Conductive heat dissipation laser communication processor and mounting structure thereof

Abstract

The utility model relates to the technical field of electronic equipment, and discloses a conduction heat dissipation laser communication processor and a mounting structure thereof, which comprise a casing and a cover, the cover is separably mounted on the casing, a control circuit board is mounted in the casing, an active optical device is arranged on the circuit board, a cover plate is welded in the casing, and the cover plate is provided with a light source. A sealing cavity is formed between the cover plate and the bottom of the machine shell and filled with a liquid phase change material. The beneficial effects of the utility model are that when the active optical device emits heat, the liquid phase-change material in the sealing cavity is converted into a gas state and fills the whole sealing cavity, so that heat at a heat source position can be uniformly distributed on the whole bottom surface of the housing, heat accumulation is not caused, heat generated when the active optical device works can be effectively led out to the outside, and the service life of the active optical device is prolonged. And internal devices of the processor always work in a working temperature range, and the index performance is not influenced.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment, in particular to a laser communication processor with conduction heat dissipation and a mounting structure thereof. Background Art

[0002] With the continuous development of laser communication technology, the requirements for laser payloads on satellite platforms are becoming increasingly higher, with particular emphasis on achieving efficient, stable and rapid information transmission based on miniaturization.

[0003] The Chinese utility model patent (authorization announcement number: CN210469316U name: a dual-mode satellite data link terminal) includes a signal processor and a power amplifier; the signal processor and the power amplifier are stacked and locked and fixed, and the two are connected through power supply and control cables, Beidou satellite RF connection lines and relay satellite RF connection lines, and the signal processor is connected to an external control center; the signal processor is provided with a Beidou satellite receiving port and a relay satellite receiving port, wherein the Beidou satellite receiving port communicates with the Beidou satellite through an antenna, and the relay satellite receiving port communicates with the relay satellite through an antenna; the power amplifier is provided with a Beidou satellite transmitting port and more than one relay satellite transmitting port, wherein the Beidou satellite transmitting port is connected to the relay satellite through an antenna. The transmitting port communicates with the Beidou satellite through an antenna, and the relay satellite transmitting port communicates with the relay satellite through an antenna; among them, the signal processor supplies power to the power amplifier through power supply and control cables, but a large number of active optical power devices are integrated inside the signal processor. At present, the miniaturization and integration of active optical power devices are constantly improving, which has led to an increase in heat consumption inside the processor. The concentration of heat sources leads to an increase in heat flux density. Since the laser payload is located in outer space, it can only dissipate heat through conduction. In the case of a sharp increase in heat flux density, conventional conduction heat dissipation cannot transfer heat to the heat sink surface of the satellite platform in time, causing the temperature of the internal components of the processor to be too high, thus affecting the index performance. Utility Model Content

[0004] The utility model aims to provide a laser communication processor with conduction heat dissipation and its installation structure to overcome the shortcomings of the prior art.

[0005] The purpose of the utility model is achieved through the following technical solutions: a laser communication processor with conductive heat dissipation, comprising a casing and a cover, the cover being detachably mounted on the casing, a control circuit board being mounted in the casing, an active optical device being arranged on the circuit board, a cover plate being welded in the casing, a sealed cavity being formed between the cover plate and the bottom of the casing, the sealed cavity being filled with liquid phase change material, and the active optical device being fixed to the cover plate by a low-temperature solder sheet.

[0006] Preferably, a plurality of support columns distributed in a matrix are fixed to the bottom of the sealed cavity, the top end surfaces of the support columns are spherical, and the cover plate is pressed against the tops of the support columns.

[0007] Preferably, a sealing groove is provided on the port surface of the housing, the sealing groove surrounds the outer side of the port of the housing, an electronic shielding strip is installed in the sealing groove, and the shape of the sealing groove matches the shape of the electronic shielding strip.

[0008] Preferably, a porous medium plate close to the cover plate is also provided in the sealed cavity, the diameter of the support column gradually decreases from the bottom to the top, the support column is used to penetrate the porous medium plate, and a gap is formed between the porous medium plate sleeved on the support column and the bottom of the casing.

[0009] Preferably, the electronic shielding strip comprises a hollow rubber strip, a metal conductive layer is provided on the outer wall of the rubber strip located on one side of the inner cavity, the electronic shielding strip is tightly installed in the sealing groove, and the metal conductive layer is located on the inner side of the sealing groove.

[0010] Preferably, the top and bottom of the rubber strip are provided with a slot, the slot extending from one end of the rubber strip to the other end, and the metal conductive layer is provided with two convex strips, the convex strips are inserted into the corresponding slots.

[0011] Preferably, a protrusion is integrally formed on the bottom of the rubber strip on the other side opposite to the metal conductive layer, the protrusion extends from one end of the rubber strip to the other end, and the connection between the protrusion and the side wall of the rubber strip is smoothly transitioned.

[0012] A mounting structure of a laser communication processor with conduction heat dissipation includes a laser communication processor, thermal grease and a satellite platform. A sedimentation tank is provided on the satellite platform, and the thermal grease is pressed into the sedimentation tank through the laser communication processor.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] When the active optical device generates heat, the liquid phase change material in the sealed cavity changes into a gaseous state and fills the entire sealed cavity, so that the heat at the heat source is evenly distributed on the entire bottom surface of the shell without causing heat accumulation. In addition, low-temperature solder sheets are used to fill the active optical device and the cover plate, replacing the method of bonding thermal conductive silicon pads, which can greatly reduce the thermal transfer resistance between the active optical device and the bottom of the shell, and can effectively export the heat generated by the active optical device during operation to the outside world, so that the internal components of the processor always operate within the operating temperature range without affecting the index performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the installation structure of the laser communication processor;

[0016] Figure 2 It is a schematic diagram of the structure of the laser communication processor;

[0017] Figure 3 Schematic diagram of the installation structure of the porous medium plate;

[0018] Figure 4 This is a schematic diagram of the installation structure of the electronic shielding strip;

[0019] In the figure, 1-housing, 2-cover, 3-control circuit board, 4-active optical device, 5-cover plate, 6-sealed cavity, 7-low-temperature solder sheet, 8-support column, 9-sealed groove, 10-porous medium plate, 11-rubber strip, 12-metal conductive layer, 13-card slot, 14-convex strip, 15-raised part, 16-thermal grease, 17-satellite platform. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. The components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0022] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features thereof may be combined with each other.

[0023] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0024] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the utility model product is usually placed when in use, or the positions or positional relationships commonly understood by those skilled in the art, which are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0025] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] like Figure 1-3 As shown, an installation structure of a laser communication processor with conduction heat dissipation includes a laser communication processor, thermal conductive silicone grease 16 and a satellite platform 17. A sedimentation tank is provided on the satellite platform 17. The thermal conductive silicone grease 16 is pressed into the sedimentation tank by the laser communication processor. The laser communication processor includes a casing 1 and a cover 2. The cover 2 is detachably installed on the casing 1. A control circuit board 3 is installed in the casing 1. An active optical device 4 is arranged on the circuit board. A cover plate 5 is welded in the casing 1. A sealed cavity 6 is formed between the cover plate 5 and the bottom of the casing 1. The sealed cavity 6 is filled with a liquid phase change material. The active optical device 4 is soldered by low temperature solder. The sheet 7 is fixed on the cover plate 5. When the active optical device 4 generates heat, the liquid phase change material in the sealed cavity 6 is transformed into a gas state and fills the entire sealed cavity 6, so that the heat at the heat source position is evenly distributed on the entire bottom surface of the shell without causing heat accumulation. In addition, a low-temperature solder sheet 7 is used to fill the active optical device 4 and the cover plate 5, replacing the bonding thermal conductive silicon pad. This can greatly reduce the thermal transfer resistance between the active optical device 4 and the bottom of the casing 1, and can effectively conduct the heat generated by the active optical device 4 during operation to the outside, so that the internal components of the processor always operate within the operating temperature range without affecting the index performance.

[0027] In this embodiment, if Figure 3As shown, a plurality of support columns 8 distributed in a matrix are fixed to the bottom of the sealed cavity 6, and the top end faces of the support columns 8 are spherical. The cover plate 5 is pressed against the tops of the support columns 8 to reduce the contact area between the support columns 8 and the cover plate 5. When the liquid phase change material is liquidized, a larger area contacts the cover plate 5, thereby quickly and evenly taking away the heat generated by the active optical device 4.

[0028] In this embodiment, if Figure 3 As shown, a porous medium plate 10 is also provided in the sealing cavity 6 and is close to the cover plate 5. The diameter of the support column 8 gradually decreases from the bottom to the top. The support column 8 is used to penetrate the porous medium plate 10. A gap is formed between the porous medium plate 10 sleeved on the support column 8 and the bottom of the casing 1. After the porous medium plate 10 absorbs liquid by capillary effect, the liquid phase change material is evenly attached to the cover plate 5. When the liquid phase change material is vaporized, the gap serves as a flow channel for the gaseous phase change material to flow in the sealing ring, thereby avoiding local heat accumulation and making the cooling response more rapid.

[0029] In this embodiment, if Figure 2 and 4 As shown, a sealing groove 9 is opened on the port surface of the casing 1, and the sealing groove 9 surrounds the outer side of the port of the casing 1. An electronic shielding strip is installed in the sealing groove 9. The shape of the sealing groove 9 is adapted to the shape of the electronic shielding strip. The electronic shielding strip includes a hollow rubber strip 11. A metal conductive layer 12 is provided on the outer wall of the rubber strip 11 on one side of the inner cavity. The electronic shielding strip is tightly installed in the sealing groove 9, and the metal conductive layer 12 is located on the inner side of the sealing groove 9 to prevent electromagnetic radiation from entering the casing 1 and affecting the use of internal electrical components.

[0030] In this embodiment, if Figure 4 As shown, the top and bottom of the rubber strip 11 are provided with a card slot 13, and the card slot 13 extends from one end of the rubber strip 11 to the other end. Two convex strips 14 are provided on the metal conductive layer 12, and the convex strips 14 are inserted into the corresponding card slots 13. The metal conductive layer 12 is sprayed on the rubber strip 11 after copper powder and epoxy resin are mixed in proportion. The cured metal conductive layer 12 is stuck in the card slot 13, and the connection with the rubber strip 11 is more firm.

[0031] In this embodiment, if Figure 4 As shown, a protrusion 15 is integrally formed on the bottom of the rubber strip 11 on the other side opposite to the metal conductive layer 12. The protrusion 15 extends from one end of the rubber strip 11 to the other end. The connection between the protrusion 15 and the side wall of the rubber strip 11 is a smooth transition, which makes the structure of the electronic shielding strip more stable after installation and not easy to fall off.

[0032] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A laser communication processor for conduction heat dissipation, comprising a housing (1) and a cover (2), wherein the cover (2) is detachably mounted on the housing (1), a control circuit board (3) is mounted in the housing (1), and an active optical device (4) is arranged on the circuit board (3), characterized in that: A cover plate (5) is welded inside the housing (1), a sealed cavity (6) is formed between the cover plate (5) and the bottom of the housing (1), the sealed cavity (6) is filled with a liquid phase change material, and the active optical device (4) is fixed to the cover plate (5) via a low-temperature solder sheet (7).

2. A laser communication processor with conductive heat dissipation according to claim 1, characterized in that: A plurality of support columns (8) distributed in a matrix are fixed to the bottom of the sealed cavity (6); the top end surfaces of the support columns (8) are spherical, and the cover plate (5) is pressed against the tops of the support columns (8).

3. A laser communication processor with conductive heat dissipation according to claim 1, characterized in that: A sealing groove (9) is provided on the port surface of the housing (1), the sealing groove (9) surrounds the outer side of the port of the housing (1), an electronic shielding strip is installed in the sealing groove (9), and the shape of the sealing groove (9) is adapted to the shape of the electronic shielding strip.

4. A laser communication processor with conductive heat dissipation according to claim 2, characterized in that: A porous medium plate (10) is also provided in the sealed cavity (6) and is in close contact with the cover plate (5). The diameter of the support column (8) gradually decreases from the bottom to the top. The support column (8) is used to penetrate the porous medium plate (10). A gap is formed between the porous medium plate (10) sleeved on the support column (8) and the bottom of the casing (1).

5. The laser communication processor with conductive heat dissipation according to claim 3, characterized in that: The electronic shielding strip comprises a hollow rubber strip (11), a metal conductive layer (12) being provided on the outer wall of the rubber strip (11) located on one side of the inner cavity, the electronic shielding strip being tightly mounted in the sealing groove (9), and the metal conductive layer (12) being located on the inner side of the sealing groove (9).

6. The laser communication processor with conductive heat dissipation according to claim 5, characterized in that: The top and bottom of the rubber strip (11) are both provided with a slot (13), the slot (13) extending from one end of the rubber strip (11) to the other end, and the metal conductive layer (12) is provided with two convex strips (14), the convex strips (14) being inserted into the corresponding slots (13).

7. The laser communication processor with conductive heat dissipation according to claim 5, characterized in that: A protrusion (15) is integrally formed on the bottom of the rubber strip (11) on the other side opposite to the metal conductive layer (12); the protrusion (15) extends from one end of the rubber strip (11) to the other end; and the connection between the protrusion (15) and the side wall of the rubber strip (11) is smoothly transitioned.

8. A mounting structure for a laser communication processor with conductive heat dissipation, characterized in that: It comprises the laser communication processor according to claim 1, thermal grease (16) and a satellite platform (17), wherein a sedimentation tank is provided on the satellite platform (17), and the thermal grease (16) is pressed tightly into the sedimentation tank through the laser communication processor.

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