Radio frequency chip electromagnetic shielding laminated substrate packaging device

Abstract

The utility model relates to the field of substrate packaging, and discloses a radio frequency chip electromagnetic shielding laminated substrate packaging device which comprises a base and a connecting frame, two feeding boxes are fixedly installed at one end of the base, a gluing mechanism is slidably connected to the top of the base, a connecting box is slidably installed on the inner wall of the connecting frame, and the connecting box is fixedly connected with the base. A vacuum groove is formed in the inner wall of the connecting box, a sliding plate is slidably connected to the inner wall of the vacuum groove, and the bottom end of the connecting box communicates with a plurality of suction cups; the connecting frame is installed at one end of the gluing mechanism, the inner wall of the connecting frame is slidably connected with the connecting box, the inner wall of the connecting box is provided with the vacuum groove, the inner wall of the vacuum groove is slidably connected with the sliding plate, and the bottom end of the connecting box communicates with the suction cup, so that after the gluing mechanism glues the surface of a processing material, the sliding plate moves on the inner wall of the vacuum groove, and the surface of the processing material is glued. And the suction cup is controlled to suck the pressing plate in the feeding box, and the pressing plate is moved to the upper end of the machining material through the gluing mechanism to be packaged.

Description

Technical Field

[0001] The present application relates to the field of substrate packaging, and in particular to a radio frequency chip electromagnetic shielding laminated substrate packaging device. Background Art

[0002] Substrate surface treatment is a very important link in the production of packaging substrates. It is mainly to ensure that components can be firmly adhered to the substrate, improve the conductivity and corrosion resistance of the circuit board, and at the same time improve the anti-interference ability of the substrate with the help of the electromagnetic shielding layer. Chemical methods are usually used to treat the surface of the substrate. After the surface treatment of the substrate is completed, the components need to be adhered to the surface of the substrate. This is an important step in the production of packaging substrates. In this process, it is necessary to ensure that the position of the components is accurate and the solder joints are clear. After the final packaging is completed, the packaging test is carried out to ensure product quality and performance. When the conventional substrate electromagnetic shielding layer is packaged, after the base is installed stably, the top of the base is slidably connected with a gluing mechanism and a pressing plate mechanism, and the processed material is moved to the upper end of the base. The surface of the processed material is coated with glue with the help of the gluing mechanism. A loading box is installed at one end of the base, and the packaging plate in the loading box is moved to the upper end of the processed material with the help of the pressing plate mechanism, thereby packaging the processed material.

[0003] With respect to the above-mentioned related technologies, the inventors believe that, when using a conventional substrate packaging device, it is often necessary to separate the gluing mechanism from the pressing plate mechanism. Therefore, when the surrounding environment is relatively hot, the glue is prone to drying too quickly during movement, resulting in a deterioration in the packaging effect and increasing the processing cost of the packaging device.

[0004] The above information disclosed in the background technology is only used to increase the understanding of the background technology of the present application, and therefore, it may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0005] In order to solve the problem that the conventional gluing and pressing plate mechanisms are separated, resulting in poor glue adhesion, the present application provides a radio frequency chip electromagnetic shielding laminate substrate packaging device.

[0006] The radio frequency chip electromagnetic shielding laminate substrate packaging device provided in this application adopts the following technical solution:

[0007] The invention discloses an electromagnetic shielding laminate substrate packaging device for radio frequency chips, comprising a base and a connecting frame, wherein two feeding boxes are fixedly mounted on one end of the base, and a gluing mechanism is slidably connected to the top of the base, a connecting box is slidably mounted on the inner wall of the connecting frame, a vacuum groove is provided on the inner wall of the connecting box, a sliding plate is slidably connected to the inner wall of the vacuum groove, a plurality of suction cups are connected to the bottom end of the connecting box, one end of the connecting frame is fixedly connected to one end of the gluing mechanism, and the size of the inner wall of the connecting frame is matched with the size of the surface of the connecting box, and the size of the surface of the sliding plate is matched with the size of the inner wall of the vacuum groove.

[0008] Preferably, a pull rope is fixedly installed on the top of the sliding plate, and a plurality of pull ropes are fixedly connected to the tops of rotating rods, a motor is fixedly installed on one end of the rotating rod, and one end of the motor is slidably connected to the surface of the connecting frame.

[0009] Preferably, a spring is fixedly mounted on the top of the sliding plate, the top of the spring is fixedly connected to the top wall inside the connection box, and the center of the spring and the center of the pull rope are on the same straight line.

[0010] Preferably, a telescopic rod is fixedly installed on the top of the connecting box, the surface of the telescopic rod is slidably connected to the inner wall of the connecting frame, and one end of the telescopic rod is fixedly installed on the surface of the gluing mechanism, a sliding groove is provided on the inner wall of the connecting frame, and one end of the connecting box is fixedly connected to a connecting block adapted to the sliding groove.

[0011] Preferably, a fixing frame is fixedly connected to the surface of the connecting frame, a detector is rotatably mounted on the inner wall of the fixing frame, and one end of the detector is electrically connected to one end of the motor.

[0012] In summary, this application includes the following beneficial technical effects:

[0013] 1. By installing the connecting frame at one end of the gluing mechanism, the inner wall of the connecting frame is slidably connected to the connecting box, the inner wall of the connecting box is provided with a vacuum groove, the inner wall of the vacuum groove is slidably connected to the sliding plate, and the bottom end of the connecting box is connected to a suction cup, so that after the gluing mechanism applies glue to the surface of the processed material, the sliding plate moves on the inner wall of the vacuum groove, controls the suction cup to adsorb the pressing plate in the feeding box, and moves the pressing plate to the upper end of the processed material for packaging through the gluing mechanism, avoiding the problem that the colloid is affected by the weather and the drying speed is fast, affecting the packaging effect. A pull rope is installed on the top of the sliding plate. A rotating rod is installed on the top of the pull rope, and one end of the rotating rod is controlled to rotate by a motor, so that the pull rope can be reeled up by the rotating rod after rotation, thereby controlling the sliding plate to move up, so that the suction cup and the surface of the pressure plate are adsorbed, and the sliding plate on the inner wall of the vacuum groove is reset under the influence of pressure after the pull rope is loosened, which is more convenient when used. A spring is installed between the sliding plate and the vacuum groove, so that the sliding plate can be pushed by the spring, so that the sliding plate can be reset, and the sliding plate is prevented from being stuck on the inner wall of the vacuum groove; compared with the existing technology, the packaging effect of the substrate is effectively improved;

[0014] 2. A telescopic rod can also be installed on the top of the connecting box, one end of the telescopic rod is connected to the surface of the gluing mechanism, a connecting block is installed on the surface of the connecting box, and the surface of the connecting block is slidably connected to the slide groove of the inner wall of the connecting frame, so that the connecting box can be controlled to move up and down with the help of the telescopic rod, so that when the gluing mechanism is running, the connecting box can be put into the connecting frame to avoid affecting the use of the gluing mechanism, a fixed frame is installed on the surface of the connecting frame, and a detector is rotatably connected to the inner wall of the fixed frame, and the detector is electrically connected to the motor, so that the working status of the suction cup can be checked with the help of the detector, so that when the pressure plate at the bottom of the suction cup falls, the motor can be controlled to stop running in time, which is convenient for the staff to operate; the influence of the device on the gluing mechanism is effectively avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the radio frequency chip electromagnetic shielding laminate substrate packaging device of the application embodiment;

[0016] Figure 2 is a schematic diagram of the connecting frame structure of an embodiment of the application;

[0017] Figure 3 is a side view schematic diagram of the structure of an embodiment of the application;

[0018] Figure 4 It is a schematic diagram of the structure at location A of an embodiment of the application.

[0019] Explanation of the accompanying drawings: 1. Base; 2. Feeding box; 3. Gluing mechanism; 4. Connecting frame; 5. Connecting box; 6. Vacuum groove; 7. Sliding plate; 8. Suction cup; 9. Pull rope; 10. Rotating rod; 11. Motor; 12. Spring; 13. Telescopic rod; 14. Slide groove; 15. Connecting block; 16. Fixed frame; 17. Detector. DETAILED DESCRIPTION

[0020] The following is combined with Figure 1 —4 Provide further details of this application.

[0021] The present application embodiment discloses a radio frequency chip electromagnetic shielding laminate substrate packaging device, referring to Figure 1 - Figure 2 , including a base 1. After the base 1 is installed and stabilized, the top of the base 1 is slidably connected with a gluing mechanism 3, the processed material is moved to the upper end of the base 1, and the surface of the processed material is coated with glue by means of the gluing mechanism 3. The connecting frame 4 is installed at one end of the gluing mechanism 3. The inner wall of the connecting frame 4 is slidably connected with a connecting box 5. The inner wall of the connecting box 5 is provided with a vacuum groove 6. The inner wall of the vacuum groove 6 is slidably connected with a sliding plate 7. The bottom end of the connecting box 5 is connected with a suction cup 8. After the gluing mechanism 3 coats the surface of the processed material with glue, the sliding plate 7 is moved on the inner wall of the vacuum groove 6. A feeding box 2 is installed at one end of the base 1. The device is moved to the upper end of the feeding box 2 by the gluing mechanism 3, and the pressure plate in the feeding box 2 is adsorbed by the suction cup 8, and is moved to the upper end of the processed material for packaging, thereby avoiding the problem that the colloid is affected by the weather and the drying speed is fast, affecting the packaging effect.

[0022] Reference Figure 2 A pull rope 9 is installed on the top of the sliding plate 7, and a rotating rod 10 is installed on the top of the pull rope 9. One end of the rotating rod 10 is controlled to rotate by means of a motor 11. The surface of the motor 11 is slidably connected to the surface of the connecting frame 4. The pull rope 9 is reeled in by means of the rotated rotating rod 10, thereby controlling the sliding plate 7 to move up, so that the suction cup 8 is adsorbed on the surface of the pressure plate, and after the pull rope 9 is loosened, the sliding plate 7 on the inner wall of the vacuum groove 6 is automatically reset due to the pressure, which is more convenient in use. A spring 12 is installed between the sliding plate 7 and the vacuum groove 6. The sliding plate 7 is pushed by the spring 12 so that the sliding plate 7 can be reset to avoid the sliding plate 7 being stuck on the inner wall of the vacuum groove 6.

[0023] Reference Figure 2 - Figure 4A telescopic rod 13 is installed on the top of the connection box 5, one end of the telescopic rod 13 is connected to the surface of the gluing mechanism 3, a connection block 15 is installed on the surface of the connection box 5, and the surface of the connection block 15 is slidably connected to the slide groove 14 on the inner wall of the connection frame 4. The connection box 5 is controlled to move up and down with the help of the telescopic rod 13, so that when the gluing mechanism 3 is running, the connection box 5 is put into the connection frame 4 to avoid the device affecting the use of the gluing mechanism 3. A fixing frame 16 is installed on the surface of the connection frame 4, and a detector 17 is rotatably connected to the inner wall of the fixing frame 16. The detector 17 is electrically connected to the motor 11. The working state of the suction cup 8 is checked with the help of the detector 17, so that when the pressure plate at the bottom of the suction cup 8 falls, the motor 11 is promptly controlled to stop running, which is convenient for the staff to operate.

[0024] The implementation principle of the radio frequency chip electromagnetic shielding laminate substrate packaging device of the embodiment of the present application is as follows: by installing the connecting frame 4 at one end of the gluing mechanism 3, the inner wall of the connecting frame 4 is slidably connected to the connecting box 5, the inner wall of the connecting box 5 is provided with a vacuum groove 6, the inner wall of the vacuum groove 6 is slidably connected to the sliding plate 7, and the bottom end of the connecting box 5 is connected to the suction cup 8, so that after the gluing mechanism 3 applies glue to the surface of the processing material, the sliding plate 7 moves on the inner wall of the vacuum groove 6, and the suction cup 8 is controlled to adsorb the pressing plate in the feeding box 2, and the pressing plate is moved to the upper end of the processing material for packaging through the gluing mechanism 3, which avoids the colloid being affected by the weather and the fast drying speed affecting the sealing. In order to solve the problem of installation effect, a pull rope 9 is installed on the top of the sliding plate 7, and a rotating rod 10 is installed on the top of the pull rope 9. One end of the rotating rod 10 is controlled to rotate by means of a motor 11, so that the pull rope 9 can be reeled in by means of the rotated rotating rod 10, thereby controlling the sliding plate 7 to move up, so that the suction cup 8 is adsorbed on the surface of the pressure plate, and after the pull rope 9 is loosened, the sliding plate 7 on the inner wall of the vacuum groove 6 is reset under the influence of pressure, which is more convenient in use. A spring 12 is installed between the sliding plate 7 and the vacuum groove 6, so that the sliding plate 7 can be pushed by the spring 12, so that the sliding plate 7 can be reset, avoiding the situation that the sliding plate 7 is stuck on the inner wall of the vacuum groove 6.

[0025] A telescopic rod 13 can also be installed on the top of the connecting box 5, one end of the telescopic rod 13 is connected to the surface of the gluing mechanism 3, and a connecting block 15 is installed on the surface of the connecting box 5. The surface of the connecting block 15 is slidably connected to the slide groove 14 on the inner wall of the connecting frame 4, so that the connecting box 5 can be controlled to move up and down with the help of the telescopic rod 13, so that when the gluing mechanism 3 is running, the connecting box 5 can be put into the connecting frame 4 to avoid affecting the use of the gluing mechanism 3. A fixing frame 16 is installed on the surface of the connecting frame 4, and a detector 17 is rotatably connected to the inner wall of the fixing frame 16. The detector 17 is electrically connected to the motor 11, so that the working state of the suction cup 8 can be checked with the help of the detector 17, so that when the pressure plate at the bottom of the suction cup 8 falls, the motor 11 can be controlled to stop running in time, which is convenient for the staff to operate.

[0026] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A radio frequency chip electromagnetic shielding laminate substrate packaging device, comprising a base (1) and a connecting frame (4), characterized in that: Two feeding boxes (2) are fixedly mounted on one end of the base (1), and a gluing mechanism (3) is slidably connected to the top of the base (1), a connecting box (5) is slidably mounted on the inner wall of the connecting frame (4), a vacuum groove (6) is provided on the inner wall of the connecting box (5), a sliding plate (7) is slidably connected to the inner wall of the vacuum groove (6), and a plurality of suction cups (8) are connected to the bottom end of the connecting box (5).

2. The radio frequency chip electromagnetic shielding laminate substrate packaging device according to claim 1, characterized in that: One end of the connecting frame (4) is fixedly connected to one end of the gluing mechanism (3), and the size specifications of the inner wall of the connecting frame (4) are matched with the size specifications of the surface of the connecting box (5), and the size specifications of the surface of the sliding plate (7) are matched with the size specifications of the inner wall of the vacuum groove (6).

3. The radio frequency chip electromagnetic shielding laminate substrate packaging device according to claim 1, characterized in that: A pull rope (9) is fixedly installed on the top of the sliding plate (7), and a plurality of pull ropes (9) are fixedly connected to the tops of rotating rods (10). A motor (11) is fixedly installed on one end of the rotating rod (10), and one end of the motor (11) is slidably connected to the surface of the connecting frame (4).

4. The radio frequency chip electromagnetic shielding laminate substrate packaging device according to claim 1, characterized in that: A spring (12) is fixedly mounted on the top of the sliding plate (7), the top of the spring (12) is fixedly connected to the inner top wall of the connection box (5), and the center of the spring (12) is on the same straight line as the center of the pull rope (9).

5. The radio frequency chip electromagnetic shielding laminate substrate packaging device according to claim 1, characterized in that: A telescopic rod (13) is fixedly mounted on the top of the connection box (5); the surface of the telescopic rod (13) is slidably connected to the inner wall of the connection frame (4); one end of the telescopic rod (13) is fixedly mounted to the surface of the gluing mechanism (3); a sliding groove (14) is provided on the inner wall of the connection frame (4); and one end of the connection box (5) is fixedly connected to a connection block (15) adapted to the sliding groove (14).

6. The radio frequency chip electromagnetic shielding laminate substrate packaging device according to claim 1, characterized in that: A fixing frame (16) is fixedly connected to the surface of the connecting frame (4), a detector (17) is rotatably mounted on the inner wall of the fixing frame (16), and one end of the detector (17) is electrically connected to one end of the motor (11).

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