Photosensitive component, camera module and electronic equipment

Abstract

The utility model discloses a photosensitive component, a camera module and electronic equipment. The photosensitive assembly comprises a circuit board and a photosensitive chip, the circuit board is provided with a groove, and the groove comprises a groove bottom and a groove wall connected with the groove bottom; the light sensing chip comprises a light sensing surface, a backlight surface arranged opposite to the light sensing surface, and a connecting surface connected between the light sensing surface and the backlight surface, and the light sensing surface or the backlight surface is provided with a connecting part connected with the connecting surface and a welding part connected with the connecting part; the photosensitive chip is arranged in the groove, the welding part is connected with the groove bottom in a welding manner, the connecting part is connected with the groove bottom in an adhesive manner, and the connecting surface is connected with the groove wall in an adhesive manner. Compared with the mode that the photosensitive chip is directly bonded on the circuit board, the photosensitive component has the advantages that the height of the photosensitive component can be reduced, so that the height of the camera module is reduced, and the light and thin design requirements of the camera module and the electronic equipment are met.

Description

Technical Field

[0001] The present application relates to the field of circuit packaging technology, and in particular to a photosensitive component, a camera module and an electronic device. Background Art

[0002] At present, the packaging method of the photosensitive components of the camera module is roughly as follows: glue the photosensitive chip to the circuit board with glue, and then use gold wire to connect the photosensitive chip and the circuit board to ensure electrical conductivity between the photosensitive chip and the circuit board. However, due to the thickness of the photosensitive chip, glue, and circuit board, the height of the camera module is relatively high, which cannot meet the design requirements of the camera module to be thin and light. Utility Model Content

[0003] In view of the above, it is necessary to propose a photosensitive component, a camera module and an electronic device to reduce the height of the camera module and meet the design requirements of a thin and light camera module.

[0004] An embodiment of the present application provides a photosensitive component for lowering the height of a camera module, wherein the photosensitive component includes a circuit board and a photosensitive chip, wherein the circuit board is provided with a groove, wherein the groove includes a groove bottom and a groove wall connected to the groove bottom; the photosensitive chip includes a photosensitive surface, a backlight surface arranged opposite to the photosensitive surface, and a connecting surface connected between the photosensitive surface and the backlight surface, wherein the photosensitive surface or the backlight surface has a connecting portion connected to the connecting surface and a welding portion connected to the connecting portion; the photosensitive chip is arranged in the groove, wherein the welding portion is welded to the groove bottom, the connecting portion is adhesively connected to the groove bottom, and the connecting surface is adhesively connected to the groove wall.

[0005] The above-mentioned photosensitive component, by opening a groove on the circuit board and setting the photosensitive chip in the groove, can reduce the height of the photosensitive component compared to directly gluing the photosensitive chip to the circuit board. Therefore, when the photosensitive component provided in the embodiment of the present application is applied to the camera module, the height of the camera module can be reduced to meet the design requirements of a lightweight camera module.

[0006] In one embodiment, the groove is formed on the bottom side of the circuit board, and the circuit board is further provided with a light-transmitting hole penetrating the top side of the circuit board and the bottom of the groove. The photosensitive surface of the photosensitive chip faces the bottom of the groove and is welded to the bottom of the groove through the welding portion, and the photosensitive surface of the photosensitive chip is arranged opposite to the light-transmitting hole.

[0007] The above-mentioned photosensitive component reduces the height of the photosensitive component and enables the photosensitive chip to receive light signals by opening a groove on the bottom side of the circuit board and opening a light-transmitting hole on the circuit board.

[0008] In one of the embodiments, the photosensitive component further includes a light-transmitting member, and the light-transmitting member is disposed in the light-transmitting hole and connected to the hole wall of the light-transmitting hole.

[0009] The above-mentioned photosensitive component, by arranging a light-transmitting part in the light-transmitting hole, can protect the photosensitive chip while achieving light transmission, preventing impurities such as water vapor and dust from contaminating the photosensitive surface of the photosensitive chip. By arranging the light-transmitting part, the structural strength of the circuit board can also be improved.

[0010] In one of the embodiments, the photosensitive component further includes a light-transmitting member, which is disposed on the top side of the circuit board and covers the light-transmitting hole.

[0011] The above-mentioned photosensitive component, by arranging a light-transmitting part on the top side of the circuit board and covering the light-transmitting hole, can protect the photosensitive chip while achieving light transmission, preventing impurities such as water vapor and dust from contaminating the photosensitive surface of the photosensitive chip. By arranging the light-transmitting part, the structural strength of the circuit board can also be improved.

[0012] In one embodiment, the groove is formed inside the circuit board, and the groove also includes a receiving surface arranged opposite to the groove bottom and connected to the groove wall. The circuit board is also provided with a light-transmitting hole penetrating the top side of the circuit board and the groove bottom. The photosensitive surface of the photosensitive chip faces the groove bottom and is welded to the groove bottom through the welding portion, and the backlight surface of the photosensitive chip faces the receiving surface and is adhesively connected to the receiving surface.

[0013] The above-mentioned photosensitive component lowers the height of the circuit board and enables the photosensitive chip to receive the light signal by opening a groove inside the circuit board. In addition, by opening the groove inside the circuit board, since no slot structure is opened on the receiving surface, it helps to improve the structural strength of the circuit board.

[0014] In one embodiment, the circuit board includes a first circuit board and a second circuit board, and the first circuit board and the second circuit board are connected to form the groove and the light-transmitting hole; or, the circuit board is further provided with an embedding hole that passes through the side surface of the circuit board and the groove wall.

[0015] The above-mentioned photosensitive component is formed by setting a circuit board including a first circuit board and a second circuit board or setting a circuit board to open an embedding hole to form a groove inside the circuit board, which is helpful for installing the photosensitive chip.

[0016] In one of the embodiments, a pad corresponding to the welding portion is disposed on the bottom of the groove, and the welding portion is connected to the pad by welding with solder.

[0017] The above-mentioned photosensitive component, by arranging a soldering pad on the bottom of the groove, realizes the electrical connection between the circuit board and the photosensitive chip and facilitates the welding of the two.

[0018] In one embodiment, the height of the groove wall is greater than the height of the photosensitive chip.

[0019] The above-mentioned photosensitive component, by limiting the height of the groove wall to be greater than the height of the photosensitive chip, avoids the photosensitive chip from protruding relatively from the circuit board, thereby fully utilizing the height of the circuit board and helping to reduce the height of the photosensitive component.

[0020] An embodiment of the present application also provides a camera module, comprising a photosensitive component as described in any of the above technical solutions.

[0021] In the photosensitive component of the above-mentioned camera module, a groove is opened on the circuit board and the photosensitive chip is set in the groove. Compared with directly gluing the photosensitive chip to the circuit board, the height of the photosensitive component can be reduced, thereby reducing the height of the camera module and meeting the design requirements of a lightweight camera module.

[0022] An embodiment of the present application also provides an electronic device, comprising the camera module as described in the above technical solution.

[0023] In the camera module of the above-mentioned electronic device, a groove is opened on the circuit board of the photosensitive component and the photosensitive chip is set in the groove. Compared with directly gluing the photosensitive chip to the circuit board, the height of the photosensitive component can be reduced, thereby reducing the height of the camera module, meeting the design requirements of the camera module being lightweight and thin, and reducing the protruding height of the camera module on the electronic device, thereby meeting the design requirements of the electronic device being lightweight and thin. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a cross-sectional schematic diagram of the photosensitive component provided in the first embodiment of the present application.

[0025] Figure 2 It is a cross-sectional schematic diagram of the photosensitive component provided in the second embodiment of the present application.

[0026] Figure 3 It is a cross-sectional schematic diagram of the photosensitive component provided in the third embodiment of the present application.

[0027] Figure 4 It is a cross-sectional schematic diagram of the photosensitive component provided in the fourth embodiment of the present application.

[0028] Figure 5 It is a cross-sectional schematic diagram of the photosensitive component provided in the fifth embodiment of the present application.

[0029] Figure 6 It is a cross-sectional schematic diagram of the photosensitive component provided in the sixth embodiment of the present application.

[0030] Main component symbols

[0031] Photosensitive components 100, 200, 300, 400, 500, 600

[0032] Circuit board 10

[0033] Groove 11

[0034] Groove bottom 111

[0035] Groove wall 112

[0036] Surface 113

[0037] Bottom side 12

[0038] Top side 13

[0039] Light hole 14

[0040] First circuit board 15

[0041] Second circuit board 16

[0042] Photosensitive chip 20

[0043] Photosensitive surface 21

[0044] Backlight 22

[0045] Connection surface 23

[0046] Connecting part 24

[0047] Welding part 25

[0048] Solder 30

[0049] Glue 40

[0050] Light-transmitting member 50, 55

[0051] Light transmission 60 DETAILED DESCRIPTION

[0052] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0053] In the description of the present application, it should be understood that the terms indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, it should be noted that the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0054] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0055] Some embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0056] See also Figure 1 The first embodiment of the present application provides a photosensitive component 100, which is applied to a camera module (not shown). When the photosensitive component 100 is applied to the camera module, the height of the camera module along its optical axis can be reduced to meet the requirements of the thin and light design of the camera module. The photosensitive component 100 includes a circuit board 10 and a photosensitive chip 20.

[0057] The circuit board 10 is provided with a groove 11, and the groove 11 includes a groove bottom 111 and a groove wall 112 vertically connected to the groove bottom 111, wherein the groove wall 112 is annular. In this embodiment, the circuit board 10 also has a bottom side 12 and a top side 13 arranged opposite to each other, and the groove 11 is provided on the bottom side 12 of the circuit board 10. The circuit board 10 can be a PCB (Printed Circuit Board), a rigid-flexible board, or a reinforced FPC (Flexible Printed Circuit), wherein the rigid-flexible board includes a stacked PCB and FPC, and the reinforced flexible circuit board includes a stacked FPC and a reinforcing sheet, and the reinforcing sheet can be a steel sheet, and the steel sheet has good heat dissipation performance.

[0058] The photosensitive chip 20 includes a photosensitive surface 21, a backlight surface 22 disposed opposite to the photosensitive surface 21, and a connecting surface 23 connected between the photosensitive surface 21 and the backlight surface 22. The connecting surface 23 is annular, and the photosensitive surface 21 or the backlight surface 22 has a connecting portion 24 connected to the connecting surface 23 and a welding portion 25 connected to the connecting portion 24. In this embodiment, the photosensitive surface 21 has a connecting portion 24 and a welding portion 25. It can be understood that the connecting portion 24 and the welding portion 25 are both approximately located at the edge of the photosensitive surface 21. The photosensitive chip 20 is a device that converts light signals into electrical signals. The photosensitive chip 20 can be a CCD (Charge-coupled Device) photosensitive chip or a CMOS (Complementary Metal-Oxide-Semiconductor) photosensitive chip.

[0059] In this embodiment, the photosensitive chip 20 is arranged in the groove 11, the photosensitive surface 21 of the photosensitive chip 20 faces the groove bottom 111 and is welded to the groove bottom 111 through the welding part 25, and the four sides of the photosensitive chip 20 are glued to the groove bottom 111 through the connecting part 24, and are glued to the groove wall 112 through the connecting surface 23. In order to enable the photosensitive surface 21 to receive the optical signal, the circuit board 10 is also provided with a light-transmitting hole 14 that passes through the top side 13 of the circuit board 10 and the groove bottom 111. The photosensitive surface 21 of the photosensitive chip 20 is arranged opposite to the light-transmitting hole 14, and the light-transmitting hole 14 is used to transmit light so that the photosensitive surface 21 of the photosensitive chip 20 receives the optical signal.

[0060] The above-mentioned photosensitive component 100 is formed by opening a groove 11 on the bottom side 12 of the circuit board 10, disposing the photosensitive chip 20 in the groove 11, and realizing electrical connection between the photosensitive chip 20 and the circuit board 10 by welding the welding portion 25 of the photosensitive surface 21 to the groove bottom 111 of the circuit board 10. The photosensitive chip 20 is further fixed by gluing the surrounding areas of the photosensitive chip 20, namely, the connecting portion 24 and the connecting surface 23, with the groove bottom 111 and the groove wall 112 of the groove 11, thereby ensuring that the photosensitive chip 20 can be firmly connected to the circuit board 10. Compared with directly gluing the photosensitive chip 20 to the circuit board 10, the height of the photosensitive component 100 can be reduced, so that when the photosensitive component 100 is applied to the camera module, the height of the camera module can be reduced to meet the design requirements of the camera module to be lightweight. In addition, by opening the groove 11 on the bottom side 12 of the circuit board 10, the area of ​​the top side 13 of the circuit board 10 is relatively large, so that the circuit board 10 can receive more components such as brackets, filters, motors, etc.

[0061] In this embodiment, a circle of pads (not shown) corresponding to the welding portion 25 is provided on the groove bottom 111. Specifically, the welding portion 25 is connected to the pads by welding with solder (not shown). It can be understood that the solder and the pads are welded together to form a Figure 1 The solder 30 shown. In this way, by arranging the solder pad on the groove bottom 111, the circuit board 10 and the photosensitive chip 20 are electrically connected and the photosensitive chip 20 and the circuit board 10 are conveniently connected by soldering.

[0062] In this embodiment, after the photosensitive chip 20 is connected to the circuit board 10 by welding, glue 40 can be filled between the periphery of the photosensitive chip 20 and the groove wall 112 of the groove 11, and the photosensitive chip 20 and the groove wall 112 are connected after the glue 40 is cured. In this way, the photosensitive chip 20 and the groove wall 112 of the groove 11 are connected by gluing by filling the glue 40 between the periphery of the photosensitive chip 20 and the groove wall 112 of the groove 11.

[0063] In this embodiment, the height of the groove wall 112 is greater than the height of the photosensitive chip 20. Thus, by limiting the height of the groove wall 112 to be greater than the height of the photosensitive chip 20, the photosensitive chip 20 is prevented from relatively protruding from the circuit board 10, and the height of the circuit board 10 is fully utilized, which helps to reduce the height of the photosensitive component 100. In addition, by limiting the height of the groove wall 112 to be greater than the height of the photosensitive chip 20, it is also helpful to package the connected photosensitive chip 20 and the circuit board 10, and ensure the flatness of the circuit board 10.

[0064] See also Figure 2 , the second embodiment of the present application provides a photosensitive component 200. The structure of the photosensitive component 200 provided in this embodiment is roughly similar to that of the photosensitive component 100 provided in the first embodiment, except that, in this embodiment, the photosensitive component 200 also includes a light-transmitting member 50, and the light-transmitting member 50 is arranged in the light-transmitting hole 14 and connected to the hole wall of the light-transmitting hole 14. The light-transmitting member 50 can be an object made of glass or other light-transmitting materials, and the two sides of the light-transmitting member 50 can be glued to the hole wall of the light-transmitting hole 14 by glue 40. In this way, the photosensitive component 200 provided in this embodiment, while reducing its height, protects the photosensitive chip 20 by setting the light-transmitting member 50, and prevents impurities such as water vapor and dust from contaminating the photosensitive surface 21 of the photosensitive chip 20. In addition, by setting the light-transmitting member 50, the structural strength of the circuit board 10 can also be improved.

[0065] See also Figure 3, the third embodiment of the present application provides a photosensitive component 300. The structure of the photosensitive component 300 provided in this embodiment is roughly similar to that of the photosensitive component 100 provided in the first embodiment, except that, in this embodiment, the light-transmitting member 55 can be formed by solidifying a transparent colloid, and the light-transmitting member 55 is arranged in the light-transmitting hole 14 and connected to the hole wall of the light-transmitting hole 14. In actual implementation, the light-transmitting member 55 can be formed by curing with glue, which is simple to operate and helps to reduce costs. In this way, the photosensitive component 300 provided in this embodiment, while reducing its height, protects the photosensitive chip 20 by setting the light-transmitting member 55 to prevent impurities such as water vapor and dust from contaminating the photosensitive surface 21 of the photosensitive chip 20. In addition, the light-transmitting member 55 is relatively light in weight, which helps to reduce the weight of the photosensitive component 300 and further meet the design requirements of the camera module to be lightweight.

[0066] See also Figure 4 The fourth embodiment of the present application provides a photosensitive component 400. The structure of the photosensitive component 400 provided in this embodiment is roughly similar to that of the photosensitive component 100 provided in the first embodiment, except that, in this embodiment, the groove 11 is opened on the top side 13 of the circuit board 10, the backlight surface 22 faces the groove bottom 111 of the groove 11, the connecting portion 24 and the welding portion 25 are located on the backlight surface 22, the backlight surface 22 is welded and connected to the groove bottom 111 through the welding portion 25, and the periphery of the photosensitive chip 20 is glued and connected to the groove bottom 111 and the groove wall 112 through the connecting portion 24 and the connecting surface 23. It can be understood that in this embodiment, the welding portion 25 can be understood as a circuit pin extending from the photosensitive surface 21 toward the backlight surface 22. In this way, by opening the groove 11 on the top side 13 of the circuit board 10, the photosensitive chip 20 is assembled in the groove 11, and the assembly is simple; and there is no need to open the light-transmitting hole 14 on the circuit board 10, so as to ensure the structural strength of the circuit board 10.

[0067] See also Figure 5, the fifth embodiment of the present application provides a photosensitive component 500. The structure of the photosensitive component 500 provided in this embodiment is roughly similar to that of the photosensitive component 100 provided in the first embodiment, except that, in this embodiment, the groove 11 is opened inside the circuit board 10, that is, opened between the top side 13 and the bottom side 12 of the circuit board 10, and the groove 11 also includes a receiving surface 113 arranged opposite to the groove bottom 111 and connected to the groove wall 112, and the receiving surface 113 is located below the groove bottom 111, and the circuit board 10 is provided with a light-transmitting hole 14 that passes through the top side 13 and the groove bottom 111 of the circuit board 10, and the photosensitive surface 21 of the photosensitive chip 20 faces the groove bottom 111 and is welded to the groove bottom 111 through the welding portion 25, and the backlight surface 22 of the photosensitive chip 20 faces the receiving surface 113 and is adhesively connected to the receiving surface 113, for example, by glue 40. In this way, by opening the groove 11 inside the circuit board 10 and receiving the photosensitive chip 20 through the receiving surface 113, there is no need to open a hole on the bottom side 12 of the circuit board 10, thereby ensuring the structural strength of the circuit board 10.

[0068] In this embodiment, the circuit board 10 includes a first circuit board 15 and a second circuit board 16. A slot structure is provided on the side of the first circuit board 15 facing the second circuit board 16, and a slot structure is also provided on the side of the second circuit board 16 facing the first circuit board 15. The first circuit board 15 and the second circuit board 16 are butted together and a groove 11 and a light-transmitting hole 14 are formed through the slot structure. The first circuit board 15 and the second circuit board 16 can also be electrically connected after being butted together. For example, electrical plug-in devices are respectively provided on the first circuit board 15 and the second circuit board 16, and the first circuit board 15 and the second circuit board 16 are butted together and electrically connected through the electrical plug-in devices. In this way, by setting the circuit board 10 as a split structure, it is convenient to form the groove 11 and the light-transmitting hole 14, and at the same time, it is convenient to assemble the photosensitive chip 20.

[0069] It can be understood that in other embodiments, the circuit board 10 can also be provided with an embedding hole (not shown) that passes through the side of the circuit board 10 and the groove wall 112, and the photosensitive chip 20 is inserted into the interior of the circuit board 10 through the embedding hole so that the photosensitive chip 20 can be assembled into the groove 11.

[0070] The sixth embodiment of the present application provides a photosensitive component 600. The structure of the photosensitive component 600 provided in this embodiment is roughly similar to that of the photosensitive component 100 provided in the first embodiment, except that, in this embodiment, the photosensitive component 200 also includes a light-through piece 60, which is embedded in the top side 13 of the circuit board 10 and covers the light-transmitting hole 14. The light-through piece 60 can be an object made of glass or other light-permeable materials, and the light-through piece 60 can be glued to the circuit board 10, or can be tightly embedded in the top side 13 of the circuit board 10 through an interference fit. In this way, the photosensitive component 600 provided in this embodiment protects the photosensitive chip 20 by providing the light-through piece 60, and prevents impurities such as water vapor and dust from contaminating the photosensitive surface 21 of the photosensitive chip 20. In addition, by providing the light-through piece 60, the structural strength of the circuit board 10 can also be improved.

[0071] It is understandable that in other embodiments, the light passing member 60 may be directly disposed on the top side 13 of the circuit board 10 .

[0072] The seventh embodiment of the present application provides a camera module, which includes the photosensitive component 100, 200, 300, 400, 500, 600 described in any one of the first to fifth embodiments. This embodiment is described by taking the photosensitive component 100 provided in the first embodiment as an example.

[0073] In the above-mentioned camera module, in its photosensitive component 100, a groove 11 is opened on the bottom side 12 of the circuit board 10, and the photosensitive chip 20 is arranged in the groove 11. The welding portion 25 of the photosensitive surface 21 is welded to the groove bottom 111 of the circuit board 10 to achieve electrical connection between the photosensitive chip 20 and the circuit board 10. By gluing the photosensitive chip 20 around the connecting portion 24 and the connecting surface 23 with the groove bottom 111 and the groove wall 112 of the groove 11, the photosensitive chip 20 is further fixed to ensure that the photosensitive chip 20 can be firmly connected to the circuit board 10. Compared with directly gluing the photosensitive chip 20 to the circuit board 10, the height of the photosensitive component 100 can be reduced. Therefore, when the photosensitive component 100 is applied to the camera module, the height of the camera module can be reduced to meet the design requirements of the camera module to be lightweight.

[0074] The eighth embodiment of the present application provides an electronic device (not shown), the electronic device comprising the camera module described in the seventh embodiment. The electronic device may be a smart phone, a laptop computer, a tablet computer, a portable phone, a video phone, a digital still camera, an e-book reader, a portable multimedia player (PMP), a mobile medical device, a wearable device, or the like.

[0075] In the camera module of the above-mentioned electronic device, a groove 11 is opened on the bottom side 12 of the circuit board 10 of the photosensitive component 100, and the photosensitive chip 20 is arranged in the groove 11. The welding portion 25 of the photosensitive surface 21 is welded and connected to the groove bottom 111 of the circuit board 10 to achieve electrical connection between the photosensitive chip 20 and the circuit board 10. By gluing the photosensitive chip 20 around the connecting portion 24 and the connecting surface 23 with the groove bottom 111 and the groove wall 112 of the groove 11, the photosensitive chip 20 is further fixed to ensure that the photosensitive chip 20 can be firmly connected to the circuit board 10. Compared with directly gluing the photosensitive chip 20 to the circuit board 10, the height of the photosensitive component 100 can be reduced. Therefore, when the photosensitive component 100 is applied to the camera module, the height of the camera module can be reduced, thereby meeting the design requirements of the camera module for thinness and lightness, and reducing the protruding height of the camera module on the electronic device, thereby meeting the design requirements of the electronic device for thinness and lightness.

[0076] It is obvious to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present application.

[0077] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the preferred embodiments, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A photosensitive component, used to reduce the height of a camera module, the photosensitive component comprising a circuit board and a photosensitive chip, characterized in that: The circuit board is provided with a groove, wherein the groove comprises a groove bottom and a groove wall connected to the groove bottom; The photosensitive chip comprises a photosensitive surface, a backlight surface arranged opposite to the photosensitive surface, and a connecting surface connected between the photosensitive surface and the backlight surface, wherein the photosensitive surface or the backlight surface has a connecting portion connected to the connecting surface and a welding portion connected to the connecting portion; The photosensitive chip is arranged in the groove, wherein the welding portion is connected to the groove bottom by welding, the connecting portion is connected to the groove bottom by adhesive, and the connecting surface is connected to the groove wall by adhesive.

2. The photosensitive component according to claim 1, characterized in that: The groove is opened on the bottom side of the circuit board, and the circuit board is also opened with a light-transmitting hole penetrating the top side of the circuit board and the bottom of the groove. The photosensitive surface of the photosensitive chip faces the bottom of the groove and is welded to the bottom of the groove through the welding part, and the photosensitive surface of the photosensitive chip is arranged opposite to the light-transmitting hole.

3. The photosensitive component according to claim 2, characterized in that: The photosensitive component also includes a light-transmitting member, which is disposed in the light-transmitting hole and connected to the hole wall of the light-transmitting hole.

4. The photosensitive component according to claim 2, characterized in that: The photosensitive component also includes a light-transmitting member, which is arranged on the top side of the circuit board and covers the light-transmitting hole.

5. The photosensitive component according to claim 1, characterized in that: The groove is opened inside the circuit board, and the groove also includes a receiving surface arranged opposite to the groove bottom and connected to the groove wall. The circuit board is also provided with a light-transmitting hole penetrating the top side of the circuit board and the groove bottom. The photosensitive surface of the photosensitive chip faces the groove bottom and is welded to the groove bottom through the welding part, and the backlight surface of the photosensitive chip faces the receiving surface and is adhesively connected to the receiving surface.

6. The photosensitive component according to claim 5, characterized in that: The circuit board includes a first circuit board and a second circuit board, the first circuit board and the second circuit board are butted against each other to form the groove and the light-transmitting hole; or, the circuit board is further provided with an embedding hole penetrating through the side surface of the circuit board and the groove wall.

7. The photosensitive component according to claim 1, characterized in that: A welding pad corresponding to the welding portion is arranged on the bottom of the groove, and the welding portion is welded and connected to the welding pad through solder.

8. The photosensitive component according to claim 1, characterized in that: The height of the groove wall is greater than the height of the photosensitive chip.

9. A camera module, characterized in that: Comprising a photosensitive component as described in any one of claims 1 to 8.

10. An electronic device, characterized in that: Comprising the camera module as claimed in claim 9.

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