Lead frame for ceramic flat shell

Abstract

The utility model discloses a lead frame for a ceramic flat shell, which comprises electroplating auxiliary sheets, an outer frame and leads, a grid structure with a frame is formed, the four electroplating auxiliary sheets are distributed at four corners of the outer frame, the inner edge of the outer frame is connected with the outer ends of the leads, the inner ends of the leads respectively correspond to bonding pads on a ceramic body, and after the lead frame is connected with the bonding pads, the lead frame is connected with the bonding pads. Connecting a metal wire on the surface of the electroplating auxiliary sheet for hanging electroplating, and cutting off the electroplating auxiliary sheet after electroplating to obtain a ceramic flat shell product. The structure can ensure that the lead frame is not deformed due to wire binding electroplating, ensures that the positioning is more convenient and accurate when the lead and the bonding pad are welded, improves the production efficiency of small-spacing thin-pin shells, and improves the yield and quality of products.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor integrated circuit packaging, in particular to a lead frame for a ceramic flat shell. Background Art

[0002] With the rapid development of electronic equipment, the integration of semiconductor integrated circuits is getting higher and higher. Ceramic packaging is widely used for its high thermal conductivity, high mechanical strength, low leakage rate, and small size. Among them, the ceramic flat shell is a miniaturized mounting shell that is easy to install. Its wing-shaped leads are conducive to relieving the stress between the shell and the PCB and improving reliability. It is characterized by small size and light weight. Due to the small lead size spacing, the traditional electroplating process is to perform suspension electroplating after tying the wire on the lead. It will not only leave marks caused by nickel wire obstruction, but also cause the lead to deform, resulting in low production qualification rate, long product delivery cycle, and high product manufacturing cost. It is urgent to solve the current dilemma. Utility Model Content

[0003] The utility model aims to solve the shortcomings of the prior art and proposes a lead frame for a ceramic flat housing, which is used to make a ceramic flat housing with a pad structure, has accurate positioning when welding with the pad and is convenient for hanging electroplating.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] The utility model provides a lead frame for a ceramic flat shell, comprising four electroplating auxiliary sheets, an outer frame and leads, forming a frame-bar structure, the leads are the bars, the electroplating auxiliary sheets are connected to the outer frame, the four electroplating auxiliary sheets are distributed at the four corners of the outer frame, and the inner edge of the outer frame is connected to the outer end of the lead.

[0006] Furthermore, it also includes two metal wires, each of which is connected to the two electroplating auxiliary sheets on one side of the outer frame.

[0007] Furthermore, the lead frame is made of a material with a thickness of 0.1-0.3 mm, and a lead spacing of 0.5 mm-2.54 mm.

[0008] Furthermore, the thickness of the material used to make the lead frame is 0.1 mm, and the lead spacing is 1.27 mm.

[0009] The utility model has the following beneficial effects:

[0010] 1. The lead frame for a ceramic flat housing proposed by the utility model has leads connected to the outer frame, so the outer frame can be used for welding positioning, which is convenient and accurate and simplifies the welding mold.

[0011] 2. The utility model proposes a lead frame for a ceramic flat shell, and four electroplating auxiliary sheets are distributed at the four corners of the outer frame, on which metal wires can be connected for suspension electroplating. After the electroplating is completed, the electroplating auxiliary area is cut off to obtain a ceramic flat shell, thereby improving the production efficiency of small-pitch and thin-pin shells, and improving product yield and quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic structural diagram of a lead frame for a ceramic flat housing according to the utility model;

[0013] Figure 2 It is a schematic diagram of the structure of a ceramic body with a pad structure;

[0014] Figure 3 It is a schematic diagram of the upper surface of a ceramic flat housing after the lead frame and the pad are welded;

[0015] Figure 4 It is a schematic diagram of the lower surface of a ceramic flat housing after welding a lead frame and a pad according to the utility model;

[0016] Legend:

[0017] 1. Electroplating auxiliary sheet; 2. Outer frame; 3. Lead wire; 4. Solder pad; 5. Ceramic body; 6. Metal wire. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] Reference Figure 1-4 , the utility model provides an embodiment: a lead frame for a ceramic flat shell, comprising four electroplating auxiliary sheets 1, an outer frame 2, a lead 3 and two metal wires 6, the outer frame 2 and the lead 3 form a frame-bar structure, the lead 3 is a bar, the electroplating auxiliary sheet 1 is connected to the outer frame 2, the four electroplating auxiliary sheets 1 are distributed at the four corners of the outer frame 2, the inner edge of the outer frame 2 is connected to the outer end of the lead 3, the number of leads 2 is the same as the number of pads 4 on the ceramic body 5, the lead spacing is 1.27mm, the inner end of the lead 3 corresponds one-to-one to the pad 4 on the ceramic body 5, each of the metal wires 6 is connected to the two electroplating auxiliary sheets 1 on one side of the outer frame 2 for hanging electroplating.

[0020] The material used to make the lead frame can be iron-nickel alloy, Kovar alloy, etc. The method of making the lead frame is etching or punching. In this embodiment, the lead frame is etched out of an iron-nickel alloy with a thickness of 0.1 mm.

[0021] The workflow of this utility model is as follows:

[0022] A lead frame is etched out of a 0.1 mm thick iron-nickel alloy, positioned using a high-purity graphite mold, and the inner end of the lead 3 is welded to the corresponding pad 4 on the ceramic body 5 by high-temperature welding. After welding, a metal wire 6 is connected to the electroplating auxiliary sheet 1, and the sheet is hung for electroplating. Finally, the electroplating auxiliary sheet 1 is cut to obtain a ceramic flat shell.

[0023] The utility model adopts a lead wire to connect with the outer frame, and the outer frame can be used for welding positioning, which is convenient and accurate, and simplifies the welding mold. Four electroplating auxiliary sheets are distributed at the four corners of the outer frame, and metal wires can be connected thereto for hanging electroplating. After the electroplating is completed, the electroplating auxiliary sheets are cut off to obtain a ceramic flat shell, which improves the production efficiency of small-pitch and thin-pin shells, and improves the product yield and quality. Finally, it should be explained that the above is only a preferred embodiment of the utility model and is not used to limit the utility model. Although the utility model is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned embodiments, or to replace some of the technical features therein by equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. A lead frame for a ceramic flat package, characterized in that: It includes four electroplating auxiliary sheets, an outer frame and several leads, forming a framed grid structure, the leads are grids, the electroplating auxiliary sheets are connected to the outer frame, the four electroplating auxiliary sheets are distributed at the four corners of the outer frame, and the inner edge of the outer frame is connected to the outer ends of the leads.

2. A lead frame for a ceramic flat package according to claim 1, characterized in that: It also includes two metal wires, each of which is connected to the two electroplating auxiliary sheets on one side of the outer frame.

3. The lead frame for a ceramic flat package according to claim 2, characterized in that: The lead frame is made of a material with a thickness of 0.1-0.3 mm, and a lead spacing of 0.5 mm-2.54 mm.

4. A lead frame for a ceramic flat package according to claim 3, characterized in that: The lead frame is made of a material with a thickness of 0.1 mm and a lead spacing of 1.27 mm.

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