Wave soldering spraying device and wave soldering equipment

Abstract

The utility model provides a wave-soldering spraying device and wave-soldering equipment, the wave-soldering spraying device comprises a base and a nozzle assembly, the nozzle assembly is slidably arranged on the base and is used for spraying soldering flux; the first moving assembly is arranged on the base and used for driving the spray head assembly to move in the first direction. The second moving assembly is arranged on the base and connected with the spray head assembly so as to drive the spray head assembly to move in the second direction. The first moving assembly and the second moving assembly are arranged to drive the spray head assembly to move in the first direction and the second direction, selective area spraying of scaling powder on the circuit board to be welded is achieved, the scaling powder waste problem caused by spraying of the whole circuit board is avoided, cost is saved, and welding quality and efficiency are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of welding equipment, in particular to a wave soldering spraying device and wave soldering equipment. Background Art

[0002] In the related art, when the wave soldering equipment performs wave soldering on electronic components on the circuit board, a layer of flux needs to be sprayed on the circuit board in advance according to the process requirements to achieve better welding quality. However, in the process of spraying this layer of flux, the entire circuit board is often sprayed with a layer of flux, but in fact, it is only necessary to selectively spray the flux on the local area where the electronic components are to be soldered to meet the product's welding requirements; therefore, the existing flux spraying process will cause a waste of flux due to the large spraying area, increase production costs, and also affect welding efficiency. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the related art. To this end, the utility model proposes a wave soldering spraying device, which aims to reduce flux waste and reduce production costs.

[0004] An embodiment of the second aspect of the utility model provides a wave soldering device.

[0005] According to the first embodiment of the utility model, the wave soldering spraying device comprises:

[0006] Pedestal;

[0007] A spray head assembly is slidably disposed on the base and is used for spraying soldering flux;

[0008] A first moving assembly, disposed on the base, connected to the nozzle assembly and used to drive the nozzle assembly to move along a first direction;

[0009] The second moving component is disposed on the base, and the second moving component is connected to the nozzle component to drive the nozzle component to move along the second direction.

[0010] According to the wave soldering spraying device of the embodiment of the utility model, the wave soldering spraying device includes a base, a nozzle assembly, the nozzle assembly is slidably arranged on the base, and is used to spray solder flux; a first moving assembly is arranged on the base, and is used to drive the nozzle assembly to move along a first direction; a second moving assembly is arranged on the base, and the second moving assembly is connected to the nozzle assembly to drive the nozzle assembly to move along a second direction. By arranging the first moving assembly and the second moving assembly to drive the nozzle assembly to move along the first direction and the second direction, selective regional spraying of solder flux on the circuit board to be soldered is achieved, avoiding the problem of flux waste caused by spraying the entire circuit board, which is conducive to saving costs and improving welding quality and efficiency.

[0011] According to the wave soldering spraying device of the embodiment of the utility model, the first direction is perpendicular to the second direction.

[0012] According to the wave soldering spraying device of the embodiment of the utility model, the spray head assembly comprises:

[0013] A guide rod, arranged along the height direction of the wave soldering spraying device;

[0014] A sliding block, slidably disposed on the guide rod and sliding along the guide rod;

[0015] A nozzle is mounted on the slider.

[0016] According to the wave soldering spraying device of the embodiment of the utility model, the nozzle is provided with a solenoid valve to control the flow rate of the nozzle.

[0017] According to the wave soldering spraying device of the embodiment of the utility model, the wave soldering spraying device further includes:

[0018] A mounting frame, arranged on the base;

[0019] A position sensor, mounted on the mounting frame, for detecting position information of the circuit board to be soldered;

[0020] A controller is connected to the position sensor, the first moving component and the second moving component to control the operation of the first moving component and the second moving component based on the position information of the circuit board to be soldered.

[0021] According to the wave soldering spraying device of the embodiment of the utility model, at least one of the first moving assembly and the second moving assembly is installed with a shock absorbing pad.

[0022] According to the wave soldering spraying device of the embodiment of the utility model, the wave soldering spraying device is further provided with a cable guide chain, and the cable guide chain is used to guide the cable.

[0023] According to the wave soldering spraying device of the embodiment of the utility model, the nozzle assembly is provided with a flow sensor, and the flow sensor is used to detect the flux flow of the nozzle.

[0024] According to the wave soldering spraying device of the embodiment of the utility model, the base is provided with a mounting plate, and the first moving component includes:

[0025] A first guide rail, mounted on the mounting plate;

[0026] a first sliding block, slidably disposed on the first guide rail, wherein the first sliding block is provided with the nozzle assembly;

[0027] The first driving member is connected to the first sliding block to drive the first sliding block to slide along the first guide rail.

[0028] According to the wave soldering spraying device of the embodiment of the utility model, the second moving component includes:

[0029] A second guide rail, disposed on the base;

[0030] A second slider, slidably disposed on the second guide rail, the second slider being connected to the mounting plate;

[0031] The second driving member is connected to the second sliding block to drive the second sliding block to slide along the second guide rail.

[0032] The wave soldering equipment according to the second embodiment of the utility model includes:

[0033] A conveying device, used for conveying the circuit board to be soldered;

[0034] The wave soldering spraying device described in any of the above embodiments is arranged on the conveying device to spray flux onto the circuit board to be soldered.

[0035] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0037] Figure 1 This is a schematic diagram of the structure of the wave soldering spraying device provided by the embodiment of the utility model Figure 1 ;

[0038] Figure 2 This is a front view of a wave soldering spraying device provided by an embodiment of the utility model;

[0039] Figure 3 It is a side view of the wave soldering spraying device provided by an embodiment of the utility model;

[0040] Figure 4 This is a schematic diagram of the structure of the wave soldering spraying device provided by the embodiment of the utility model Figure 2 ;

[0041] Figure 5It is a structural schematic diagram of the wave soldering equipment provided by the embodiment of the utility model.

[0042] Reference numerals:

[0043] 10. Wave soldering spraying device; 20. Conveying device;

[0044] 100, base; 110, mounting frame; 120, position sensor; 130, shock-absorbing pad; 140, cable guide chain; 150, mounting plate;

[0045] 200, nozzle assembly; 210, guide rod; 220, sliding block; 230, nozzle;

[0046] 300, first moving assembly; 310, first guide rail; 320, first slider; 330, first driving member;

[0047] 400, second moving assembly; 410, second guide rail; 420, second slider; 430, second driving member. DETAILED DESCRIPTION

[0048] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0049] In the description of the embodiments of the present utility model, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present utility model. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0050] In the description of the embodiments of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.

[0051] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0052] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model embodiment. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0053] The embodiments of the present utility model refer to Figure 1-Figure 5 As shown, a wave soldering spraying device 10 and a wave soldering equipment are provided.

[0054] In the related art, when the wave soldering equipment performs wave soldering on electronic components on the circuit board, a layer of flux needs to be sprayed on the circuit board in advance according to the process requirements to achieve better welding quality. However, in the process of spraying this layer of flux, the entire circuit board is often sprayed with a layer of flux, but in fact, it is only necessary to selectively spray the flux on the local area where the electronic components are to be soldered to meet the product's welding requirements; therefore, the existing flux spraying process will cause a waste of flux due to the large spraying area, increase production costs, and also affect welding efficiency.

[0055] According to an embodiment of the present utility model, please refer to Figure 1 and Figure 2According to the wave soldering spraying device 10 of the embodiment of the utility model, it includes a base 100, a nozzle assembly 200, which is slidably arranged on the base 100 and is used to spray flux; a first moving assembly 300, which is arranged on the base 100, and the first moving assembly 300 is connected to the nozzle assembly 200 to drive the nozzle assembly 200 to move along the first direction; a second moving assembly 400, which is arranged on the base 100, and the second moving assembly 400 is connected to the nozzle assembly 200 to drive the nozzle assembly 200 to move along the second direction.

[0056] In this embodiment, the base 100 is the support platform of the entire wave soldering spraying device 10, and a mounting cavity is formed to provide a foundation and stability for the installation of other components. The nozzle assembly 200, the first movable assembly 300 and the second movable assembly 400 can all be installed in the mounting cavity, so that the various components can cooperate closely and work together to achieve precise spraying operation on the circuit board. Through this design, the base 100 not only supports and fixes other components, but also provides a unified mounting platform for the entire wave soldering spraying device 10, which is convenient for maintenance and operation. The positions of the nozzle assembly 200, the first movable assembly 300 and the second movable assembly 400 in the mounting cavity can cooperate with each other to achieve the movement and adjustment required for the spraying operation, thereby ensuring the accuracy and efficiency of the spraying.

[0057] In an alternative embodiment, reference Figure 4 As shown, the base 100 can adopt a frame structure, and the four sides of the base 100 can be closed by panels. This design can effectively provide a stable support platform, and the closed panels can protect the internal components and prevent the entry of dust or other impurities, thereby keeping the equipment clean and safe. The frame structure base 100 is usually made of a solid metal material, such as steel or aluminum alloy, to ensure sufficient bearing capacity and stability. At the same time, the closed design of the panel helps to reduce noise in the working environment and prevent accidental contact with internal moving parts, thereby improving the overall safety of the equipment.

[0058] Furthermore, adjustment buttons can be set on the ground panel of the base 100. By setting the adjustment buttons on the panel, the operator can easily adjust the spraying parameters, such as spraying speed, spraying pressure, nozzle angle, etc., so as to achieve precise control and adjustment of the spraying process. Through this design, the operator can adjust the spraying parameters at any time according to actual needs to ensure the stability and accuracy of the spraying process.

[0059] The nozzle assembly 200 is located in the installation cavity, and its main function is to spray flux. By controlling the position of the nozzle assembly 200, spraying can be achieved on a specific area of ​​the circuit board. The first moving assembly 300 and the second moving assembly 400 work together to control the nozzle assembly 200 to move along the first direction and the second direction to achieve position adjustment of the nozzle assembly 200.

[0060] Flux is an auxiliary material used in the welding process, and its main function is to help improve welding quality and efficiency. Flux is usually coated on the welding surface, and plays a role in cleaning, anti-oxidation, and promoting wetting during the welding process, which helps the contact and diffusion of solder with the workpiece surface, thereby improving welding quality and reliability.

[0061] It can be understood that in this embodiment, the wave soldering spraying device includes a base 100, a nozzle assembly 200, the nozzle assembly 200 is slidably arranged on the base 100, and is used to spray solder flux; a first moving assembly 300 is arranged on the base 100, and the first moving assembly 300 is connected to the nozzle assembly 200, and is used to drive the nozzle assembly 200 to move along a first direction; a second moving assembly 400 is arranged on the base 100, and the second moving assembly 400 is connected to the nozzle assembly 200 to drive the nozzle assembly 200 to move along a second direction. By arranging the first moving assembly 300 and the second moving assembly 400 to drive the nozzle assembly 200 to move along the first direction and the second direction, selective regional spraying of solder flux on the circuit board to be soldered is achieved, avoiding the problem of flux waste caused by spraying the entire circuit board, which is conducive to saving costs and improving soldering quality and efficiency.

[0062] According to an embodiment of the utility model, the first direction is perpendicular to the second direction. For example, the first direction is longitudinal and the second direction is transverse, that is, the first moving assembly 300 can drive the nozzle assembly 200 to move longitudinally, and the second moving assembly 400 can drive the nozzle assembly 200 to move transversely. Since the first direction is perpendicular to the second direction, the vertical moving direction allows the nozzle assembly 200 to cover all corners and edges of the circuit board, achieving comprehensive and accurate spraying. In addition, in a two-dimensional coordinate system, the two perpendicular directions can simplify the design of the control system, improve the response speed and stability of the system, and ensure the accuracy of spraying.

[0063] According to one embodiment of the present invention, referring to Figure 1 As shown, the nozzle assembly 200 includes: a guide rod 210, which is arranged along the height direction of the wave soldering spraying device 10; a sliding block 220, which is slidably arranged on the guide rod 210 and slides along the guide rod 210; and a nozzle 230, which is installed on the sliding block 220.

[0064] It can be understood that in this embodiment, the guide rod 210 is arranged along the height direction of the wave soldering spray device 10, and the slider is installed on the guide rod 210 and can be slid thereon, and the nozzle 230 is installed on the sliding block 220, so that the operator can easily adjust the height of the nozzle 230. The operator can adjust the height of the nozzle 230 as needed to ensure the accuracy and adaptability of the spraying process. It is suitable for circuit boards of different types and sizes, which helps to improve production efficiency and ensure the quality of spraying.

[0065] In some embodiments, a threaded structure can be provided between the sliding block 220 and the guide rod 210, and the position of the sliding block 220 can be adjusted by rotating a nut or a bolt, thereby changing the height of the nozzle 230. This adjustment method is simple and effective, has high adjustment accuracy and good stability, and can maintain the adjusted position for a long time. It can also achieve slight height adjustments, thereby meeting process requirements for higher position accuracy of the nozzle 230.

[0066] According to an embodiment of the present invention, the spray head 230 is provided with a solenoid valve to adjust the flow rate of the spray head 230 .

[0067] It can be understood that in this embodiment, the flow rate of the flux sprayed from the nozzle 230 can be adjusted by controlling the opening of the solenoid valve. The solenoid valve, as a control element, can be controlled to open or close according to an external signal or instruction, thereby adjusting the flow of the flux in the pipeline.

[0068] In the wave soldering spraying device 10, the flow control of the nozzle 230 is crucial to ensure coating uniformity and spraying quality. By setting a solenoid valve, the flow of the nozzle 230 can be accurately adjusted to meet the spraying requirements of different process requirements and workpiece characteristics. The operator can adjust the flow size of the nozzle 230 by controlling parameters such as the opening time, frequency or opening of the solenoid valve, thereby controlling the spraying amount of the coating or liquid. This flow regulation method can achieve rapid response and precise control, and improve the stability and reliability of the spraying process.

[0069] It can be understood that in this embodiment, the types of solenoid valves include but are not limited to direct-acting solenoid valves, indirect solenoid valves, diaphragm solenoid valves, sleeve solenoid valves, plug-in solenoid valves, etc., which can be selected according to different flux, pressure, temperature requirements and control methods to ensure the normal and stable operation of the nozzle assembly 200. This embodiment does not make specific limitations on this.

[0070] According to the embodiment of the present utility model, reference Figure 2 and Figure 3As shown, the wave soldering spray device 10 also includes a mounting frame 110, a position sensor 120 and a controller, wherein the mounting frame 110 is arranged on the base 100; the position sensor 120 is installed on the mounting frame 110, and is used to detect the position information of the circuit board to be soldered; the controller connects the position sensor 120, the first movable component 300 and the second movable component 400, so as to control the operation of the first movable component 300 and the second movable component 400 based on the position information of the circuit board to be soldered.

[0071] It can be understood that in this embodiment, the mounting frame 110 is arranged on the base 100 to support and fix other components so that the structure of the entire wave soldering spray device 10 is stable, and the position sensor 120 is installed on the mounting frame 110, and its function is to detect the position information of the circuit board to be soldered. By detecting the position of the circuit board, the spraying position and direction can be determined, so as to accurately control the flux spraying process. Once the position sensor 120 detects the position of the circuit board, the controller can adjust the position and movement trajectory of the spray head according to this information. In this way, it can be ensured that the flux is accurately sprayed in the area where welding is required, thereby improving the welding quality and efficiency. By automating the spraying process, the possibility of human error can also be reduced and production consistency can be improved.

[0072] The controller is connected to the position sensor 120, the first movable assembly 300 and the second movable assembly 400. Based on the position information of the circuit board to be soldered detected by the position sensor 120, the controller can accurately control the first movable assembly 300 and the second movable assembly 400, adjust the position and movement trajectory of the nozzle 230, and ensure the spraying quality and efficiency. The first movable assembly 300 is responsible for controlling the nozzle 230 to move in the longitudinal direction, and can move according to the instructions of the controller to adjust the relative position of the nozzle 230 and the circuit board. The second movable assembly 400 is responsible for controlling the nozzle 230 to move in the lateral direction, and can move left and right according to the instructions of the controller to adjust the relative position of the nozzle 230 and the circuit board.

[0073] In this embodiment, the position sensor 120 may be a sensor device that uses the principle of photoelectric conversion for detection and measurement. The position sensor 120 may be composed of a light emitting device and a receiving device, and detects information such as the position, distance, and color of an object by emitting a light beam and receiving a reflected light beam or a transmitted light beam. In industrial applications, the position sensor 120 is often used to detect the existence, position, or motion state of an object to achieve automated control and monitoring, precise control, monitoring and optimization of the production process, and improve production efficiency and quality.

[0074] According to one embodiment of the present invention, referring to Figure 2 and Figure 3 As shown, at least one of the first moving assembly 300 and the second moving assembly 400 is installed with a shock absorbing pad 130 .

[0075] It can be understood that in this embodiment, by installing the shock absorbing pad 130 in at least one of the first moving assembly 300 and the second moving assembly 400, the vibration and impact generated by the equipment during movement can be effectively absorbed and reduced, preventing these vibrations from damaging the equipment structure and key components or affecting the normal operation of the equipment, effectively extending the service life of the equipment, and improving the stability and safety of the equipment. Reducing vibration and impact also helps to reduce the noise level when the equipment is running and improve the working environment.

[0076] In addition, reducing vibration and shock during the movement of the equipment can also help reduce errors. Vibration and shock will have a negative impact on the operating stability and accuracy of the equipment, which may cause errors and instability in the production process. By installing the shock absorbing pad 130, the stability and accuracy of the equipment can be improved, and the possibility of errors can be reduced, thereby improving production efficiency and product quality.

[0077] In an optional embodiment, the first moving assembly 300 and the second moving assembly 400 are both provided with a shock absorbing pad 130, which can effectively absorb and reduce the vibration and impact generated by the device in different directions. This design can enable the device to obtain a good shock absorbing effect in various mobile operations, reduce the possibility of vibration transmission to other parts of the device, and thus extend the service life of the device.

[0078] It should be noted that the types of the shock absorbing pad 130 include but are not limited to spring shock absorbing pad 130, shock absorber shock absorbing pad 130, liquid shock absorbing pad 130 and gas shock absorbing pad 130, etc., which can be selected according to specific application requirements, and this embodiment does not make specific limitations on this.

[0079] According to one embodiment of the present invention, referring to Figure 3 As shown, the wave soldering spraying device 10 is further provided with a cable guide chain 140, and the cable guide chain 140 is used to guide the cables.

[0080] It is understood that, in this embodiment, the cable guide chain 140 is a device for guiding the cable. The cable guide chain 140 is usually composed of a plurality of rollers or guide wheels, and its function is to ensure that the cable can maintain a stable guide during movement and prevent the cable from being entangled, crossed or messy during movement.

[0081] The cable guide chain 140 is provided in the wave soldering spraying device 10 to help maintain the cable position required during the soldering / spraying process stable and accurate. By properly setting the cable guide chain 140, it can be ensured that the cable can be guided according to the design requirements during the operation of the equipment, avoiding accidental pulling or crossing, thereby improving the stability and safety of the equipment operation.

[0082] In an optional embodiment, the cable guide chain 140 may be formed with a guide groove, and the cable is arranged in the guide groove, which can effectively limit the movement range of the cable and guide it along a designed path. Such a design can improve the neatness and reliability of cable routing, reduce the risk of cable damage, and also help maintain the safety and stability of the equipment.

[0083] According to an embodiment of the present invention, the nozzle assembly 200 is provided with a flow sensor, and the flow sensor is used to detect the flux flow of the nozzle 230 .

[0084] It is easy to understand that in this embodiment, a flow sensor is installed on the nozzle assembly 200, which can monitor the flow of the flux in real time to ensure that the nozzle 230 provides an accurate spraying amount during operation. This helps to control the material consumption during welding or spraying and improve the stability and controllability of production. The flow sensor can feed back the detected flow signal to the control system so as to adjust the working state of the nozzle 230 in time to maintain the required spraying amount. This real-time feedback and adjustment mechanism can help improve production efficiency and avoid waste and unnecessary costs.

[0085] Furthermore, monitoring the flux flow rate can also help determine whether the nozzle 230 is clogged or leaking. When the nozzle 230 is clogged, the flow sensor will detect a sudden decrease or even interruption in the flow rate, which will trigger an alarm and prompt the operator to check and clean. In addition, if a leak occurs, the flow sensor will also detect abnormal flow conditions, thereby promptly discovering and solving the leakage problem and ensuring the stability and safety of the production process.

[0086] In this embodiment, the types of flow sensors include but are not limited to mechanical flow sensors, electromagnetic flow sensors, ultrasonic flow sensors, thermal flow sensors, eddy current flow sensors and mass flow sensors, etc. As long as they can detect the flow rate of the flux, they can be selected according to the specific application scenario. This embodiment does not make any specific limitations on this.

[0087] According to one embodiment of the present invention, referring to Figure 1 and Figure 2 As shown, the base 100 is provided with a mounting plate 150, and the first moving assembly 300 includes a first guide rail 310, a first slider 320 and a first driving member 330. The first guide rail 310 is installed on the mounting plate 150, the first slider 320 is slidably set on the first guide rail 310, and the first slider 320 is provided with a nozzle assembly 200; the first driving member 330 is connected to the first slider 320 to drive the first slider 320 to slide along the first guide rail 310.

[0088] It can be understood that in this embodiment, by providing the first slider 320 and the first guide rail 310, precise positioning of the nozzle assembly 200 in the longitudinal direction can be achieved, and this precise positioning can ensure that the nozzle 230 is accurately aligned with the target position during operation. The structural design of the first guide rail 310 and the first slider 320 is stable and reliable, and can withstand a certain load and maintain the smooth movement of the nozzle assembly 200, which can ensure that the nozzle assembly 200 will not shake or jitter during movement, thereby ensuring working stability and consistency. The first slider 320 is driven by the first driving member 330 to slide along the first guide rail 310, so as to realize automatic control of the movement of the nozzle assembly 200, improve production efficiency, and can adjust the moving speed and distance as needed to achieve more flexible adjustment.

[0089] In some embodiments, the first driving member 330 can drive the first slider 320 to move by means of a synchronous belt transmission. The first driving member 330 is connected to the first slider 320 by a synchronous belt, and the synchronous belt transmits power and motion, thereby driving the first slider 320 to move along the first guide rail 310. Synchronous belt transmission can provide precise position control to ensure the accuracy and stability of the first slider 320 during movement. Synchronous belt transmission has high efficiency, can effectively transmit power, and reduce energy loss. Compared with transmission methods such as chain transmission, synchronous belt transmission is lighter and has less noise, and is suitable for workplaces that require a low-noise environment.

[0090] According to the wave soldering spraying device 10 of the utility model embodiment, refer to Figure 1 and Figure 2 As shown, the second movable assembly 400 includes a second guide rail 410, a second slider 420 and a second driving member 430. The second guide rail 410 is arranged on the base 100. The second slider 420 is slidably arranged on the second guide rail 410. The second slider 420 is arranged to be connected to the mounting plate 150. The second driving member 430 is connected to the second slider 420 to drive the second slider 420 to slide along the second guide rail 410. When the second slider 420 slides, it will drive the first guide rail 310 on the mounting plate 150 to move, thereby realizing the movement of the nozzle assembly 200 in the first direction and the second direction.

[0091] It is understandable that, in this embodiment, the lateral movement of the nozzle assembly 200 can be achieved through the second guide rail 410, the second slider 420 and the second driving member 430. The design of the second slider 420 provided with the first guide rail 310 enables the lateral movement and the longitudinal movement to be combined to form a multi-axis linkage movement. Through the design of the second guide rail 410 and the second slider 420, the movement of the nozzle assembly 200 in the horizontal direction can be achieved, and the second driving member 430 is responsible for providing power and transmitting it to the second slider 420, thereby achieving lateral movement, so that the nozzle assembly 200 can cover a wider area during operation, improving production efficiency and flexibility.

[0092] Similarly, the second driving member 430 can also drive the second slider 420 to move by means of a synchronous belt drive. The second driving member 430 is connected to the second slider 420 through a synchronous belt. The synchronous belt transmits power and motion, thereby driving the second slider 420 to move along the second guide rail 410.

[0093] The embodiment of the second aspect of the utility model refers to Figure 5 As shown, a wave soldering equipment is provided, including a conveying device 20 and a wave soldering spraying device 10 of any one of the above-mentioned embodiments, the conveying device 20 is used to convey the circuit board to be soldered, and the wave soldering spraying device 10 is arranged on the conveying device 20, and is used to spray flux to the circuit board to be soldered.

[0094] It can be understood that in this embodiment, the conveying device 20 is used to convey the circuit board to be soldered, and convey the circuit board from the starting position along the production line to the wave soldering work area. The conveying device 20 can be in the form of a conveyor belt, a chain conveying system, etc., to ensure that the circuit board moves stably during the spraying and soldering process. The wave soldering spraying device 10 can be arranged below the conveying device 20 to spray flux on the circuit board to be soldered. The spraying of flux is to improve the welding quality and promote the wetting and flow of solder during the welding process. Usually, the wave soldering spraying device 10 will accurately control the spraying position, spraying amount and spraying method according to production needs to ensure that each circuit board can get an appropriate amount of flux spray. The conveying device 20 and the wave soldering spraying device 10 are used in combination to effectively realize the spraying of flux and the transportation of circuit boards in the wave soldering process, and provide necessary support and conditions for welding work.

[0095] It can be understood that the wave soldering spray device 10 has the beneficial effects of the above-mentioned embodiment, and the wave soldering equipment correspondingly has the beneficial effects of the above-mentioned embodiment. Its specific implementation method can refer to the above-mentioned embodiment, and this application will not elaborate on it.

[0096] Finally, it should be noted that the above implementation modes are only used to illustrate the present invention, rather than to limit the present invention. Although the present invention is described in detail with reference to the embodiments, a person skilled in the art should understand that various combinations, modifications or equivalent replacements of the technical solutions of the present invention do not deviate from the spirit and scope of the technical solutions of the present invention, and should be included in the protection scope of the present invention.

Claims

1. A wave soldering spraying device, characterized in that: include: Pedestal; A spray head assembly is slidably disposed on the base and is used for spraying soldering flux; A first moving assembly, disposed on the base, connected to the nozzle assembly and used to drive the nozzle assembly to move along a first direction; The second moving component is disposed on the base, and the second moving component is connected to the nozzle component to drive the nozzle component to move along the second direction.

2. The wave soldering spraying device according to claim 1, characterized in that: The first direction is perpendicular to the second direction.

3. The wave soldering spraying device according to claim 1, characterized in that: The nozzle assembly comprises: A guide rod, arranged along the height direction of the wave soldering spraying device; A sliding block, slidably disposed on the guide rod and sliding along the guide rod; The nozzle is mounted on the sliding block.

4. The wave soldering spraying device according to claim 3, characterized in that: The spray head is provided with a solenoid valve to adjust the flow rate of the spray head.

5. The wave soldering spraying device according to claim 1, characterized in that: The wave soldering spraying device also includes: A mounting frame, arranged on the base; A position sensor, mounted on the mounting frame, for detecting position information of the circuit board to be soldered; A controller is connected to the position sensor, the first moving component and the second moving component to control the operation of the first moving component and the second moving component based on the position information of the circuit board to be soldered.

6. The wave soldering spraying device according to claim 1, characterized in that: At least one of the first moving assembly and the second moving assembly is equipped with a shock absorbing pad.

7. The wave soldering spraying device according to claim 1, characterized in that: The wave soldering spraying device is also provided with a cable guide chain, and the cable guide chain is used for guiding the cable.

8. The wave soldering spraying device according to any one of claims 1 to 7, characterized in that: The nozzle assembly is provided with a flow sensor, and the flow sensor is used to detect the flux flow of the nozzle.

9. The wave soldering spraying device according to any one of claims 1 to 7, characterized in that: The base is provided with a mounting plate, and the first moving assembly comprises: A first guide rail, mounted on the mounting plate; a first sliding block, slidably disposed on the first guide rail, wherein the first sliding block is provided with the nozzle assembly; The first driving member is connected to the first sliding block to drive the first sliding block to slide along the first guide rail.

10. The wave soldering spraying device according to claim 9, characterized in that: The second moving component comprises: A second guide rail, disposed on the base; A second slider is slidably disposed on the second guide rail, and the second slider is connected to the mounting plate; The second driving member is connected to the second sliding block to drive the second sliding block to slide along the second guide rail.

11. A wave soldering equipment, characterized in that: include: A conveying device, used for conveying the circuit board to be soldered; The wave soldering spraying device according to any one of claims 1 to 10 is arranged on the conveying device to spray flux onto the circuit board to be soldered.

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