Resistance measuring equipment

Abstract

The utility model provides resistance measuring equipment, which comprises a measuring table, a probe base, a cover body, a signal transmitting piece, a signal receiving piece and a control module, the signal transmitting piece is arranged on the inner side wall of the probe base and / or the cover body and is used for transmitting signals; the signal receiving part is arranged on the inner side wall of the cover body and is opposite to the signal transmitting part; the signal receiving part is used for receiving signals; the control module is connected with the signal receiving part and the probe base, and the control module is used for controlling the probe base to stop moving according to signal receiving information sent by the signal receiving part at a first preset position of the inner side wall of the cover body, so that the depth of the probe pricking the wafer accords with the preset depth. According to the utility model, the probe insertion depth is ensured to be consistent each time, the influence of factors such as membranous quality or flatness of the wafer to be measured is avoided, the accuracy of inserting the probe into the wafer is effectively improved, and the stability of measurement is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a resistance measuring device. Background Art

[0002] The commonly used method for measuring resistance in the industry is the linear four-probe method, which requires four probes to be arranged in a row and pressed vertically on the surface of the object to be measured with a certain pressure. The four-probe measurement method is widely used in various fields to measure the square resistance Rs, especially in the production and manufacturing of semiconductor integrated circuit chips. Four-probe measurement is an essential means for testing the preparation process of various conductive films. The use of four-probes to measure the square resistance requires precise control of the penetration depth of the probe into the sample to ensure the accuracy of the measurement results.

[0003] When measuring the resistance of a wafer, the needle penetration depth is affected by the following factors: (1) Because there may be a thin oxide layer on the surface of the wafer being measured or the surface is not flat enough, the needle penetration depth of the probe cannot be too shallow during measurement; (2) The contact point between the needle tip and the sample should be hemispherical, and because the incident current diverges, the needle penetration depth cannot be too deep and should be much smaller than the needle distance; (3) The needle penetration depth is also affected by the film quality of the wafer surface being measured. Therefore, resistance (RES) measurement equipment usually has the problem of inconsistent needle penetration depth, which leads to changes in measurement results.

[0004] In the prior art, resistance measuring equipment usually locates the penetration depth of the probe on the wafer to be measured in the following two ways. The first resistance measuring equipment determines whether the probe has penetrated the wafer by monitoring the changes in voltage and current between the probes, and the second resistance measuring equipment ensures the penetration depth of the probe by detecting the pressure and acceleration under the probe. Although both resistance measuring equipment can ensure that the probe penetrates the wafer to be measured, due to the differences caused by the different film qualities on the wafer surface, there is no way to ensure that the penetration depth on different film layers is consistent, and the penetration depth cannot be detected. Utility Model Content

[0005] The purpose of the utility model is to provide a resistance measuring device, which ensures that the needle insertion depth is consistent each time, avoids the influence of factors such as film quality or flatness of the wafer being measured, effectively improves the accuracy of the probe penetrating the wafer, ensures the stability of the measurement, and solves the problem of measurement result changes caused by inconsistent needle insertion depth.

[0006] To achieve the above-mentioned purpose, the resistance measuring device of the utility model includes a measuring table, a probe base, a cover, a signal transmitting component, a signal receiving component and a control module; the measuring table is used to carry a wafer; a plurality of probes arranged toward the measuring table are provided at the bottom of the probe base, and the probe base drives the probes to move toward or away from the measuring table; the cover is arranged outside the measuring table and the probe base; the signal transmitting component is arranged on the inner side wall of the probe base and / or the cover, and the signal transmitting component is used to transmit a signal; the signal receiving component is arranged on the inner side wall of the cover and is arranged opposite to the signal transmitting component, and the signal receiving component is used to receive the signal; the control module is respectively connected to the signal receiving component and the probe base, and the control module is used to control the probe base to stop moving according to the signal reception information sent by the signal receiving component at the first preset position of the inner side wall of the cover, so that the depth of the probe penetrating into the wafer meets the preset depth.

[0007] The beneficial effects of the resistance measuring device of the utility model are as follows: the signal transmitting component is arranged on the probe base and / or the inner side wall of the cover body, and the signal transmitting component is used to transmit the signal; the signal receiving component is arranged on the inner side wall of the cover body and is arranged opposite to the signal transmitting component, and the signal receiving component is used to receive the signal; the control module is connected to the signal receiving component and the probe base respectively, and the control module is used to control the probe base to stop moving according to the signal receiving information sent by the signal receiving component at the first preset position of the inner side wall of the cover body, so that the depth of the probe penetrating into the wafer meets the preset depth That is, the signal receiving component at the first preset position on the inner wall of the cover body sends signal reception information to the control module according to the received signal situation, so that the control module can control the probe base to stop moving according to the signal reception information to locate the depth of the probe penetrating into the wafer, so that the depth of the probe penetrating into the wafer meets the preset depth, ensuring that the penetration depth is consistent each time, avoiding the influence of factors such as the film quality or flatness of the wafer itself, effectively improving the accuracy of the probe penetrating into the wafer, ensuring the stability of the measurement, and solving the problem of changes in measurement results caused by inconsistent penetration depth.

[0008] Preferably, the resistance measuring device further comprises an input module connected to the control module, the input module is used to input the preset depth of the probe inserted into the wafer, the control module is further used to control the signal receiving component to receive the signal at the first preset position according to the preset depth, and the distance L1 between the first preset position and the measuring table, the thickness L2 of the wafer, the length L3 of the probe and the preset depth L4 satisfy: L1 = L2 + L3 - L4. Its beneficial effect is that: different preset depths can be set according to actual needs, and then the signal receiving component can be adjusted to the corresponding first preset position to receive the signal to achieve the positioning of the depth of the probe inserted into the wafer, which has strong versatility and is suitable for testing wafers with different needle insertion depths and different film qualities and flatness.

[0009] Preferably, the signal receiving information includes received signal information and non-received signal information; when the signal transmitting element is arranged on the inner side wall of the cover body, it has the following characteristics: the signal receiving element is used to receive the signal at the first preset position of the inner side wall of the cover body and send the non-received signal information to the control module when the signal is not received, and the control module is used to control the probe base to stop moving according to the non-received signal information; when the signal transmitting element is arranged on the probe base, it has the following characteristics: the signal receiving element is used to receive the signal at the first preset position of the inner side wall of the cover body and send the received signal information to the control module when the signal is received, and the control module is used to control the probe base to stop moving according to the received signal information. Its beneficial effect is that the signal transmitting element can be arranged on the inner side wall of the cover body and / or on the probe base according to actual use conditions, and it has strong versatility and a wide range of applications.

[0010] Preferably, the input module is also used to input the estimated thickness of the wafer, and the control module is also used to control the signal receiving information sent by the signal receiving component at the second preset position on the inner side wall of the cover body according to the estimated thickness to measure the actual thickness of the wafer, and the distance L5 between the second preset position and the measuring platform and the estimated thickness L6 of the wafer satisfy: L5 = (L6-5μm) ~ (L6+5μm). Its beneficial effect is that it enables the actual thickness of the wafer to be detected, thereby facilitating the improvement of the accuracy of the probe penetrating the wafer and effectively ensuring the stability of the measurement.

[0011] Preferably, there are a plurality of signal receiving members, and the plurality of signal receiving members are sequentially arranged along the height direction of the inner side wall of the cover body, and the control module is used to control the signal receiving members at the first preset position and / or the second preset position of the inner side wall of the cover body to open, so that the signal receiving members at the first preset position and / or the second preset position of the inner side wall of the cover body receive the signal. Its beneficial effects are: it enables testing of wafers with different needle piercing depths and different thicknesses, and has strong versatility; and corresponding to different needle piercing depths, the signal receiving members at the corresponding first preset position of the inner side wall of the cover body are controlled to open, and corresponding to different thicknesses of wafers, the signal receiving members at the corresponding second preset position of the inner side wall of the cover body are controlled to open, forming a one-to-one targeted test, which is conducive to improving the accuracy of the probe piercing the wafer and effectively ensuring the stability of the measurement.

[0012] Preferably, the signal transmitter is arranged on the inner side wall of the cover body, and the signal transmitter is provided with a plurality of signal transmitters, and the plurality of signal transmitters are arranged in sequence along the height direction of the inner side wall of the cover body, and the signal transmitter is connected to the control module, and the control module is used to control the signal transmitter at the first preset position and / or the second preset position of the inner side wall of the cover body to be turned on, so that the signal transmitter at the first preset position and / or the second preset position of the inner side wall of the cover body emits the signal. Its beneficial effect is that: it enables testing of wafers with different needle piercing depths and different thicknesses, and has strong versatility; and corresponding to different needle piercing depths, the signal transmitter at the corresponding first preset position of the inner side wall of the cover body is controlled to be turned on, and corresponding to wafers with different thicknesses, the signal transmitter at the corresponding second preset position of the inner side wall of the cover body is controlled to be turned on, forming a one-to-one targeted test, which is conducive to improving the accuracy of the probe piercing the wafer and effectively ensuring the stability of the measurement.

[0013] Preferably, the signal receiving member is slidably disposed on the inner side wall of the cover body, and the signal receiving member slides to the first preset position and / or the second preset position of the inner side wall of the cover body to receive the signal. Its beneficial effect is that the signal receiving member slides and adjusts to the corresponding first preset position of the inner side wall of the cover body according to different needle piercing depths, and / or the signal receiving member slides and adjusts to the corresponding second preset position of the inner side wall of the cover body according to different thicknesses of wafers, so that different needle piercing depths and wafers of different thicknesses can be tested, with strong versatility, no need to set up multiple signal receiving members, and reduced cost investment.

[0014] Preferably, the signal transmitter is slidably disposed on the inner side wall of the cover body, and the signal transmitter slides to the first preset position and / or the second preset position of the inner side wall of the cover body to transmit the signal. Its beneficial effect is that the signal transmitter slides and adjusts to the corresponding first preset position of the inner side wall of the cover body according to different needle piercing depths, and / or the signal transmitter slides and adjusts to the corresponding second preset position of the inner side wall of the cover body according to different thicknesses of wafers, so that different needle piercing depths and different thicknesses of wafers can be tested, with strong versatility, no need to set up multiple signal transmitters, and reduced cost investment.

[0015] Preferably, a symmetrical inner side wall of the cover body is respectively provided with a guide rail arranged along the height direction of the inner side wall of the cover body, and the guide rail is provided with a plurality of fixed parts arranged at intervals, and the signal receiving component is fixed to the fixed part of the first preset position and / or the second preset position of one of the guide rails, and the signal emitting component is fixed to the fixed part of the first preset position and / or the second preset position of the other guide rail. Its beneficial effect is that the fixed part is set at the corresponding position of the guide rail according to the first preset position and / or the second preset position, and the signal receiving component and the signal emitting component are directly adjusted to the position of the fixed part and fixed to perform the test during the test, which greatly improves the test efficiency, and is conducive to improving the accuracy of the probe piercing the wafer, and effectively ensures the stability of the measurement.

[0016] Preferably, the signal receiving component and the signal emitting component are both slidably arranged on the guide rail via a slider, the two symmetrical outer walls of the slider are provided with any one of a groove and a boss, the fixing part is a U-shaped bracket, the two symmetrical inner walls of the U-shaped bracket are provided with the other of the groove and the boss, and the groove and the boss are adapted. The beneficial effect is that the signal receiving component and the signal emitting component are fixed to the fixing part by the boss being inserted into the groove, which is convenient and quick, and improves the test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the structure of a resistance measuring device according to a first embodiment of the present utility model;

[0018] Figure 2 This is a schematic diagram of the structure of a resistance measuring device according to a second embodiment of the present invention;

[0019] Figure 3 for Figure 2 The schematic diagram of the use status of the resistance measuring device shown;

[0020] Figure 4 This is a schematic structural diagram of a resistance measuring device according to a third embodiment of the present utility model;

[0021] Figure 5 It is a structural schematic diagram of a resistance measuring device according to a fourth embodiment of the present utility model. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the utility model belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0023] In order to overcome the problems existing in the prior art, an embodiment of the utility model provides a resistance measuring device, which ensures that the depth of each needle insertion is consistent, avoids the influence of factors such as film quality or flatness of the wafer being measured, effectively improves the accuracy of the probe penetrating the wafer, ensures the stability of the measurement, and solves the problem of changes in measurement results caused by inconsistent needle insertion depth.

[0024] Figure 1 This is a schematic diagram of the structure of a resistance measuring device according to a first embodiment of the present utility model; Figure 2 This is a schematic diagram of the structure of a resistance measuring device according to a second embodiment of the present invention; Figure 3 for Figure 2 The schematic diagram of the use status of the resistance measuring device shown; Figure 4 This is a schematic structural diagram of a resistance measuring device according to a third embodiment of the present utility model; Figure 5 It is a structural schematic diagram of a resistance measuring device according to a fourth embodiment of the present utility model.

[0025] In some embodiments of the present invention, reference Figures 1 to 5The resistance measuring device comprises a measuring platform 1, a probe base 2, a cover 3, a signal transmitter 4, a signal receiver 5 and a control module (not shown in the figure); the measuring platform 1 is used to carry a wafer 6; the bottom of the probe base 2 is provided with a plurality of probes 21 arranged toward the measuring platform 1, and the probe base 2 drives the probes 21 to move toward or away from the wafer 6 on the measuring platform 1; the cover 3 is arranged outside the measuring platform 1 and the probe base 2; the signal transmitter 4 is arranged on the inner side wall of the probe base 2 and / or the cover 3, and the signal receiver 5 is arranged on the inner side wall of the probe base 2 and / or the cover 3. The transmitting element 4 is used for transmitting signals; the signal receiving element 5 is arranged on the inner wall of the cover body 3 and is arranged opposite to the signal transmitting element 4, and the signal receiving element 5 is used for receiving the signal; the control module (not shown in the figure) is respectively connected to the signal receiving element 5 and the probe base 2, and the control module (not shown in the figure) is used for controlling the probe base 2 to stop moving according to the signal reception information sent by the signal receiving element 5 at the first preset position 31 on the inner wall of the cover body 3, so that the depth of the probe 21 penetrating into the wafer 6 meets the preset depth.

[0026] Specifically, the signal transmitting component 4 is arranged on the inner wall of the probe base 2 and / or the cover body 3, and the signal transmitting component 4 is used to transmit the signal; the signal receiving component 5 is arranged on the inner wall of the cover body 3 and is arranged opposite to the signal transmitting component 4, and the signal receiving component 5 is used to receive the signal; the control module is connected to the signal receiving component 5 and the probe base 2 respectively, and the control module is used to control the probe base 2 to stop moving according to the signal reception information sent by the signal receiving component 5 at the first preset position 31 on the inner wall of the cover body 3, so that the depth of the probe penetrating into the wafer 6 meets the preset depth, that is, at the preset position 31, the probe is inserted into the wafer 6. The signal receiving element 5 at the first preset position 31 of the inner wall of the cover body 3 sends signal receiving information to the control module according to the received signal situation, so that the control module can control the probe base 2 to stop moving according to the signal receiving information to locate the depth of the probe penetrating into the wafer 6, so that the depth of the probe penetrating into the wafer 6 meets the preset depth, ensuring that the penetration depth is consistent each time, avoiding the influence of factors such as film quality or flatness of the wafer 6 itself, effectively improving the accuracy of the probe 21 penetrating into the wafer 6, ensuring the stability of the measurement, and solving the problem of changes in measurement results caused by inconsistent penetration depth.

[0027] In some embodiments of the utility model, the resistance measuring device further includes an input module connected to the control module, the input module is used to input the preset depth of the probe inserted into the wafer, the control module is also used to control the signal receiving component to receive the signal at the first preset position according to the preset depth, and the distance L1 between the first preset position and the measuring table, the thickness L2 of the wafer, the length L3 of the probe and the preset depth L4 satisfy: L1 = L2 + L3 - L4. Different preset depths can be set according to actual needs, and then the signal receiving component can be adjusted to the corresponding first preset position to receive the signal to achieve the positioning of the depth of the probe inserted into the wafer. It has strong versatility and is suitable for testing wafers with different needle insertion depths and different film qualities and flatness.

[0028] In some embodiments of the present invention, the signal reception information includes received signal information and not received signal information.

[0029] In some embodiments of the present invention, reference Figure 1 and Figure 2 , when the signal transmitting component 4 is arranged on the inner wall of the cover body 3, it has the following characteristics: the signal receiving component 5 is used to receive the signal at the first preset position 31 of the inner wall of the cover body 3 and send the signal not received information to the control module when the signal is not received, and the control module is used to control the probe base 2 to stop moving according to the signal not received information, that is, the signal emitted by the signal transmitting component 4 is blocked by the probe base 2 which moves to a position flush with the first preset position 31, so that the signal receiving component 5 which has been receiving the signal does not receive the signal, indicating that the probe base 2 has reached a position flush with the first preset position 31, that is, the depth of the probe 21 inserted into the wafer 6 meets the preset depth. At this time, the control module controls the probe base 2 to stop moving according to the signal not received information, so as to locate the depth of the probe inserted into the wafer 6.

[0030] In some embodiments of the present invention, reference Figure 4 and Figure 5, when the signal transmitting component 4 is arranged on the probe base 2, it has the following characteristics: the signal receiving component 5 is used to receive the signal at the first preset position 31 on the inner wall of the cover body 3 and send the received signal information to the control module when receiving the signal, and the control module is used to control the probe base 2 to stop moving according to the received signal information, that is, when the probe base 2 moves to a position flush with the first preset position 31, the signal emitted by the signal transmitting component 4 on the probe base 2 is received by the signal receiving component 5 at the first preset position 31, indicating that the probe base 2 has reached a position flush with the first preset position 31, that is, the depth of the probe 21 inserted into the wafer 6 meets the preset depth. At this time, the control module controls the probe base 2 to stop moving according to the received signal information, so as to locate the depth of the probe inserted into the wafer 6.

[0031] In some specific embodiments of the present utility model, reference Figures 1 to 3 The signal transmitter 4 is disposed on the inner wall of the cover body 3, and the signal receiver 5 is disposed on the inner wall of the cover body 3 and is disposed opposite to the signal transmitter 4. The signal transmitter 4 at the first preset position 31 of the inner wall of the cover body 3 transmits the signal, and the signal receiver 5 at the first preset position 31 of the inner wall of the cover body 3 receives the signal and sends the received signal information to the control module, such as Figure 2 The probe base 2 moves toward the measuring platform 1. When the probe base 2 moves to a position flush with the first preset position 31, the signal emitted by the signal emitting element 4 at the first preset position 31 of the inner wall of the cover body 3 is blocked by the probe base 2, and the signal receiving element 5 at the first preset position 31 of the inner wall of the cover body 3 does not receive the signal, so as to send a signal-not-received information to the control module. Figure 3 As shown, the control module controls the probe base 2 to stop moving according to the signal information not being received, so that the depth of the probe 21 penetrating into the wafer 6 meets the preset depth.

[0032] In some other specific embodiments of the present invention, reference is made to Figure 4 and Figure 5, the signal transmitting component 4 is arranged on the probe base 2, and the signal receiving component 5 is arranged on the inner wall of the cover body 3 and is arranged opposite to the signal transmitting component 4. At the beginning, the signal transmitting component 4 on the probe base 2 transmits the signal, but the signal receiving component 5 at the first preset position 31 of the inner wall of the cover body 3 does not receive the signal to send the signal not received information to the control module, and the probe base 2 moves toward the measuring table 1. When the probe base 2 moves to a position flush with the first preset position 31, the signal emitted by the signal transmitting component 4 on the probe base 2 is received by the signal receiving component 5 at the first preset position 31 of the inner wall of the cover body 3. At this time, the signal receiving component 5 sends the received signal information to the control module, and the control module controls the probe base 2 to stop moving according to the received signal information, so that the depth of the probe 21 inserted into the wafer 6 meets the preset depth.

[0033] In some embodiments of the utility model, the input module is also used to input the estimated thickness of the wafer, and the control module is also used to control the signal receiving information sent by the signal receiving component at the second preset position of the inner side wall of the cover body according to the estimated thickness to measure the actual thickness of the wafer, and the distance L5 between the second preset position and the measuring platform and the estimated thickness L6 of the wafer satisfy: L5 = (L6-5μm) ~ (L6+5μm). The actual thickness of the wafer can be detected, which is conducive to improving the accuracy of the probe piercing the wafer and effectively ensuring the stability of the measurement.

[0034] In some specific embodiments of the present invention, the thickness L2 of the wafer is equal to the actual thickness of the wafer, which is beneficial to improving the accuracy of the probe penetrating into the wafer and effectively ensuring the stability of the measurement.

[0035] In an embodiment of the present invention, the first preset position is a fixed value coordinate position of the inner side wall of the cover body, and the second preset position is a section position of the inner side wall of the cover body.

[0036] In some specific embodiments of the present utility model, reference Figure 2 , Figure 3 and Figure 5, the signal transmitter 4 is disposed at the second preset position 32 of the inner side wall of the cover body 3, and the signal receiver 5 is disposed at the second preset position 32 of the inner side wall of the cover body 3 and is disposed opposite to the signal transmitter 4. When the signal emitted by the signal transmitter 4 at the second preset position 32 of the inner side wall of the cover body 3 is blocked by the wafer 6, the signal receiver 5 at the second preset position 32 of the inner side wall of the cover body 3 does not receive the signal, so as to send a signal non-receiving information to the control module, and the control module can measure the actual thickness of the wafer 6 according to the signal non-receiving information.

[0037] In some embodiments of the present invention, reference Figures 1 to 3 , Figure 5 , the signal receiving components 5 are provided in a plurality, and the plurality of signal receiving components 5 are sequentially arranged along the height direction of the inner side wall of the cover body 3, and the control module is used to control the signal receiving components 5 at the first preset position 31 and / or the second preset position 32 of the inner side wall of the cover body 3 to be opened, so that the signal receiving components 5 at the first preset position 31 and / or the second preset position 32 of the inner side wall of the cover body 3 receive the signal. This allows the testing of wafers 6 of different needle piercing depths and different thicknesses, and has strong versatility; and the signal receiving components 5 at the corresponding first preset position 31 of the inner side wall of the cover body 3 are controlled to be opened corresponding to different needle piercing depths, and the signal receiving components 5 at the corresponding second preset position 32 of the inner side wall of the cover body 3 are controlled to be opened corresponding to wafers 6 of different thicknesses, forming a one-to-one targeted test, which is conducive to improving the accuracy of the probe piercing the wafer 6 and effectively ensuring the stability of the measurement.

[0038] In some embodiments of the present invention, reference Figures 1 to 3The signal transmitter 4 is arranged on the inner wall of the cover 3, and the signal transmitter 4 is provided with a plurality of signal transmitters 4, which are arranged in sequence along the height direction of the inner wall of the cover 3. The signal transmitter 4 is connected to the control module, and the control module is used to control the signal transmitter 4 at the first preset position 31 and / or the second preset position 32 of the inner wall of the cover 3 to be turned on, so that the signal transmitter 4 at the first preset position 31 and / or the second preset position 32 of the inner wall of the cover 3 emits the signal. This allows different needle piercing depths and wafers 6 of different thicknesses to be tested, and has strong versatility; and corresponding to different needle piercing depths, the signal transmitter 4 corresponding to the first preset position 31 of the inner wall of the cover 3 is controlled to be turned on, and corresponding to different thicknesses of wafers 6, the signal transmitter 4 corresponding to the second preset position 32 of the inner wall of the cover 3 is controlled to be turned on, forming a one-to-one targeted test, which is conducive to improving the accuracy of the probe piercing the wafer 6 and effectively ensuring the stability of the measurement.

[0039] In some specific embodiments of the present utility model, reference Figure 1 , the signal transmitter 4 and the signal receiver 5 are relatively arranged on a symmetrical inner wall of the cover body 3, and the signal transmitter 4 and the signal receiver 5 are both provided with a plurality of them, and the plurality of the signal transmitters 4 are sequentially arranged along the height direction of one inner wall of the cover body 3, and the plurality of the signal receivers 5 are sequentially arranged along the height direction of the other inner wall of the cover body 3. The plurality of the signal transmitters 4 respectively transmit the signals, and the plurality of the signal receivers 5 respectively receive the corresponding signals. The probe base 2 moves toward the measuring table 1. When the probe base 2 moves to a position flush with the first preset position 31, the signal emitted by the signal transmitter 4 at the first preset position 31 of the inner wall of the cover body 3 is blocked by the probe base 2, and the signal receiver 5 at the first preset position 31 of the inner wall of the cover body 3 does not receive the signal to send the signal not received information to the control module. At this time, the control module controls the probe base 2 to stop moving according to the signal not received information, so that the depth of the probe 21 inserted into the wafer 6 meets the preset depth.

[0040] In other embodiments of the present invention, reference Figure 2 and Figure 3The signal transmitter 4 and the signal receiving element 5 are relatively arranged on a symmetrical inner side wall of the cover body 3, and a plurality of the signal transmitters 4 and the signal receiving elements 5 are provided. The plurality of signal transmitters 4 are arranged in sequence along the height direction of one inner side wall of the cover body 3, and the plurality of signal receiving elements 5 are arranged in sequence along the height direction of the other inner side wall of the cover body 3. The control module is used to control the signal transmitter 4 and the signal receiving element 5 at the first preset position 31 of the inner side wall of the cover body 3 to be turned on, so that the signal transmitter 4 at the first preset position 31 of the cover body 3 transmits the signal, and the signal receiving element 5 at the first preset position 31 of the inner side wall of the cover body 3 receives the signal. When the probe base 2 moves to a position flush with the first preset position 31, the signal emitted by the signal transmitter 4 at the first preset position 31 of the inner wall of the cover body 3 is blocked by the probe base 2, and the signal receiver 5 at the first preset position 31 of the inner wall of the cover body 3 does not receive the signal and sends a signal non-receiving information to the control module. At this time, the control module controls the probe base 2 to stop moving according to the signal non-receiving information, so that the depth of the probe 21 inserted into the wafer 6 meets the preset depth. Figure 1 In the embodiment described, the control module in this embodiment controls the signal transmitting component 4 and the signal receiving component 5 at the first preset position 31 of the inner wall of the cover body 3 to open, which can save energy consumption and reduce loss and cost.

[0041] In some embodiments of the present invention, reference Figure 2 , Figure 3 and Figure 5 , a plurality of the signal emitting elements 4 are provided at the second preset position 32 of one inner side wall of the cover body 3, and a plurality of the signal receiving elements 5 are provided at the second preset position 32 of the other symmetrical inner side wall of the cover body 3. The control module is used to control the signal emitting elements 4 and the signal receiving elements 5 at the second preset position 32 of the inner side wall of the cover body 3 to be turned on, so that the signal emitting elements 4 at the second preset position 32 of the inner side wall of the cover body 3 emit the signal, and the signal receiving elements 5 at the second preset position 32 of the inner side wall of the cover body 3 receive the signal. When the signals emitted by the signal emitting elements 4 in a section of the second preset position 32 of the inner side wall of the cover body 3 are blocked by the wafer 6, the signal receiving elements 5 in the corresponding area of ​​the second preset position 32 of the inner side wall of the cover body 3 do not receive the signal, so as to send the signal not received information to the control module, and the control module can measure the actual thickness of the wafer 6 according to the signal not received information, that is, the actual thickness of the wafer 6 can be calculated according to the height of the section.

[0042] In some embodiments of the present invention, reference Figure 5 The signal emitting component includes a first signal emitting component 41 and a second signal emitting component 42. The first signal emitting component 41 is arranged on the probe base 2. A plurality of second signal emitting components 42 are arranged on the second preset position 32 of an inner side wall of the cover body 3. A plurality of signal receiving components 5 are arranged on the first preset position 31 and the second preset position 32 of another symmetrical inner side wall of the cover body 3. The control module is used to control the second signal emitting component 42 at the second preset position 32 of the inner wall of the cover body 3, and the signal receiving components 5 at the first preset position 31 and the second preset position 32 of the inner wall of the cover body 3 to be turned on, so that the second signal emitting component 42 at the second preset position 32 of the cover body 3 emits the signal, and the signal receiving component 5 at the second preset position 32 of the inner wall of the cover body 3 receives the signal, so as to test the actual thickness of the wafer 6; and to enable the first signal emitting component 41 on the probe base 2 to emit the signal, and the signal receiving component 5 at the first preset position 31 of the inner wall of the cover body 3 receives the signal, so as to locate the depth of the probe 21 penetrating into the wafer 6.

[0043] In some embodiments of the present invention, reference Figure 4 , the signal receiving member 5 is slidably disposed on the inner side wall of the cover body 3, and the signal receiving member 5 slides to the first preset position 31 and / or the second preset position 32 of the inner side wall of the cover body 3 to receive the signal. That is, the signal receiving member 5 is slidably adjusted to the corresponding first preset position 31 of the inner side wall of the cover body 3 according to different needle piercing depths, and / or the signal receiving member 5 is slidably adjusted to the corresponding second preset position 32 of the inner side wall of the cover body 3 according to different thicknesses of the wafer 6, so that different needle piercing depths and different thicknesses of wafers 6 can be tested, with strong versatility, no need to set up multiple signal receiving members 5, and reduced cost investment.

[0044] In some embodiments of the utility model, the signal transmitter 4 is slidably disposed on the inner side wall of the cover body 3, and the signal transmitter 4 slides to the first preset position 31 and / or the second preset position 32 of the inner side wall of the cover body 3 to transmit the signal. That is, the signal transmitter 4 is slidably adjusted to the corresponding first preset position 31 of the inner side wall of the cover body 3 according to different needle piercing depths, and / or the signal transmitter 4 is slidably adjusted to the corresponding second preset position 32 of the inner side wall of the cover body 3 according to different thicknesses of the wafer 6, so that different needle piercing depths and different thicknesses of wafers 6 can be tested, with strong versatility, no need to set up multiple signal transmitters 4, and reduced cost investment.

[0045] In some embodiments of the utility model, a symmetrical inner side wall of the cover body 3 is respectively provided with a guide rail arranged along the height direction of the inner side wall of the cover body 3, and the guide rail is provided with a plurality of fixed parts arranged at intervals, and the signal receiving component 5 is fixed to the fixed part of the first preset position 31 and / or the second preset position 32 of one of the guide rails, and the signal emitting component 4 is fixed to the fixed part of the first preset position 31 and / or the second preset position 32 of another guide rail. Its beneficial effect is that the fixed part is set at the corresponding position of the guide rail according to the first preset position 31 and / or the second preset position 32, and the signal receiving component 5 and the signal emitting component 4 are directly adjusted to the position of the fixed part and fixed to perform the test during the test, which greatly improves the test efficiency, and is conducive to improving the accuracy of the probe piercing the wafer 6, and effectively ensures the stability of the measurement.

[0046] In some specific embodiments of the present utility model, reference Figure 4 , the signal transmitting component 4 is arranged on the probe base 2, an inner side wall of the cover body 3 is provided with a guide rail arranged along the height direction of the inner side wall of the cover body 3, and the signal receiving component 5 is slidably arranged on the guide rail. The control module controls the signal receiving component 5 to slide to the first preset position 31 of the inner side wall of the cover body 3. When the probe base 2 moves to a position flush with the first preset position 31, the signal emitted by the signal transmitting component 4 on the probe base 2 is received by the signal receiving component 5 at the first preset position 31, and at this time, the signal receiving component 5 sends a received signal information to the control module, and the control module controls the probe base 2 to stop moving according to the received signal information, so that the depth of the probe 21 inserted into the wafer 6 meets the preset depth.

[0047] In some other specific embodiments of the utility model, a symmetrical inner side wall of the cover body 3 is respectively provided with a guide rail arranged along the height direction of the inner side wall of the cover body 3, that is, the guide rails are respectively a first guide rail and a second guide rail, the signal transmitter 4 is slidably arranged on the first guide rail, and the signal receiver 5 is slidably arranged on the second guide rail. The control module controls the signal transmitter 4 to slide to the first preset position 31 of the inner side wall of the cover body 3 to transmit the signal, and the control module controls the signal receiver 5 to slide to the first preset position 31 of the inner side wall of the cover body 3 to receive the signal. When the probe base 2 moves to a position flush with the first preset position 31, the signal emitted by the signal emitting component 4 at the first preset position 31 of the inner wall of the cover body 3 is blocked by the probe base 2, and the signal receiving component 5 at the first preset position 31 of the inner wall of the cover body 3 does not receive the signal to send a signal non-receiving information to the control module. At this time, the control module controls the probe base 2 to stop moving according to the signal non-receiving information so that the depth of the probe 21 penetrating into the wafer 6 meets the preset depth.

[0048] In some specific embodiments of the utility model, a symmetrical inner wall of the cover body 3 is respectively provided with a guide rail arranged along the height direction of the inner wall of the cover body 3, that is, the guide rails are respectively a first guide rail and a second guide rail, the signal transmitter 4 is slidably arranged on the first guide rail, and the signal receiver 5 is slidably arranged on the second guide rail. The control module controls the signal transmitter 4 to slide to the second preset position 32 of the inner wall of the cover body 3 to transmit the signal, and the control module controls the signal receiver 5 to slide to the second preset position 32 of the inner wall of the cover body 3 to receive the signal. When the signal transmitter 4 moves to a section of the second preset position 32 of the inner wall of the cover body 3, the signal emitted is blocked by the wafer 6, and the signal receiver 5 does not receive the signal in the corresponding area of ​​the second preset position 32 of the inner wall of the cover body 3, so as to send the signal non-receiving information to the control module, and the control module can measure the actual thickness of the wafer 6 according to the signal non-receiving information.

[0049] In some specific embodiments of the utility model, a symmetrical inner side wall of the cover body 3 is respectively provided with a guide rail arranged along the height direction of the inner side wall of the cover body 3, that is, the guide rails are respectively a first guide rail and a second guide rail, the signal transmitter 4 is slidably arranged on the first guide rail, and the signal receiver 5 is slidably arranged on the second guide rail. First, the control module first controls the signal transmitter 4 to slide to the second preset position 32 of the inner side wall of the cover body 3 to transmit the signal, and controls the signal receiver 5 to slide to the second preset position 32 of the inner side wall of the cover body 3 to receive the signal, so as to test the actual thickness of the wafer 6. Then, the control module controls the signal transmitter 4 to slide to the first preset position 31 of the inner side wall of the cover body 3 to transmit the signal, and the control module controls the signal receiver 5 to slide to the first preset position 31 of the inner side wall of the cover body 3 to receive the signal, so as to locate the depth of the probe 21 inserted into the wafer 6.

[0050] In some embodiments of the present invention, the distance between the fixing portions is equal to the difference between different needle insertion depths that need to be measured, and / or the distance between the fixing portions is equal to the difference between thicknesses of wafers of different thicknesses.

[0051] In some embodiments of the utility model, the signal receiving component and the signal emitting component are both slidably arranged on the guide rail through a slider, and the two symmetrical outer walls of the slider are provided with any one of a groove and a boss, and the fixing part is a U-shaped bracket, and the two symmetrical inner walls of the U-shaped bracket are provided with the other of the groove and the boss, and the groove and the boss are adapted. The signal receiving component and the signal emitting component are fixed to the fixing part by the boss being inserted into the groove, which is convenient and quick, and improves the test efficiency.

[0052] In some embodiments of the utility model, the signal transmitting element is any one of an infrared transmitter, a laser transmitter or a light source, and the signal receiving element is a corresponding detector.

[0053] In some embodiments of the utility model, a distance detector is installed on the active surface of the probe base facing the measuring table, that is, the depth of the probe penetrating into the wafer is controlled in real time by real-time detection of the distance between the probe base and the wafer surface to ensure the stability of measurement.

[0054] In some embodiments of the present invention, reference Figure 2 and Figure 3 The measuring method of the resistance measuring device comprises the following steps:

[0055] S1, inputting the estimated thickness L6 of the wafer and the preset depth L4 of the probe inserted into the wafer into the input module;

[0056] S2, the control module controls the signal transmitting element 4 and the signal receiving element 5 in the second preset position 32 area of ​​the inner wall of the cover body 3 to turn on according to the estimated thickness L6, so as to measure the actual thickness of the wafer;

[0057] S3, the control module obtains the coordinates of the first preset position according to the preset depth L4, the length L3 of the probe and the actual thickness L2 of the wafer, and controls the signal transmitter 4 and the signal receiver 5 at the first preset position 31 of the inner wall of the cover body 3 to turn on;

[0058] S4, the control module controls the probe base 2 to move toward the measuring table 1. When the probe base 2 moves to a position flush with the first preset position 31, the signal emitted by the signal emitting component 4 at the first preset position 31 of the inner wall of the cover body 3 is blocked by the probe base 2. The signal receiving component 5 at the first preset position 31 of the inner wall of the cover body 3 does not receive the signal and sends a signal non-receiving information to the control module. The control module controls the probe base 2 to stop moving according to the signal non-receiving information so that the depth of the probe 21 penetrating into the wafer 6 meets the preset depth.

[0059] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A resistance measuring device, characterized in that: include: A measuring table for holding wafers; A probe base, with a plurality of probes disposed toward the measuring platform at the bottom, and the probe base drives the probes to move toward or away from the measuring platform; A cover body, which is arranged outside the measuring platform and the probe base; A signal emitting element, disposed on the probe base and / or the inner side wall of the cover, and used for emitting a signal; A signal receiving element, arranged on the inner side wall of the cover body and opposite to the signal transmitting element, and the signal receiving element is used to receive the signal; A control module is connected to the signal receiving component and the probe base respectively. The control module is used to control the probe base to stop moving according to the signal receiving information sent by the signal receiving component at the first preset position on the inner wall of the cover body, so that the depth of the probe penetrating into the wafer meets the preset depth.

2. The resistance measuring device according to claim 1, characterized in that: It also includes an input module connected to the control module, the input module is used to input the preset depth of the probe penetrating the wafer, and the control module is also used to control the signal receiving component to receive the signal at the first preset position according to the preset depth, and the distance L1 between the first preset position and the measuring table, the thickness L2 of the wafer, the length L3 of the probe and the preset depth L4 satisfy: L1=L2+L3-L4.

3. The resistance measuring device according to claim 1, characterized in that: The signal reception information includes received signal information and not received signal information; When the signal emitting element is disposed on the inner side wall of the cover body, it has the following characteristics: The signal receiving member is used to receive the signal at a first preset position of the inner side wall of the cover body and send the signal non-receiving information to the control module when the signal is not received, and the control module is used to control the probe base to stop moving according to the signal non-receiving information; When the signal transmitting component is arranged on the probe base, it has the following characteristics: the signal receiving component is used to receive the signal at a first preset position on the inner wall of the cover body and send the received signal information to the control module when receiving the signal, and the control module is used to control the probe base to stop moving according to the received signal information.

4. The resistance measuring device according to claim 2, characterized in that: The input module is also used to input the estimated thickness of the wafer, and the control module is also used to control the signal receiving information sent by the signal receiving component at the second preset position on the inner wall of the cover body according to the estimated thickness to measure the actual thickness of the wafer. The distance L5 between the second preset position and the measuring platform and the estimated thickness L6 of the wafer satisfy: L5 = (L6-5μm) ~ (L6+5μm).

5. The resistance measuring device according to claim 4, characterized in that: There are a plurality of signal receiving components, and the plurality of signal receiving components are arranged sequentially along the height direction of the inner side wall of the cover body. The control module is used to control the signal receiving components at the first preset position and / or the second preset position of the inner side wall of the cover body to open, so that the signal receiving components at the first preset position and / or the second preset position of the inner side wall of the cover body receive the signal.

6. The resistance measuring device according to claim 4, characterized in that: The signal transmitter is arranged on the inner side wall of the cover body, and there are a plurality of the signal transmitters, which are arranged sequentially along the height direction of the inner side wall of the cover body. The signal transmitter is connected to the control module, and the control module is used to control the signal transmitter at the first preset position and / or the second preset position of the inner side wall of the cover body to be turned on, so that the signal transmitter at the first preset position and / or the second preset position of the inner side wall of the cover body emits the signal.

7. The resistance measuring device according to claim 4, characterized in that: The signal receiving member is slidably disposed on the inner side wall of the cover body, and the signal receiving member slides to the first preset position and / or the second preset position of the inner side wall of the cover body to receive the signal.

8. The resistance measuring device according to claim 7, characterized in that: The signal emitting element is slidably disposed on the inner side wall of the cover body, and the signal emitting element slides to the first preset position and / or the second preset position of the inner side wall of the cover body to emit the signal.

9. The resistance measuring device according to claim 8, characterized in that: A symmetrical inner side wall of the cover body is respectively provided with a guide rail arranged along the height direction of the inner side wall of the cover body, and the guide rail is provided with a plurality of fixing parts arranged at intervals. The signal receiving component is fixed to the fixing part of the first preset position and / or the second preset position of one of the guide rails, and the signal transmitting component is fixed to the fixing part of the first preset position and / or the second preset position of the other guide rail.

10. The resistance measuring device according to claim 9, characterized in that: The signal receiving component and the signal transmitting component are both slidably arranged on the guide rail through a slider, and the two symmetrical outer walls of the slider are provided with any one of the grooves and the bosses. The fixing part is a U-shaped bracket, and the two symmetrical inner walls of the U-shaped bracket are provided with the other of the grooves and the bosses, and the grooves and the bosses are adapted to each other.

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