Power device packaging structure

Abstract

The utility model discloses a power device packaging structure, comprising a track platform and a frame, the track platform is provided with a frame limiting part, and the frame limiting part at least comprises a first step and a second step; a first bending part and a second bending part which correspond to the first step and the second step respectively are arranged on the frame, and the frame is clamped on the track platform. In the process that a frame is placed on the track platform to be conveyed, packaged and the like, the bent parts on the frame are designed to be of a structure conforming to the steps on the track platform, that is, the frame can be clamped on the first step and the second step through the first bent part and the second bent part, and therefore in the conveying process of the track platform, the frame can be clamped on the first step and the second step through the first bent part and the second bent part. The frame is limited by the frame limiting part on the rail platform and cannot shake. The frame is clamped on the track platform and then attached to the track platform, no gap exists between the frame and the track platform, and the flatness of the frame is guaranteed.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor packaging, and in particular relates to a power device packaging structure. Background Art

[0002] In recent years, the scale of power MOSFET has grown rapidly. Power MOS can be used in power storage, chargers, UPS, inverters and other occasions. With the continuous improvement of market application requirements, higher requirements are put forward for the packaging process. The packaging types involved in power devices include TO / PDFN / ITO and other series of products.

[0003] In the whole packaging process, the die bonding process is undoubtedly an important part. Among the power devices involved, ITO packaging is difficult to debug due to the particularity of its frame. During the lead-tin solder shaping process, the floating of the frame itself has a great impact on the quality.

[0004] like Figure 1 and Figure 2 As shown, when the frame loaded with chips moves on the track platform, the traditional frame end is bent downward to form a bent portion, and the bent portion conflicts with the step on the track platform, causing a gap between the frame and the track platform. This causes the frame to not be pressed into place and shake when being transported on the track platform. The unevenness of the frame also leads to uneven tin material during tinning and tinning, causing problems such as high and low chips and uncontrolled voids. Utility Model Content

[0005] In order to solve the technical problem that the frame is not smooth and easy to shake when being transported on the track platform in the background technology, the purpose of the utility model is to provide a power device packaging structure that can solve the above problems.

[0006] The technical solution for achieving the purpose of the utility model is: a power device packaging structure, including a rail platform and a frame, a frame limiting portion is provided on the rail platform, and the frame limiting portion includes at least a first step and a second step; a first bending portion and a second bending portion corresponding to the first step and the second step respectively are provided on the frame, and the frame is clamped on the rail platform.

[0007] First, the chip is fixed on the frame, and then the frame is placed on the track platform for transmission, packaging and other processes. In order to ensure the stability of the power device during the packaging process, the bending part on the frame is designed to conform to the structure of the steps on the track platform, that is, the frame can be clamped on the first step and the second step through the first bending part and the second bending part. In this way, during the transmission of the track platform, the frame is limited by the frame limit part on the track platform and will not shake. Similar to the inlaid structure, after the frame is clamped on the track platform and adheres to the track platform, there is no gap between the two, which ensures the flatness of the frame and the stability during the tinning, tinning and packaging processes on the frame.

[0008] Furthermore, the first step is upwardly protruding, and the first bent portion is correspondingly extended upwardly to form a raised end portion, and the raised end portion is fitted on the top of the first step. That is, the first bent portion has a similar outer contour to the first step and is used in conjunction with the first step, and is tightly fitted on the first step, so that no conflicting structure is formed, and no gap is formed between the frame and the track platform, thereby ensuring the flatness of the frame. At the same time, such a structure can also limit the frame and prevent shaking.

[0009] Furthermore, the second bent portion extends upward to form a placement portion, and the placement portion is attached to the top of the second step. Similarly, the second bent portion is limited by the second step to reduce shaking, and is tightly attached to the top of the second step to prevent a gap between the two and cause unevenness of the frame. Components such as pins bonded to the chip can be placed on the placement portion.

[0010] Furthermore, a tin material portion is formed between the raised end portion and the placement portion. According to the above description, the raised end portion and the placement portion are higher than the tin material portion to form a "basin". After the liquid tin material is applied to the tin material portion, it will not overflow due to the limitation of the raised end portion and the placement portion. Then the chip is pressed onto the base material and further bonded to other components such as pins to form a power device. Subsequently, steps such as tin pressing are performed to complete the entire packaging process.

[0011] Furthermore, the first bending portion and the second bending portion are both inclined. Compared with a right-angle setting, the inclined setting of this solution can reduce the problem of collision damage to the frame and the track platform when the frame is placed on the track platform.

[0012] Furthermore, it also includes a pressure plate device, which is pressed against the frame to further prevent the frame from shaking when being packaged on the track platform. The pressure plate device is fixed above the track platform, similar to a machine tool tool holder, and can be telescopically moved up and down. The specific structure will not be described in detail.

[0013] Furthermore, the pressing plate device is provided with a roller, and the roller is pressed against the frame. When the frame moves to a specified position along with the track platform, the pressing plate descends, and the roller is pressed against the frame and rolls along with the movement of the track platform. After the roller rolls and presses against the frame to a specified position, the roller leaves the frame and moves to an initial position to press against the next frame. By pressing the frame against the track platform by rolling the roller, the wear problem can be reduced.

[0014] Furthermore, a buffer structure is connected to the roller to buffer the contact of the roller with the frame to prevent the roller from damaging the frame due to excessive force when pressing down on the frame. The specific buffer structure can be a spring to provide the roller with a certain up and down buffering effect.

[0015] Furthermore, it also includes a third step, which is located on one side of the first step position, and the raised end abuts against the side of the third step. That is to say, the possibility of the frame shaking on the rail platform is further limited. Combined with the limit of the first step and the second step, the frame is more stable when transported on the rail platform and will not shake.

[0016] By adopting the above technical solution, the utility model has the following beneficial effects:

[0017] (1) The frame is provided with a first bending portion and a second bending portion that match the first step and the second step on the track platform, so that the frame can be locked and tightly attached to the track platform, thereby solving the shaking and unevenness problems of the frame when the track platform transports the frame;

[0018] (2) The first bent portion extends upward to form a raised end portion, and the raised end portion is attached to the top of the first step. Such a structure solves the problem that the traditional frame and the track platform conflict with each other, forming a gap between the two, which affects the unevenness and shaking of the frame when it is transported on the track platform;

[0019] (3) A tin material portion with a relatively low height is formed between the raised end portion and the placement portion, so that the tin material will not overflow during the process of tinning and pressing;

[0020] (4) A roller is further provided above the track platform to press the frame onto the track platform, so as to roll and press the frame to reduce wear. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to make the content of the utility model easier to understand, the utility model is further described in detail below according to specific embodiments and in conjunction with the accompanying drawings, wherein

[0022] Figure 1 A side view of the conventional frame structure in the present invention;

[0023] Figure 2 A side view of the structure of the middle track platform of the utility model;

[0024] Figure 3 A side view of the improved frame structure in the utility model;

[0025] Figure 4 A schematic diagram of the structure of the medium pressure plate device of the utility model;

[0026] Figure 5 A top view of the frame of the present invention.

[0027] The numbers in the accompanying drawings are: 1 track platform; 2 frame; 3 first step; 4 second step; 5 first bending portion; 6 second bending portion; 7 raised end portion; 8 placement portion; 9 tin material portion; 10 pressure plate device; 11 roller; 12 third step. DETAILED DESCRIPTION

[0028] Example:

[0029] like Figure 2-Figure 5As shown, this embodiment provides a power device packaging structure, including a track platform 1 and a frame 2, the track platform 1 is provided with a frame 2 limiting portion, the frame 2 limiting portion includes at least a first step 3 and a second step 4; the frame 2 is provided with a first bending portion 5 and a second bending portion 6 corresponding to the first step 3 and the second step 4 respectively, and the frame 2 is engaged with the track platform 1. First, the chip is fixed on the frame 2, and then the frame 2 is placed on the track platform 1 for transmission, packaging and other processes. In order to ensure the stability of the power device during the packaging process, the bending portion on the frame 2 is designed to conform to the structure of the steps on the track platform 1, that is, the frame 2 can be engaged with the first step 3 and the second step 4 through the first bending portion 5 and the second bending portion 6. In this way, during the transmission of the track platform 1, the frame 2 is limited by the limiting portion of the frame 2 on the track platform 1 and will not shake. Similar to the inlaid structure, the frame 2 is snapped onto the track platform 1 and adheres to the track platform 1 without any gap between them, thus ensuring the flatness of the frame 2 and the stability during the tinning, tinning and packaging processes on the frame 2.

[0030] Preferably, the first step 3 is convex upward, and the first bent portion 5 is correspondingly extended upward to form a raised end portion 7, and the raised end portion 7 is fitted on the top of the first step 3. That is, the first bent portion 5 has a similar outer contour to the first step 3 and is used in conjunction with the first step 3, and is tightly fitted on the first step 3, so that no conflicting structure is formed, and no gap is formed between the frame 2 and the track platform 1, thereby ensuring the flatness of the frame 2. At the same time, such a structure can also limit the frame 2 and prevent shaking.

[0031] Preferably, the second bending portion 6 extends upward to form a placement portion 8, and the placement portion 8 is attached to the top of the second step 4. Similarly, the second bending portion 6 is limited by the second step 4 to reduce shaking, and is tightly attached to the top of the second step 4 to prevent a gap between the two and cause unevenness of the frame 2. Components such as pins bonded to the chip can be placed on the placement portion 8.

[0032] Preferably, a tin material portion 9 is formed between the raised end portion 7 and the placement portion 8. According to the above description, the raised end portion 7 and the placement portion 8 are higher than the tin material portion 9 to form a "basin". After the liquid tin is applied to the tin material portion 9, it will not overflow due to the limitation of the raised end portion 7 and the placement portion 8. Then the chip is pressed onto the base material and further bonded to other components such as pins to form a power device. Subsequently, steps such as tin pressing are performed to complete the entire packaging process.

[0033] Preferably, the first bending portion 5 and the second bending portion 6 are both inclined. Compared with the right-angle setting, the inclined setting of this scheme can reduce the problem of collision damage to the frame 2 and the track platform 1 when the frame 2 is placed on the track platform 1.

[0034] Preferably, it also includes a third step 12, which is located on one side of the first step 3, and the raised end 7 abuts against the side of the third step 12. That is to say, the possibility of the frame 2 shaking on the track platform 1 is further limited. Combined with the limiting of the first step 3 and the second step 4, the frame 2 is more stable when being transported on the track platform 1 and will not shake.

[0035] like Figure 4 As shown, it also includes a pressure plate device 10, and the pressure plate structure is pressed against the frame 2 to further prevent the frame 2 from shaking during packaging on the track platform 1. The pressure plate device 10 is fixed above the track platform 1, similar to the tool holder of a machine tool, and can be telescopically moved up and down. The specific structure will not be described in detail. The pressure plate device 10 is provided with a roller 11, and the roller 11 is pressed against the frame 2. When the frame 2 moves to a specified position along with the track platform 1, the pressure plate descends, and the roller 11 is pressed against the frame 2 and rolls along with the movement of the track platform 1. After the roller 11 rolls and presses against the frame 2 to the specified position, the roller 11 leaves the frame 2 and moves to the initial position to press the next frame 2. The frame 2 is pressed against the track platform 1 by the rolling of the roller 11, which can reduce the wear problem. The roller 11 is connected with a buffer structure for buffering the contact of the roller 11 with the frame 2 to prevent the roller 11 from damaging the frame 2 due to excessive force when pressing down on the frame 2. The specific buffer structure may be a spring to provide the roller 11 with a certain up and down buffering effect.

[0036] Working principle: The chip is fixed at the position of the tin material part 9 on the frame 2, and then the frame 2 is placed on the track platform 1 for transportation. The bending part on the frame 2 is designed to conform to the structure of the steps on the track platform 1, that is, the frame 2 can be engaged with the first step 3 and the second step 4 through the first bending part 5 and the second bending part 6. In this way, during the transportation of the track platform 1, the frame 2 is limited by the limiting part of the frame 2 on the track platform 1 and will not shake. Similar to the inlaid structure, after the frame 2 is engaged with the track platform 1 and adheres to the track platform 1, there is no gap between the two, which ensures the flatness of the frame 2 and the stability during the tinning, pressing and packaging processes on the frame 2. The third step 12 further limits the frame 2 from shaking.

[0037] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A power device packaging structure, characterized in that: The invention comprises a track platform (1) and a frame (2); the track platform (1) is provided with a frame (2) limiting portion, the frame (2) limiting portion at least comprising a first step (3) and a second step (4); the frame (2) is provided with a first bending portion (5) and a second bending portion (6) respectively corresponding to the first step (3) and the second step (4); the frame (2) is clamped on the track platform (1).

2. A power device packaging structure according to claim 1, characterized in that: The first step (3) protrudes upward, and the first bent portion (5) correspondingly extends upward to form a raised end portion (7), and the raised end portion (7) is attached to the top of the first step (3).

3. A power device packaging structure according to claim 2, characterized in that: The second bent portion (6) extends upward to form a placement portion (8), and the placement portion (8) is attached to the top of the second step (4).

4. A power device packaging structure according to claim 3, characterized in that: A tin material portion (9) is formed between the raised end portion (7) and the placement portion (8).

5. The power device packaging structure according to claim 1, characterized in that: The first bending portion (5) and the second bending portion (6) are both arranged obliquely.

6. The power device packaging structure according to claim 1, characterized in that: It also comprises a pressing plate device (10), wherein the pressing plate device (10) is pressed tightly onto the frame (2).

7. A power device packaging structure according to claim 6, characterized in that: The pressure plate device (10) is provided with a roller (11), and the roller (11) is pressed tightly against the frame (2).

8. A power device packaging structure according to claim 7, characterized in that: The roller (11) is connected to a buffer structure for buffering the contact of the roller (11) with the frame (2).

9. The power device packaging structure according to claim 2, characterized in that: It also comprises a third step (12), the third step (12) being located on one side of the first step (3), and the raised end portion (7) abuts against the side surface of the third step (12).

Images