Silicon wafer separating device

Abstract

The utility model relates to the technical field of photovoltaic equipment manufacturing, in particular to a silicon wafer separating device. The silicon wafer separating device comprises a wafer box, the wafer box comprises a bottom plate and a flange, the bottom plate is provided with a bearing part for bearing silicon wafers, the flange is arranged on the bottom plate, surrounds the bearing part and is used for positioning the silicon wafers on the bearing part, and the bottom plate is provided with a plurality of first positioning holes and a plurality of second positioning holes. The plurality of first positioning holes and the plurality of second positioning holes are arranged around the bearing part, each flange is correspondingly inserted into each first positioning hole to form a first accommodating space for accommodating a silicon wafer, and each flange is correspondingly inserted into each second positioning hole to form a second accommodating space for accommodating the silicon wafer; the size of the first accommodating space adapted to accommodate the silicon wafer is larger than the size of the second accommodating space adapted to accommodate the silicon wafer. The silicon wafer separating device is beneficial to improving the compatibility of silicon wafers.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic equipment manufacturing, in particular to a silicon wafer slicing device. Background Art

[0002] With the rapid development of the photovoltaic field, the demand for solar cells is increasing, and the specifications and types of solar cells are also increasing. In the entire production process of solar cells, splitting the stacked silicon wafers into single silicon wafers after unpacking and sending them to the basket is the most basic link in the entire production process. The wafer box is an important carrier for transporting stacked silicon wafers. It can make the stacked silicon wafers flow in different equipment. Since the thickness of a single silicon wafer is very thin, the stacked silicon wafers may stick to each other after removing the air in the gap between the wafers. Therefore, it is necessary to cooperate with the wind knife slice structure to separate the stacked silicon wafers into independent single silicon wafers and then transfer them to the basket to ensure the smooth production of solar cells.

[0003] As the specifications of silicon wafers currently used to prepare solar cells tend to be diversified, and the existing wafer boxes have poor compatibility with silicon wafers of different specifications and sizes, in order to achieve high equipment production capacity and reduce equipment costs, higher requirements are placed on the compatibility and fast switching functions of the wafer boxes. Utility Model Content

[0004] The main purpose of the utility model is to provide a silicon wafer separation device, aiming to solve the technical problem that the current wafer box has poor compatibility with silicon wafers of different specifications and sizes and cannot achieve fast switching.

[0005] To achieve the above-mentioned purpose, the utility model provides a silicon wafer separation device, including a wafer box, wherein the wafer box includes:

[0006] A bottom plate, wherein the bottom plate has a receiving portion, the receiving portion is used to receive the silicon wafer, the bottom plate is provided with a plurality of first positioning holes and a plurality of second positioning holes, and the plurality of first positioning holes and the plurality of second positioning holes are all arranged around the receiving portion;

[0007] A plurality of ribs, wherein the ribs are arranged on the bottom plate and are arranged around the receiving portion, and are used to position the silicon wafer on the receiving portion;

[0008] Among them, each of the said guard edges is correspondingly inserted into each of the first positioning holes to form a first accommodating space for accommodating the silicon wafer, and each of the said guard edges is correspondingly inserted into each of the second positioning holes to form a second accommodating space for accommodating the silicon wafer, and the size of the first accommodating space adapted to accommodate the silicon wafer is larger than the size of the second accommodating space adapted to accommodate the silicon wafer.

[0009] In some embodiments, the silicon wafer slicing device further comprises:

[0010] An air knife mechanism, wherein the air knife mechanism has an air blowing port, and the air blowing port is used to blow air to separate the stacked silicon wafers;

[0011] A lifting mechanism, the lifting mechanism is arranged on a side of the bottom plate away from the retaining edge, the lifting mechanism is configured to be able to move in a direction close to or away from the bottom plate, when the lifting mechanism moves in a direction close to the bottom plate, the lifting mechanism can lift the silicon wafer to align the silicon wafer with the blowing port, and when the lifting mechanism moves in a direction away from the bottom plate, the lifting mechanism can place the silicon wafer on the receiving portion;

[0012] Wherein, the bottom plate is provided with a through hole at a position corresponding to the lifting mechanism, so that the lifting mechanism can lift the silicon wafer through the through hole.

[0013] In some embodiments, the air knife mechanism is driven by a cylinder, and the cylinder can drive the air knife mechanism to move toward or away from the silicon wafer.

[0014] In some embodiments, the cylinder is configured to drive the air knife mechanism to move between two adjacent ribs.

[0015] In some embodiments, the base plate has a plurality of receiving portions, which are arranged in parallel and at intervals along the length direction of the base plate. Along the width direction of the base plate, a wind knife mechanism is correspondingly arranged on both sides of each receiving portion, and the air port is aligned with the receiving portion.

[0016] In some embodiments, the silicon wafer separation device further comprises a transmission rail, the wafer box is connected to the transmission rail, and the wafer box can slide along the transmission rail to realize the transportation of the silicon wafer;

[0017] Wherein, the transmission guide rail is provided with an electromagnet device and a photoelectric positioning device at the wafer separation position of the silicon wafer, and the electromagnet device and the photoelectric positioning device are used to position the wafer box.

[0018] In some embodiments, the silicon wafer separation device includes a plurality of the wafer boxes and a plurality of the transmission rails, each of the wafer boxes is correspondingly connected to each of the transmission rails, the wafer boxes are configured as an upper wafer box and a lower wafer box, the upper wafer box is used to receive the silicon wafers to be separated, and the lower wafer box is used to collect the reworked silicon wafers;

[0019] Wherein, a baffle is arranged between each of the film boxes.

[0020] In some embodiments, the wind knife mechanism includes an optical fiber sensing portion for sensing the silicon wafer, the air blowing port includes a first air blowing port and a second air blowing port, the first air blowing port is used for auxiliary air blowing to the silicon wafer, and the second air blowing port is used for intermittent air blowing to the silicon wafer;

[0021] Wherein, the velocity V of the air flow blown out of the first blowing port is 1 and the velocity V of the air flow blown out of the second blowing port 2 Satisfaction: V 1 <V 2 .

[0022] In some embodiments, the receiving portion is provided with a pad, and a receiving end surface is provided on a side of the pad away from the bottom plate, the receiving end surface is used to receive the silicon wafer, and an angle is formed between the receiving end surface and the bottom plate;

[0023] Wherein, the retaining edge is arranged around the backing plate.

[0024] In some embodiments, the rib and the bottom plate are not arranged perpendicularly, and along the direction from the rib to the bottom plate, the rib is inclined from bottom to top in a direction away from the first accommodating space or the second accommodating space.

[0025] Compared with the prior art, the beneficial effects of the utility model are:

[0026] In the technical solution of the utility model, a silicon wafer slicing device is provided. In view of the technical problem that the current wafer box has poor compatibility with silicon wafers of different specifications and sizes and cannot achieve fast switching, the wafer box for receiving stacked silicon wafers is further improved. The improved wafer box of the utility model includes a bottom plate and a rib, the bottom plate has a receiving portion for receiving the stacked silicon wafers, the rib is connected to the bottom plate, and the rib is arranged around the receiving portion to block the silicon wafer in the receiving portion. Furthermore, around the receiving portion, a plurality of first positioning holes and a plurality of second positioning holes are opened on the bottom plate, each rib is correspondingly inserted into each first positioning hole to form a first accommodating space for accommodating silicon wafers, or each rib is correspondingly inserted into each second positioning hole to form a second accommodating space for accommodating silicon wafers, wherein the size of the silicon wafer adapted to be accommodated in the first accommodating space is larger than the size of the silicon wafer adapted to be accommodated in the second accommodating space, that is, compared with the second accommodating space, the first accommodating space can accommodate silicon wafers of larger specifications and sizes.

[0027] The silicon wafer separating device provided by the utility model sets the wafer box into a structure with adjustable accommodating space. By switching the plugging position of the retaining edge in the positioning hole at different positions, the size of the wafer box accommodating space can be quickly changed, so that the wafer box can be compatible with silicon wafers of different specifications and sizes, and meet the needs of stacking and transporting silicon wafers of different specifications and sizes. The wafer box with the above structure avoids the need to spend a long time and high cost to replace and modify the wafer box when transporting silicon wafers of different specifications and sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0029] Figure 1 A schematic diagram of the overall structure of a silicon wafer separation device provided in one embodiment of the utility model;

[0030] Figure 2 A schematic diagram of the structure of a wafer box in a silicon wafer separation device provided in an embodiment of the utility model;

[0031] Figure 3 A top view of the structure of a wafer box in a silicon wafer separation device provided by an embodiment of the utility model;

[0032] Figure 4 A schematic diagram of the positional relationship between a first positioning hole and a second positioning hole on a bottom plate of a wafer box in a silicon wafer separation device provided by an embodiment of the utility model;

[0033] Figure 5 A schematic diagram of the positional relationship between a first positioning hole and a second positioning hole on a bottom plate of a wafer box in a silicon wafer separation device provided by another embodiment of the utility model;

[0034] Figure 6 A schematic diagram of the structure of an air knife mechanism in a silicon wafer separation device provided in one embodiment of the utility model;

[0035] Figure 7 A front view of the structure of the air knife mechanism in the silicon wafer separation device provided by one embodiment of the utility model;

[0036] Figure 8 A schematic diagram of the overall structure of a silicon wafer separation device in an initial state provided by an embodiment of the utility model;

[0037] Fig. 9The present invention is a schematic diagram of the overall structure of a silicon wafer separation device in a working state according to an embodiment of the present invention.

[0038] Description of Figure Numbers:

[0039] 100-piece box;

[0040] 110-bottom plate; 120-rib; 130-backing plate; 140-mounting seat;

[0041] 111- receiving portion; 112- first positioning hole; 113- second positioning hole;

[0042] 200-air knife mechanism;

[0043] 210-first air blowing port; 220-second air blowing port; 230-optical fiber sensing part;

[0044] 300-cylinder;

[0045] 400-lifting mechanism;

[0046] 500-Transmission rail;

[0047] 510-electromagnet device; 520-photoelectric positioning device;

[0048] 600-Baffle.

[0049] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0051] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0052] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or", "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0053] With the rapid development of the photovoltaic field, the demand for solar cells is increasing, and the specifications and types of solar cells are also increasing. In the entire production process of solar cells, splitting the stacked silicon wafers into single silicon wafers after unpacking and sending them to the basket is the most basic link in the entire production process. The wafer box is an important carrier for transporting stacked silicon wafers. It can make the stacked silicon wafers flow in different equipment. Since the thickness of a single silicon wafer is very thin, the stacked silicon wafers may stick to each other after removing the air in the gap between the wafers. Therefore, it is necessary to cooperate with the wind knife slice structure to separate the stacked silicon wafers into independent single silicon wafers and then transfer them to the basket to ensure the smooth production of solar cells.

[0054] As the specifications of silicon wafers currently used to prepare solar cells tend to be diversified, and the existing wafer boxes have poor compatibility with silicon wafers of different specifications and sizes, in order to achieve high equipment production capacity and reduce equipment costs, higher requirements are placed on the compatibility and fast switching functions of the wafer boxes.

[0055] In order to solve the technical problem that the current chip box 100 has poor compatibility with silicon chips of different specifications and sizes and cannot achieve fast switching, refer to Figures 1 to 9An embodiment of the utility model provides a silicon wafer slicing device, including a wafer box 100, which is used to carry and transport stacked silicon wafers and transport the silicon wafers to different processing stations to complete the overall production of solar cells. The wafer box 100 includes a bottom plate 110 and a plurality of sidewalls 120. The bottom plate 110 has a receiving portion 111, which is used to receive a silicon wafer. The sidewalls 120 are arranged on the bottom plate 110, and the sidewalls 120 are arranged around the receiving portion 111, and are used to position the silicon wafer on the receiving portion 111. The bottom plate 110 is provided with a plurality of first positioning holes 112 and a plurality of second positioning holes 113, and the plurality of first positioning holes 112 and the plurality of second positioning holes 113 are all arranged around the receiving portion 111. Each sidewall 120 is correspondingly plugged into each first positioning hole 112 to form a first accommodating space for accommodating a silicon wafer, and each sidewall 120 is correspondingly plugged into each second positioning hole 113 to form a second accommodating space for accommodating a silicon wafer. The size of the first accommodating space adapted to accommodate a silicon wafer is larger than the size of the second accommodating space adapted to accommodate a silicon wafer.

[0056] Specifically, in this embodiment, a silicon wafer separation device is provided. In view of the technical problem that the current wafer box 100 has poor compatibility with silicon wafers of different specifications and sizes and cannot achieve fast switching, the wafer box 100 for receiving stacked silicon wafers is further improved. The improved wafer box 100 in this embodiment includes a bottom plate 110 and a retaining edge 120. The bottom plate 110 has a receiving portion 111 for receiving the stacked silicon wafers. The retaining edge 120 is connected to the bottom plate 110, and the retaining edge 120 is arranged around the receiving portion 111 to retain the silicon wafers in the receiving portion 111. Furthermore, the surrounding Around the supporting portion 111, a plurality of first positioning holes 112 and a plurality of second positioning holes 113 are opened on the bottom plate 110, and each retaining edge 120 is correspondingly inserted into each first positioning hole 112 to form a first accommodating space for accommodating a silicon wafer, or each retaining edge 120 is correspondingly inserted into each second positioning hole 113 to form a second accommodating space for accommodating a silicon wafer, wherein the size of the silicon wafer adapted to be accommodated in the first accommodating space is larger than the size of the silicon wafer adapted to be accommodated in the second accommodating space, that is, compared with the second accommodating space, the first accommodating space can accommodate silicon wafers of larger specifications.

[0057] The silicon wafer separating device provided in this embodiment sets the wafer box 100 into a structure with adjustable accommodating space. By switching the insertion position of the retaining edge 120 in the positioning holes at different positions, the size of the accommodating space of the wafer box 100 can be quickly changed, so that the wafer box 100 can be compatible with silicon wafers of different specifications and sizes, and meet the stacking and transportation of silicon wafers of different specifications and sizes. The wafer box 100 with the above structure avoids the need to spend a long time and high cost to replace and modify the wafer box 100 when transporting silicon wafers of different specifications and sizes.

[0058] Further, refer to Figures 2 to 3In order to improve the efficiency of replacing the ribs 120 and save the time cost of replacing the ribs 120, a plurality of ribs 120 can be plugged into a mounting seat 140 in groups, and the mounting seat 140 is adapted to the first positioning hole 112 and the second positioning hole 113, that is, the mounting seat 140 can be plugged into the first positioning hole 112 and the second positioning hole 113, so as to achieve the change of the size of the accommodating space of the film box 100. Specifically, when it is necessary to change the size of the accommodating space of the film box 100, it is only necessary to change the installation position of the mounting seat 140 in the positioning hole, and it is not necessary to change the position of the ribs 120 one by one, so that the accommodating space of the film box 100 can be expanded or reduced while reducing the number of times the ribs 120 are replaced. For example, assuming that a film box 100 has eight flanges 120, and a mounting seat 140 can be plugged with two flanges 120, when the flange 120 needs to be unplugged from the first positioning hole 112 and plugged into the second positioning hole 113, if the flange 120 is not plugged into the mounting seat 140 and the installation position of the flange 120 is directly changed, the flange 120 needs to be disassembled and assembled eight times in total. If the flange 120 is first plugged into the mounting seat 140, and then the installation position of the mounting seat 140 is changed to change the installation position of the flange 120, the flange 120 needs to be disassembled and assembled four times in total. It can be seen that the method of plugging the flange 120 into the mounting seat 140 is conducive to improving the efficiency of replacing the flange 120 and realizing rapid switching of the flange 120.

[0059] Further, refer to Figures 4 to 5 A plurality of receiving parts 111 may be arranged in parallel on a bottom plate 110, and silicon wafers may be stacked in each receiving part 111 to improve the transportation efficiency of the silicon wafers. Since a rib 120 is inserted around each receiving part 111, in order to ensure that the ribs 120 arranged around two adjacent receiving parts 111 do not interfere with each other (especially when the two adjacent receiving parts 111 need to increase their respective accommodating spaces), the volume of the bottom plate 110 is further reduced, so that the wafer box 100 is miniaturized while being able to accommodate a large number of silicon wafers, the arrangement of each group of positioning holes around the receiving part 111 can be optimized, and the reserved positioning holes can be arranged in a staggered manner. For example, in some embodiments, assuming that an inner and outer circle positioning hole groups are provided around a receiving portion 111, the inner circle positioning hole group around each receiving portion 111 can be arranged along the edge of the receiving portion 111, the outer circle positioning hole group around one receiving portion 111 can be arranged along the diagonal, and the outer circle positioning hole group around the adjacent receiving portion 111 can be arranged horizontally or vertically. In this way, the staggered insertion of the retaining edge 120 can be achieved, the distance between two adjacent receiving portions 111 becomes smaller, the structure is more compact, and the space of the base plate 110 can be utilized more effectively.

[0060] It should be noted that a single wafer box 100 can transport a stack of full silicon wafers (similar to square silicon wafers with specifications of 182mm*182mm and 210mm*210mm), or two stacks of silicon half wafers placed side by side (similar to rectangular silicon wafers with specifications of 182mm*91mm and 210mm*105mm). When a single wafer box 100 increases the accommodating space by changing the position of the retaining edge 120, it can transport a stack of larger full silicon wafers, or a larger number of stacks of silicon half wafers.

[0061] In some embodiments, the rib 120 includes an aluminum support portion and a polyimide layer, and the polyimide layer is disposed on an outer surface of the aluminum support portion.

[0062] Specifically, in the present embodiment, a specific structural composition of a retaining edge 120 is provided. Since the retaining edge 120 is in direct contact with the silicon wafer, which is thin and brittle, in order to avoid abnormal conditions such as wear, burrs, and edge collapse of the silicon wafer caused by friction between the silicon wafer and the retaining edge 120 when the silicon wafer contacts the retaining edge 120 or during the silicon wafer slicing process, or the silicon wafer scrapes the retaining edge 120 to cause scratches and burrs on the retaining edge 120, and to reduce the cost of frequently replacing new retaining edges 120 and the fragmentation (defective product) rate of the silicon wafer, the retaining edge 120 is reasonably designed and selected in the present embodiment, with metal aluminum as the inner support and the outer surface of the metal aluminum tightly covered with a film made of polyimide material, so that the stacked silicon wafers only contact with the polyimide layer when they are lifted and lowered for slicing in the wafer box 100. The aluminum support part can provide stable support for the stacked silicon wafers, so that the silicon wafers can be stably positioned in the wafer box 100. The polyimide layer itself is relatively smooth, which can effectively reduce the friction between the retaining edge 120 and the silicon wafer, thereby effectively reducing the damage to the silicon wafer caused by the retaining edge 120. At the same time, the polyimide layer is wear-resistant and has a longer service life, and can effectively deal with scratches on the silicon wafer. In addition, since the polyimide layer is pasted on the outer surface of the aluminum support part, even when the retaining edge 120 is worn, it is the outer polyimide layer that is worn, while the inner aluminum support part is still structurally intact. At this time, you only need to tear off the worn polyimide layer and replace it with a new polyimide layer, which further saves material costs.

[0063] By using the retaining edge 120 provided in this embodiment, the contact surface between the retaining edge 120 and the silicon wafer can be made smooth, burr-free and wear-resistant, and it is not easy to cause damage to the silicon wafers stacked inside the wafer box 100, thereby ensuring the yield rate of the processed silicon wafers. At the same time, it is beneficial to extend the service life of the retaining edge 120, so that the retaining edge 120 will not be replaced frequently, thereby reducing the cost of production and processing.

[0064] In some embodiments, the thickness D of the polyimide layer satisfies: 0.15 mm≤D≤0.25 mm. For example, the thickness D may be 0.15 mm, 0.18 mm, 0.2 mm, 0.23 mm, 0.25 mm, and so on.

[0065] Specifically, in this embodiment, the polyimide layer is processed by cold cutting, so that the cut edge of the polyimide layer has no defects such as burrs and scratches. Since the cold cutting process transfers the cutting heat generated during the cutting process to the sawdust through the saw teeth, the cut polyimide layer and the saw teeth are kept cool, so that the cut polyimide layer does not generate burrs, the cutting accuracy of the polyimide layer is improved, and the cut edge of the polyimide layer is ensured to be smooth and flat. In addition, the cold cutting process has a fast sawing speed, which is conducive to improving cutting efficiency.

[0066] In some embodiments, reference Figure 1 The silicon wafer slicing device also includes an air knife mechanism 200 and a lifting mechanism 400. The air knife mechanism 200 is used to provide airflow to the stacked silicon wafers to slice the stacked silicon wafers. The lifting mechanism 400 is used to lift the stacked silicon wafers in the wafer box 100 to a slicing position. Specifically, the wind knife mechanism 200 has an air blowing port, which is used to blow air to separate the stacked silicon wafers. The lifting mechanism 400 is arranged on the side of the base plate 110 away from the retaining edge 120. The lifting mechanism 400 is configured to be able to move in a direction close to or away from the base plate 110. When the lifting mechanism 400 moves in a direction close to the base plate 110, the lifting mechanism 400 can lift the silicon wafer to align the silicon wafer with the air blowing port. When the lifting mechanism 400 moves in a direction away from the base plate 110, the lifting mechanism 400 can place the silicon wafer on the receiving portion 111, wherein the base plate 110 is provided with a through hole corresponding to the position of the lifting mechanism 400, so that the lifting mechanism 400 can lift the silicon wafer through the through hole.

[0067] In some embodiments, reference Figure 1 More preferably, the wind knife mechanism 200 is driven by the cylinder 300, and the cylinder 300 can drive the wind knife mechanism 200 to move towards or away from the silicon wafer.

[0068] Specifically, in the present embodiment, the stacked silicon wafers in the wafer box 100 are separated by the cooperation of the wind knife mechanism 200 and the lifting mechanism 400. The operation process of the silicon wafer separating device includes: first, the lifting mechanism 400 is actuated, and the lifting mechanism 400 will move toward the direction close to the bottom plate 110, and pass through the through hole opened on the bottom plate 110 to lift the silicon wafer until the silicon wafer moves to the separating position, and then the lifting mechanism 400 stops moving, and then the wind knife mechanism 200 is driven by the cylinder 300 to move toward the direction close to the silicon wafer at the separating position, and aligns the air port with the stacked silicon wafer, and the stable airflow blown out of the air port separates the bonded stacked silicon wafers into single silicon wafers, and then the suction cup mechanism takes away the separated single silicon wafer and feeds it to other processing stations. For example, the suction cup mechanism can be used to place a single silicon wafer on a belt line, and the belt line transfers the silicon wafer to the flower basket.

[0069] Further, refer to Figure 1 , Figure 6 , a cylinder 300 is added to the wind knife mechanism 200, and the wind knife mechanism 200 can move towards or away from the silicon wafer under the drive of the cylinder 300. When the cylinder 300 is in a retracted state, the distance between the wind knife mechanisms 200 arranged opposite to each other on both sides of the wafer box 100 is greater than the size of the wafer box 100 itself, so that the wafer box 100 will not interfere with the wind knife mechanism 200 during its movement and transportation. When the cylinder 300 is in an extended state, the wind knife mechanism 200 will be driven to approach the wafer box 100 that has stopped in place, so as to facilitate the air blowing port to be aligned with the silicon wafer in the wafer box 100, which is beneficial to shorten the distance between the air blowing port and the silicon wafer. For example, the air blowing port can be moved from a position 13 mm away from the silicon wafer to a position 3 mm away from the silicon wafer, so that the size and speed of the air flow blown out of the air port can be reduced, so that a more stable and more concentrated slicing air flow can be blown out of the air port, thereby ultimately improving the slicing effect of the silicon wafer.

[0070] In some embodiments, the cylinder 300 is configured to drive the air knife mechanism 200 to move between two adjacent ribs 120 .

[0071] Specifically, in this embodiment, since the side guards 120 arranged around the receiving portion 111 are arranged at intervals, there is a gap between two adjacent side guards 120. Under the drive of the cylinder 300, the wind knife mechanism 200 is finally moved to the gap between the two adjacent side guards 120. On the one hand, it is beneficial to make the air port close to the stacked silicon wafers, so that a more stable and concentrated slicing airflow is blown out from the air port to improve the slicing effect of the stacked silicon wafers. On the other hand, it is beneficial to utilize the gap space between two adjacent side guards 120, thereby reducing the total volume of the overall structure of the silicon wafer slicing device, so that the silicon wafer slicing device tends to be miniaturized.

[0072] In some embodiments, reference Figures 1 to 5 ,as well as Figures 8 to 9 The bottom plate 110 has a plurality of receiving portions 111 , which are arranged in parallel and at intervals along the length direction of the bottom plate 110 . Along the width direction of the bottom plate 110 , a wind knife mechanism 200 is correspondingly arranged on both sides of each receiving portion 111 , and the air outlet is aligned with the receiving portion 111 .

[0073] Specifically, in this embodiment, in order to increase the capacity of the wafer box 100 for transporting stacked silicon wafers at one time, a plurality of receiving parts 111 for receiving silicon wafers are provided on the bottom plate 110 of the wafer box 100, and stacked silicon wafers can be placed in each receiving part 111, and silicon wafers of the same specification and size can be placed in each receiving part 111, and silicon wafers of different specifications and sizes can also be placed, which greatly improves the transportation efficiency of silicon wafers, and further improves the efficiency of silicon wafer separation. Each receiving part 111 is correspondingly provided with at least two wind knife mechanisms 200, which can realize independent separation, so that the silicon wafers in each receiving part 111 do not interfere with each other during separation.

[0074] Further, refer to Figure 1 , Figure 6 , corresponding to multiple receiving parts 111, multiple air knife mechanisms 200 can be integrated together and driven by a cylinder 300. This is beneficial to improving the movement accuracy of the multiple air knife mechanisms 200, wherein each air knife mechanism 200 corresponds to a receiving part 111, so that each air knife mechanism 200 can blow and slice the silicon wafers placed in each receiving part 111.

[0075] It should be noted that the air knife mechanism 200 is a common structural device in the art, so the specific structure of the air knife mechanism 200 will not be described in detail in this embodiment.

[0076] In some embodiments, reference Figures 8 to 9 The silicon wafer slicing device also includes a transmission rail 500, and the wafer box 100 is connected to the transmission rail 500. The wafer box 100 can slide along the transmission rail 500 to realize the transportation of silicon wafers, wherein the transmission rail 500 is provided with an electromagnet device 510 and a photoelectric positioning device 520 at the slicing position of the silicon wafer, and the electromagnet device 510 and the photoelectric positioning device 520 are used to position the wafer box 100.

[0077] Specifically, in this embodiment, in order to facilitate the circulation and transportation of the wafer box 100 between various workstations, for example, to facilitate the circulation and transportation of the wafer box 100 between the loading position and the wafer separation position, or to facilitate the circulation and transportation of the wafer box 100 between the rework position and the unloading position, the wafer box 100 is installed on the transmission guide rail 500. In combination with the above embodiment, illustratively, taking the circulation and transportation of the wafer box 100 between the loading position and the wafer separation position as an example, the wafer box 100 slides along the transmission guide rail 500 to realize the silicon wafer loading and transportation, including the following action process: manually or by an automatic loader, stacked silicon wafers are placed in the wafer box 100, and then the stacked silicon wafers are placed in the wafer box 100. The wafer box 100 with silicon wafers is placed on the pallet of the horizontal transmission rail 500, and the pallet is pushed to transport the stacked silicon wafers to the wafer separation position. The transmission rail 500 is provided with an electromagnet device 510 and a photoelectric positioning device 520 at the wafer separation position to position the wafer box 100. After the arrival signal is confirmed, the wind knife mechanism 200 on both sides of the wafer box 100 runs to the inner side of the retaining edge 120 through the cylinder 300, so that the wind knife blowing port is close to the silicon wafer with a gap of about 3mm. After the wind knife mechanism 200 approaches the silicon wafer, the size and speed of the air flow blown out of the blowing port can be reduced, so that the air flow blown out of the blowing port is more stable, thereby improving the wafer separation effect. When the silicon wafers in the wafer box 100 are sucked by the suction cup structure, the wind knife mechanism 200 returns to the initial position, and the wafer box 100 is dragged away to the loading position along the transmission rail 500 manually or by a robot, and a new wafer box 100 loaded with silicon wafers is replaced to continue feeding to the wafer separation position.

[0078] The above structure can improve the efficiency of the transfer of the wafer box 100 between various workstations through the transfer rail 500, and can improve the positioning accuracy of the wafer box 100 at various workstations through the electromagnet device 510 and the photoelectric positioning device 520, thereby improving the processing quality of the silicon wafer.

[0079] Furthermore, in order to ensure that the film box 100 can be stably positioned at any position on the transmission guide rail 500, a plurality of first positioning pin holes are provided on the transmission guide rail 500, and a plurality of second positioning pin holes are provided on the bottom plate 110 of the film box 100. The film box 100 can be stably positioned at any position on the transmission guide rail 500 by means of positioning pins that pass through the second positioning pin holes and the first positioning pin holes in sequence.

[0080] It should be noted that the electromagnet device 510 and the photoelectric positioning device 520 are common structural devices in the art, so the specific structures of the electromagnet device 510 and the photoelectric positioning device 520 are not further described in this embodiment.

[0081] In some embodiments, reference Figures 8 to 9The silicon wafer separation device includes a plurality of wafer boxes 100 and a plurality of transmission rails 500. Each wafer box 100 is connected to each transmission rail 500. The wafer boxes 100 are configured as a loading wafer box and a unloading wafer box. The loading wafer box is used to receive unloaded silicon wafers, and the unloading wafer box is used to collect reworked silicon wafers. A baffle 600 is provided between each wafer box 100.

[0082] Specifically, in this embodiment, in order to facilitate the development of the silicon wafer slicing device in the direction of multi-function and high efficiency, further improve the integration level of the silicon wafer slicing device, so that the silicon wafer slicing device has the functions of loading and slicing and recycling reworked silicon wafers, the silicon wafer slicing device includes a plurality of wafer boxes 100, each wafer box 100 is correspondingly provided with a transmission guide rail 500 to ensure that each wafer box 100 does not interfere with each other during transmission. Further, the plurality of wafer boxes 100 include wafer boxes 100 with different carrying functions. For example, illustratively, it is assumed that the silicon wafer slicing device includes three wafer boxes 100, wherein two wafer boxes 100 can be set as loading wafer boxes for realizing stacking silicon wafer slicing, and another wafer box 100 can be set as unloading wafer box for collecting reworked silicon wafers. With such a structure, it is possible to realize the simultaneous loading of multiple groups of silicon wafers at a time, and to realize the recycling of a single silicon wafer in the flower basket in the unloading wafer box, so that the reworked silicon wafers are neatly stacked in the unloading wafer box.

[0083] Among them, illustratively, when the reworked silicon wafers are recycled into the unloading wafer box, the following action process is included: the empty unloading wafer box is transferred to the slicing position through the horizontal transmission rail 500 manually or by a robot, and the electromagnet device 510 and the photoelectric positioning device 520 set at the slicing position of the transmission rail 500 are used to position the unloading wafer box. After the arrival signal is confirmed, the wind knife mechanism 200 on both sides of the unloading wafer box does not work, and the silicon wafers on the belt transmission line are sucked into the unloading wafer box through the suction cup structure. The silicon wafers slide along the inclined surface of the pad 130 in the unloading wafer box and are neatly stacked at a corner of the unloading wafer box. After the unloading wafer box receives the specified number of silicon wafers, the unloading wafer box is moved to the unloading position along the transmission rail 500 manually or by a robot, and the full wafer box is taken out.

[0084] Further, refer to Figures 8 to 9 Since wind knife mechanisms 200 are provided on both sides of each wafer box 100, in order to avoid the airflows blown out by two adjacent groups of wind knife mechanisms 200 interfering with each other and affecting the stacked silicon wafers, the two adjacent groups of wind knife mechanisms 200 are separated by a baffle 600 so that each wafer box 100 is not disturbed when in working state.

[0085] In some embodiments, reference Figure 7The wind knife mechanism 200 includes an optical fiber sensing part 230 for sensing the silicon wafer, and the air blowing port includes a first air blowing port 210 and a second air blowing port 220. The first air blowing port 210 is used for auxiliary air blowing to the silicon wafer, and the second air blowing port 220 is used for intermittent air blowing to the silicon wafer. The flow rate V of the air flow blown out by the first air blowing port 210 is 1 and the velocity V of the air flow blown out of the second air outlet 220 2 Satisfaction: V 1 <V 2 For example, the first air blowing port 210 and the second air blowing port 220 may be arranged vertically and spaced apart.

[0086] Specifically, in this embodiment, the optical fiber sensing unit 230 senses the silicon wafer to determine whether the wind knife mechanism 200 moves to the slicing position, so as to improve the alignment accuracy between the air blowing port and the stacked silicon wafers. After determining that the wind knife mechanism 200 moves to the slicing position, the first air blowing port 210 first blows out an auxiliary airflow with a relatively low flow rate, so that the silicon wafers stuck together have a preliminary gap, and then the second air blowing port 220 intermittently blows out a relatively high flow rate of steady airflow, so that the silicon wafers stuck together are completely separated into single silicon wafers. The use of a blowing method combining the first air blowing port 210 and the second air blowing port 220 is conducive to improving the slicing effect of the silicon wafers. This method generally separates five silicon wafers at the same time, so that the five silicon wafers are in a stable suspension state.

[0087] Furthermore, the blowing port can be a rectangular blowing port or a circular hole blowing port. Compared with the circular hole blowing port, the rectangular blowing port is preferred. The rectangular blowing port has the following advantages: when the rectangular blowing port is used to blow air outward, the blowing area of ​​the wind knife mechanism 200 is large, and the air output to the outside is uniform, so it is easy to blow open the silicon wafers in the wafer box 100, and it is not easy for the silicon wafers to stick together, thereby reducing the phenomenon of sucking double or multiple silicon wafers when using a suction cup structure to transfer silicon wafers.

[0088] It should be noted that the optical fiber sensing unit 230 is a common structural device in the art, so the specific structure of the optical fiber sensing unit 230 will not be described in detail in this embodiment.

[0089] In some embodiments, the optical fiber sensing unit 230 may be replaced by laser photoelectric sensing to achieve the purpose of sensing the silicon wafer, so as to improve the alignment accuracy between the air outlet and the stacked silicon wafers.

[0090] In some embodiments, reference Figures 1 to 3 The receiving portion 111 is provided with a pad 130 , and a receiving end surface is provided on the side of the pad 130 facing away from the bottom plate 110 , and the receiving end surface is used to receive the silicon wafer, and an angle is formed between the receiving end surface and the bottom plate 110 , wherein the retaining edge 120 is arranged around the pad 130 .

[0091] Specifically, in this embodiment, in order to improve the slicing effect of the silicon wafer slicing device on the silicon wafer and effectively avoid problems such as silicon wafer stacking, a pad 130 is provided on the receiving portion 111 of the bottom plate 110, and the stacked silicon wafers in the wafer box 100 will be placed on the pad 130, wherein the receiving end surface of the pad 130 for receiving the silicon wafers is inclined and has an angle with the horizontal bottom plate 110, so that when the stacked silicon wafers are placed on the receiving end surface, each silicon wafer will slide away along the inclined surface under the action of its own gravity, and a relative displacement will be formed between the silicon wafers, rather than directly stacking a pile of neat silicon wafers on the receiving end surface. The placement of the stacked silicon wafers in a staggered manner is conducive to reducing the contact area between two adjacent silicon wafers, thereby reducing the probability of adhesion between two adjacent silicon wafers, and improving the slicing effect of the silicon wafers, so as to facilitate the subsequent use of the suction cup structure to transport the single silicon wafer to each processing position.

[0092] Further, the angle α between the receiving end face and the bottom plate 110 can satisfy: 20°≤α≤50°. For example, the value of the angle α can be 20°, 35°, 40°, 45°, 50°, etc., that is, the inclination angle α of the receiving end face satisfies: 20°≤α≤50°. The angle selection of α can be adaptively selected according to the actual processing conditions. α is set in the above range to avoid the silicon wafers eventually sliding along the inclined surface to the bottom of the pad 130 and stacking at the bottom of the pad 130 due to the excessive value of α (for example, α is 60°, 70°, 80°, etc.), and the silicon wafers cannot be staggered and slid apart. It is also avoided that the silicon wafers cannot slide effectively along the inclined surface due to the value of α is too small (for example, α is 5°, 10°, 15°, etc.), and the effect of the silicon wafers sliding apart cannot be achieved. Therefore, the value of α that is too large or too small will affect the slicing quality of the stacked silicon wafers.

[0093] Furthermore, after the size of the storage space of the film box 100 is adjusted, the pads 130 of different sizes can be replaced accordingly. For example, when the film box 100 is converted from a larger storage space to a smaller storage space, the pads 130 of smaller sizes can be replaced accordingly. When the film box 100 is converted from a smaller storage space to a larger storage space, the pads 130 of larger sizes can be replaced accordingly.

[0094] In some embodiments, the rib 120 and the bottom plate 110 are not arranged perpendicularly, and the rib 120 is inclined from bottom to top in a direction away from the first accommodating space or the second accommodating space along the direction from the rib 120 to the bottom plate 110 .

[0095] Specifically, in this embodiment, in order to facilitate the suction cup structure to smoothly transfer the silicon wafer from the wafer box 100, and to avoid the silicon wafer from contacting and colliding with the retaining edge 120 during the transfer process, resulting in damage, edge collapse, gaps and other abnormalities when the silicon wafer is sliced ​​in the wafer box 100, each retaining edge 120 is not set vertically in a conventional manner, but is tilted outward in the direction away from the accommodating space, that is, along the direction away from the bottom plate 110, the opening formed by all retaining edges 120 from bottom to top gradually increases, so that the area surrounded by all retaining edges 120 extends in a trumpet shape from one end close to the bottom plate 110 to the end away from the bottom plate 110. With such a structure, it can be ensured that the silicon wafer will not be scratched by the retaining edge 120 when it is transferred from the gap above the wafer box 100 after being sliced, thereby avoiding damage to the silicon wafer or the retaining edge 120.

[0096] It should be noted that other contents of the silicon wafer slicing device disclosed in the present invention can be found in the prior art and will not be described in detail here.

[0097] The above are only preferred embodiments of the present invention, and do not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A silicon wafer slicing device, characterized in that: The invention comprises a sheet box, wherein the sheet box comprises: A bottom plate, wherein the bottom plate has a receiving portion, the receiving portion is used to receive the silicon wafer, the bottom plate is provided with a plurality of first positioning holes and a plurality of second positioning holes, and the plurality of first positioning holes and the plurality of second positioning holes are all arranged around the receiving portion; A plurality of ribs, wherein the ribs are arranged on the bottom plate and are arranged around the receiving portion, and are used to position the silicon wafer on the receiving portion; Among them, each of the said guard edges is correspondingly inserted into each of the first positioning holes to form a first accommodating space for accommodating the silicon wafer, and each of the said guard edges is correspondingly inserted into each of the second positioning holes to form a second accommodating space for accommodating the silicon wafer, and the size of the first accommodating space adapted to accommodate the silicon wafer is larger than the size of the second accommodating space adapted to accommodate the silicon wafer.

2. The silicon wafer separation device according to claim 1, characterized in that: The silicon wafer separation device further comprises: An air knife mechanism, wherein the air knife mechanism has an air blowing port, and the air blowing port is used to blow air to separate the stacked silicon wafers; A lifting mechanism, the lifting mechanism is arranged on a side of the bottom plate away from the retaining edge, the lifting mechanism is configured to be able to move in a direction close to or away from the bottom plate, when the lifting mechanism moves in a direction close to the bottom plate, the lifting mechanism can lift the silicon wafer to align the silicon wafer with the blowing port, and when the lifting mechanism moves in a direction away from the bottom plate, the lifting mechanism can place the silicon wafer on the receiving portion; Wherein, the bottom plate is provided with a through hole at a position corresponding to the lifting mechanism, so that the lifting mechanism can lift the silicon wafer through the through hole.

3. The silicon wafer separation device according to claim 2, characterized in that: The air knife mechanism is driven by a cylinder, and the cylinder can drive the air knife mechanism to move toward or away from the silicon wafer.

4. The silicon wafer separation device according to claim 3, characterized in that: The cylinder is configured to drive the air knife mechanism to move between two adjacent ribs.

5. The silicon wafer separation device according to claim 2, characterized in that: The base plate has a plurality of receiving parts, which are arranged in parallel and at intervals along the length direction of the base plate. Along the width direction of the base plate, one wind knife mechanism is correspondingly arranged on both sides of each receiving part, and the air outlet is aligned with the receiving part.

6. The silicon wafer separation device according to claim 1, characterized in that: The silicon wafer separation device further comprises a transmission rail, the wafer box is connected to the transmission rail, and the wafer box can slide along the transmission rail to realize the transportation of the silicon wafer; Wherein, the transmission guide rail is provided with an electromagnet device and a photoelectric positioning device at the wafer separation position of the silicon wafer, and the electromagnet device and the photoelectric positioning device are used to position the wafer box.

7. The silicon wafer separation device according to claim 6, characterized in that: The silicon wafer separation device comprises a plurality of wafer boxes and a plurality of transmission rails, each wafer box is correspondingly connected to each transmission rail, the wafer boxes are configured as an upper wafer box and a lower wafer box, the upper wafer box is used to receive the silicon wafers to be separated, and the lower wafer box is used to collect the reworked silicon wafers; Wherein, a baffle is arranged between each of the film boxes.

8. The silicon wafer separation device according to claim 2, characterized in that: The wind knife mechanism includes an optical fiber sensing part for sensing the silicon wafer, and the air blowing port includes a first air blowing port and a second air blowing port, wherein the first air blowing port is used for auxiliary air blowing to the silicon wafer, and the second air blowing port is used for intermittent air blowing to the silicon wafer; Wherein, a flow rate V1 of the airflow blown out of the first air outlet and a flow rate V2 of the airflow blown out of the second air outlet satisfy: V1<V2.

9. The silicon wafer separation device according to claim 1, characterized in that: The receiving portion is provided with a pad, and a receiving end surface is provided on a side of the pad away from the bottom plate, the receiving end surface is used to receive the silicon wafer, and an angle is formed between the receiving end surface and the bottom plate; Wherein, the retaining edge is arranged around the backing plate.

10. The silicon wafer separation device according to claim 1, characterized in that: The rib and the bottom plate are not arranged perpendicularly, and along the direction from the rib to the bottom plate, the rib is inclined from bottom to top in a direction away from the first accommodating space or the second accommodating space.

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