Feeding mechanism capable of preventing material stacking and used for edge grinding of circuit board

Abstract

The utility model discloses a material-stacking-preventing feeding mechanism for edge grinding of a circuit board, which comprises a material supporting seat on which a thin plate to be subjected to edge grinding is placed; the material taking assembly comprises a first sliding rail, a first adsorption unit and a second adsorption unit, the first adsorption unit comprises a first mounting beam, a first driving air cylinder, a first supporting profile and a first suction cup, the end of the first mounting beam is fixedly mounted on the sliding block, and the first driving air cylinder is fixedly mounted on the first mounting beam; the first supporting profile is fixedly installed on a piston rod of the first driving air cylinder, the first suction cup is fixedly installed on the first supporting profile, the second adsorption unit is slidably connected to the first sliding rail, and the second adsorption unit comprises a second suction cup corresponding to the first suction cup in position. Compared with the prior art, the feeding device solves the problem that the edge grinding machining quality is affected due to the fact that sheet materials for circuit board machining are stacked in the edge grinding machining feeding process.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to a feeding mechanism for circuit board edge grinding processing which can prevent material stacking. Background Art

[0002] During the processing of the circuit board, it is first necessary to grind the edge of the metal sheet used for processing the circuit board so that the edge of the metal sheet is smooth and flat. For example, Chinese Patent 202220988407.X discloses an angle-adjustable grinding device for processing circuit boards, including a grinding device body, a first roller is provided on the upper outer surface of the grinding device body, a second roller is provided on the upper outer surface of the grinding device body, a driving motor is fixedly connected to the right outer surface of the grinding device body, a grinding piece is fixedly connected to the upper outer surface of the grinding device body, and a movable component is provided on the grinding device body, which can be adjusted at an angle. The device can change the angle and direction of the circuit board, so that the device can perform edge grinding operations on multiple edges of the circuit board in a single edge grinding operation. When performing edge grinding work, the staff does not need to change the edge of the circuit board, which indirectly improves the working efficiency of the device.

[0003] When performing edge grinding of thin plate materials for circuit board processing, the material picking mechanism picks up the stacked thin plates by adsorption, which makes it easy for two thin plates to fit closely and overlap during the picking process, causing the material picking mechanism to pick up two thin plates at a time, affecting the edge grinding quality. Utility Model Content

[0004] The utility model aims to provide a feeding mechanism for circuit board edge grinding processing which can prevent material overlap, so as to solve the problem that thin plate materials for circuit board processing overlap when feeding for edge grinding processing, thus affecting the quality of edge grinding processing.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a feeding mechanism for circuit board edge grinding processing to prevent stacking, comprising:

[0006] A support seat, on which the thin plate to be edge-milled is placed;

[0007] A material picking assembly includes a first slide rail, a first adsorption unit and a second adsorption unit. A symmetrically arranged first slide rail is arranged on both sides of a material supporting seat. A slider is arranged on the first slide rail. The first adsorption unit includes a first mounting beam, a first driving cylinder, a first supporting profile and a first suction cup. The end of the first mounting beam is fixedly mounted on the slider, the first driving cylinder is fixedly mounted on the first mounting beam, the first supporting profile is fixedly mounted on the piston rod of the first driving cylinder, the first suction cup is fixedly mounted on the first supporting profile, the first suction cup faces the thin plate to be edged, the second adsorption unit is slidably connected to the first slide rail, and the second adsorption unit includes a second suction cup corresponding in position to the first suction cup.

[0008] As a further description of the above technical solution:

[0009] The first suction cup is a corrugated suction cup.

[0010] As a further description of the above technical solution:

[0011] A mounting arm is arranged on the first supporting profile, the mounting arm is fixedly mounted on the first supporting profile by a first bolt, and the first suction cup is fixedly mounted on the mounting arm.

[0012] As a further description of the above technical solution:

[0013] The first supporting profile is provided with a slide groove arranged along the length direction of the first supporting profile, and the head of the first bolt is slidably connected in the first supporting profile.

[0014] As a further description of the above technical solution:

[0015] A waist-shaped hole is arranged on the mounting arm, and the rod body of the first bolt passes through the waist-shaped hole.

[0016] As a further description of the above technical solution:

[0017] A reinforcing rod is arranged between the first adsorption unit and the second adsorption unit.

[0018] As a further description of the above technical solution:

[0019] The material supporting seat is slidably connected to the second slide rail.

[0020] In summary, due to the adoption of the above technical solution, the beneficial effects of the utility model are:

[0021] 1. In the utility model, after the first suction cup of the first suction unit and the second suction cup of the second suction unit move downward synchronously to absorb the thin plate to be processed by edge grinding, the first suction cup is lifted first, and the height of the second suction cup remains unchanged. The thin plate to be processed by edge grinding is arranged tilted, and as the first driving cylinder drives the first suction cup upward, the thin plate to be processed by edge grinding is deformed and shaken, which effectively prevents the thin plates to be processed by edge grinding from stacking and avoids the absorption of two thin plates to be processed by edge grinding at one time.

[0022] 2. In the present invention, the first suction cup is a corrugated suction cup. The corrugated structure allows the first suction cup to be deformed, and the first suction cup can be stretched or compressed to adjust its own length, thereby preventing the first suction cup from being separated from the thin plate to be edged when it is lifted first.

[0023] 3. In the utility model, the first suction cup is fixedly mounted on the mounting arm, and the mounting arm can slide through the slide groove to adjust the mounting position, thereby realizing the adjustment of the position of the first suction cup, which is convenient for adsorbing thin plates to be edged of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 The present invention is a structural schematic diagram of a feeding mechanism for circuit board edge grinding processing to prevent material stacking.

[0026] Figure 2 The figure is a schematic diagram of the structure from a side view of a feeding mechanism for circuit board edge grinding processing to prevent material overlap.

[0027] Figure 3 The present invention is a schematic diagram of anti-overlapping adsorption of thin plates to be processed for edge grinding in a feeding mechanism for circuit board edge grinding to prevent overlapping.

[0028] Figure 4 The present invention is a structural schematic diagram of a material taking component in a feeding mechanism for circuit board edge grinding processing to prevent material stacking.

[0029] Figure 5 for Figure 4 A partial enlarged view of point A in the middle.

[0030] Legend:

[0031] 1. Material support seat; 11. Second slide rail; 2. First slide rail; 21. Sliding block; 3. First adsorption unit; 31. First mounting beam; 32. First driving cylinder; 33. First supporting profile; 331. Mounting arm; 3311. Waist-shaped hole; 332. First bolt; 333. Slide groove; 34. First suction cup; 4. Second adsorption unit; 41. Second suction cup; 6. Reinforcing rod; 9. Thin plate to be edged. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] Example 1

[0034] See also Figure 1-5 The utility model provides a technical solution: a feeding mechanism for circuit board edge grinding processing to prevent stacking, comprising:

[0035] A support 1, on which the thin plate 9 to be edged is placed;

[0036] The material picking assembly includes a first slide rail 2, a first adsorption unit 3, and a second adsorption unit 4. The first slide rails 2 are symmetrically arranged on both sides of the material support seat 1. The first slide rails 2 are provided with a slider 21. The first adsorption unit 3 includes a first mounting beam 31, a first driving cylinder 32, a first supporting profile 33, and a first suction cup 34. The end of the first mounting beam 31 is fixedly mounted on the slider 21. The first driving cylinder 32 is fixedly mounted on the first mounting beam 31. The first supporting profile 33 is fixedly mounted on the piston rod of the first driving cylinder 32. The first suction cup 34 is fixedly mounted on the first supporting profile 33. The first suction cup 34 faces the thin plate 9 to be edged. The second adsorption unit 4 is slidably connected to the first slide rail 2. The second adsorption unit 4 includes a second suction cup 41 whose position corresponds to the first suction cup 34. The structure and working principle of the second adsorption unit 4 are the same as those of the first adsorption unit 3, except that the structures of the first suction cup 34 and the second suction cup 41 are different.

[0037] The first suction cup 34 is a corrugated suction cup. The corrugated fold structure allows the first suction cup 34 to be deformed, and the first suction cup 34 can be stretched or compressed to adjust its own length, so as to prevent the first suction cup 34 from being separated from the thin plate 9 to be edged when it is lifted first.

[0038] The first supporting profile 33 is provided with a mounting arm 331, which is fixedly mounted on the first supporting profile 33 by a first bolt 332, and the first suction cup 34 is fixedly mounted on the mounting arm 331. The first supporting profile 33 is provided with a slide groove 333 arranged along its length direction, and the head of the first bolt 332 is slidably connected in the first supporting profile 33. The rod body of the first bolt 332 passes through the mounting arm 331 and is fixed by a nut to achieve the fixation of the mounting arm 331. The mounting arm 331 can slide and adjust the mounting position through the slide groove 333, thereby achieving the adjustment of the position of the first suction cup 34, which is convenient for adsorbing thin plates 9 to be edged of different sizes.

[0039] A waist-shaped hole 3311 is provided on the mounting arm 331 , and the rod of the first bolt 332 is passed through the waist-shaped hole 3311 , which further improves the flexibility of position adjustment of the mounting arm 331 , thereby further realizing the adjustment of the position of the first suction cup 34 .

[0040] A reinforcing rod 6 is provided between the first adsorption unit 3 and the second adsorption unit 4. One end of the reinforcing rod 6 is fixedly mounted on the first mounting beam 31, and the other end thereof is fixedly mounted on the second mounting beam of the second adsorption unit 4, so as to realize synchronous movement of the first adsorption unit 3 and the second adsorption unit 4 and ensure the adsorption and positioning effect of the thin plate 9 to be edged.

[0041] The support base 1 is slidably connected to the second slide rail 11. A sensor is arranged on one side of the support base 1. When the height of the topmost sheet 9 to be edged and processed stacked on the surface of the support base 1 is less than the set height and cannot be detected by the sensor, the support base 1 moves upward in the vertical direction along the second slide rail 11, so that the first adsorption unit 3 and the second adsorption unit 4 can adsorb the sheet 9 to be edged and processed thereon.

[0042] Working principle: When loading the thin plates 9 to be edge-grinded for processing the circuit board, several thin plates 9 to be edge-grinded are stacked on the support 1, and the material picking component picks up the thin plates 9 to be edge-grinded on the support 1 for the next step of edge grinding.

[0043] The specific picking process of the material picking component is:

[0044] 1) The first adsorption unit 3 and the second adsorption unit 4 move synchronously along the first slide rail 2 to above the support seat 1;

[0045] 2) The first suction cup 34 of the first suction unit 3 and the second suction cup 41 of the second suction unit 4 move downward synchronously to absorb the thin plate 9 to be edged. Specifically, taking the absorption of the first suction cup 34 as an example, the first driving cylinder 32 drives the first supporting profile 33 downward, and the first suction cup 34 moves downward accordingly and contacts the surface of the thin plate 9 to be edged. Then, the first suction cup 34 realizes negative pressure absorption by vacuuming, and the absorption of the second suction cup 41 is similar;

[0046] 3) The first suction cup 34 is lifted first, and the height of the second suction cup 41 remains unchanged. The thin plate 9 to be edged is arranged tilted, and as the first driving cylinder 32 drives the first suction cup 34 upward, the thin plate 9 to be edged is deformed and shaken, which effectively prevents the thin plates 9 to be edged from stacking and avoids sucking two thin plates 9 to be edged at one time;

[0047] 4) The second suction cup 41 is raised, the second suction cup 41 and the first suction cup 34 are at the same height, and the thin plate 9 to be edged is level;

[0048] 5) The first adsorption unit 3 and the second adsorption unit 4 are synchronously moved out from above the support 1 along the first slide rail 2, and the single sheet to be edge-grinded 9 is placed on the conveying line of the edge-grinding device for the next step of processing.

[0049] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A feeding mechanism for circuit board edge grinding to prevent stacking, characterized in that: include: A support seat, on which the thin plate to be edged is placed; A material picking assembly, comprising a first slide rail, a first adsorption unit and a second adsorption unit, wherein the first slide rails are symmetrically arranged on both sides of the material supporting seat, a slider is arranged on the first slide rail, the first adsorption unit comprises a first mounting beam, a first driving cylinder, a first supporting profile and a first suction cup, the end of the first mounting beam is fixedly mounted on the slider, the first driving cylinder is fixedly mounted on the first mounting beam, the first supporting profile is fixedly mounted on the piston rod of the first driving cylinder, the first suction cup is fixedly mounted on the first supporting profile, the first suction cup faces the thin plate to be edged, the second adsorption unit is slidably connected to the first slide rail, and the second adsorption unit comprises a second suction cup corresponding in position to the first suction cup.

2. A feeding mechanism for circuit board edge grinding to prevent stacking according to claim 1, characterized in that: The first suction cup is a corrugated suction cup.

3. A feeding mechanism for circuit board edge grinding to prevent stacking according to claim 1, characterized in that: The first supporting profile is provided with a mounting arm, the mounting arm is fixedly mounted on the first supporting profile by a first bolt, and the first suction cup is fixedly mounted on the mounting arm.

4. A feeding mechanism for circuit board edge grinding to prevent stacking according to claim 3, characterized in that: The first supporting profile is provided with a sliding groove arranged along the length direction of the first supporting profile, and the head of the first bolt is slidably connected in the first supporting profile.

5. A feeding mechanism for circuit board edge grinding to prevent stacking according to claim 3 or 4, characterized in that: The mounting arm is provided with a waist-shaped hole, and the rod body of the first bolt is passed through the waist-shaped hole.

6. The feeding mechanism for circuit board edge grinding to prevent stacking according to claim 1, characterized in that: A reinforcing rod is arranged between the first adsorption unit and the second adsorption unit.

7. The feeding mechanism for circuit board edge grinding to prevent stacking according to claim 1, characterized in that: The supporting seat is slidably connected to the second slide rail.

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