Material taking detection device

Abstract

The utility model discloses a material taking detection device. A supporting frame is arranged at the position, opposite to a material taking fork which does not stretch out and draw back, of a shell. The top of the supporting frame is provided with a plurality of vertical detectors corresponding to the edges of the wafers along the two sides of the telescoping direction of the material taking fork. The shell is provided with laser receivers corresponding to the vertical detectors. The supporting frame is provided with a first horizontal detector corresponding to the material taking fork located on the upper portion, and the top of the shell is provided with a second horizontal detector corresponding to the material taking fork located on the lower portion. According to the utility model, the laser receiver, the first horizontal detector and the second horizontal detector can detect whether the wafer supported by the material taking fork deviates or not in time, and manual intervention is carried out if the wafer deviates, so that the situation that the wafer falls off and is damaged is reduced, the production efficiency is improved, the production cost is reduced, and the production efficiency is improved. And the problem of internal pollution caused by the fact that the wafer falls and is broken in the material taking detection device can also be prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of detection, in particular to a material taking detection device. Background Art

[0002] During the wafer manufacturing process, wafer robotic arms (also called material handling devices) are used in various links of wafer manufacturing. The wafers can be transported to various links through the robotic arms.

[0003] Among them, wafer robots are precision automation equipment designed for semiconductor wafer processing, mainly used in wafer transmission, handling and processing. These wafer robots usually have the characteristics of high precision, high speed and high cleanliness, can work in harsh clean room environments, and can safely pick up, place and flip very thin and fragile wafers.

[0004] However, the wafer robot needs to repeatedly cycle to pick up materials, and the wafer robot needs to move continuously. There is a small probability that the wafer will shift during the continuous movement. When the wafer shifts and there is no timely and effective human intervention, the shifted wafer will fall, wasting the wafer, reducing production efficiency, and increasing production costs. In addition, if the wafer falls and breaks inside the device, it will cause contamination inside the device. Utility Model Content

[0005] In view of this, the utility model provides a material picking detection device for solving the problem in the prior art that the wafer picking device cannot detect the wafer deviation, resulting in the wafer falling and increasing the cost, and the wafer falling and breaking and causing the internal contamination of the device.

[0006] In order to achieve one or part or all of the above purposes or other purposes, the technical solution of the utility model is a material picking detection device, including a shell and a plurality of material picking units arranged on the shell, each of the material picking units includes a driving device and a material picking fork driven by the driving device and capable of independent telescopic movement, the material picking forks of the plurality of material picking units are arranged along the height direction, the shell is provided with a support frame relative to the position of the material picking fork before the telescopic movement occurs, the top of the support frame is provided with a plurality of vertical detectors along both sides of the telescopic direction of the material picking fork and corresponding to the edge of the wafer, and the shell is provided with a laser receiver corresponding to each of the vertical detectors;

[0007] The support frame is provided with a first level detector corresponding to the material picking fork located at the upper part, and the top of the shell is provided with a second level detector corresponding to the material picking fork located at the lower part;

[0008] The vertical detector is used to detect the vertical state of all wafers held by the pick-up forks; the first horizontal detector and the second horizontal detector are both used to detect the horizontal state of the wafers held by the pick-up forks.

[0009] Furthermore, the support frame includes a first "L"-shaped connecting arm and a connecting platform, and first "L"-shaped connecting arms are provided on both sides of the bottom of the shell body opposite to the material picking fork and perpendicular to the telescopic direction, and a first passage space is formed between each of the first "L"-shaped connecting arms and the shell body, and all the material picking forks can telescopically pass through the first passage space;

[0010] The top end of each first "L"-shaped connecting arm is connected to the bottom of the connecting platform.

[0011] Furthermore, a plurality of vertical detectors are provided on both sides of the bottom of the connection platform along the extension and retraction direction of the material picking fork and corresponding to the edges of the wafer.

[0012] Furthermore, a first level detector is provided on the upper portion of any of the first “L”-shaped connecting arms.

[0013] Furthermore, there are four vertical detectors, and a vertical detector is arranged at both ends of the bottom of the connecting table along the extension and retraction direction of the material picking fork. Each vertical detector is arranged corresponding to the edge of the wafer, and is used to detect whether the edges of all the wafers supported by the material picking forks are in the same vertical plane.

[0014] Furthermore, there are four material taking units, and two side walls of the housing perpendicular to the telescopic direction are each provided with two slide grooves, and the sliding directions of the slide grooves are parallel to the telescopic direction;

[0015] Each of the driving devices can control the material picking fork to slide on the corresponding sliding groove to perform horizontal telescopic movement.

[0016] Furthermore, the material picking detection device also includes a control center, and the control center is electrically connected to the driving device, the vertical detector, the first horizontal detector and the second horizontal detector respectively.

[0017] Furthermore, the shell is in the shape of a cuboid.

[0018] Furthermore, the first "L"-shaped connecting arm is provided with a plurality of weight-reducing holes.

[0019] Furthermore, the connecting platform is a hollow annular structure.

[0020] Compared with the prior art, the utility model has at least the following beneficial effects:

[0021] The utility model can timely detect whether the wafer held by the material picking fork is offset through the laser receiver and / or the first horizontal detector and / or the second horizontal detector. If the wafer is offset, timely and effective manual intervention can be carried out to return or reset the offset wafer, thereby reducing the occurrence of wafer falling and damage, thereby improving production efficiency and reducing production costs. It can also prevent the problem of wafer falling and breaking inside the material picking detection device, causing internal contamination. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of the present invention; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention; the terms "including" and "having" and any variations thereof in the specification and claims of the present invention and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of the present invention or the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order.

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0024] Figure 1 It is a structural schematic diagram of the material taking detection device of the utility model;

[0025] Figure 2 for Figure 1 An enlarged schematic diagram of the reference numeral A in FIG.

[0026] Figure 3 It is a left view of the material taking detection device of the present utility model.

[0027] Reference numerals:

[0028] 10. Shell;

[0029] 11. Support frame;

[0030] 111. first "L"-shaped connecting arm; 112. connecting platform; 113. first passage space; 114. weight-reducing hole;

[0031] 12. Chute;

[0032] 13. Second "L"-shaped connecting arm;

[0033] 14. Second passage space;

[0034] 20. Reclaiming unit;

[0035] 21. Material fork;

[0036] 22. Limit block;

[0037] 23. Card slot;

[0038] 30. Vertical detector;

[0039] 40. Laser receiver;

[0040] 50. A first horizontal detector;

[0041] 60. A second horizontal detector;

[0042] 70. Laser amplifier. DETAILED DESCRIPTION

[0043] In order to make the technical problems, technical solutions and beneficial effects to be solved by the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model. Thus, a feature indicated in this specification will be used to illustrate one of the features of an embodiment of the utility model, rather than implying that each embodiment of the utility model must have the described features. In addition, it should be noted that this specification describes many features. Although certain features can be combined together to illustrate possible system designs, these features can also be used in other combinations that are not explicitly described. Thus, unless otherwise stated, the described combinations are not intended to be limiting.

[0044] The principle and structure of the present utility model are described in detail below with reference to the accompanying drawings and embodiments.

[0045] In one embodiment, referring to the attached Figure 1-3The utility model proposes a material picking detection device, including a shell 10 and a plurality of material picking units 20 arranged on the shell 10, each of the material picking units 20 includes a driving device (not shown, the same throughout the text) and a material picking fork 21 driven by the driving device and capable of independent telescopic movement, the material picking forks 21 of the plurality of material picking units 20 are arranged in a staggered manner along the height direction and can perform horizontal telescopic movement at the top of the shell 10 to pick up and place wafers, the shell 10 is provided with a support frame 11 relative to the position of the material picking fork 21 before the telescopic movement occurs, and all the material picking forks 21 before the telescopic movement occurs are located in the support frame 11; the top of the support frame 11 is provided with a plurality of vertical detectors 30 along both sides of the telescopic direction of the material picking fork 21 and corresponding to the edge of the wafer, and the shell 10 is provided with a laser receiver 40 corresponding to each of the vertical detectors 30; the driving device is preferably a motor.

[0046] The support frame 11 is provided with a first level detector 50 corresponding to the material picking fork 21 located at the upper part, and the top of the housing 10 is provided with a second level detector 60 corresponding to the material picking fork 21 located at the lower part.

[0047] Among them, the vertical detector 30 is used to emit laser vertically to detect the vertical state of all wafers picked up by the picking fork 21; the first horizontal detector 50 and the second horizontal detector 60 are both used to emit laser horizontally to detect the horizontal state of the corresponding wafers picked up by the picking fork 21.

[0048] The housing 10 is in the shape of a cuboid, and of course, the housing 10 can also be in the shape of a cube or other shapes that are convenient for installing the material taking unit 20. Two material taking units 20 are respectively provided on the two side walls of one end of the housing 10 along the length direction, and each material taking fork 21 can perform horizontal telescopic movement along the length direction of the housing 10 under the control of a corresponding driving device to take and place wafers.

[0049] When the driving device controls the corresponding material picking fork 21 to extend horizontally to the device for storing wafers to pick up the wafers, the driving device then controls the corresponding material picking fork 21 to retract horizontally to reset the material picking fork 21 holding the wafers, that is, the material picking fork 21 and the held wafers are both located below the support frame 11. At this time, in order to prevent the material picking detection device from shifting the wafers during the process of constantly picking up and placing the wafers, it is necessary to detect the wafers held by the reset material picking fork 21, specifically:

[0050] After the pick-up fork 21 is reset, the vertical detector 30 will detect the vertical state of all wafers picked up by the pick-up fork 21, that is, whether the edges of all wafers are in the same vertical plane. If a wafer is offset in the horizontal direction, the edge of the offset wafer and the edges of other wafers will not be in the same vertical plane, which will cause the laser emitted by some vertical detectors 30 to be blocked by the horizontally offset wafer, so that the corresponding laser receiver 40 cannot receive the laser emitted by the vertical detector 30, and the laser receiver 40 will send a first fault electrical signal; at the same time, the first horizontal detector 50 and the second horizontal detector 60 are used in conjunction to detect the vertical state of all wafers picked up by the pick-up fork 21. The horizontal state of the wafer being taken, that is, whether the wafers held by each picking fork 21 are in the same horizontal plane. If a wafer is offset in the vertical direction, the offset wafer will be in a tilted state, and the entire offset wafer will not be in the same horizontal plane, and the laser emitted by the first horizontal detector 50 and / or the second horizontal detector 60 will be blocked by the vertically offset wafer. At this time, the first horizontal detector 50 and / or the second horizontal detector 60 will send out a second fault electrical signal, and then the control center in the picking detection device will send out an alarm after receiving the first fault electrical signal and / or the second fault electrical signal, so as to remind the operator to return or reset the offset wafer as soon as possible.

[0051] In this way, the material picking detection device can promptly detect whether the wafer held by the material picking fork 21 is offset through the laser receiver 40 and / or the first horizontal detector 50 and / or the second horizontal detector 60. If the wafer is offset, manual intervention can be carried out promptly and effectively to return or reset the offset wafer, thereby reducing the occurrence of wafer falling and damage, thereby improving production efficiency, reducing production costs, and preventing the problem of wafers falling and breaking inside the material picking detection device, causing internal contamination.

[0052] The material picking detection device further includes a control center, and the control center is electrically connected to the driving device, the vertical detector 30, the first horizontal detector 50 and the second horizontal detector 60 respectively.

[0053] The outside of the material-retrieving detection device is also provided with a host computer (not shown, the same as in the whole text) electrically connected to the control center, and the host computer is preferably a computer. When the operator starts or shuts down the material-retrieving detection device on the host computer, the control center receives the start-up electrical signal or shut-down electrical signal sent by the host computer, and then controls the material-retrieving detection device to execute the corresponding program, so that the material-retrieving detection device reaches the position where the wafer is stored and performs horizontal telescopic movement to pick up and put down the wafer.

[0054] In other embodiments, a buzzer (not shown, the same throughout) may be provided in the host computer. When the control center receives the first fault electrical signal and / or the second fault electrical signal, it will send an alarm electrical signal to the host computer, causing the host computer to emit an alarm sound and / or a warning message to pop up on the screen of the host computer to remind the operator to return or reset the offset wafer as soon as possible.

[0055] There is even a three-axis motion controller at the bottom of the material picking detection device (not shown, the same throughout the text), which makes it convenient for the control center to control the three-axis motion of the material picking detection device through the three-axis motion controller, so as to facilitate the material picking detection device to move back and forth between the loading point where the wafers are stored and the unloading point where the wafers are used.

[0056] In other embodiments, refer to the attached Figure 1 A laser amplifier 70 is also provided on the top of the material picking detection device and on one side along the retraction direction of the material picking fork 21. The laser amplifier 70 is used to amplify the lasers emitted by the vertical detector 30, the first horizontal detector 50 and the second horizontal detector 60, so as to obtain high laser energy or power while maintaining the quality of the laser (including pulse width, line width, polarization characteristics, etc.), so that the lasers emitted by the vertical detector 30, the first horizontal detector 50 and the second horizontal detector 60 can better and more stably detect the vertical state and horizontal state of the wafer.

[0057] Among them, refer to the attached Figure 1 and 3 There are four material picking units 20, and two side walls of the shell 10 perpendicular to the telescopic direction are provided with two slide grooves 12 (that is, two side walls of the shell 10 along the width direction are provided with two slide grooves 12), and the sliding directions of the slide grooves 12 are parallel to the telescopic direction; the two slide grooves 12 located on the same side wall are arranged in parallel with an upper and lower interval, so that each material picking fork 21 can slide on a corresponding slide groove 12, thereby realizing the independent telescopic movement of each material picking fork 21.

[0058] Each of the driving devices can control the material picking fork 21 to slide on the corresponding sliding groove 12 to perform horizontal telescopic movement.

[0059] Of course, the number of the material taking units 20 is not limited to four, and can also be set to other numbers according to actual conditions, which is not limited here.

[0060] In this way, when the corresponding material taking unit 20 needs to perform horizontal telescopic movement, the driving device can control the corresponding material taking fork 21 to slide on the corresponding slide groove 12, so that the material taking fork 21 can perform horizontal telescopic movement faster and more smoothly, thereby improving production efficiency.

[0061] In order to enable the vertical detector 30 on the support frame 11 to better detect the vertical state of all wafers held by the pick-up forks 21, and not to hinder the horizontal telescopic movement of all the pick-up forks 21, this embodiment proposes a structure of the support frame 11, as shown in FIG. Figure 1 The support frame 11 includes a first "L"-shaped connecting arm 111 and a connecting platform 112. The first "L"-shaped connecting arm 111 is provided on both sides of the bottom of the shell 10 opposite to the material picking fork 21 and perpendicular to the telescopic direction, and a first passage space 113 is formed between each of the first "L"-shaped connecting arms 111 and the shell 10, and all the material picking forks 21 can be telescopically moved through the first passage space 113; and the ends of the short sides of each first "L"-shaped connecting arm 111 are correspondingly connected to the bottom of both sides of the shell 10 along the width direction, and the ends of the long sides of each first "L"-shaped connecting arm 111 are correspondingly connected to both sides of the connecting platform 112 along the width direction of the shell 10.

[0062] The top end of each first “L”-shaped connecting arm 111 is connected to the bottom end of the connecting platform 112 .

[0063] In order to further enable the support frame 11 to be more firmly installed on the housing 10, refer to the attached Figure 3 The housing 10 is also provided with a second "L"-shaped connecting arm 13 at one end along the retraction direction of the material fork 21, and the end of the short side of the second "L"-shaped connecting arm 13 is connected to the top of the housing 10, and the end of the long side of the second "L"-shaped connecting arm 13 is connected to one side of the connecting platform 112 along the retraction direction of the material fork 21, so as to cooperate with the two first "L"-shaped connecting arms 111 to firmly support the connecting platform 112. A second passage space 14 is formed between the second "L"-shaped connecting arm 13 and the housing 10, and all the reset material forks 21 can be placed in the second passage space 14 without hindering the subsequent horizontal telescopic movement of all the material forks 21.

[0064] In order to enable the vertical detector 30 to better detect the vertical state of all wafers taken by the pick-up forks 21, refer to the attached Figure 1 A plurality of vertical detectors 30 are provided at the bottom of the connection platform 112 on both sides of the extension direction of the material picking fork 21 and corresponding to the edges of the wafer.

[0065] Specifically, there are preferably four vertical detectors 30, and a vertical detector 30 is provided at both ends of the bottom of the connecting platform 112 along the extension and retraction direction of the material picking fork 21. Each of the vertical detectors 30 is provided corresponding to the edge of the wafer, and is used to detect whether the edges of all the wafers picked up by the material picking forks 21 are in the same vertical plane.

[0066] In this way, it is possible to more comprehensively detect whether all the edges of the wafer are in the same vertical plane. If one of the laser receivers 40 cannot receive the laser emitted by the corresponding vertical detector 30, it can be determined that the wafer is offset. Setting four vertical detectors 30 and four corresponding laser receivers 40 can improve the accuracy and reliability of wafer offset and reduce the probability of misjudgment.

[0067] Among them, refer to the attached Figure 1 A first level detector 50 is provided at the upper portion of any of the first “L”-shaped connecting arms 111 .

[0068] If the laser emitted by the first horizontal detector 50 and / or the second horizontal detector 60 is blocked by the wafer, the wavelength of the laser will change, and this wavelength change can be detected by the optical system inside the first horizontal detector 50 and / or the second horizontal detector 60. Once the change in wavelength is detected, the first horizontal detector 50 and / or the second horizontal detector 60 will know that the laser emitted by it is blocked by the wafer, so that the first horizontal detector 50 and / or the second horizontal detector 60 will send a second fault electrical signal to the control center. When the control center receives the second fault electrical signal, the host computer will sound an alarm or / and a warning message will pop up on the screen of the host computer to remind the operator to return or reset the offset wafer as soon as possible; and this method does not require an additional monitor to receive the laser, making the material detection device simpler.

[0069] The first level detector 50 is used to detect the level of two adjacent upper material picking forks 21. Specifically:

[0070] The two adjacent material forks 21 at the top both hold wafers, and the first horizontal detector 50 can emit three lasers according to the two adjacent wafers at the top, wherein each two adjacent lasers will detect the same wafer, that is, the three lasers will be located above the first wafer at the top, in the middle of the two wafers at the top, and below the second wafer at the top, in order to detect whether the two adjacent wafers at the top are both horizontally arranged. If any laser is blocked, it is determined that the wafer is offset. And any laser is not close to the wafer, but is separated by a certain space, and the size of the interval is preferably 0.5mm.

[0071] Similarly, refer to the attached Figure 3 The top of the housing 10 is provided with a second level detector 60 corresponding to the two adjacent material picking forks 21 at the bottom, and the distance between the lowest material picking fork 21 at the top and the highest material picking fork 21 at the bottom is preferably 2 mm. The second level detector 60 is provided to detect the horizontal state of the two adjacent material picking forks 21 at the bottom. Specifically:

[0072] The two adjacent material forks 21 at the bottom both hold wafers, and the second horizontal detector 60 can emit three lasers according to the two adjacent wafers at the bottom, where each two adjacent lasers will detect the same wafer, that is, the three lasers will be located above the first wafer at the bottom, in the middle of the two wafers at the bottom, and below the second wafer at the bottom, so as to detect whether the two adjacent wafers at the bottom are both horizontally arranged. If any laser is blocked, it is determined that the wafer is offset. And any laser is not close to the wafer, but is separated by a certain space, and the size of the interval is preferably 0.5mm.

[0073] See attached Figure 1-2 Because each of the upper and lower material picking forks 21 is provided with a limit block 22 at the four corners of the corresponding wafer, and each limit block 22 is provided with a slot 23 corresponding to the wafer, and the slot 23 is used to prevent the wafer from moving, so when the material picking fork 21 correctly holds the wafer, the edge of the held wafer will fit into the slot 23 of each limit block 22 to contact to achieve the limiting effect, wherein the height of the limit block 22 is generally greater than 0.5mm, and the height of the limit block 22 is preferably 0.6mm, so once the wafer is vertically offset, the wafer will not fit into the slot 23, causing the wafer to be located at the top of the slot 23, causing the vertical offset of the wafer to be greater than 0.5mm, and any laser is 0.5mm away from the wafer, so in this way it can be detected whether the wafers are all horizontally set.

[0074] In order to reduce the weight of the support frame 11 and thus reduce the load of the housing 10, Figure 1 The first “L”-shaped connecting arm 111 is provided with a plurality of weight-reducing holes 114 .

[0075] In order to further reduce the weight of the support frame 11 and further reduce the load of the housing 10 , the connecting platform 112 is a hollow ring structure.

[0076] The use process of the material taking detection device proposed by the utility model is as follows:

[0077] First, the material picking detection device is started on the host computer. The three-axis motion controller will control the material picking detection device to reach the loading point where the wafers are stored. Then the driving device controls the corresponding material picking fork 21 to extend along the slide slot 12 to the upper material point to pick up the wafer. The driving device controls the material picking fork 21 to reset after picking up the wafer. Then the four material picking forks 21 pick up the wafers in turn. Then the control center uses four vertical detectors 30 and corresponding laser receivers 40 to detect the vertical state of the four wafers picked up by the material picking fork 21. At the same time, the control center uses the first horizontal detector 50 and the second horizontal detector 60 to respectively detect the horizontal state of the four wafers picked up by the material picking fork 21. If the four laser receivers 40 can receive the laser emitted by the corresponding vertical detector 30 and the wavelength of the laser emitted by the first horizontal detector 50 and / or the second horizontal detector 60 has not changed, then the four wafers picked up by the material picking fork 21 are all offset.

[0078] If any laser receiver 40 fails to receive the laser emitted by the corresponding vertical detector 30, and / or the wavelength of the laser emitted by the first horizontal detector 50 changes or the wavelength of the laser emitted by the second horizontal detector 60 changes, the control center will receive the first fault electrical signal and / or the second fault electrical signal and will be able to determine that the corresponding wafer has shifted. The control center will then send an alarm electrical signal to the host computer, causing the host computer to sound an alarm or / and a warning message to pop up on the screen of the host computer to remind the operator to return or reset the shifted wafer as soon as possible.

[0079] Obviously, the embodiments described above are only some embodiments of the utility model, rather than all embodiments. The preferred embodiments of the utility model are given in the accompanying drawings, but they do not limit the patent scope of the utility model. The utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Although the utility model is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the utility model specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the utility model.

Claims

1. A material picking detection device, comprising a housing (10) and a plurality of material picking units (20) arranged on the housing (10), each of the material picking units (20) comprising a driving device and a material picking fork (21) driven by the driving device and capable of independent telescopic movement, the material picking forks (21) of the plurality of material picking units (20) being arranged in a height direction, characterized in that: The housing (10) is provided with a support frame (11) at a position of the material picking fork (21) before the telescopic movement occurs, and a plurality of vertical detectors (30) are provided on the top of the support frame (11) along both sides of the telescopic direction of the material picking fork (21) and corresponding to the edges of the wafer, and the housing (10) is provided with a laser receiver (40) corresponding to each of the vertical detectors (30); The support frame (11) is provided with a first level detector (50) corresponding to the material picking fork (21) located at the upper part, and the top of the housing (10) is provided with a second level detector (60) corresponding to the material picking fork (21) located at the lower part; The vertical detector (30) is used to detect the vertical state of all wafers picked up by the pick-up fork (21); and the first horizontal detector (50) and the second horizontal detector (60) are used to detect the horizontal state of the wafers picked up by the corresponding pick-up fork (21).

2. The material taking detection device according to claim 1, characterized in that: The support frame (11) comprises a first "L"-shaped connecting arm (111) and a connecting platform (112); a first "L"-shaped connecting arm (111) is provided on both sides of the bottom of the shell (10) opposite to the material picking fork (21) and perpendicular to the telescopic direction; a first passage space (113) is formed between each of the first "L"-shaped connecting arms (111) and the shell (10); and all the material picking forks (21) can telescopically pass through the first passage space (113); The top end of each first "L"-shaped connecting arm (111) is connected to the bottom end of the connecting platform (112).

3. The material taking detection device according to claim 2, characterized in that: A plurality of vertical detectors (30) are provided on both sides of the bottom of the connection platform (112) along the extension and retraction direction of the material picking fork (21) and corresponding to the edges of the wafer.

4. The material taking detection device according to claim 2, characterized in that: A first level detector (50) is provided on the upper portion of any one of the first "L"-shaped connecting arms (111).

5. The material taking detection device according to claim 2, characterized in that: There are four vertical detectors (30), and a vertical detector (30) is provided at both ends of the bottom of the connection platform (112) along the extension and retraction direction of the material picking fork (21). Each vertical detector (30) is provided corresponding to the edge of the wafer and is used to detect whether the edges of the wafers picked up by all the material picking forks (21) are in the same vertical plane.

6. The material taking detection device according to claim 1, characterized in that: There are four material taking units (20), and two side walls of the housing (10) perpendicular to the telescopic direction are each provided with two slide grooves (12), and the sliding directions of the slide grooves (12) are both parallel to the telescopic direction; Each of the driving devices can control the material picking fork (21) to slide on the corresponding sliding groove (12) to perform horizontal telescopic movement.

7. The material taking detection device according to claim 1, characterized in that: The material picking detection device also includes a control center, and the control center is electrically connected to the driving device, the vertical detector (30), the first horizontal detector (50) and the second horizontal detector (60) respectively.

8. The material taking detection device according to claim 1, characterized in that: The shell (10) is in the shape of a cuboid.

9. The material taking detection device according to claim 2, characterized in that: The first "L"-shaped connecting arm (111) is provided with a plurality of weight-reducing holes (114).

10. The material taking detection device according to claim 2, characterized in that: The connecting platform (112) is a hollow annular structure.

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