Heat dissipation module and notebook computer

Abstract

The utility model discloses a heat dissipation module, which is applied to electronic equipment, the heat dissipation module comprises a heat pipe and a heat conduction interface plate used for bonding the heat pipe and an electronic element of a PCB (printed circuit board) in the electronic equipment, and the heat conduction interface plate is made of a low-melting-point metal matrix composite material. Compared with the prior art, the heat conduction interface plate of the heat dissipation module is made of the metal matrix composite material with the low melting point, and the metal matrix composite material has the advantages of excellent heat conductivity, machinability and low thermal expansion, so that the metal matrix composite material can be used as a heat interface material of a heat pipe and an electronic element, and can also be used as a heat conduction plate, and therefore, the heat dissipation module can be used for heat dissipation. According to the heat dissipation module, a heat conduction plate in a traditional heat dissipation module of the notebook computer is omitted, the stacking thickness can be effectively reduced, the weight can be reduced, meanwhile, screw fixing is not needed, and assembling is easy. The utility model further discloses a notebook computer.

Description

Technical Field

[0001] The utility model relates to the field of electronic products, and more specifically to a heat dissipation module and a notebook computer. Background Art

[0002] The heat dissipation module in the current laptop usually uses heat pipes for heat dissipation, such as Figure 1 As shown, the heat pipe 11 indirectly contacts the electronic components 141 on the PCB board 14 using the thermal interface material 13 and the thermal conductive plate 12, and is fixed to the PCB board 14 by screws 15 and the like. However, the stacking thickness of the heat dissipation module is relatively high due to the components such as the screws 15, which affects the thinness of the notebook computer. At present, the heat pipe 11 is generally flattened to reduce the thickness of the heat dissipation module, but if the heat pipe 11 is too thin, its thermal conductivity will be quickly reduced, which affects the heat dissipation performance of the notebook computer. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a heat dissipation module and a notebook computer with better heat dissipation performance and smaller stacking thickness.

[0004] In order to solve the above technical problems, according to one aspect of the utility model, a heat dissipation module is provided, which is applied to electronic equipment, and includes a heat pipe and a thermal interface plate for bonding the heat pipe and the electronic components of the PCB board in the electronic equipment, and the thermal interface plate is made of a low melting point metal-based composite material.

[0005] A further technical solution is as follows: the melting point of the low-melting-point metal-based composite material is 150°C-215°C.

[0006] A further technical solution is as follows: the melting point of the low-melting-point metal-based composite material is 150°C-180°C.

[0007] To solve the above technical problems, according to another aspect of the utility model, a laptop computer is provided, comprising a shell, a PCB board located inside the shell, and the above-mentioned heat dissipation module, wherein the thermal interface plate of the heat dissipation module is located between one side of the electronic components in the PCB board and the heat pipe, and is bonded to the heat pipe and the electronic components.

[0008] Compared with the prior art, the heat dissipation module of the utility model is provided with a thermal interface plate, and the thermal interface plate is made of a metal-based composite material with a low melting point. The metal-based composite material has the advantages of excellent thermal conductivity, processability and low thermal expansion. When used in a laptop computer, the electronic components in the laptop computer and the heat pipe for heat dissipation are connected through the thermal interface plate. It can be used as a thermal interface material for the heat pipe and the electronic components, and can also be used as a thermal plate. It can be seen that the heat dissipation module of the utility model eliminates the thermal plate in the heat dissipation module of the traditional laptop computer, which can effectively reduce the thickness of the stack and reduce the weight. At the same time, no screws are required for fixing, and the assembly is simple. In addition, the connection through holes are reduced on the PCB board of the laptop computer, which is conducive to wiring. The heat dissipation module of the utility model not only reduces the weight, but also reduces the thickness of the internal stack of the laptop computer, and the entire laptop computer can be designed to be lighter and thinner. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a cross-sectional schematic diagram of the connection between the heat dissipation module and the PCB board in the prior art.

[0010] Figure 2 It is a cross-sectional schematic diagram of the connection between the heat dissipation module and the PCB board provided by the first embodiment of the utility model.

[0011] Figure 3 It is a cross-sectional schematic diagram of the connection between the heat dissipation module and the PCB board provided by the second embodiment of the utility model. DETAILED DESCRIPTION

[0012] In order to enable ordinary technicians in the field to more clearly understand the purpose, technical solutions and advantages of the utility model, the utility model is further explained below in conjunction with the accompanying drawings and embodiments.

[0013] Reference Figure 2 , Figure 2 The cross-sectional schematic diagram of the connection between the heat dissipation module 20 and the PCB board 24 provided in the first embodiment of the utility model shows a specific embodiment of the heat dissipation module 20 of the utility model. The heat dissipation module 20 of the utility model can be applied to electronic devices to dissipate heat for electronic components 241 in the PCB board 24 in the electronic device, wherein the electronic device can be a laptop computer, etc.

[0014] In the embodiment shown in the accompanying drawings, the heat dissipation module 20 includes a heat pipe 21 and a thermal interface plate 22 for bonding the heat pipe 21 and the electronic components 241 of the PCB board 24 in the electronic device, and the thermal interface plate 22 is made of a low-melting-point metal-based composite material. Based on the above design, the metal-based composite material has the advantages of excellent thermal conductivity, processability and low thermal expansion, and can be used as a bonding material for the heat pipe 21 and the electronic component 241. In the utility model, the thermal interface plate 22 made of the low-melting-point metal-based composite material can be used to bond the electronic component 241 of the PCB board 24 in the electronic device and the heat pipe 21 for dissipating heat from the electronic component 241. The thermal interface plate 22 of the utility model can not only be used as a thermal interface material for the heat pipe 21 and the electronic component 241, but also has good interface wettability with the electronic component 241 and the heat pipe 21. At the same time, it can also be used as a heat conduction plate, that is, the heat conduction plate between the heat pipe 21 and the heating element (that is, the electronic component 241 on the PCB board 24) in the traditional electronic product is cancelled, which can effectively reduce the stacking thickness and the weight. When used in the heat dissipation design of electronic products, it is conducive to the lightweight design of electronic products. At the same time, there is no need to fix the heat dissipation module 20 and the PCB board 24 with screws, and the assembly is simple. The connection through holes on the PCB board 24 can also be reduced, which is conducive to wiring.

[0015] In some embodiments, the melting point of the low-melting-point metal-based composite material is 150°C-215°C. In the present invention, the melting point of the low-melting-point metal-based composite material is higher than the maximum operating temperature of the electronic component 241 and lower than the maximum temperature of the SMT reflow soldering of the electronic component 241, and can be a value between 150°C-215°C. Preferably, in this embodiment, the melting point of the low-melting-point metal-based composite material is 150°C-180°C, that is, this embodiment uses a metal-based composite material with a melting point of 150°C-180°C to manufacture the thermal interface plate 22.

[0016] The preparation process of assembling the heat dissipation module 20 of the utility model to the electronic product is as follows: before bonding, the PCB board 24 of the electronic product and the heat dissipation module 20 are arranged in order from top to bottom, and the thermal interface board 22 is located between the PCB board 24 and the heat pipe 21, and the side of the PCB board 24 on which the electronic component 241 is mounted faces the side of the thermal interface board 22 made of the low-melting-point metal-based composite material, and a special fixture is used to maintain the shape of the low-melting-point metal-based composite material. Then, the electronic component 241, the low-melting-point metal-based composite material and the heat pipe 21 are heated, and the heating temperature is controlled between 120°C and 150°C. After heating, the PCB board 24 is moved downward so that the electronic component 241 contacts the thermal interface board 22, and a certain pressure is applied, and then the temperature is heated to between 150°C and 180°C, and maintained for several seconds to complete the bonding of the electronic component 241 and the heat dissipation component, and the heating is exited and cooled naturally. After the assembly is completed, the low-melting-point metal-based composite material does not undergo solid-liquid phase change in the subsequent working process of the electronic component 241.

[0017] Reference Figure 3 , Figure 3 The schematic cross-sectional view of the connection between the heat dissipation module 20 and the PCB board 24 provided in the second embodiment of the utility model, the difference between this embodiment and the first embodiment mentioned above is that the specific shapes of the heat pipe 21 and the thermal interface plate 22 are different, and the remaining structures are the same or similar. In this embodiment, the heat pipe 21 is flattened and compressed, and its shape is approximately rectangular, and the thermal interface plate 22 is also squeezed during the flattening and compression process of the heat pipe 21, so that the thermal interface plate 22 at the contact surface between the heat pipe 21 and the electronic component 241 is thinner, and thicker at both ends. The thicker part is in contact with the electronic component 241, and can be used as a thermal conductive plate to cover the electronic component 241 that the heat pipe 21 cannot cover. The thermal interface plate 22 has excellent thermal conductivity. After the heat pipe 21 is flattened, it can not only further reduce the stacking thickness, but also maintain good thermal conductivity, so that the thermal conductivity of the heat dissipation module 20 is not affected by the compression of the heat pipe 21.

[0018] Understandably, the utility model can also provide a laptop computer, the laptop computer comprises a housing, a PCB board 24 located in the housing, and the heat dissipation module 20 described in the above embodiment, the heat conduction interface plate 22 of the heat dissipation module 20 is located between one side of the electronic component 241 in the PCB board 24 and the heat pipe 21, and is bonded to the heat pipe 21 and the electronic component 241. The laptop computer using the heat dissipation module 20 can be designed to be light and thin, and has good heat dissipation performance.

[0019] In summary, the heat dissipation module of the utility model is provided with a thermal interface plate, and the thermal interface plate is made of a low-melting-point metal-based composite material. The metal-based composite material has the advantages of excellent thermal conductivity, processability and low thermal expansion, and can be used as a bonding material for heat pipes and electronic component materials, which can ensure the reliability of the connection. When used in a laptop computer, the thermal interface plate made of a low-melting-point metal-based composite material can be used to bond the electronic components of the PCB board in the laptop computer and the heat pipe that dissipates heat from the electronic components. The thermal interface plate of the utility model can not only be used as a thermal interface material for the heat pipe and the electronic components, but also has good interface wettability with both the electronic components and the heat pipe, and can also be used as a thermal conductive plate, that is, the thermal conductive plate between the heat pipe and the heating element (that is, the electronic component on the PCB board) in traditional electronic products is eliminated, which can effectively reduce the stacking thickness and reduce the weight. When used in electronic products for heat dissipation design, it is conducive to the lightweight design of electronic products. At the same time, there is no need to fix the heat dissipation module and the PCB board with screws, and the assembly is simple. The connection through holes on the PCB board can also be reduced, which is conducive to wiring.

[0020] The above description is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Those skilled in the art can make various equivalent changes and improvements based on the above embodiments, and all equivalent changes or modifications made within the scope of the claims should fall within the protection scope of the utility model.

Claims

1. A heat dissipation module, applied to electronic equipment, characterized in that: The heat dissipation module includes a heat pipe and a thermal interface plate for bonding the heat pipe and electronic components of a PCB board in an electronic device, and the thermal interface plate is made of a low-melting-point metal-based composite material, and the melting point of the low-melting-point metal-based composite material is 150°C-215°C.

2. The heat dissipation module according to claim 1, characterized in that: The melting point of the low-melting-point metal-based composite material is 150°C-180°C.

3. A notebook computer, characterized in that: The laptop computer comprises a shell, a PCB board located inside the shell, and the heat dissipation module described in any one of claims 1 to 2. The thermal interface plate of the heat dissipation module is located between one side of the electronic component in the PCB board and the heat pipe, and is bonded to the heat pipe and the electronic component.

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