Light source module and lighting device

Abstract

The embodiment of the utility model provides a light source module and a lighting device, a plurality of ceramic substrates of the light source module are tiled and connected to a copper substrate at intervals, the plurality of ceramic substrates are electrically connected through gold wires, the surface, deviating from the copper substrate, of each ceramic substrate is connected with one or more LED light-emitting chips, and the LED light-emitting chips are electrically connected with the copper substrate. The transparent cover is connected to the copper substrate and covers the LED light-emitting chips, heat of the LED light-emitting chips can be transmitted to the copper substrate through the ceramic substrate, the heat conductivity of the copper substrate is high, the heat generated by the LED light-emitting chips can be rapidly dissipated to surrounding air or other structures, the working temperature is effectively reduced, and the service life of the LED light-emitting chips is prolonged. According to the light source module, the multiple ceramic substrates can jointly disperse the thermal expansion influence of the copper substrate, the situation that due to the fact that a single and large-size ceramic substrate is adopted, serious buckling deformation and even tension cracking happen is avoided, the warping degree of the light source module is effectively reduced, and the potential damage risk caused by thermal stress concentration is further reduced.

Description

Technical Field

[0001] The present application relates to the field of lighting technology, and in particular to a light source module and a lighting device. Background Art

[0002] The high-power multi-color light sources currently used in the market mainly adopt a combination module solution in which multiple colored lamp beads are welded on a copper base plate.

[0003] Related technologies include a combined module solution that uses a whole piece of ceramic as a chip heat sink carrier and welds it to a copper substrate. Due to the large difference in expansion coefficients between the copper substrate and the ceramic substrate, the module will warp after the two materials are welded together at high temperature through solder paste and cooled. When the power demand is higher and the color variety demand is greater, the size of the ceramic and copper substrate used will be larger accordingly, and the warping of the light source module will be more obvious. In severe cases, the warping degree is greater than the deformation range that the ceramic substrate can withstand, which will cause the ceramic to crack.

[0004] In addition, the copper substrate is concave and warped toward one side of the ceramic substrate, and the largest point of the concave is located at the geometric center of the back of the light source. The geometric center has relatively high heat when the light source is working. In the finished lamps on the market application side, thermal grease is applied to the matching heat sink when the light source module is used. The thinner the thermal grease, the better the thermal conductivity of the light source. If the light source module is warped too much, the filled thermal grease cannot fill the concave part and a cavity is formed. The cavity will cause the heat of the light source to be unable to be discharged when it is working, which will cause heat accumulation and increase the warping. In severe cases, the ceramic substrate will be cracked, causing the module to fail. Utility Model Content

[0005] The embodiments of the present application provide a light source module and a lighting device to solve the above technical problems.

[0006] The embodiments of the present application achieve the above-mentioned objectives through the following technical solutions.

[0007] An embodiment of the present application provides a light source module, which includes a copper substrate, multiple ceramic substrates, multiple LED light-emitting chips and a transparent cover. The multiple ceramic substrates are laid flat and connected to the copper substrate at intervals. The multiple ceramic substrates are electrically connected through gold wires. One or more LED light-emitting chips are connected to the surface of each ceramic substrate facing away from the copper substrate. The transparent cover is connected to the copper substrate and covers the multiple LED light-emitting chips.

[0008] In some embodiments, a gap between at least two adjacent ceramic substrates is less than or equal to 0.2 mm.

[0009] In some embodiments, the thickness of the copper substrate is greater than or equal to 4 mm; and / or, the copper substrate is a red copper substrate.

[0010] In some embodiments, the copper substrate is provided with a boss, the boss is provided with a soldering pad, and the ceramic substrate is soldered to the soldering pad.

[0011] In some embodiments, the copper substrate is provided with a plurality of pads, each ceramic substrate is soldered to a corresponding pad, and a solder resist structure is provided between any two adjacent pads.

[0012] In some embodiments, the solder resist structure is a solder resist layer with a width less than or equal to 0.2 mm and a thickness less than or equal to 30 μm; or, the solder resist structure is a groove structure with a width less than or equal to 0.2 mm provided on a copper substrate.

[0013] In some embodiments, the light source module 100 further includes a packaging adhesive layer, which is disposed on the ceramic substrate. The packaging adhesive layer surrounds a plurality of LED light-emitting chips, and the transparent cover is connected to the copper substrate through the packaging adhesive layer.

[0014] In some embodiments, the reflectivity of the encapsulation glue layer is greater than or equal to 98%, and the transmittance of the transparent cover is greater than or equal to 98.5%.

[0015] In some embodiments, a plurality of LED light-emitting chips with different luminous colors are connected to a surface of at least one ceramic substrate facing away from the copper substrate; and / or, the ceramic substrate is provided with an identifier.

[0016] An embodiment of the present application provides a lighting device, which includes a housing and a light source module according to any one of the above embodiments, wherein the light source module is assembled in the housing.

[0017] In the light source module and lighting device provided by any of the above embodiments of the present application, multiple ceramic substrates of the light source module are laid flat and connected to the copper substrate at intervals, and the multiple ceramic substrates are electrically connected through gold wires. The surface of each ceramic substrate facing away from the copper substrate is connected to one or more LED light-emitting chips, and a transparent cover is connected to the copper substrate and covers the multiple LED light-emitting chips. Then, the heat of the LED light-emitting chip can be transferred to the copper substrate through the ceramic substrate, and the copper substrate has a high thermal conductivity, which can quickly dissipate the heat generated by the LED light-emitting chip to the surrounding air or other structures, effectively reducing the operating temperature, extending the service life of the LED light-emitting chip, and helping to maintain the stability and reliability of the light source module. In addition, multiple ceramic substrates can jointly disperse the thermal expansion effect of the copper substrate, so that the internal stress generated by the copper substrate during the process of thermal expansion and contraction is released, which helps to avoid the situation of severe warping and deformation or even cracking caused by the use of a single, large-sized ceramic substrate, thereby effectively reducing the warping degree of the light source module, improving the mechanical stability of the light source module, and reducing the potential damage risk caused by thermal stress concentration. In addition, light source modules with low warpage have higher flatness, and thermal interface materials (such as thermal grease) can fully contact and fit tightly to all contact surfaces, so that the thermal interface materials applied by users at the application end can be thinner and evenly distributed, which helps to reduce thermal resistance and conduct heat from the light source module to other heat dissipation systems more quickly. It also helps to prevent the filled thermal interface material from being unable to fill the warping depressions of the module and forming voids, thereby helping to avoid heat accumulation and the formation of hot spots, and helping to reduce the risk of increased warping during thermal cycling, thereby improving the thermal stability and long-term working reliability of the light source module, helping to improve the overall heat dissipation efficiency, and extending the life of the light source module. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 The structural schematic diagram of the light source module provided by some embodiments of the present application is illustrated.

[0020] Figure 2 Example Figure 1 A schematic structural diagram of a light source module from another perspective of an embodiment of the present invention.

[0021] Figure 3 Example Figure 1 A partial structural schematic diagram of a light source module of an embodiment. DETAILED DESCRIPTION

[0022] In order to make those skilled in the art better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application.

[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0024] See also Figures 1 to 3 The embodiment of the present application provides a light source module 100, which includes a copper substrate 10, a plurality of ceramic substrates 20, a plurality of LED light emitting chips 30 and a transparent cover 50. The ceramic substrate 20 is connected to the copper substrate 10, and the LED light emitting chips 30 and the transparent cover 50 are both connected to the ceramic substrate 20. In this way, the heat of the LED light emitting chip 30 can be transferred to the copper substrate 10 through the ceramic substrate 20, and the copper substrate 10 has a high thermal conductivity, which can quickly dissipate the heat generated by the LED light emitting chip 30 to the surrounding air or other structures, effectively reducing the operating temperature of the LED light emitting chip 30, extending the service life of the LED light emitting chip 30, and helping to maintain the stability and reliability of the operation of the light source module 100.

[0025] In the present invention, the term "plurality" means greater than or equal to two, for example, the number of ceramic substrates 20 can be two, three, four, five or other numbers. For example, the number of LED light emitting chips 30 can be two, three, four, five or other numbers.

[0026] In some embodiments, a plurality of ceramic substrates 20 are laid flat and connected to the copper substrate 10 at intervals, for example, a plurality of ceramic substrates 20 are laid flat and connected to the copper substrate 10 at even intervals. The ceramic substrates 20 are electrically connected through gold wires 70, and one or more LED light-emitting chips 30 are connected to the surface of each ceramic substrate 20 facing away from the copper substrate 10. In this way, each ceramic substrate 20 and the LED light-emitting chips 30 thereon form a small module, and the heat dissipation and structural stability of the plurality of small modules are better. At the same time, the scheme of the plurality of small modules retains the advantage of the ceramic substrate scheme with a smaller light-emitting surface. Furthermore, the small module scheme will not be as prone to overheating or deformation as the original single, large-sized ceramic substrate, so the small module can continue to work reliably at high power, that is, the LED chip can continue to work at high current, that is, the advantage of the high power of the LED chip is retained. Furthermore, the multiple ceramic substrates 20 can disperse the thermal expansion effect of the copper substrate 10, so that the internal stress generated by the copper substrate 10 during the thermal expansion and contraction process can be released, which helps to avoid the situation where serious warping and deformation or even cracking occurs due to the use of a single, large-sized ceramic substrate, thereby effectively reducing the warping degree of the light source module 100, improving the mechanical stability of the light source module 100, and reducing the potential damage risk caused by thermal stress concentration. In summary, the utility model sets multiple ceramic substrates, each of which is provided with multiple LED chips. The use of the ceramic substrate solution can make the light-emitting surface of the entire light source module smaller, which is convenient for subsequent optical system collection, and the multiple ceramic substrates can disperse the stress generated by thermal expansion and contraction, so that the ceramic substrate can reduce the thermal expansion effect of the copper substrate, and further enables the light-emitting chip to continue to work under high current, ensuring the high-power light emission of the light source module.

[0027] In addition, the low-warping light source module 100 has a higher flatness, and the thermal interface material (such as thermal grease) can fully contact and fit tightly to all contact surfaces, so that the thermal interface material applied by the user at the application end can be thinner and evenly distributed, which helps to reduce thermal resistance and allows heat to be transferred more quickly from the light source module 100 to other heat dissipation systems. It also helps to prevent the filled thermal interface material from being unable to fill the warping depressions of the module and forming voids, thereby helping to avoid heat accumulation and the formation of hot spots, and helping to reduce the risk of increased warping during thermal cycling, thereby improving the thermal stability and long-term working reliability of the light source module 100, helping to improve the overall heat dissipation efficiency, and extending the life of the light source module 100.

[0028] In some embodiments, the transparent cover 50 covers the plurality of LED light emitting chips 30. Thus, the transparent cover 50 and the copper substrate 10 cooperate with each other to form a protective barrier, which helps to isolate the direct impact of the external environment on the LED light emitting chips 30, such as preventing pollutants such as moisture and dust from invading the LED light emitting chips 30, and helps to extend the service life of the light source module 100.

[0029] In some embodiments, the gap d between at least two adjacent ceramic substrates 20 may be less than or equal to 0.2 mm, for example, the gap d between at least two adjacent ceramic substrates 20 may be 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm or other values. In this way, the gap d between at least two adjacent ceramic substrates 20 is not too large, which helps to reduce the loss caused by the propagation of light between the ceramic substrates 20, helps to improve the space utilization of the light source module 100, and allows more ceramic substrates 20 and LED light-emitting chips 30 to be integrated under the same size of the copper substrate 10, which helps the light source module 100 to be applied to products requiring high light density and miniaturized design.

[0030] In addition, the smaller gap d helps the ceramic substrates 20 to support each other, helps to enhance the overall rigidity of the light source module 100, and helps to reduce the risk of displacement or misalignment due to external impact or thermal expansion differences, thereby improving the mechanical stability of the light source module 100 and its reliability in long-term use.

[0031] In some embodiments, the gap d between any two adjacent ceramic substrates 20 may be less than or equal to 0.2 mm.

[0032] In some embodiments, the ceramic substrates 20 may be electrically connected via gold wires 70 .

[0033] In some embodiments, the ceramic substrate 20 may be provided with an identifier, which may be Arabic numerals or English characters. Thus, the identifier serves as a positioning mark to help guide operators to correctly place components or perform welding, ensure assembly accuracy, and avoid misalignment.

[0034] In some embodiments, two opposite surfaces of the ceramic substrate 20 may be plated with nickel-palladium-gold layers.

[0035] In some embodiments, the thickness of the copper substrate 10 can be greater than or equal to 4 mm, for example, the thickness of the copper substrate 10 can be greater than or equal to 4.5 mm, 5 mm, 5.5 mm, 6 mm, 6.5 mm, 7 mm, 7.5 mm, 8 mm, 8.5 mm, 9 mm, 9.5 mm, 10 mm or other values. In this way, the thickness of the copper substrate 10 is not too small, and the copper substrate 10 has a larger heat capacity when the length and width of the copper substrate 10 remain unchanged, so that more heat can be stored in a short time, which helps to avoid instantaneous high temperature from damaging the LED light-emitting chip 30, and helps the light source module 100 to be used in high-power operation or scenes with large ambient temperature fluctuations. In addition, the thicker copper substrate 10 also helps to improve the robustness of the structure, enhance the overall rigidity of the light source module 100, and reduce the shortening of the service life due to thermal fatigue or physical damage.

[0036] In some embodiments, the copper substrate 10 may be provided with a plurality of pads 11, and each ceramic substrate 20 is welded to a corresponding pad 11. In this way, the ceramic substrate 20 is welded to the preset pads 11, which can simplify the assembly process, reduce the complexity of manual operation, improve production efficiency, and reduce the error rate caused by improper operation compared to free welding.

[0037] In some embodiments, the number of the pads 11 may be consistent with the number of the ceramic substrates 20 .

[0038] In some embodiments, a solder resist structure 40 is provided between any two adjacent pads 11. Thus, the solder resist structure 40 helps prevent solder from overflowing to areas that should not be conductive during the soldering process, helps ensure electrical isolation between the ceramic substrates 20, prevents potential short circuit problems, and enhances circuit safety. The solder resist structure 40 also helps simplify subsequent packaging steps, such as eliminating the need for additional insulation processing or reducing manual intervention, thereby helping to improve production efficiency and reduce error rates.

[0039] In some embodiments, the solder resist structure 40 can be a solder resist layer with a width less than or equal to 0.2 mm and a thickness less than or equal to 30 μm. For example, the width of the solder resist layer can be adapted to the situation where the gap d between two adjacent ceramic substrates 20 is less than or equal to 0.2 mm. The width of the solder resist layer can be 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm or other values. For another example, the thickness of the solder resist layer can be 30 μm, 25 μm, 20 μm, 15 μm, 10 μm, 5 μm or other values. In this way, the solder resist layer helps to reduce the excessive diffusion of solder during the welding process, helps to improve the reliability of the welding point, reduces the failure caused by poor welding, and enhances the overall electrical connection stability. The solder resist structure 40 in the form of a solder resist layer also helps to reduce thermal barriers and helps to transfer heat more smoothly between the ceramic substrate 20 and the copper substrate 10, which is beneficial to thermal management, keeps the components within a safe operating temperature range, and prolongs the service life. In addition, a solder resist layer with a smaller thickness helps reduce obstruction and interference to the light path, and helps improve the brightness and uniformity of the light source module 100 .

[0040] In some embodiments, the solder resist layer may be formed by curing ink.

[0041] In some embodiments, the solder resist structure 40 may be a groove structure provided on the copper substrate 10 and having a width less than or equal to 0.2 mm. For example, the width of the groove structure may be 0.2 mm, 0.15 mm, 0.1 mm, 0.05 mm or other values. In this way, the groove structure also helps to reduce the excessive diffusion of solder during the welding process, helps to improve the reliability of the welding point, reduces failures caused by poor welding, and enhances the overall electrical connection stability. The solder resist structure 40 in the form of a groove structure also helps to reduce thermal barriers and helps to transfer heat more smoothly between the ceramic substrate 20 and the copper substrate 10, thereby facilitating thermal management, keeping the components within a safe operating temperature range, and extending the service life. In addition, the groove structure also helps to reduce obstruction and interference to the light path, and helps to improve the brightness and uniformity of the light source module 100.

[0042] In some embodiments, the groove structure can be formed by laser burning the copper substrate 10 .

[0043] In some embodiments, the copper substrate 10 may be provided with a boss, and the boss may be provided with the above-mentioned pad 11, and the ceramic substrate 20 may be welded to the pad 11. In this way, the boss and the pad 11 help to achieve precise alignment of the ceramic substrate 20 during the assembly process, help to ensure that the ceramic substrate 20 is accurately arranged according to the design requirements, and help to improve the standardization level of production. In addition, the boss also helps to increase the contact area between the copper substrate 10 and the air, which helps to more efficiently conduct heat from the LED light-emitting chip 30 to the copper substrate 10 via the ceramic substrate 20, thereby facilitating the heat dissipation of the copper substrate 10 to the surrounding environment.

[0044] In some embodiments, the copper substrate 10 may be a red copper substrate, which helps the copper substrate 10 to have good thermal conductivity and corrosion resistance.

[0045] In some embodiments, a circuit layer may be distributed on the surface of the copper substrate 10 , and the circuit layer may be electrically connected to the pad 11 .

[0046] In some embodiments, the surface of the circuit layer may be plated with a nickel-gold layer.

[0047] In some embodiments, the copper substrate 10 may also be welded with components such as electrical connectors and thermistors.

[0048] In some embodiments, the LED light emitting chip 30 can be soldered to the ceramic substrate 20 by using silver paste, solder paste or eutectic method.

[0049] In some embodiments, a portion of the light-emitting surface of the LED light-emitting chip 30 may be coated with fluorescent powder, so that the light emitted by the LED light-emitting chip 30 forms yellow-green light, amber light or other light colors after passing through the fluorescent powder.

[0050] In some embodiments, at least one surface of the ceramic substrate 20 facing away from the copper substrate 10 is connected with a plurality of LED light-emitting chips 30 with different luminous colors. In this way, the light source module 100 can flexibly adapt to various lighting or display requirements, provide a hardware foundation for achieving precise color control and blending, help produce richer and more delicate color effects, and facilitate the application of the light source module 100 in scenes with high requirements for color reproduction.

[0051] In some embodiments, the plurality of LED light emitting chips 30 with different light emitting colors may include a red LED light emitting chip, a green LED light emitting chip, a blue LED light emitting chip, etc. In addition, in addition to the above-mentioned red, green, and blue chips, the plurality of LED light emitting chips 30 with different light emitting colors may also include a cyan LED light emitting chip, a blue LED light emitting chip coated with phosphor to emit yellow-green light, a blue LED light emitting chip coated with phosphor to emit amber light, or other color light chips.

[0052] In some embodiments, the light source module 100 may further include a packaging adhesive layer 60 , which is disposed on the ceramic substrate 20 , surrounding the plurality of LED light-emitting chips 30 , and the transparent cover 50 is connected to the copper substrate 10 through the packaging adhesive layer 60 .

[0053] This helps to simplify the final packaging step of the light source module 100. The transparent cover 50 and the copper substrate 10 can be connected through a bonding process to protect the LED light-emitting chip 30, which helps to improve production efficiency and reduce assembly complexity.

[0054] In some embodiments, the reflectivity of the encapsulation glue layer 60 can be greater than or equal to 98%, and the transmittance of the transparent cover 50 can be greater than or equal to 98.5%. In this way, the high-reflectivity encapsulation glue layer 60 can reflect a portion of the light emitted by the LED light-emitting chip 30 back to the forward output path, reducing the loss of light energy, thereby helping to improve the overall light effect and the brightness of the light source module 100, and also helping to maintain the consistency and purity of the light color of the light source module 100, reducing unnecessary light absorption and dispersion, and making the color of the light source module 100 more vivid and realistic. The high-transmittance transparent cover 50 helps to reduce the attenuation of light during the light transmission process, and together with the high-reflectivity encapsulation glue layer 60, can provide a uniform, soft and high-quality lighting effect.

[0055] In some embodiments, the encapsulation adhesive layer 60 may be a dam adhesive, for example, the encapsulation adhesive layer 60 may be a white dam adhesive. In this way, the dam adhesive has high adhesion and strength, and has the characteristics of moisture-proof, waterproof, weather-resistant, ozone-resistant, radiation-resistant, etc., effectively isolating the external environment from erosion of the internal components, and can enhance the overall stability of the encapsulation structure, prevent mechanical vibration or external force damage, and can improve the reliability and durability of the light source assembly for long-term operation.

[0056] In addition, the white dam glue also has high reflectivity, which helps to reflect and control light, and improve the light output efficiency and color uniformity of the light source module 100.

[0057] The embodiment of the present application provides a lighting device, which may be a stage light or other lamps. The lighting device comprises a housing and a light source module 100 of any of the above embodiments, the light source module 100 is assembled in the housing, and the housing can provide certain protection for the light source module 100.

[0058] In this application, unless otherwise clearly specified or limited, the terms "installation", "connection" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can be internal communication between two elements, it can be only surface contact, or it can be connected through surface contact through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0059] In addition, the terms "first", "second", etc. are only used to distinguish descriptions and cannot be understood as specific or special structures. The description of the term "some embodiments" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of the different embodiments or examples without contradiction.

[0060] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A light source module, characterized in that: include: Copper substrate; A plurality of ceramic substrates, wherein the plurality of ceramic substrates are laid flat and connected to the copper substrate at intervals, and the plurality of ceramic substrates are electrically connected to each other through gold wires; A plurality of LED light-emitting chips, wherein the surface of each ceramic substrate facing away from the copper substrate is connected with one or more of the LED light-emitting chips; as well as A transparent cover is connected to the copper substrate and covers the plurality of LED light-emitting chips.

2. The light source module according to claim 1, characterized in that: The gap between at least two adjacent ceramic substrates is less than or equal to 0.2 mm.

3. The light source module according to claim 1, characterized in that: The thickness of the copper substrate is greater than or equal to 4 mm; and / or the copper substrate is a red copper substrate.

4. The light source module according to claim 1, characterized in that: The copper substrate is provided with a boss, the boss is provided with a pad, and the ceramic substrate is welded to the pad.

5. The light source module according to claim 1, characterized in that: The copper substrate is provided with a plurality of pads, each of the ceramic substrates is welded to a corresponding pad, and a solder resist structure is provided between any two adjacent pads.

6. The light source module according to claim 5, characterized in that: The solder resist structure is a solder resist layer with a width less than or equal to 0.2 mm and a thickness less than or equal to 30 μm; or, the solder resist structure is a groove structure provided on the copper substrate and with a width less than or equal to 0.2 mm.

7. The light source module according to claim 1, characterized in that: The light source module further comprises a packaging adhesive layer, which is arranged on the ceramic substrate and surrounds the plurality of LED light-emitting chips. The transparent cover is connected to the copper substrate through the packaging adhesive layer.

8. The light source module according to claim 7, characterized in that: The reflectivity of the packaging glue layer is greater than or equal to 98%, and the transmittance of the transparent cover is greater than or equal to 98.5%.

9. The light source module according to claim 1, characterized in that: A plurality of LED light-emitting chips with different luminous colors are connected to a surface of at least one of the ceramic substrates facing away from the copper substrate; And / or, the ceramic substrate is provided with an identifier.

10. A lighting device, characterized in that: include: case; as well as According to any one of claims 1 to 9, the light source module is assembled on the housing.

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