Chip frame conveying device

Abstract

The utility model discloses a chip frame conveying device which comprises a supporting mechanism and a conveying mechanism. The supporting mechanism comprises two supporting rails which are symmetrically arranged, and a conveying area of the chip frame is formed between the two supporting rails. The conveying mechanism is used for clamping the chip frame arranged in the conveying area and driving the chip frame to be conveyed in the conveying area. A supporting platform is arranged in the conveying area; and a screen glue printing mechanism for printing glue on the chip frame is arranged above the supporting platform. According to the utility model, in the transportation process of the chip frame, the chip frame can be positioned on the supporting platform by utilizing the conveying mechanism, so that the chip frame can be glued by the screen glue printing mechanism, the chip frame can be glued in the transportation process of the chip frame, a gluing station does not need to be additionally arranged, the production efficiency is improved, and the production cost is reduced. And the production cost is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a chip frame conveying device. Background Art

[0002] When the chip frame is installing the chip crystal, the chip frame needs to be transported to the workbench. At present, most of the existing chip frame transmission devices transmit through a conveyor belt. However, when the chip frame is sucked to the next process by a suction cup, the suction cup needs to ensure the suction position of the suction cup, and the chip frame transmission accuracy is high. At the same time, since the chip frame needs to be coated with glue when installing the crystal, the existing transmission device cannot coat the chip frame with glue during the transmission process. The chip frame needs to be coated with glue before transmission, which requires an additional gluing station, which not only reduces production efficiency, but also increases production costs.

[0003] Therefore, it is necessary to design a chip frame conveying device to solve the above problems. Utility Model Content

[0004] The utility model aims to solve the deficiencies of the prior art and propose a chip frame conveying device.

[0005] The technical solution of the utility model is: a chip frame conveying device, comprising a supporting mechanism and a conveying mechanism; the supporting mechanism comprises two symmetrically arranged supporting rails, and a conveying area for the chip frame is formed between the two supporting rails; the conveying mechanism is used to clamp the chip frame placed in the conveying area, and drive the chip frame to be transmitted in the conveying area; a supporting platform is provided in the conveying area; a screen printing mechanism for printing glue on the chip frame is provided above the supporting platform.

[0006] A supporting boss for supporting the chip frame is provided on the inner side of the supporting rail.

[0007] The conveying mechanism includes a pneumatic chuck and a driving component that drives the pneumatic chuck to move along the conveying area; the clamping end of the pneumatic chuck is covered on one of the support rails, and a gap is left between the support platform and the support rail covered by the pneumatic chuck for the pneumatic chuck to move.

[0008] The driving component is an electric slide; the pneumatic chuck is connected to the moving end of the electric slide through a connecting plate.

[0009] A flattening mechanism is provided at the outlet end of the support mechanism; the flattening mechanism includes a mounting seat and a mounting rod arranged on the mounting seat; the mounting rod is arranged perpendicular to the movement direction of the chip frame; a plurality of fixing blocks are evenly distributed on the mounting rod; each fixing block is provided with an elastic pressure strip; the elastic pressure strip is arranged corresponding to the grid of the chip frame; a support plate for supporting the chip frame is provided below the elastic pressure strip.

[0010] A mounting hole matched with the mounting rod is arranged in the middle of the fixing block; a locking screw connected to the mounting hole is arranged on the top of the fixing block.

[0011] By adopting the above technical scheme, the utility model has the following beneficial effects: the utility model forms a conveying area for the chip frame by two supporting rails, and clamps the chip frame for transmission by a conveying mechanism, and at the same time a supporting platform is arranged in the conveying area, and a screen printing mechanism for printing glue on the chip frame is arranged above the supporting platform. During the transportation of the chip frame, the conveying mechanism can be used to position the chip frame on the supporting platform, so that the screen printing mechanism can apply glue to the chip frame. The chip frame can be applied with glue during the conveying process of the chip frame, and there is no need to set up an additional gluing station, thereby improving production efficiency and saving production costs. At the same time, the conveying mechanism is used to convey the chip frame instead of the original suction cup transmission, which reduces the requirements for the transmission accuracy of the chip frame and makes the chip frame transmission more convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to make the content of the utility model more clearly understood, the utility model is further described in detail below based on specific embodiments and in conjunction with the accompanying drawings.

[0013] Figure 1 It is a structural schematic diagram of the utility model.

[0014] Figure 2 for Figure 1 Enlarged view of point A in the middle.

[0015] The reference numerals in the accompanying drawings are:

[0016] Support mechanism 1, support rail 1-1, support boss 1-2, conveying mechanism 2, pneumatic chuck 2-1, drive assembly 2-2, connecting plate 2-3, chip frame 3, support platform 4, screen printing glue mechanism 5, flattening mechanism 6, mounting seat 6-1, mounting rod 6-2, fixing block 6-3, elastic pressure strip 6-4, locking screw 6-5, support plate 6-6. DETAILED DESCRIPTION

[0017] (Example 1)

[0018] See Figure 1 and Figure 2The chip frame conveying device of this embodiment includes a supporting mechanism 1 and a conveying mechanism 2; the supporting mechanism 1 includes two symmetrically arranged supporting rails 1-1, and a conveying area for the chip frame 3 is formed between the two supporting rails 1-1; the conveying mechanism 2 is used to clamp the chip frame 3 placed in the conveying area, and drive the chip frame 3 to be transmitted in the conveying area; a supporting platform 4 is provided in the conveying area; a screen printing mechanism 5 for printing glue on the chip frame 3 is provided above the supporting platform 4; the screen printing mechanism 5 adopts the existing screen printing equipment.

[0019] Furthermore, a supporting boss 1 - 2 for supporting the chip frame 3 is provided on the inner side of the supporting rail 1 - 1 , so as to provide good support and position limitation for the chip frame 3 .

[0020] Furthermore, in order to facilitate the conveying mechanism 2 to clamp the chip frame 3 more conveniently and stably, the conveying mechanism 2 includes a pneumatic chuck 2-1 and a driving component 2-2 that drives the pneumatic chuck 2-1 to move along the conveying area; the clamping end of the pneumatic chuck 2-1 is covered on one of the support rails 1-1, and a gap is left between the support platform 4 and the support rail 1-1 covered by the pneumatic chuck 2-1 for the pneumatic chuck 2-1 to move.

[0021] Furthermore, the driving component 2-2 is an electric slide, so as to more conveniently control the position of the pneumatic chuck 2-1; the pneumatic chuck 2-1 is connected to the moving end of the electric slide through a connecting plate 2-3.

[0022] Furthermore, in order to ensure that the chip frame 3 has good flatness when entering the next process, a flattening mechanism 6 is provided at the outlet end of the support mechanism 1; the flattening mechanism 6 includes a mounting seat 6-1 and a mounting rod 6-2 arranged on the mounting seat 6-1; the mounting rod 6-2 is arranged perpendicular to the movement direction of the chip frame 3; a plurality of fixed blocks 6-3 are evenly distributed on the mounting rod 6-2; each fixed block 6-3 is provided with an elastic pressure strip 6-4; the elastic pressure strip 6-4 corresponds to the grid setting of the chip frame 3; a support plate 6-6 for supporting the chip frame 3 is provided below the elastic pressure strip 6-4.

[0023] Furthermore, in order to facilitate the adjustment of the position of the elastic pressure strip 6-4 to adapt to the use of chip frames 3 of different specifications, a mounting hole cooperating with the mounting rod 6-2 is provided in the middle of the fixed block 6-3; a locking screw 6-5 connected to the mounting hole is provided at the top of the fixed block 6-3.

[0024] The chip rack conveying device of the present embodiment forms a conveying area for the chip frame 3 through two support rails 1-1, and clamps the chip frame 3 for transmission through the conveying mechanism 2. At the same time, a support platform 4 is set in the conveying area, and a screen printing mechanism 5 for printing glue on the chip frame 3 is set above the support platform 4. During the transportation of the chip frame 3, the conveying mechanism 2 can be used to position the chip frame 3 on the support platform 4, so that the screen printing mechanism 5 can apply glue to the chip frame 3. During the conveying process of the chip frame 3, the chip frame 3 can be coated with glue without setting up an additional gluing station, thereby improving production efficiency and saving production costs. At the same time, the conveying mechanism 2 is used to convey the chip frame 3 instead of the original suction cup transmission, which reduces the requirements for the transmission accuracy of the chip frame 3 and makes the chip frame 3 more convenient to transport.

[0025] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip frame conveying device, characterized in that: The invention comprises a support mechanism (1) and a conveying mechanism (2); the support mechanism (1) comprises two symmetrically arranged support rails (1-1), and a conveying area for a chip frame (3) is formed between the two support rails (1-1); the conveying mechanism (2) is used to clamp a chip frame (3) placed in the conveying area, and drive the chip frame (3) to be transported in the conveying area; a support platform (4) is provided in the conveying area; and a screen printing mechanism (5) for printing glue on the chip frame (3) is provided above the support platform (4).

2. A chip frame conveying device according to claim 1, characterized in that: A supporting boss (1-2) for supporting a chip frame (3) is provided on the inner side of the supporting rail (1-1).

3. The chip frame conveying device according to claim 1, characterized in that: The conveying mechanism (2) comprises a pneumatic chuck (2-1) and a driving assembly (2-2) for driving the pneumatic chuck (2-1) to move along a conveying area; the clamping end of the pneumatic chuck (2-1) is wrapped around one of the support rails (1-1), and a gap is left between the support platform (4) and the support rail (1-1) wrapped around the pneumatic chuck (2-1) for the pneumatic chuck (2-1) to move.

4. A chip frame conveying device according to claim 3, characterized in that: The driving component (2-2) is an electric slide; the pneumatic chuck (2-1) is connected to the moving end of the electric slide via a connecting plate (2-3).

5. The chip frame conveying device according to claim 1, characterized in that: A flattening mechanism (6) is provided at the outlet end of the support mechanism (1); the flattening mechanism (6) comprises a mounting seat (6-1) and a mounting rod (6-2) arranged on the mounting seat (6-1); the mounting rod (6-2) is arranged perpendicular to the movement direction of the chip frame (3); a plurality of fixing blocks (6-3) are evenly distributed on the mounting rod (6-2); each fixing block (6-3) is provided with an elastic pressure strip (6-4); the elastic pressure strip (6-4) is arranged corresponding to the grid of the chip frame (3); and a support plate (6-6) for supporting the chip frame (3) is provided below the elastic pressure strip (6-4).

6. The chip frame conveying device according to claim 5, characterized in that: A mounting hole matching the mounting rod (6-2) is provided in the middle of the fixing block (6-3); and a locking screw (6-5) connected to the mounting hole is provided at the top of the fixing block (6-3).

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