High-temperature-resistant PCB (Printed Circuit Board)
By designing structures such as high-temperature resistance layers, heat dissipation holes and micro-heat dissipation fans on PCB circuit boards, the problem of easy damage to traditional circuit boards in high-temperature environments is solved, and higher high-temperature resistance and service life are achieved.
Patent Information
- Application Number
- CN202421146510.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-23
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2034-05-23
AI Technical Summary
Traditional PCB circuit boards are susceptible to damage in high temperature environments, resulting in reduced service life.
A high-temperature resistant PCB circuit board including printed circuit board layer, circuit board body structure and heat dissipation structure is designed. The circuit board adopts structures such as high-temperature resistant layer, heat dissipation holes and micro-heat dissipation fans, which enhances heat dissipation capabilities and improves high-temperature resistance.
By improving the heat dissipation ability and high temperature resistance of the circuit board, the service life of the circuit board is extended and the circuit board damage caused by high temperature is prevented.
Smart Images
Figure CN222484983U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of high temperature resistant circuit boards, in particular to a high temperature resistant PCB circuit board. Background Art
[0002] PCB circuit board, Chinese name is printed circuit board, also known as printed circuit board, printed circuit board, is an important electronic component, a support for electronic components, and a provider of electrical connections for electronic components. Because it is made by electronic printing, it is called a "printed" circuit board. However, the structure of the traditional PCB circuit board is relatively simple, and its high temperature resistance performance is also relatively poor. When the various electrical components on the PCB circuit board work for a long time in the corresponding equipment, the heat and high temperature generated by the electrical components and the current transfer will act on the PCB circuit board. The PCB circuit board is easily damaged in a high temperature environment, which may cause the service life of the PCB circuit board to be reduced. Therefore, those skilled in the art provide a high temperature resistant PCB circuit board to solve the problems raised in the above background technology. Utility Model Content
[0003] The purpose of the utility model is to provide a high temperature resistant PCB circuit board to solve the problems raised in the above background technology.
[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0005] A high temperature resistant PCB circuit board comprises a printed circuit board layer, a circuit board main structure and a heat dissipation structure, wherein the lower end of the printed circuit board layer is provided with the circuit board main structure, and the lower end of the circuit board main structure is provided with the heat dissipation structure, and the circuit board main structure comprises: electrical components, heat dissipation holes, a high temperature resistant layer 1, a high temperature resistant layer 2, a protective bottom plate, heat dissipation grooves, a support column 1, a support column 2, a support column 3, a support column 4 and a connecting threaded hole 1, a plurality of groups of electrical components are arranged on the upper surface of the printed circuit board layer, a plurality of groups of heat dissipation holes arranged linearly are opened on the front side surface of the printed circuit board layer, the heat dissipation holes penetrate the front and rear side surfaces of the printed circuit board layer, a high temperature resistant layer 1 is fixedly installed on the bottom surface of the printed circuit board layer, a high temperature resistant layer 2 is fixedly installed on the bottom surface of the high temperature resistant layer 1, a protective bottom plate is fixedly installed on the bottom surface of the high temperature resistant layer 2, and a plurality of groups of heat dissipation grooves are opened on the bottom surface of the protective bottom plate.
[0006] Preferably: a support column 1 is fixedly installed at the left front end on the bottom surface of the protective bottom plate, and a support column 2 is fixedly installed at the left rear end on the bottom surface of the protective bottom plate.
[0007] Preferably: a support column three is fixedly installed at the front right side of the bottom surface of the protective base plate, and a support column four is fixedly installed at the rear right side of the bottom surface of the protective base plate.
[0008] Preferably, a connecting threaded hole 1 is provided in the middle of the bottom surface of each of the support pillars 1, 2, 3 and 4.
[0009] Preferably: the heat dissipation structure includes: a heat dissipation base plate, two connecting threaded holes, a mounting through hole, a drying layer, a protective frame one, a micro heat dissipation fan one, a protective frame two and a micro heat dissipation fan two, and the bottoms of support column one, support column two, support column three and support column four are jointly provided with a heat dissipation base plate.
[0010] Preferably, a drying layer is fixedly installed on the bottom surface of the heat dissipation bottom plate, and connecting threaded holes 2 are provided through the four sides of the upper surface of the heat dissipation bottom plate.
[0011] Preferably: the number of the connecting threaded holes 2 is four groups, the four groups of connecting threaded holes 2 all penetrate the drying layer, the positions of the four groups of connecting threaded holes 2 respectively correspond to the positions of the connecting threaded holes 1 on the bottom surfaces of support column 1, support column 2, support column 3 and support column 4, and the four groups of connecting threaded holes 2 on the upper surface of the heat dissipation base plate are respectively connected to the connecting threaded holes 1 on the bottom surfaces of support column 1, support column 2, support column 3 and support column 4 by bolts, so that the main structure of the circuit board can be fixed on the upper surface of the heat dissipation base plate.
[0012] Preferably, two groups of mounting through holes are symmetrically arranged at both the front and rear ends of the upper surface of the heat dissipation bottom plate, and the mounting through holes penetrate the drying layer.
[0013] Preferably: a protective frame 1 is arranged on the left side of the upper surface of the heat dissipation base plate, and a micro heat dissipation fan 1 is arranged inside the protective frame 1.
[0014] Preferably: a protective frame 2 is arranged on the right side of the upper surface of the heat dissipation base plate, and a micro cooling fan 2 is arranged inside the protective frame 2, and the main structure of the circuit board at the upper ends of the micro cooling fan 1 and the micro cooling fan 2 is cooled by blowing air through the micro cooling fan 1 and the micro cooling fan 2.
[0015] Compared with the prior art, the beneficial effects of the utility model are as follows: the four groups of connecting threaded holes 2 on the upper surface of the heat dissipation base plate are respectively connected with the connecting threaded holes 1 on the bottom surfaces of the support columns 1, 2, 3 and 4 by bolts, so that the main structure of the circuit board is fixed on the upper surface of the heat dissipation base plate, and then the overall structure is fixed in a suitable position by bolts and the mounting through holes on the heat dissipation base plate, the high temperature resistant performance of the overall main structure of the circuit board can be improved by the high temperature resistant layer 1 and the high temperature resistant layer 2, the inside of the printed circuit board layer can be dissipated by the heat dissipation holes, and the heat generated by the operation of the electrical components on the surface of the printed circuit board layer is effectively reduced to act on the printed circuit board layer, thereby preventing the printed circuit board from being damaged due to the high temperature effect. The service life of the circuit board layer is reduced, and the micro-cooling fan 1 and the micro-cooling fan 2 are used to blow air to dissipate heat to the circuit board main structure on the upper ends of the micro-cooling fan 1 and the micro-cooling fan 2, thereby increasing the air circulation speed around the circuit board main structure to take away the heat inside the circuit board main structure, solving the above-mentioned problem. However, the structure of the traditional PCB circuit board is relatively simple, and its high temperature resistance performance is also poor. When the various electrical components on the PCB circuit board work for a long time in the corresponding equipment, the heat and high temperature generated by the electrical components and the current transfer will act on the PCB circuit board. The PCB circuit board is easily damaged in a high temperature environment, which may cause the service life of the PCB circuit board to be reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 The figure is a schematic diagram of the overall structure of a high temperature resistant PCB circuit board.
[0017] Figure 2 The figure is a schematic diagram of the structure of a partial structure disassembled in a high temperature resistant PCB circuit board.
[0018] Figure 3 The figure is a schematic diagram of the structure of the main structure of a circuit board in a high temperature resistant PCB circuit board.
[0019] Figure 4 The present invention is a structural schematic diagram of the bottom structure of a circuit board main structure in a high temperature resistant PCB circuit board.
[0020] Figure 5 The figure is a schematic diagram of a heat dissipation structure in a high temperature resistant PCB circuit board.
[0021] In the figure: 1-printed circuit board layer, 101-electrical component, 2-heat dissipation hole, 3-high temperature resistant layer one, 4-high temperature resistant layer two, 5-protective base plate, 501-heat dissipation groove, 6-support column one, 7-support column two, 8-support column three, 9-support column four, 10-connecting threaded hole one, 11-heat dissipation base plate, 1101-connecting threaded hole two, 1102-mounting through hole, 1103-drying layer, 12-protective frame one, 1201-micro cooling fan one, 13-protective frame two, 1301-micro cooling fan two. DETAILED DESCRIPTION
[0022] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.
[0023] See also Figures 1 to 5In the embodiment of the utility model, a high temperature resistant PCB circuit board includes a printed circuit board layer 1, a circuit board main structure and a heat dissipation structure. The lower end of the printed circuit board layer 1 is provided with a circuit board main structure, and the lower end of the circuit board main structure is provided with a heat dissipation structure. The circuit board main structure includes: electrical components 101, heat dissipation holes 2, a high temperature resistant layer 1 3, a high temperature resistant layer 2 4, a protective bottom plate 5, a heat dissipation groove 501, a support column 1 6, a support column 2 7, a support column 3 8, a support column 4 9 and a connecting threaded hole 10. A plurality of groups of electrical components 101 are provided on the upper surface of the printed circuit board layer 1, and a plurality of groups of heat dissipation holes 2 arranged linearly are opened on the front side surface of the printed circuit board layer 1. The heat dissipation holes 2 penetrate the front and rear surfaces of the printed circuit board layer 1. A high temperature resistant layer 1 3 is fixedly installed on the bottom surface of the printed circuit board layer 1, a high temperature resistant layer 2 4 is fixedly installed on the bottom surface of the high temperature resistant layer 1 3, a protective bottom plate 5 is fixedly installed on the bottom surface of the high temperature resistant layer 2 4, a plurality of heat dissipation grooves 501 are penetrated through the bottom surface of the protective bottom plate 5, a support column 1 6 is fixedly installed on the left front end of the bottom surface of the protective bottom plate 5, a support column 2 7 is fixedly installed on the left rear end of the bottom surface of the protective bottom plate 5, a support column 3 8 is fixedly installed on the right front end of the bottom surface of the protective bottom plate 5, a support column 4 9 is fixedly installed on the right rear end of the bottom surface of the protective bottom plate 5, and a connecting threaded hole 1 is opened in the middle of the bottom surfaces of the support column 1 6, the support column 2 7, the support column 3 8 and the support column 4 9. 10. The heat dissipation structure includes: a heat dissipation base plate 11, a second connecting threaded hole 1101, a mounting through hole 1102, a drying layer 1103, a protective frame 12, a micro cooling fan 1201, a protective frame 2 13 and a micro cooling fan 2 1301. The bottoms of the support columns 1 6, 2 7, 3 8 and 4 9 are jointly provided with the heat dissipation base plate 11. The drying layer 1103 is fixedly installed on the bottom surface of the heat dissipation base plate 11. The upper surface of the heat dissipation base plate 11 is penetrated by connecting threaded holes 1101 on all sides, that is, the number of the connecting threaded holes 1101 is four groups, and the four groups of connecting threaded holes 1101 all penetrate the drying layer 1103. The positions of the four groups of connecting threaded holes 1101 are respectively corresponding to the positions of the support columns 1 6, 7, 8 and 9. The positions of the connecting threaded holes 10 on the bottom surfaces of the support columns 127, 38 and 49 correspond to each other, and the four groups of connecting threaded holes 1101 are respectively connected to the connecting threaded holes 10 on the bottom surfaces of the support columns 16, 27, 38 and 49 by bolts, so that the main structure of the circuit board is fixed on the upper surface of the heat dissipation base plate 11, and two groups of mounting through holes 1102 are penetrated and symmetrically arranged at both the front and rear ends of the upper surface of the heat dissipation base plate 11, and the mounting through holes 1102 penetrate the drying layer 1103, and a protective frame 12 is arranged on the left side of the upper surface of the heat dissipation base plate 11, and a micro heat dissipation fan 1201 is arranged inside the protective frame 12, and a protective frame 2 13 is arranged on the right side of the upper surface of the heat dissipation base plate 11,A micro cooling fan 1301 is provided inside the protection frame 13.
[0024] The working principle of the utility model is:
[0025] The utility model relates to a high temperature resistant PCB circuit board. In a specific use process, firstly, four groups of connecting threaded holes 1101 on the upper surface of a heat dissipation base plate 11 are connected to the connecting threaded holes 10 on the bottom surfaces of support columns 16, 2, 7, 3 and 4 by bolts, so that the main structure of the circuit board is fixed on the upper surface of the heat dissipation base plate 11. Then, the whole structure is fixed in a suitable position by bolts and mounting through holes 1102 on the heat dissipation base plate 11. The heat resistant layer 13 and the heat resistant layer 24 can improve the overall stability of the main structure of the circuit board. High temperature resistance: the heat inside the printed circuit board layer 1 can be dissipated through the heat dissipation holes 2, effectively reducing the heat generated by the operation of the electrical components 101 on the surface of the printed circuit board layer 1 acting on the printed circuit board layer 1, thereby preventing the service life of the printed circuit board layer 1 from being reduced due to the high temperature effect. The micro-cooling fan 1201 and the micro-cooling fan 2 1301 are used to blow air to dissipate heat from the circuit board main structure on the upper ends of the micro-cooling fan 1201 and the micro-cooling fan 2 1301, thereby increasing the air circulation speed around the circuit board main structure and taking away the heat inside the circuit board main structure.
[0026] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.
Claims
1. A high temperature resistant PCB circuit board, comprising a printed circuit board layer (1), a circuit board main structure and a heat dissipation structure, characterized in that: The printed circuit board layer (1) is provided with a circuit board main structure at the lower end, and a heat dissipation structure is provided at the lower end of the circuit board main structure. The circuit board main structure comprises: electrical components (101), heat dissipation holes (2), a first high temperature resistant layer (3), a second high temperature resistant layer (4), a protective bottom plate (5), a heat dissipation slot (501), a first support column (6), a second support column (7), a third support column (8), a fourth support column (9) and a first connecting threaded hole (10). A plurality of groups of electrical components (101) are provided on the upper surface of the printed circuit board layer (1). 1), a plurality of groups of heat dissipation holes (2) arranged linearly are provided on the front side surface of the printed circuit board layer (1), the heat dissipation holes (2) penetrate the front and rear side surfaces of the printed circuit board layer (1), a high temperature resistant layer 1 (3) is fixedly installed on the bottom surface of the printed circuit board layer (1), a high temperature resistant layer 2 (4) is fixedly installed on the bottom surface of the high temperature resistant layer 1 (3), a protective bottom plate (5) is fixedly installed on the bottom surface of the high temperature resistant layer 2 (4), and a plurality of groups of heat dissipation grooves (501) are penetrated on the bottom surface of the protective bottom plate (5).
2. A high temperature resistant PCB circuit board according to claim 1, characterized in that: A support column 1 (6) is fixedly mounted on the left front end of the bottom surface of the protective bottom plate (5), and a support column 2 (7) is fixedly mounted on the left rear end of the bottom surface of the protective bottom plate (5).
3. A high temperature resistant PCB circuit board according to claim 1, characterized in that: A support column three (8) is fixedly installed at the right front end on the bottom surface of the protective base plate (5), and a support column four (9) is fixedly installed at the right rear end on the bottom surface of the protective base plate (5).
4. A high temperature resistant PCB circuit board according to claim 1, characterized in that: A connecting threaded hole 1 (10) is provided in the middle of the bottom surface of each of the support column 1 (6), the support column 2 (7), the support column 3 (8) and the support column 4 (9).
5. A high temperature resistant PCB circuit board according to claim 1, characterized in that: The heat dissipation structure comprises: a heat dissipation base plate (11), a second connecting threaded hole (1101), a mounting through hole (1102), a drying layer (1103), a first protective frame (12), a first micro heat dissipation fan (1201), a second protective frame (13) and a second micro heat dissipation fan (1301), and the bottoms of the first support column (6), the second support column (7), the third support column (8) and the fourth support column (9) are jointly provided with the heat dissipation base plate (11).
6. A high temperature resistant PCB circuit board according to claim 5, characterized in that: A drying layer (1103) is fixedly mounted on the bottom surface of the heat dissipation base plate (11), and connecting threaded holes (1101) are provided through the four sides of the upper surface of the heat dissipation base plate (11).
7. A high temperature resistant PCB circuit board according to claim 5, characterized in that: The number of the connecting threaded holes 2 (1101) is four groups, and the four groups of connecting threaded holes 2 (1101) all penetrate the drying layer (1103). The positions of the four groups of connecting threaded holes 2 (1101) respectively correspond to the positions of the connecting threaded holes 1 (10) on the bottom surfaces of the supporting column 1 (6), the supporting column 2 (7), the supporting column 3 (8) and the supporting column 4 (9).
8. A high temperature resistant PCB circuit board according to claim 5, characterized in that: Two groups of mounting through holes (1102) are symmetrically arranged at both the front and rear ends of the upper surface of the heat dissipation base plate (11), and the mounting through holes (1102) penetrate the drying layer (1103).
9. A high temperature resistant PCB circuit board according to claim 5, characterized in that: A protective frame (12) is arranged on the left side of the upper surface of the heat dissipation base plate (11), and a micro heat dissipation fan (1201) is arranged inside the protective frame (12).
10. The high temperature resistant PCB circuit board according to claim 5, characterized in that: A second protective frame (13) is arranged on the right side of the upper surface of the heat dissipation base plate (11), and a second micro heat dissipation fan (1301) is arranged inside the second protective frame (13).