Substrate processing apparatus
By designing gas supply, liner and suction portion in the substrate processing device, uniform drying of the substrate is achieved, the problem of uneven drying of the substrate is solved, and the light emission quality of the display is improved.
Patent Information
- Application Number
- CN202421004324.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2023-11-10
- Filing Date
- 2024-05-10
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2034-05-10
AI Technical Summary
In the substrate processing device, it is difficult to achieve uniform drying of the substrate, which affects the light emission quality of the display.
A substrate processing device is designed, including a gas supply part, a liner part and a suction part. The gas supply unit supplies gas to the substrate, the liner injects gas through a plurality of holes, and draws gas injected into the substrate through the suction unit to achieve uniform ejection and absorption of gas.
Through the non-contact adsorption method, the substrate is uniformly dried without physical damage, thereby improving the uniformity and efficiency of drying.
Smart Images
Figure CN222483300U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a substrate processing device. More specifically, the utility model relates to a device for drying a substrate. Background Art
[0002] In a processing space for processing a substrate in a substrate processing device, a large amount of gas may be supplied and exhausted for the purpose of forming a thin film on the substrate, forming a pattern on the thin film on the substrate, or ventilating the atmosphere inside the processing space. When supplying and exhausting the gas, the substrate must be dried uniformly to improve the light emission quality of the display. Therefore, in the drying process of the substrate, attempts are constantly made to improve the drying uniformity.
[0003] Furthermore, as a non-contact adsorption device, the pressurized air is ejected and sucked simultaneously on the surface of the porous plate, thereby achieving non-contact adsorption that holds and supports the thin plate-shaped workpiece while suspending it on the porous plate. Summary of the invention
[0004] The utility model aims to provide a substrate processing device with improved reliability.
[0005] However, the purpose of the present invention is not limited to the above purpose, and various extensions can be made without departing from the scope of the idea and field of the present invention.
[0006] In order to achieve the aforementioned purpose of the utility model, a substrate processing device of an embodiment of the utility model may include: a gas supply part, which is used to supply gas to the substrate; a pad part, which is defined with a plurality of first holes through which the gas supplied from the gas supply part passes; and a suction part, which is used to suck the gas sprayed onto the substrate through the plurality of first holes.
[0007] In one embodiment, the gas supply unit may include a gas heating unit and a pressure regulating unit.
[0008] In one embodiment, the pad portion may be spaced apart from the substrate along the first direction.
[0009] In one embodiment, the substrate may be located below the pad portion.
[0010] In one embodiment, the substrate may be located above the pad portion.
[0011] In one embodiment, a distance between the substrate and the pad portion in the first direction may be greater than or equal to about 10 μm and less than or equal to about 100 μm.
[0012] In one embodiment, the invention may further include a suction pipe connected to the suction portion, and the cushion portion may further define a plurality of second holes connected to the suction pipe.
[0013] In one embodiment, the diameter of each of the second holes may be larger than the diameter of each of the first holes.
[0014] In one embodiment, the number of the first holes may be greater than the number of the second holes.
[0015] In one embodiment, the diameter of each of the first holes may be greater than or equal to about 10 μm and less than or equal to about 50 μm.
[0016] In one embodiment, the suction tube may correspond to the second hole in a one-to-one manner.
[0017] In one embodiment, the present invention may further include a roller arranged adjacent to the substrate in the first direction.
[0018] In an embodiment, the roller may be arranged below the substrate.
[0019] In an embodiment, the roller may be arranged above the substrate.
[0020] In one embodiment, the substrate may be moved in a second direction intersecting the first direction by the roller.
[0021] In order to achieve the aforementioned purpose of the utility model, a substrate processing device of another embodiment of the utility model may include a first unit and a second unit, the first unit including: a first gas supply part for supplying gas to the substrate; a first pad part for passing the gas supplied from the first gas supply part and defining a plurality of holes; and a first suction part for sucking the gas sprayed to the substrate through the plurality of holes, the second unit including: a second gas supply part for supplying gas to the substrate; a second pad part for passing the gas supplied from the second gas supply part and defining a plurality of holes; and a second suction part for sucking the gas sprayed to the substrate through the plurality of holes.
[0022] In one embodiment, the first pad portion and the second pad portion may be respectively arranged to be spaced apart from the substrate along a first direction.
[0023] In one embodiment, a distance between each of the first pad portion and the second pad portion and the substrate in the first direction may be greater than or equal to about 10 μm and less than or equal to about 100 μm.
[0024] In one embodiment, the first unit and the second unit may be adjacent to each other along the second direction crossing the first direction.
[0025] In one embodiment, the present invention may further include a roller arranged adjacent to the substrate in the first direction.
[0026] A substrate processing device according to an embodiment of the utility model may include: a gas supply part for supplying gas to a substrate; a pad part defining a plurality of holes through which the gas supplied from the gas supply part passes; and a suction part for sucking the gas sprayed onto the substrate through the plurality of holes.
[0027] As a result, the substrate processing device can dry the substrate in a non-contact adsorption manner. That is, the substrate processing device can dry the substrate in a state where the pad portion and the substrate are not in direct contact but are kept at a distance. By performing non-contact adsorption with the substrate and the pad portion at the distance, the substrate can be dried without being physically damaged. Moreover, by driving the gas supply portion and the suction portion at the same time, the gas can be uniformly sprayed onto the substrate.
[0028] However, the effects of the present invention are not limited to the above effects, and various extensions are possible without departing from the idea and scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Figure 1 It is a cross-sectional view showing an embodiment of a substrate processing apparatus of the present invention.
[0030] Figure 2 is included in Figure 1 A cross-sectional view of a method of supplying gas to a gas supply unit in a substrate processing apparatus.
[0031] Figure 3 is included in Figure 1 A cross-sectional view of a method for sucking gas by a suction portion in a substrate processing apparatus.
[0032] Figure 4 It is a cross-sectional view showing another embodiment of the substrate processing apparatus of the present invention.
[0033] Figure 5 Yes Figure 1 Magnified image of part A.
[0034] Figure 6 Yes means included in Figure 1 A top view of the pad portion in FIG.
[0035] Figures 7 to 9 Yes means Figure 1 A cross-sectional view of an embodiment of substrate movement.
[0036] Fig.10 Yes means Figure 1 A cross-sectional view of another embodiment of substrate movement.
[0037] Description of Reference Numerals
[0038] SPA: Substrate Processing Unit VU: Suction Unit
[0039] GS: Gas supply unit GH: Gas heating unit
[0040] PC: Pressure regulator VP: Suction pipe
[0041] PD: pad part SUB: substrate
[0042] RL: Roller DT: Roller Distance
[0043] HL1, HL2: first hole, second hole DETAILED DESCRIPTION
[0044] The embodiments of the present invention are described in more detail below with reference to the accompanying drawings. The same reference numerals are used for the same structural elements in the accompanying drawings, and repeated descriptions of the same structural elements are omitted.
[0045] In this specification, a plane may be defined by a first direction D1 and a second direction D2 intersecting the first direction D1. For example, the second direction D2 may be perpendicular to the first direction D1. In addition, a third direction D3 may be a normal direction of the plane. That is, the third direction D3 may be perpendicular to the plane formed by the first direction D1 and the second direction D2.
[0046] Figure 1 It is a cross-sectional view showing an embodiment of a substrate processing apparatus of the present invention. Figure 2 is included in Figure 1 A cross-sectional view of a method of supplying gas to a gas supply unit in a substrate processing apparatus. Figure 3 is included in Figure 1 A cross-sectional view of a method for sucking gas by a suction portion in a substrate processing apparatus.
[0047] Reference Figures 1 to 3 , the substrate processing apparatus SPA may include a gas supply part GS, a pad part PD, a suction part VU, and a suction pipe VP.
[0048] The gas supply unit GS may supply the gas DG to the substrate SUB. Specifically, the gas DG may be discharged from the gas supply unit GS and sprayed onto the substrate SUB through the pad portion PD. Figure 2 As shown, the gas DG may be ejected through the pad portion PD in a direction opposite to the first direction D1 .
[0049] The gas DG may include an inert gas. For example, the gas DG may include helium (He), neon (Ne), argon (Ar), etc. However, the embodiments of the present invention are not limited thereto. The gas DG may also include air in the atmosphere. That is, the gas DG may include nitrogen (N 2 ), oxygen (O 2 ), carbon dioxide (CO 2 ) and other gases.
[0050] The gas supply part GS may include a gas heating part GH and a pressure regulating part PC.
[0051] The gas heating unit GH may heat the gas DG. By heating the gas DG by the gas heating unit GH and spraying the heated gas DG onto the substrate SUB, the substrate SUB may be dried more effectively. However, the gas heating unit GH may be omitted.
[0052] In one embodiment, the gas heating unit GH may heat the gas DG at a temperature of about 20° C. to about 80° C. Preferably, the gas heating unit GH may heat the gas DG at a temperature of about 30° C. to about 60° C. However, the embodiments of the present invention are not limited thereto.
[0053] The pressure regulator PC may regulate the pressure of the gas DG. By regulating the pressure of the gas DG by the pressure regulator PC, the flow rate and / or flow velocity of the gas DG supplied from the gas supply unit GS may be regulated.
[0054] In one embodiment, the pressure regulating unit PC can regulate the pressure of the gas DG to be greater than about 0.1 MPa and less than about 1 MPa. Preferably, the pressure regulating unit PC can regulate the pressure of the gas DG to be greater than about 0.1 MPa and less than about 0.8 MPa. However, the embodiments of the present invention are not limited thereto.
[0055] The pad portion PD may be a structure that is spaced apart from the substrate SUB in the first direction D1. The gas DG may be uniformly sprayed toward the substrate SUB through the pad portion PD. A plurality of regions for the gas DG to pass through may be defined on the pad portion PD. That is, the pad portion PD may be a pad including a porous structure. Since the pad portion PD includes a porous structure, when the gas DG supplied from the gas supply portion GS is sprayed toward the substrate SUB, it can be sprayed at a substantially uniform speed through each hole. The pad portion PD will be discussed later. Figure 6 Describe it in detail together.
[0056] The suction part VU can suck the gas DG sprayed onto the substrate SUB. The suction part VU can make the gas DG sprayed onto the substrate SUB diffuse uniformly without gathering in a certain direction. That is, by sucking the gas DG by the suction part VU, the gas DG can react uniformly with the substrate SUB without diffusing to the periphery.
[0057] In one embodiment, the gas supply unit GS and the suction unit VU may be operated simultaneously. When the gas supply unit GS and the suction unit VU are operated simultaneously, the gas DG can be sprayed onto the substrate SUB more uniformly than when only the gas supply unit GS is operated without the suction unit VU.
[0058] In one embodiment, the substrate SUB can be non-contactly adsorbed to the substrate processing apparatus SPA by the suction part VU. For example, the substrate SUB can be non-contactly adsorbed to the pad part PD by adjusting the pressure of the suction part VU.
[0059] The suction pipe VP may be arranged to be connected to the suction part VU and the pad part PD. The suction pipe VP may be a passage through which the gas DG injected to the substrate SUB leads to the suction part VU. Figure 3 As shown, the gas DG sprayed onto the substrate SUB may be sucked into the suction pipe VP along the first direction D1.
[0060] The substrate SUB may include a glass substrate, a metal substrate, a plastic substrate, etc. However, the embodiments of the present invention are not limited thereto. The substrate SUB may be an inorganic layer, an organic layer, or a composite material layer.
[0061] like Figure 1 As shown, the substrate SUB may be arranged below the pad portion PD. The substrate SUB and the pad portion PD may be arranged in a manner of having a separation distance DT. That is, the substrate SUB and the pad portion PD may be non-contactly adsorbed while being separated by the separation distance DT.
[0062] In one embodiment, the spacing distance DT between the substrate SUB and the pad portion PD in the first direction D1 may be greater than about 10 μm and less than about 100 μm. Preferably, the spacing distance DT between the substrate SUB and the pad portion PD in the first direction D1 may be greater than about 10 μm and less than about 80 μm. However, the embodiments of the present utility model are not limited thereto.
[0063] The substrate processing apparatus SPA may further include a roller RL. The roller RL may be arranged below the substrate SUB. The roller RL may move the substrate SUB in the second direction D2. However, the embodiment of the present invention is not limited thereto. The roller RL may also move the substrate SUB in the third direction D3.
[0064] As a result, the substrate processing apparatus SPA can dry the substrate SUB in a non-contact adsorption manner. That is, the substrate processing apparatus SPA can dry the substrate SUB in a state where the pad portion PD and the substrate SUB are not in direct contact but are maintained at the distance DT. By performing non-contact adsorption with the substrate SUB and the pad portion PD having the distance DT, the substrate SUB can be dried without being physically damaged. Moreover, by driving the gas supply portion GS and the suction portion VU at the same time, the gas DG can be uniformly sprayed onto the substrate SUB.
[0065] Figure 4 2 is a cross-sectional view showing another embodiment of the substrate processing device of the present invention. Specifically, Figure 4 Except in Figure 1 Except that the substrate SUB and the roller RL are arranged above the substrate processing apparatus SPA, other aspects are the same, and thus the repeated contents may be omitted or simplified.
[0066] Reference Figure 4 The substrate SUB and the roller RL may be arranged on the upper part of the substrate processing apparatus SPA. That is, the substrate SUB and the roller RL may be arranged above the pad part PD. The substrate SUB may be separated from the pad part PD in the first direction D1 and non-contact adsorbed by the pressure of the gas DG supplied by the gas supply part GS and sucked by the suction part VU.
[0067] In one embodiment, the substrate SUB may be disposed above the pad portion PD by adjusting the pressure of the gas DG supplied from the gas supply portion GS and sucked by the suction portion VU. Specifically, the substrate SUB may be disposed apart from the pad portion PD in the first direction D1.
[0068] Figure 5 Yes Figure 1 Magnified image of part A.
[0069] Reference Figures 1 to 5, ink DI may be ejected onto the substrate SUB. For example, the ink DI may be ink required for a light-emitting layer of a display. That is, the ink DI may include at least one of red ink, blue ink, and green ink arranged on each pixel of the display. However, the embodiments of the present utility model are not limited thereto.
[0070] In one embodiment, the suction unit VU may also suck the evaporated ink DI. By sucking the evaporated ink DI between the substrate SUB and the pad portion PD by the suction unit VU, the drying speed of the ink DI may be further accelerated. That is, by including the suction unit VU, the drying speed efficiency of the substrate SUB by the substrate processing apparatus SPA may be increased.
[0071] In one embodiment, the suction unit VU can make the ink DI dry more evenly. By sucking the gas DG by the suction unit VU, the gas DG can be uniformly sprayed onto the substrate SUB instead of advancing in only one direction (for example, the second direction D2). If the ink DI disposed on the substrate SUB is not uniformly dried, the ink DI may form a slope or a concave pattern layer.
[0072] If the suction part VU is not present, the volatilized ink DI may remain in the center of the substrate SUB compared to the edge of the substrate SUB. As time passes, the concentration of the evaporated ink DI becomes higher in the center of the upper portion of the substrate SUB, and thus the thickness of the ink DI dried on the substrate SUB becomes different between the center and the edge. Since the thickness of the ink DI disposed on the substrate SUB is uneven, the visual recognition of the display device may be reduced.
[0073] Figure 6 Yes means included in Figure 1 A top view of the pad portion in FIG.
[0074] Reference Figure 1 and Figure 6 , the pad portion PD may include a first hole HL1 and a second hole HL2. Figure 6 In the embodiment, the first hole HL1 and the second hole HL2 are defined as circular, but the present invention is not limited thereto. The first hole HL1 and the second hole HL2 may be in various shapes such as polygonal and elliptical as long as they are defined as areas where the gas DG can pass.
[0075] The first hole HL1 may be a region through which the gas DG supplied from the gas supply unit GS passes. That is, the gas DG supplied from the gas supply unit GS may be uniformly sprayed onto the substrate SUB by being sprayed through the first hole HL1 .
[0076] The first holes HL1 may be defined to be evenly distributed in the pad portion PD in a plan view. Figure 4 As described in the foregoing, for uniform drying, the first holes HL1 may be evenly distributed in the pad portion PD. However, the embodiments of the present invention are not limited thereto.
[0077] The second hole HL2 may be a region through which the gas DG sprayed onto the substrate SUB passes when being sucked by the suction part VU.
[0078] The second holes HL2 may be defined to be evenly distributed in the pad portion PD in a plan view. Figure 4 As described in the foregoing, for uniform drying, the second holes HL2 may be evenly distributed in the pad portion PD. However, the embodiments of the present invention are not limited thereto.
[0079] In one embodiment, the diameter of each of the second holes HL2 may be greater than the diameter of each of the first holes HL1. The diameter of each of the first holes HL1 may be greater than about 10 μm and less than about 100 μm. Preferably, the diameter of each of the first holes HL1 may be greater than about 10 μm and less than about 50 μm. However, the embodiments of the present invention are not limited thereto.
[0080] In one embodiment, the number of the first holes HL1 may be greater than the number of the second holes HL2. However, the embodiments of the present invention are not limited thereto.
[0081] In one embodiment, the suction pipe VP may be connected to the second hole HL2 in a one-to-one correspondence. That is, the area where the suction pipe VP is opened corresponding to the pad portion PD may be the area where the second hole HL2 is defined. Thus, the diameters of the second hole HL2 and the suction pipe VP in a plan view may be the same. However, the embodiments of the present utility model are not limited thereto.
[0082] Figures 7 to 9 Yes means Figure 1 A cross-sectional view of an embodiment of substrate movement. Fig.10 Yes means Figure 1 A cross-sectional view of another embodiment of substrate movement. Figures 7 to 10 The substrate processing apparatus SPA described in the invention has the following features: Figure 1 The repeated contents of the substrate processing apparatus SPA described in the specification may be omitted or simplified.
[0083] Reference Figures 7 to 10 , the substrate processing apparatus SPA may include a first unit UN1, a second unit UN2, and a third unit UN3. For example, the first unit UN1, the second unit UN2, and the third unit UN3 may be adjacent to each other along the second direction D2. That is, the second unit UN2 may be arranged along the second direction D2 from the first unit UN1, and the third unit UN3 may be arranged along the second direction D2 from the second unit UN2. However, the embodiments of the present utility model are not limited thereto. The substrate processing apparatus SPA may further include a fourth unit and the like along the second direction D2.
[0084] The first unit UN1 may include a first gas supply part GS1, a first pad part PD1, and a first suction part VU1. Specifically, the gas DG may be discharged from the first gas supply part GS1 and sprayed to the substrate SUB through the first pad part PD1. Figure 7 As shown, the gas DG may be ejected in a direction opposite to the first direction D1 through the first pad portion PD1 .
[0085] The gas DG may be uniformly sprayed onto the substrate SUB through the first pad portion PD1. A plurality of regions for the gas DG to pass through may be defined on the first pad portion PD1. That is, the first pad portion PD1 may be a pad including a porous structure. Since the first pad portion PD1 includes a porous structure, when the gas DG supplied by the first gas supply portion GS1 is sprayed onto the substrate SUB, it can be sprayed from each hole at a substantially uniform speed.
[0086] The first suction part VU1 can suck the gas DG sprayed onto the substrate SUB. The first suction part VU1 can make the gas DG sprayed onto the substrate SUB diffuse uniformly without gathering in a certain direction. That is, by sucking the gas DG by the first suction part VU1, the gas DG can react uniformly with the substrate SUB.
[0087] The roller RL may move the substrate SUB in the second direction D2. For example, the substrate SUB that has been dried in the first unit UN1 may be moved to the second unit UN2 adjacent to the first unit UN1 in the second direction D2. That is, the roller RL may be a roller that ejects the ink (for example, Figure 5 A device used to transport the ink DI in the ink for other processes after the ink process.
[0088] The structures and functions of the second unit UN2 and the third unit UN3 are substantially the same as those of the first unit UN1 , and thus repeated contents are omitted.
[0089] In one embodiment, if Figures 7 to 9 As shown, when the substrate SUB overlaps with the first unit UN1 in a plan view, the first unit UN1 may be opened, and the second unit UN2 and the third unit UN3 may be closed. Similarly, when the substrate SUB overlaps with the second unit UN2 in a plan view, the second unit UN2 may be opened, and the first unit UN1 and the third unit UN3 may be closed. When the substrate SUB overlaps with the third unit UN3 in a plan view, the third unit UN3 may be opened, and the first unit UN1 and the second unit UN2 may be closed.
[0090] In another embodiment, if Fig.10 As shown, the first unit UN1, the second unit UN2 and the third unit UN3 can be operated simultaneously. That is, when the substrate SUB does not overlap with the first unit UN1, the second unit UN2 and the third unit UN3 in a plan view, the first unit UN1, the second unit UN2 and the third unit UN3 can also be turned on.
[0091] The present invention can be applied to a display device and an electronic device including the display device. For example, the present invention can be applied to a high-resolution smart phone, a cellular phone, a smart tablet, a smart watch, a tablet PC, a car navigation system, a television, a computer monitor, a notebook computer, etc.
[0092] In the above content, reference is made to exemplary embodiments of the present invention, but a person having general knowledge in the relevant technical field should be able to understand that the present invention can be modified and changed in various ways without departing from the scope of the idea and field of the present invention recorded in the claims.
Claims
1. A substrate processing device, characterized in that: include: A gas supply unit, used for supplying gas to the substrate; a liner portion defining a plurality of first holes through which the gas supplied from the gas supply portion passes; and The suction part is used to suck the gas sprayed onto the substrate through the plurality of first holes.
2. The substrate processing device according to claim 1, characterized in that: The gas supply unit includes a gas heating unit and a pressure regulating unit.
3. The substrate processing device according to claim 1, characterized in that: The pad portion is arranged spaced apart from the substrate along a first direction.
4. The substrate processing device according to claim 3, characterized in that: A distance between the substrate and the pad portion in the first direction is greater than or equal to 10 μm and less than or equal to 100 μm.
5. The substrate processing apparatus according to claim 1, wherein: further comprising a suction pipe connected to the suction part, A plurality of second holes connected to the suction pipe are further defined on the cushion portion.
6. The substrate processing device according to claim 5, characterized in that: The second holes each have a diameter greater than the first holes each have a diameter.
7. The substrate processing device according to claim 5, characterized in that: The number of the first holes is greater than the number of the second holes.
8. A substrate processing device, characterized in that: It includes the first unit and the second unit. The first unit comprises: A first gas supply unit, used for supplying gas to the substrate; a first gasket portion through which the gas supplied from the first gas supply portion passes and which defines a plurality of holes; and a first suction unit for sucking the gas sprayed onto the substrate through the plurality of holes; The second unit comprises: A second gas supply unit, used for supplying gas to the substrate; a second gasket portion through which the gas supplied from the second gas supply portion passes and which defines a plurality of holes; and The second suction part is used to suck the gas sprayed onto the substrate through the plurality of holes.
9. The substrate processing device according to claim 8, characterized in that: The first pad portion and the second pad portion are respectively arranged to be spaced apart from the substrate along a first direction.
10. The substrate processing apparatus according to claim 9, wherein: The first pad portion and the second pad portion are each separated from the substrate by a distance in the first direction of not less than 10 μm and not more than 100 μm.