantum chip.

7. The packaging box according to claim 6, characterized in that: The packaging box further comprises a column, and the column passes through the base, the circuit board and the top cover in sequence along its own extension direction; And / or, the circuit board is provided with a groove for accommodating the superconducting quantum chip; And / or, the base and the top cover are respectively flat plate structures.

8. A packaging structure, characterized in that: include: Superconducting quantum chips; as well as The packaging box according to any one of claims 1 to 5, wherein the superconducting quantum chip is arranged on the base and the top cover, and the contact portion of the probe is pressed into contact with the signal port of the superconducting quantum chip.

9. The packaging structure according to claim 8, characterized in that: The superconducting quantum chip is a flip chip and at least comprises a first chip layer configured with a signal port and a second chip layer configured with superconducting quantum bits, and the contact portion of the probe is pressed and contacted with the signal port of the first chip layer.

10. A packaging structure, characterized in that: include: Superconducting quantum chips; as well as In the packaging box according to claim 6 or 7, the superconducting quantum chip is arranged on the base and the top cover, and the contact portion of the probe is pressed into contact with the lead-out port of the circuit board.

11. A quantum computer, characterized in that: It comprises the packaging structure according to any one of claims 8 to 10, or the packaging box according to any one of claims 1 to 7.

Images