Phased array plane heat dissipation protection device

Abstract

The utility model provides a phased array plane heat dissipation protection device, and the device comprises a first power unit which is used for selectively providing power supply for a heat dissipation system; the power-up feedback unit is used for transmitting a working state signal of the heat dissipation system; the second power unit is connected with the phased array plane and is used for selectively providing power supply for the phased array plane; the control unit is used for judging according to a received control signal and a preset logic and controlling the on and off states of the two power units; when the heat dissipation system is powered up and operates normally, the power-up feedback unit sends a working state signal, the second power unit is conducted, and when the heat dissipation system breaks down or is powered off, the working state signal is interrupted, and the second power unit is disconnected. High-real-time control over the working state of the phased array plane is achieved, the working state of an array plane heat dissipation system is sensed in real time, therefore, power supply of the phased array plane is automatically controlled, and it is avoided that heat dissipation is not timely, and active devices in the antenna array plane are affected.

Description

Technical Field

[0001] The present application relates to the technical field of active phased array antennas, and in particular to a phased array surface heat dissipation protection device. Background Art

[0002] With the development of modern communications, radar and electronic warfare technologies, active phased array antennas have become the core components of many high-performance electronic systems due to their significant advantages in beamforming flexibility, scanning speed, and anti-interference capability.

[0003] The active phased array antenna combines active devices such as the radiation unit (T / R component), transceiver module, control unit and antenna unit, among which the core device is the T / R component. When the existing T / R component is working, about 70% of the electrical power is converted into heat consumption, and when the antenna is operating normally, 90% of its heat comes from the high-power devices in the T / R component. Usually, the phased array antenna is often composed of hundreds or thousands of T / R components. Therefore, when the active phased array antenna is operating normally, it generates a lot of heat. The current phased array surface is often equipped with a special heat dissipation system to dissipate heat and cool the antenna array surface. The current heat dissipation design of the phased array surface adopts forced air cooling, forced liquid cooling and high-efficiency heat pipe technology according to the size of its heat flux density, which can ensure the normal operation of heat-generating components such as T / R components.

[0004] In the related art, temperature sensors are used to monitor the working temperature in real time. However, in the normal use of the phased array, once the heat dissipation device has a problem, the antenna array will continue to work without heat dissipation until the device overheats. The temperature sensor of the internal active device will feedback to the integrated processing platform, and after logical judgment, the array will be controlled to power off for protection. Since this method continues to work after the heat dissipation device fails, it may cause damage to the internal active devices or affect the life of the active devices, thereby affecting the reliability and safety of the entire antenna array. Utility Model Content

[0005] The present application provides a phased array surface heat dissipation protection device, which solves the problem in the related art that there is a delay in sensing the heat dissipation condition of the antenna array surface through feedback information from a temperature sensor.

[0006] In order to achieve the above objectives, this application adopts the following technical solutions:

[0007] A phased array surface heat dissipation protection device is provided, the device comprising:

[0008] A first power unit, the first power unit being connected to a heat dissipation system of the phased array surface and configured to selectively provide power supply to the heat dissipation system;

[0009] The heat dissipation system is connected to a power-on feedback unit, and the power-on feedback unit is used to transmit a working status signal of the heat dissipation system;

[0010] a second power unit, the second power unit being connected to the phased array surface and configured to selectively provide power supply to the phased array surface;

[0011] A control unit, configured to make a judgment based on a received control signal and a preset logic, and control the on and off states of the first power unit and the second power unit;

[0012] When the cooling system is powered on and operates normally, the power-on feedback unit sends the working status signal to the control unit, and the control unit controls the second power unit to be turned on. When the cooling system fails or loses power, the working status signal is interrupted, and the control unit controls the second power unit to be turned off.

[0013] As an improvement of the heat dissipation protection device of the phased array,

[0014] A third optical coupler is arranged between the control unit and the power-on feedback unit.

[0015] As an improvement to the phased array surface heat dissipation protection device, the control signal includes a power-on good feedback signal.

[0016] As an improvement of the heat dissipation protection device of the phased array surface, the control unit is connected to the integrated processing platform of the phased array surface.

[0017] As an improvement to the phased array surface heat dissipation protection device, the control signal includes a remote control shutdown signal.

[0018] As an improvement to the phased array surface heat dissipation protection device, a fourth optical coupler is provided between the control unit and the integrated processing platform.

[0019] As an improvement of the phased array surface heat dissipation protection device, the first power unit is connected to a first power supply input, and the first power supply input is a power supply input that meets the power supply requirements of the heat dissipation system.

[0020] As an improvement of the phased array surface heat dissipation protection device, the second power unit is connected to a second power supply input, and the second power supply input is a power supply input that meets the power supply requirements of the phased array surface.

[0021] As an improvement of the phased array surface heat dissipation protection device, the control unit includes a control chip and a control switch, and the control chip is used to receive a control signal and control the control switch to be turned on or off according to the control signal.

[0022] As an improvement to the phased array surface heat dissipation protection device, the first power unit and the second power unit both include an overload protection circuit and a short circuit protection circuit.

[0023] A phased array surface heat dissipation protection device proposed in the present application can achieve high real-time control of the working state of the phased array surface, and perceive the working state of the surface heat dissipation system in real time, so as to automatically control the power supply of the phased array radar surface, avoid the influence of untimely heat dissipation on the active devices in the antenna surface, ensure the safe and reliable heat dissipation of the phased array surface, and improve the reliability and safety of the phased array radar surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic structural block diagram of a phased array surface heat dissipation protection device provided in an embodiment of the present application;

[0025] Figure 2 is a schematic principle block diagram of a phased array surface heat dissipation protection device according to an embodiment of the present application;

[0026] Figure 3 A schematic flow chart of powering up a phased array surface according to an embodiment of the present application;

[0027] Figure 4 is a schematic principle block diagram of another phased array surface heat dissipation protection device according to an embodiment of the present application;

[0028] Figure 5 is a schematic flow chart of powering off a phased array surface according to an embodiment of the present application;

[0029] Figure 6 4 is a schematic structural block diagram of another phased array surface heat dissipation protection device according to an embodiment of the present application.

[0030] Figure numerals: phased array surface heat dissipation protection device 100; phased array surface 200; heat dissipation system 300; integrated processing platform 400; first power supply input 500; second power supply input 600; first power unit 1; power-on feedback unit 2; second power unit 3; control unit 4; control chip 41; control switch 42; third optical coupler 5; fourth optical coupler 6. DETAILED DESCRIPTION

[0031] In order to further explain the technical means and effects adopted by the present application to achieve the predetermined purpose, the technical solutions in the embodiments of the present application are clearly described. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present application.

[0032] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way are interchangeable where appropriate, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0033] The description of the method flow in the specification of this application and the steps of the flowchart in the drawings of the specification of this application do not have to be strictly executed according to the step numbers, and the method steps can be executed in a different order. Moreover, some steps can be omitted, multiple steps can be combined into one step, and / or one step can be decomposed into multiple steps.

[0034] The phased array surface heat dissipation protection device 100 provided in the embodiment of the present application is described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0035] In order to solve the problem that the current phased array radar has difficulty in real-time perception of the heat dissipation of the antenna array surface, the active devices in the phased array surface 200 feed back temperature information to the radar's integrated processing platform through temperature sensors. The integrated processing platform sets a temperature threshold value for temperature control. When the phased array surface heat dissipation system 300 fails, the feedback information of the active device temperature sensor has a delay, and the real-time control of the working state of the phased array surface 200 is poor.

[0036] Specifically, the radar in the related art is composed of an antenna array, a heat dissipation system 300, a back-end processing platform, an intermediate frequency inverter, and a distribution box. 380V / 50Hz is input to the intermediate frequency inverter, which is converted to 400Hz / 220V and output to the distribution box, which powers the entire radar. The heat dissipation system 300 and the antenna array are powered on and off at the same time. When the heat dissipation system 300 fails, the distribution box continues to supply power, and the antenna array continues to maintain the transmitting or receiving state. Each device in the antenna array is equipped with a temperature sensor, which feeds back the temperature to the integrated processing platform. When the temperature exceeds the set threshold value, the integrated processing platform controls the distribution box to cut off the power to the array.

[0037] That is to say, the active devices in the phased array surface 200 feed back temperature information to the integrated processing platform of the radar through the temperature sensor, and the integrated processing platform sets the temperature threshold value for temperature control. When the phased array surface heat dissipation system 300 fails, the feedback information of the active device temperature sensor has a delay, and the real-time control of the working state of the phased array surface 200 is poor.

[0038] Therefore, in response to the problem that the current phased array radar is difficult to perceive the heat dissipation of the antenna array surface in real time, the present application proposes a phased array surface heat dissipation protection device 100, which can achieve high real-time control of the working state of the phased array surface 200, and real-time perception of the working state of the array surface heat dissipation system 300, so as to automatically control the power supply of the phased array radar array surface, avoid the influence of untimely heat dissipation on the active devices in the antenna array surface, ensure the safe and reliable heat dissipation of the phased array surface 200, and improve the reliability and safety of the phased array radar array surface.

[0039] First, the application scenario of the phased array surface heat dissipation protection device 100 of the embodiment of the present application is described in detail as follows.

[0040] The heat dissipation system 300 of the phased array radar is an important component of the active phased array antenna. The core component of the active phased array antenna, the T / R component, usually converts about 70% of the input electrical energy into heat energy during operation. When the array contains hundreds of T / R components, the accumulated heat power consumption is very considerable. According to statistics, up to 90% of the total heat of the antenna array comes from high-power devices inside the T / R components, such as power amplifiers and mixers. Such large-scale concentrated heat generation, if not effectively cooled by the heat dissipation system 300, will quickly cause the device temperature to rise, which will not only directly affect its working performance, such as gain reduction, noise coefficient increase, nonlinear distortion aggravation, etc., but also often trigger the over-temperature protection mechanism, causing the array to lose power, and even cause permanent physical damage, shortening the service life of the device and the entire system. The phased array heat dissipation protection device 100 of the present application isolates the power supply mode of the array T / R module and the functional module from the power supply mode of the heat dissipation system 300, ensuring that other modules of the array can be powered on only after the heat dissipation system 300 is powered on and sends feedback; once the heat dissipation system 300 fails, the feedback signal is interrupted, and the power supply to other modules of the array is immediately stopped; when the power is cut off, the phased array surface 200 is powered off first, and then the heat dissipation system 300 is powered off. In this way, the power supply of the phased array radar array surface is automatically controlled, the safety of other modules in the array surface is guaranteed, and it has an effective preventive effect. Based on this, high real-time control of the working state of the phased array surface 200 can be achieved, and the working state of the array heat dissipation system 300 can be perceived in real time, so as to automatically control the power supply of the phased array radar array surface, avoid the influence of untimely heat dissipation on the active devices in the antenna array surface, ensure the safe and reliable heat dissipation of the phased array surface 200, and improve the reliability and safety of the phased array radar array surface.

[0041] See also Figure 1 The embodiment of the present application provides a phased array surface heat dissipation protection device 100. Figure 1 A schematic structural block diagram of a phased array surface heat dissipation protection device 100 provided in an embodiment of the present application is shown in FIG. Figure 1As shown, the phased array surface heat dissipation protection device 100 of the embodiment of the present application includes a first power unit 1, a power-on feedback unit 2, a second power unit 3, a control unit 4 and an optical coupling unit.

[0042] The first power unit 1 is connected to the heat dissipation system 300 of the phased array surface 200, and is used to selectively provide power supply for the heat dissipation system 300. The first power unit 1 is connected to a first power supply input 500, and the first power supply input 500 is a power supply input that meets the power supply requirements of the heat dissipation system 300.

[0043] The power-on feedback unit 2 is connected to the heat dissipation system 300 and is used to transmit the working state signal of the heat dissipation system 300. When the heat dissipation system 300 is powered on and operates normally, the working state signal, such as the power-on good feedback signal, is sent to the phased array surface heat dissipation protection device 100 through the power-on feedback unit 2. Once the heat dissipation system 300 fails or loses power, the signal is immediately interrupted, triggering the phased array surface heat dissipation protection device 100 to perform corresponding control operations.

[0044] The second power unit 3 is connected to the phased array surface 200, and is used to selectively provide power supply to the phased array surface 200 (including the T / R module and the functional module). The operation of the second power unit 3 is controlled by the control unit 4 of the phased array surface heat dissipation protection device 100, and can selectively supply power to the phased array surface 200. The second power unit 3 is connected to a second power supply input 600, and the second power supply input 600 is a power supply input that meets the power supply requirements of the phased array surface 200.

[0045] Specifically, the second power unit 3 will be turned on to supply power to the phased array surface 200 only after the phased array surface heat dissipation protection device 100 receives the power-on feedback signal of the heat dissipation system 300. Once the heat dissipation system 300 fails and causes the feedback signal to disappear, the second power unit 3 will be quickly cut off from supplying power to the phased array surface 200 to prevent overheating caused by poor heat dissipation.

[0046] The control unit 4 is used to make judgments based on the received signals and preset logic, and output corresponding control instructions to control the on and off states of the first power unit 1 and the second power unit 3 .

[0047] Specifically, the control unit 4 includes a control chip 41 and a control switch 42. The control chip 41 is used to receive a control signal and control the control switch 42 to turn on or off according to the received control signal to power on or off the corresponding component. The control signal includes a power-on good feedback signal and a remote control shutdown signal input.

[0048] The optical coupling unit is used to achieve isolation between the control unit 4 and the integrated processing platform 400 of the radar, and between the first power unit 1 and the second power unit 3, to ensure the correct execution of the control logic. Specifically, a first optical coupler is provided between the control unit 4 and the first power unit 1, a third optical coupler 5 is provided between the control unit 4 and the power-on feedback unit 2, and a fourth optical coupler 6 is provided between the control unit 4 and the integrated processing platform 400.

[0049] In some embodiments, the first power unit 1 and the second power unit 3 may have safety functions such as overload protection and short circuit protection to ensure that the power supply status can be adjusted in time when the heat dissipation system 300 is working normally or fails.

[0050] See also Figure 2-3 , Figure 2 FIG. 1 is a schematic principle block diagram of a phased array surface heat dissipation protection device 100 according to an embodiment of the present application, as shown in FIG. Figure 2 As shown, the phased array surface heat dissipation protection device 100 of the embodiment of the present application can implement the following logic control method:

[0051] 1. After the cooling system 300 is powered on and sends feedback, the phased array surface 200 (including the T / R module and the functional module) can be powered on;

[0052] 2. Once the heat dissipation system 300 fails and the feedback signal is interrupted, the power supply to the phased array surface 200 (including the T / R module and the functional module) is immediately stopped;

[0053] 3. Set a remote shutdown signal to first power off the phased array surface 200 (including the T / R module and the functional module), and then power off the cooling system 300.

[0054] The working principle of the phased array surface heat dissipation protection device 100 of the embodiment of the present application is as follows:

[0055] When there is power input, the first power unit 1 powers up the cooling system 300, and the cooling system 300 sends a power-on good return signal. After the phased array surface heat dissipation protection device 100 receives the power-on good return signal of the cooling system 300, the internal optical coupler is turned on, the control chip 41 is activated, and the control switch 42 is pressed to control the second power unit 3 to turn on to power up the phased array surface 200. Once the cooling system 300 is powered off, the power-on good return signal disappears, the second power unit 3 is immediately disconnected, and the phased array surface 200 is powered off.

[0056] Figure 3 A schematic flow chart of powering up a phased array surface according to an embodiment of the present application is shown in FIG. Figure 3 As shown, the phased array surface 200 is powered on including the following steps:

[0057] Step 101, sending a power-on command: the radar system sends a power-on command.

[0058] Step 102 , the device powers on the cooling system 300 : after receiving the power-on instruction, the device will power on the cooling system 300 .

[0059] Step 103, check the power-on status: the device will check the power-on status of the cooling system 300 to see if it is successful.

[0060] Step 103a, if the cooling system 300 is powered on successfully:

[0061] The device powers up the phased array surface: In this case, the device continues to power up the phased array surface.

[0062] Step 103b, if the cooling system 300 fails to power on:

[0063] The device does not power up the phased array surface: In this case, the device does not power up the phased array surface because the heat dissipation system 300 does not work properly.

[0064] See also Figure 4-5 , Figure 4 is a schematic principle block diagram of another phased array surface heat dissipation protection device 100 according to an embodiment of the present application. Figure 4 The working principle of the power-off process of the phased array heat dissipation protection device 100 is shown:

[0065] The integrated processing platform 400 sends a shutdown signal 1, the optical coupler is turned on, the control chip 41 is activated, the second power unit 3 is controlled to be disconnected, and the phased array surface 200 is powered off; the integrated processing platform 400 sends a shutdown signal 2, the optical coupler is turned on, the control chip 41 is activated, the first power unit 1 is controlled to be disconnected, and the heat dissipation system 300 is powered off. The integrated processing platform 400 can send a shutdown signal 2 only after sending the shutdown signal 1.

[0066] Figure 5 FIG. 1 is a schematic flow chart of powering off a phased array surface according to an embodiment of the present application, such as Figure 5 As shown, the power-off of the phased array surface 200 includes the following steps:

[0067] Step 201, sending a shutdown signal 1: the radar system sends a shutdown signal.

[0068] Step 202, the device turns off the power to the phased array surface: after receiving the shutdown signal 1, the device will turn off the power to the phased array surface.

[0069] Step 203, sending a shutdown signal 2: after the power supply of the phased array is disconnected, a second shutdown signal is sent.

[0070] Step 204 , the device cuts off the power to the cooling system 300 : after receiving the shutdown signal 2 , the device cuts off the power to the cooling system 300 .

[0071] See also Figure 6 , illustratively, the present application embodiment provides an application example of a phased array surface heat dissipation protection device 100 for further full description. Figure 6 FIG. 1 is a schematic structural block diagram of another phased array surface heat dissipation protection device 100 according to an embodiment of the present application, as shown in FIG. Figure 6 As shown, a certain type of radar installs the heat dissipation system 300 on the back of the antenna array. The heat dissipation system 300 is located inside the rear cover of the array. The T / R module and various functional modules are attached to the heat dissipation cold plate. The forced air cooling method is adopted. The heat dissipation channel and the functional modules in the array are waterproof and sealed.

[0072] The cooling system 300 is powered by AC220V, and other modules in the array are powered by AC380V. When AC220V is powered, the cooling system 300 is powered on and feeds back a 24V feedback signal, which is a continuous voltage signal. After receiving the 24V feedback signal, the power supply device turns on the AC380V output. If the cooling system 300 fails, the 24V feedback signal is withdrawn, and the power supply device immediately stops the AC380V output. When the cooling system 300 fails, the phased array 200 can complete the power-off action within 100 milliseconds.

[0073] When the device is powered off, it receives a 5V power-off signal 1 (continuous voltage signal), first cuts off the AC380V output, and then cuts off the power supply (380V) of the phased array surface 200; after receiving a 5V power-off signal 2 (continuous voltage signal), it cuts off the power supply (220V) of the array surface cooling system 300.

[0074] When there is AC input, the AC220V / AC380V input is output to each power unit through the EMI filter, and the control unit 4 is powered on and waits for the command signal. After receiving the command signal, the AC220V output is turned on, and after receiving the 24V feedback signal (continuous voltage) of the cooling system 300, the AC380V output is turned on for use by the rear antenna array of the whole machine. When the remote control is powered off, the 5V power-off signal 1 (continuous voltage signal) is received, and the AC380V output is disconnected first; after receiving the 5V power-off signal 2 (continuous voltage signal), the power supply (220V) of the array cooling system 300 is disconnected.

[0075] In summary, the embodiment of the present application proposes a phased array surface heat dissipation protection device, which can achieve high real-time control of the working state of the phased array surface, and perceive the working state of the surface heat dissipation system 300 in real time, so as to automatically control the power supply of the phased array radar surface, avoid the influence of untimely heat dissipation on the active devices in the antenna surface, ensure the safe and reliable heat dissipation of the phased array surface, and improve the reliability and safety of the phased array radar surface.

[0076] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0077] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A phased array surface heat dissipation protection device, characterized in that: include: A first power unit, the first power unit being connected to a heat dissipation system of the phased array surface and configured to selectively provide power supply to the heat dissipation system; The heat dissipation system is connected to a power-on feedback unit, and the power-on feedback unit is used to transmit a working status signal of the heat dissipation system; a second power unit, the second power unit being connected to the phased array surface and configured to selectively provide power supply to the phased array surface; A control unit, configured to make a judgment based on a received control signal and a preset logic, and control the on and off states of the first power unit and the second power unit; When the cooling system is powered on and operates normally, the power-on feedback unit sends the working status signal to the control unit, and the control unit controls the second power unit to be turned on. When the cooling system fails or loses power, the working status signal is interrupted, and the control unit controls the second power unit to be turned off.

2. The phased array surface heat dissipation protection device according to claim 1, characterized in that: A third optical coupler is arranged between the control unit and the power-on feedback unit.

3. The phased array surface heat dissipation protection device according to claim 1, characterized in that: The control signal includes a power-on good reporting signal.

4. The phased array surface heat dissipation protection device according to claim 1, characterized in that: The control unit is connected to the integrated processing platform of the phased array surface.

5. The phased array surface heat dissipation protection device according to claim 4, characterized in that: The control signal includes a remote control shutdown signal.

6. The phased array surface heat dissipation protection device according to claim 4, characterized in that: A fourth optical coupler is arranged between the control unit and the integrated processing platform.

7. The phased array surface heat dissipation protection device according to claim 1, characterized in that: The first power unit is connected to a first power supply input, and the first power supply input is a power supply input that meets the power supply requirement of the heat dissipation system.

8. The phased array surface heat dissipation protection device according to claim 1, characterized in that: The second power unit is connected to a second power supply input, and the second power supply input is a power supply input that meets the power supply requirement of the phased array surface.

9. The phased array surface heat dissipation protection device according to claim 1, characterized in that: The control unit includes a control chip and a control switch. The control chip is used to receive a control signal and control the control switch to be turned on or off according to the control signal.

10. The phased array surface heat dissipation protection device according to any one of claims 1 to 9, characterized in that: The first power unit and the second power unit both include an overload protection circuit and a short circuit protection circuit.

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