Pin needle for power module

Abstract

The utility model discloses a pin needle for a power module. The power module comprises a pin seat and a pin body, the pin seat and the pin body are integrally formed, the pin seat is fixedly arranged on the power module through solder paste, a solder resisting part is arranged on the surface of the pin body, and a gold plating layer is arranged on the outer surface of the pin body and keeps away from the solder resisting part; according to the scheme, the solder resisting part is arranged on the outer surface of the pin, so that the pin can effectively prevent tin from climbing up in the welding process, tin climbing is avoided, solder paste can fully wrap the bottom of the pin seat, the welding reliability of the pin and the power module is ensured, and the vibration reliability of a product is also ensured; the solder resisting part is formed by the surface, without the gold plating layer, of the needle body; and the needle body part does not need to be provided with a gold plating layer, so that the material cost is also reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a pin needle used for a power module. Background Art

[0002] With the rapid development of electronic technology, more and more power modules have been widely used. These modules must use connectors to transmit signals with external components. Among them, the PIN pins of the power module can enable the power chip to achieve electrical connection with external components.

[0003] The PIN pin is a metal material used in the connector to conduct electricity (signals). Usually, a layer of gold is plated on the surface of the PIN pin, which can significantly improve the efficiency of current conduction, reduce signal attenuation and energy loss, and ensure the quality and stability of signal transmission. The PIN pin is connected to the surface of the AMB substrate by melting the solder paste at high temperature.

[0004] At present, PIN pins on the market are generally divided into integrated PIN pins and split PIN pins.

[0005] Among them, the tin creeping height of the integrated PIN needle is uncontrollable. As the welding temperature increases, the tin creeping height also increases, the amount of solder at the bottom gradually decreases, and the solder paste cannot completely wrap the bottom of the needle seat, resulting in the possibility of cold soldering, which affects the vibration reliability of the product.

[0006] The tin creep of the split-type PIN needle is controllable, the amount of solder in the needle holder is sufficient, and the solder can completely wrap the bottom of the needle holder, which does not affect the welding strength and product vibration reliability. However, the processing technology requirements of the needle holder and the needle body are high, and the tolerance requirements are strict, which increases the cost. Materials with different tolerances will cause the joint between the needle holder and the needle to be loose and fall off, and the tensile force will affect the vibration reliability of the product. Because it is a segmented structure, it is necessary to introduce pin insertion equipment. The pin insertion machine inserts the PIN needle downward into the welded needle holder for assembly, which increases the production cost. Utility Model Content

[0007] In view of the problems existing in the above-mentioned prior art, the utility model provides a pin needle for a power module, which can effectively solve the problems existing in the above-mentioned prior art.

[0008] The technical solution of the utility model is:

[0009] According to one aspect of the utility model, it includes: a needle seat and a needle body, the needle seat and the needle body are integrally formed, the needle seat is fixed to the power module by solder paste, a solder resist is provided on the surface of the needle body, and a gold plating layer is provided on the outer surface of the needle body avoiding the solder resist.

[0010] Furthermore, the solder resist portion is arranged around the middle of the needle body.

[0011] Furthermore, a solder resist is provided on the surface of the needle body, and the solder resist portion is formed by the solder resist.

[0012] Furthermore, the solder resist is green oil.

[0013] Furthermore, an aluminum layer is provided on the surface of the needle body, and the solder resist portion is formed by the aluminum layer.

[0014] Furthermore, the needle body is a copper product or a copper alloy product, and the solder resist portion is formed by the surface of the needle body that is not provided with a gold plating layer.

[0015] Furthermore, the distance between the lower end of the solder resist portion and the lower end of the needle body is 20 μm-50 μm.

[0016] Furthermore, the upper and lower widths of the solder resist are 1-2 times of the spacing, and the width is inversely proportional to the spacing.

[0017] By adopting the above technical solution, the utility model has the following beneficial effects compared with the prior art:

[0018] Firstly, this solution sets a solder resist on the outer surface of the pin needle, so that the pin needle can effectively prevent the climbing of tin during the welding process. Without tin climbing, the solder paste can fully wrap the bottom of the pin seat, ensuring the reliability of the welding between the pin needle and the power module, and ensuring the vibration reliability of the product.

[0019] Secondly, the solder resist is formed by the surface of the needle body that is not provided with a gold plating layer; because the needle body portion does not need to be provided with a gold plating layer, the material cost is also reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0022] Figure 2 It is a structural schematic diagram of solder paste distribution after the solder resist portion is set in the utility model;

[0023] Figure 3 This is a schematic diagram of the structure of the utility model without a solder resist portion and the solder paste climbing upward;

[0024] In the figure: needle holder-1, needle body-2, solder mask-3, solder paste-4. DETAILED DESCRIPTION

[0025] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is particularly noted that the following embodiments are only used to illustrate the present invention, but do not limit the scope of the present invention. Similarly, the following embodiments are only partial embodiments of the present invention rather than all embodiments. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] like Figures 1 to 3 As shown, the present solution provides a pin for a power module.

[0027] See also Figure 1 and Figure 2 , including: a needle seat 1 and a needle body 2, the needle seat 1 and the needle body 2 are integrally formed, the needle seat 1 is fixed to the power module through solder paste 4, the power module includes but is not limited to the AMB substrate; the surface of the needle body 2 is provided with a solder resist 3, the solder resist 3 is used to prevent the solder paste 4 from climbing toward the end of the needle body 2 with high temperature, the solder resist 3 is arranged around the middle of the needle body 2, and the outer surface of the needle body 2 is provided with a gold plating layer away from the solder resist 3. The needle body 2 is a copper product or a copper alloy product, and the solder resist 3 is formed by the surface of the needle body 2 without the gold plating layer; because the needle body 2 part does not need to be provided with a gold plating layer, the material cost is also reduced.

[0028] See also Figure 1 and Figure 2 , the spacing between the lower end of the solder resist 3 and the lower end of the needle body 2 is 20μm-50μm; the upper and lower widths of the solder resist 3 are 1-2 times the spacing, and the width is inversely proportional to the spacing. If the spacing between the lower end of the solder resist 3 and the lower end of the needle body 2 is too large, the solder paste 4 will rise toward the end of the needle body 2 with the high temperature, and the solder paste 4 at the bottom of the needle seat 1 will gradually decrease, which will not play a role in preventing tin creeping; if the width of the solder resist 3 is too narrow, the solder paste 4 may cross the solder resist 3 and continue to climb toward the end of the needle body 2, which will also not play a role in preventing tin creeping.

[0029] Embodiment 2 is different from Embodiment 1 in that: a solder resist is provided on the surface of the needle body 2, and the solder resist forms the solder resist portion 3. The solder resist includes but is not limited to green oil. The green oil can be evenly coated on the surface of the needle body 2 by brushing, spraying or dipping.

[0030] The third embodiment is different from the first embodiment in that an aluminum layer is provided on the surface of the needle body 2, and the aluminum layer forms the solder resist 3. The aluminum layer can be provided on the surface of the needle body 2 by electroplating, hot-dip plating or welding.

[0031] See also Figure 2 and Figure 3, Figure 2 In the embodiment, a solder resist 3 is provided on the outer surface of the needle body 2, the solder paste 4 does not rise toward the end of the needle body 2, and the solder paste 4 is sufficient at the bottom of the needle seat 1; Figure 3 In the figure, no solder resist 3 is provided on the outer surface of the needle body 2 , the solder paste 4 rises toward the end of the needle body 2 , and the solder paste 4 is scarce at the bottom of the needle seat 1 .

[0032] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A pin for a power module, comprising: A needle seat (1) and a needle body (2), wherein the needle seat (1) and the needle body (2) are integrally formed, and the needle seat (1) is fixed to the power module by means of solder paste (4), and is characterized in that a solder resist portion (3) is provided on the surface of the needle body (2), and a gold-plated layer is provided on the outer surface of the needle body (2) avoiding the solder resist portion (3).

2. A pin for a power module as claimed in claim 1, characterized in that: The solder resist portion (3) is arranged around the middle of the needle body (2).

3. A pin for a power module as claimed in claim 1 or 2, characterized in that: The surface of the needle body (2) is provided with a solder resist, and the solder resist portion (3) is formed by the solder resist.

4. A pin for a power module as claimed in claim 3, characterized in that: The solder resist is green oil.

5. A pin for a power module as claimed in claim 3, characterized in that: An aluminum layer is provided on the surface of the needle body (2), and the solder resist portion (3) is formed by the aluminum layer.

6. A pin for a power module as claimed in claim 1 or 2, characterized in that: The needle body (2) is a copper product or a copper alloy product, and the solder resist portion (3) is formed by the surface of the needle body (2) that is not provided with a gold plating layer.

7. A pin for a power module as claimed in claim 1 or 2, characterized in that: The distance between the lower end of the solder resist (3) and the lower end of the needle body (2) is 20 μm-50 μm.

8. A pin for a power module as claimed in claim 7, characterized in that: The upper and lower widths of the solder resist portion (3) are 1 to 2 times the spacing, and the width is inversely proportional to the spacing.

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