Air-cooled closed case suitable for 6U module

Abstract

The utility model provides an air-cooled closed case suitable for a 6U module. The air-cooled closed case suitable for the 6U module comprises a closed case body used for containing the 6U module and a fan module used for dissipating heat of the case body. A pair of oppositely-arranged ground box walls of the case is configured to be of a heat dissipation plate structure; the heat dissipation plate structure comprises a heat conduction mounting plate, and a plurality of heat dissipation fins are arranged on the side, facing the exterior of the closed cavity, of the heat conduction mounting plate and are arranged at equal intervals in the length direction of the heat conduction mounting plate; a plurality of heat conduction bosses are arranged on the side, facing the interior of the closed cavity, of the heat conduction mounting plate and are arranged at equal intervals in the length direction of the heat conduction mounting plate. Every two adjacent heat conduction bosses form a guide groove; the 6U module is fixedly connected in the guide groove through the module heat conduction plate and the auxiliary heat conduction plate. The air-cooled closed case is more reasonable in air duct design, optimized in heat dissipation path, improved in heat transfer efficiency and enhanced in heat dissipation capability, and provides good working environment conditions for functional modules.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment, in particular to an air-cooled closed case suitable for a 6U module. Background Art

[0002] In the field of electronic equipment, 6U modules are a common standard specification and are widely used in various electronic equipment. However, with the continuous advancement of technology, the functions of single modules are becoming more and more powerful, and the integration is becoming higher and higher, resulting in increasing heat consumption of single modules. When facing high heat consumption 6U modules, the heat dissipation capacity of traditional air-cooled closed chassis can no longer meet the needs of the modules.

[0003] Traditional air-cooled sealed chassis usually use ambient air generated by fans to dissipate heat, and the heat dissipation path is often long, with the heat transfer path being: functional module chip-module heat conduction plate-air-cooled chassis heat conduction boss-air-cooled chassis corrugated plate heat sink-ambient air generated by fans. However, this method has low heat transfer efficiency when facing high heat consumption modules, and its heat dissipation effect is often unsatisfactory.

[0004] In addition, traditional air-cooled closed chassis usually have certain restrictions on the heat consumption of a single module and the total heat consumption of all modules in the entire chassis. Generally, the heat consumption of a single module is no more than 40W, and the total heat consumption of all modules in the entire chassis is no more than 300W.

[0005] In order to solve the above technical problems, other measures such as liquid cooling are adopted in related technologies. However, these measures often bring additional costs, such as the need to add supporting equipment such as liquid cooling sources, which increases the complexity of the thermal control system and the product cost.

[0006] Therefore, designing an air-cooled closed chassis suitable for high heat consumption 6U modules, while ensuring that the heat dissipation method and protection method remain unchanged, improving the chassis's heat dissipation capacity for a single module of a high heat consumption 6U module, and at the same time improving the chassis's total heat dissipation capacity for all modules, optimizing the heat dissipation path, and improving the heat transfer efficiency has become one of the problems that need to be urgently solved in the current electronic equipment field. Utility Model Content

[0007] In order to overcome the defects of the above-mentioned heat dissipation devices and methods, the utility model provides an air-cooled closed chassis suitable for 6U modules, which has an optimized heat dissipation path, improved heat transfer efficiency and enhanced heat dissipation capacity.

[0008] The utility model is an air-cooled closed chassis suitable for 6U modules to solve the technical problem, comprising:

[0009] A closed chassis for accommodating 6U modules and a fan module for dissipating heat from the chassis;

[0010] A pair of oppositely disposed ground box walls of the chassis are configured as a heat dissipation plate structure; the heat dissipation plate structure includes a heat-conducting mounting plate, a side of the heat-conducting mounting plate facing the outside of the closed cavity is provided with a plurality of heat-dissipating fins, and the heat-dissipating fins are arranged at equal intervals along the length direction of the heat-conducting mounting plate; a side of the heat-conducting mounting plate facing the inside of the closed cavity is provided with a plurality of heat-conducting bosses, and the heat-conducting bosses are arranged at equal intervals along the length direction of the heat-conducting mounting plate; two adjacent heat-conducting bosses form a guide groove;

[0011] The 6U module is fixedly connected in the guide groove via a module heat conducting plate and an auxiliary heat conducting plate, and each of the 6U modules is arranged between one of the module heat conducting plates and one of the auxiliary heat conducting plates.

[0012] As an improvement of the air-cooled closed chassis suitable for 6U modules, the module heat conducting plate is installed in the guide groove by a puller, and the module heat conducting plate is attached to the corresponding heat conducting boss by a locker. The auxiliary heat conducting plate is attached to the guide groove adjacent to the guide groove where the module heat conducting plate is located by a locker;

[0013] A heat-conducting pad is mounted on a middle area of ​​a side of the auxiliary heat-conducting plate close to the module heat-conducting plate, and the heat-conducting pad is sandwiched between the module heat-conducting plate and the auxiliary heat-conducting plate.

[0014] As an improvement of the air-cooled closed chassis suitable for 6U modules, the thermally conductive pad is provided with a certain compression margin.

[0015] As an improvement of an air-cooled closed chassis suitable for 6U modules, the heat sink structure includes a cover plate, which is fixedly connected to a side of the heat sink structure close to the heat sink fins through a cover plate mounting block, and the interval between two adjacent heat sink fins and the cover plate form a heat exchange air duct;

[0016] The fan module is arranged at the end of the heat exchange air duct.

[0017] As an improvement of the air-cooled closed chassis suitable for 6U modules, the heat dissipation fins are provided with transverse spoiler holes penetrating along the length direction of the heat-conducting mounting plate.

[0018] As an improvement of the air-cooled closed chassis suitable for 6U modules, the heat-conducting mounting plate is provided with longitudinal spoiler grooves along the width direction of the heat-conducting mounting plate.

[0019] As an improvement to the air-cooled sealed chassis suitable for 6U modules, a back panel mounting block for fixedly connecting the rear cover is fixedly provided on one end edge of the two thermal conductive bosses located on the edge of the heat sink structure. The rear cover is fixedly connected to the back panel mounting block by screws to form a welded sealing structure.

[0020] As an improvement to the air-cooled sealed chassis suitable for 6U modules,

[0021] The fan module includes a plurality of fans, and the plurality of fans are connected in parallel.

[0022] As an improvement to the air-cooled closed chassis suitable for 6U modules, the locker is a multi-section locker.

[0023] As an improvement to the air-cooled closed chassis suitable for 6U modules, the heat sink structure, module heat conduction plate and auxiliary heat conduction plate are made of 6063 aluminum alloy.

[0024] Beneficial effects:

[0025] Compared with the related art, the air-cooled closed chassis suitable for 6U modules provided by the utility model has been greatly improved in welding processability and is not easy to deform, thereby indirectly improving the conduction effect of heat loss from the module to the chassis. The air duct design is more reasonable, which reduces the wind resistance loss outside the heat exchange duct, and adds turbulence to the heat exchange duct to enhance the heat exchange effect. Multiple fans work in parallel, which improves the reliability of the entire air-cooled closed chassis. Even if a single fan stops working, the design safety margin reserved for the entire chassis can ensure the normal operation of the equipment. The module heat conduction plate and the auxiliary heat conduction plate can quickly and efficiently transfer the heat loss generated by the 6U board to the upper and lower heat dissipation plates, which is the most effective means to reduce the temperature rise caused by the conduction thermal resistance and the contact thermal resistance, and is also the main temperature rise link of the entire air-cooled closed chassis. The sealing of the entire chassis is good, which can provide good working environment conditions for the functional modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a three-dimensional diagram of an air-cooled closed chassis suitable for 6U modules according to an embodiment of the utility model;

[0027] Figure 2 This is a schematic diagram of the internal structure of an air-cooled closed chassis suitable for 6U modules according to an embodiment of the utility model;

[0028] Figure 3 A three-dimensional diagram of a first heat sink of an air-cooled sealed chassis suitable for a 6U module according to an embodiment of the utility model;

[0029] Figure 4 According to the embodiment of the present utility model Figure 3 The enlarged view of point A in the middle;

[0030] Figure 5 According to the embodiment of the present utility model Figure 3 Top view of point A in the middle.

[0031] Reference numerals:

[0032] The first heat sink 1a; the second heat sink 1b; the left side plate 2a; the right side plate 2b; the upper cover plate 3a; the lower cover plate 3b; the front panel 4; the rear cover plate 5; the fan mounting plate 6; the fan 7; the positioning pin bracket 8; the ear screw 9; the decorative nut 10; the captive screw 11; the handle 12; the module heat conducting plate 13; the auxiliary heat conducting plate 14; the lock 15; the puller 16; the thermal pad 17; the sealing rope 18; the thermal conductive boss 101, the thermal conductive mounting plate 102; the heat dissipation fins 103; the transverse spoiler holes 104; the longitudinal spoiler grooves 105; the back plate mounting block 106; the upper and lower cover plate mounting blocks 107. DETAILED DESCRIPTION

[0033] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined purpose, the present invention is described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0034] The utility model proposes an air-cooled sealed chassis suitable for 6U modules, which aims to solve the heat dissipation problem of a single module with high heat consumption and the problem of insufficient total heat dissipation capacity of the chassis in the prior art. The air-cooled sealed chassis improves the total heat dissipation capacity of the chassis by increasing the area of ​​the heat dissipation fins, improving the efficiency of convection heat transfer, increasing the ventilation volume, and improving the air duct. At the same time, by thickening the module heat conduction plate, increasing the contact area, adding auxiliary heat conduction plates, and enhancing the pre-tightening force, the heat dissipation capacity of a single module is improved. The air-cooled sealed chassis suitable for 6U modules with high heat consumption has broad application prospects.

[0035] See also Figure 1-2 , Figure 1 This is a three-dimensional diagram of an air-cooled sealed chassis suitable for 6U modules according to an embodiment of the utility model. Figure 2 FIG. 1 is a schematic diagram of the internal structure of an air-cooled sealed chassis suitable for 6U modules according to an embodiment of the utility model. Figure 1-2 As shown, the air-cooled closed chassis suitable for 6U modules proposed by the utility model is fixed in the cabinet, and the air-cooled closed chassis includes a first heat sink 1a and a second heat sink 1b arranged oppositely, a first side panel 2a and a second side panel 2b arranged oppositely, and a front panel 4 and a rear cover 5 arranged oppositely; the first heat sink 1a, the second heat sink 1b, the first side panel 2a and the second side panel 2b are fixedly connected to each other to form a rectangular frame structure, and the front panel 4 and the rear cover 5 are arranged on the frame structure to form a closed box structure for accommodating 6U modules; a fan module for heat dissipation is arranged on the side wall of the box structure; a plurality of 6U modules are fixed inside the box structure through a module heat conducting plate 13.

[0036] During the specific implementation process, the frame structure of the air-cooled sealed chassis is formed by first bolting and then welding the first heat sink 1a, the second heat sink 1b, the first side panel 2a and the second side panel 2b. The purpose of the bolt connection is to position the parts before welding and prevent deformation during welding; the purpose of welding is to enhance the rigidity of the chassis frame and to improve the airtightness of the entire chassis.

[0037] The front panel 4 is installed on the front of the chassis frame structure by screws. The front panel 4 is provided with sealing grooves for installing the sealing rope 18. After the sealing rope 18 is installed in place, it is firmly attached to the front of the chassis frame structure to improve the sealing of the chassis. The front panel 4 is riveted with a decorative nut 10, and a captive screw 11 is reserved on the decorative nut 10. When installing the air-cooled closed chassis, the front panel 4 is compacted and fixed to the front of the cabinet or the set position by the captive screw 11 and the captive nut. The front panel 4 is provided with a handle 12, and the chassis is pulled out and transported by the handle 12.

[0038] The rear cover 5 is installed at the rear of the chassis frame structure by screws. Sealing grooves for installing the sealing rope 18 are processed around the rear cover 5. After the sealing rope 18 is installed in place, it is fixed to the rear of the chassis frame structure, which can improve the sealing of the chassis; the rear cover 5 is provided with a trapezoidal heat exchange duct near the edge of the first heat sink 1a and the second heat sink 1b, and the fan 7 is installed in the trapezoidal heat exchange duct, which can reduce the local wind resistance loss of the entire heat dissipation duct; an installation hole for the electrical connector is reserved in the middle of the rear cover 5 to realize the external electrical connection of the chassis.

[0039] The outer walls of the first side panel 2a and the second side panel 2b are both provided with ear screws 9, which are connected and fixed to the guide rails inside the cabinet through the ear screws 9; the edges of the first side panel 2a and the second side panel 2b close to the rear cover plate 5 are both provided with positioning pin brackets 8, and the chassis is positioned through the positioning pin brackets 8 and the guide rail positioning pins of the cabinet.

[0040] The fan module includes a plurality of fans 7 working in parallel; the fans 7 are fixed in the trapezoidal transition air duct of the rear cover 5 through the fan mounting plate 6 and screws. The fans 7 are evenly distributed on the fan mounting plate 6 and work in parallel to reduce the difference in the air volume flowing through each heat sink structure; the fans 7 can be selected according to the total design air volume of the air-cooled closed chassis, and the air volume of a single fan 7 is greater than 1.2 times the ratio of the total design air volume to the number of fans.

[0041] See also Figure 3 , Figure 3 FIG. 1 is a perspective view of a first heat sink of an air-cooled sealed chassis suitable for a 6U module according to an embodiment of the utility model. Figure 3 As shown,

[0042] The first heat sink 1a and the second heat sink 1b are core parts of the air-cooled closed chassis. The first heat sink 1a and the second heat sink 1b have the same structure. Taking the first heat sink 1a as an example, the first heat sink 1a includes a heat-conducting mounting plate 102, which is used to be assembled and connected with the first side plate 2a, the second side plate 2b, the front panel 4 and the rear cover plate 5 respectively. After assembly, a sealed closed cavity with good sealing can be formed to improve the local environmental conditions of the module operation. A plurality of heat dissipation fins 103 are arranged on the side of the heat-conducting mounting plate 102 facing the outside of the closed cavity. The heat dissipation fins 103 are arranged at equal intervals along the length direction of the heat-conducting mounting plate 102. The fin thickness and fin spacing are reasonably designed, the heat dissipation area is large, the convection heat transfer temperature rise is small, and it is easy to machine. A plurality of heat-conducting bosses 101 are arranged on the side of the heat-conducting mounting plate 102 facing the inside of the closed cavity. The heat-conducting bosses 101 are arranged at equal intervals along the length direction of the heat-conducting mounting plate 102, and a guide groove for installing the module heat-conducting plate 13 is formed between two adjacent heat-conducting bosses 101.

[0043] A cover plate mounting block 107 is provided at the edge of the heat-conducting mounting plate 102 close to the heat-dissipating fins 103, and an upper cover plate 3a is provided at the side of the first heat-dissipating plate 1a close to the heat-dissipating fins 103. The interval between two adjacent heat-dissipating fins 103 and the upper cover plate 3 form a heat-exchange air duct. Similarly, a lower cover plate 3b is provided and fixed to the corresponding position of the second heat-dissipating plate 1b to form a heat-exchange air duct of the chassis. At the same time, the cover plate mounting block 107 needs to minimize the influence on the air inlet and outlet of the heat-exchange air duct.

[0044] For further information, see Figure 3 Each heat sink 103 is provided with a transverse spoiler hole 104 along the length direction of the heat-conducting mounting plate 102; the functions of the transverse spoiler hole 104 are to increase the turbulence in the heat dissipation air duct and improve the convection heat transfer coefficient; secondly, to further reduce the difference in air volume flowing through each heat sink 103 and improve the overall heat dissipation effect of the chassis.

[0045] See also Figure 4-5 , Figure 4 According to the embodiment of the present utility model Figure 3 The enlarged view of point A in the middle. Figure 5 According to the embodiment of the present utility model Figure 3 The top view at A in the middle is as follows: Figure 4-5 As shown, each heat dissipation fin 103 is provided with a longitudinal spoiler groove 105 in a direction perpendicular to the heat conductive mounting plate 102. The functions of the longitudinal spoiler groove 105 are, firstly, to increase the turbulence in the heat dissipation air duct and improve the convective heat transfer coefficient; secondly, to further increase the heat exchange area of ​​the heat dissipation fin 103; and thirdly, to further increase the effective heat exchange area on the heat conductive mounting plate 102.

[0046] The two thermally conductive bosses 101 located at both ends of the thermally conductive mounting plate are fixedly provided with a backplane mounting block 106 at one end edge close to the rear cover 5. The function of the backplane mounting block 106 is to install the rear cover 5 of the chassis. By controlling the processing error between the backplane mounting block 106 and the thermally conductive boss 101, the installation accuracy of the module connector and the backplane connector can be easily improved.

[0047] Please continue to see Figure 2 The air-cooled sealed chassis for 6U modules provided by the utility model is optimized on the basis of the structure of assembling the module heat conducting plate 13. The module heat conducting plate 13 is used to install the standard 6U board. The heat loss on the board is first transferred to the module heat conducting plate 13. The module heat conducting plate 13 is installed into the guide groove of the chassis through the puller 16, and then the side of the module heat conducting plate 13 is attached to the heat conducting bosses 101 corresponding to the first heat dissipation plate 1a and the second heat dissipation plate 1b through the locker 15. An auxiliary heat conducting plate 14 is provided on the side of the module heat conducting plate 13 close to the heat source, and the auxiliary heat conducting plate 14 is attached to the slot adjacent to the installation slot of the module heat conducting plate 13 through the locker 15; a thermal conductive pad 17 is attached to the middle area of ​​the auxiliary heat conducting plate 14 on the side close to the module heat conducting plate 13, and when the auxiliary heat conducting plate 14 is fixed by the locker 15, the thermal conductive pad 17 is compacted between the module heat conducting plate 13 and the auxiliary heat conducting plate 14; the main function of the thermal conductive pad 17 is to divert part of the heat loss on the module heat conducting plate 13 to the auxiliary heat conducting plate 14, reduce the heat flux density on the module heat conducting plate 13, and further reduce the temperature rise caused by conduction; the thermal conductive pad 17 needs to have a certain compression margin to offset the tolerance during processing and assembly.

[0048] In the specific implementation process, the heat-conducting boss 101 is used to fix the module heat-conducting plate 13 and the auxiliary heat-conducting plate 14, and at the same time, the heat of the module heat-conducting plate 13 and the auxiliary heat-conducting plate 14 is transferred to the heat-dissipating fin 103. The lockers 15 of the module heat-conducting plate 13 and the auxiliary heat-conducting plate 14 are both located on the right side of their corresponding heat-conducting bosses 101. The clamping force of the lockers 15 on the module heat-conducting plate 13 and the auxiliary heat-conducting plate 14 is both to the left. At the same time, the module heat-conducting plate 13 also bears the leftward pressure transmitted from the heat-conducting pad 17, which can further reduce the contact thermal resistance between the module heat-conducting plate 13 and the upper and lower heat-dissipating plate heat-conducting bosses 101, thereby reducing the temperature rise caused by the contact thermal resistance. The module heat-conducting plate 13 and the auxiliary heat-conducting plate 14 use two adjacent heat-conducting bosses 101 to transfer heat loss to the upper and lower heat-dissipating plates, that is, the first heat-dissipating plate 1a and the second heat-dissipating plate 1b, which is conducive to reducing the lateral conduction of heat loss in the upper and lower heat-dissipating plates, thereby reducing the conduction temperature rise. In addition, the above-mentioned locker 15 should be a multi-section locker with a large locking force, which is beneficial to reducing the contact thermal resistance between the module and the chassis.

[0049] Furthermore, the materials of the air-cooled sealed chassis, the first heat sink 1a and the second heat sink 1b, the module heat conduction plate 13 and the auxiliary heat conduction plate 14 are made of 6063 aluminum alloy, the left side plate 2a, the right side plate 2b, the upper cover plate 3a, the lower cover plate 3b, the front panel 4, the rear cover plate 5, and the fan mounting plate 6 are made of general rust-proof aluminum alloy, and the positioning pin bracket 8, the ear screw 9, the decorative nut 10 and the captive screw 11 are made of stainless steel.

[0050] After actual testing, the utility model provides an air-cooled closed chassis suitable for 6U modules with an enhanced overall heat dissipation capacity, which can achieve 1000W heat dissipation for a single chassis, an enhanced heat dissipation capacity for a single module, which can achieve 70W heat dissipation for a single module, and a single module with an auxiliary heat conduction plate can achieve 100W heat dissipation.

[0051] The air-cooled closed chassis suitable for 6U modules provided by the utility model has greatly improved welding processability and is not easy to deform, which indirectly improves the conduction effect of heat loss from the module to the chassis. The air duct design is more reasonable, reducing the wind resistance loss outside the heat exchange duct, increasing turbulence in the heat exchange duct, and enhancing heat exchange. Multiple fans work in parallel, which improves the reliability of the entire air-cooled closed chassis. When a single fan stops working, the design safety margin reserved for the entire chassis can also ensure the normal operation of the equipment. The module heat conduction plate and the auxiliary heat conduction plate can quickly and efficiently transfer the heat loss generated by the 6U board to the upper and lower heat sinks, which is the most effective means to reduce the temperature rise caused by conduction thermal resistance and contact thermal resistance, and is also the main temperature rise link of the entire air-cooled closed chassis. The entire chassis has good sealing properties and can provide good working environment conditions for the functional modules.

[0052] Through the description of the specific implementation methods, a deeper and more specific understanding of the technical means and effects adopted by the present invention to achieve the predetermined purpose should be obtained. However, the accompanying drawings are only for reference and illustration purposes and are not used to limit the present invention.

Claims

1. An air-cooled closed chassis suitable for 6U modules, characterized in that: include: A closed chassis for accommodating 6U modules and a fan module for dissipating heat from the chassis; A pair of oppositely disposed box walls of the box are configured as a heat dissipation plate structure; The heat dissipation plate structure comprises a heat-conducting mounting plate, a side of the heat-conducting mounting plate facing the outside of the closed cavity is provided with a plurality of heat-dissipating fins, and the heat-dissipating fins are arranged at equal intervals along the length direction of the heat-conducting mounting plate; a side of the heat-conducting mounting plate facing the inside of the closed cavity is provided with a plurality of heat-conducting bosses, and the heat-conducting bosses are arranged at equal intervals along the length direction of the heat-conducting mounting plate; two adjacent heat-conducting bosses form a guide groove; The 6U module is fixedly connected in the guide groove through a module heat conducting plate and an auxiliary heat conducting plate, and each of the 6U modules is arranged between one of the module heat conducting plates and one of the auxiliary heat conducting plates.

2. The air-cooled closed chassis suitable for 6U modules according to claim 1, characterized in that: The module heat conducting plate is installed into the guide groove by means of a puller, and the module heat conducting plate is attached to the corresponding heat conducting boss by means of a locker; the auxiliary heat conducting plate is attached to the guide groove adjacent to the guide groove where the module heat conducting plate is located by means of a locker; A heat-conducting pad is mounted on a middle area of ​​a side of the auxiliary heat-conducting plate close to the module heat-conducting plate, and the heat-conducting pad is sandwiched between the module heat-conducting plate and the auxiliary heat-conducting plate.

3. The air-cooled closed chassis suitable for 6U modules according to claim 2, characterized in that: The thermally conductive pad is provided with a compression margin.

4. The air-cooled closed chassis suitable for 6U modules according to claim 1, characterized in that: The heat sink structure comprises a cover plate, which is fixedly connected to a side of the heat sink structure close to the heat sink fins through a cover plate mounting block, and the interval between two adjacent heat sink fins and the cover plate form a heat exchange air duct; The fan module is arranged at the end of the heat exchange air duct.

5. The air-cooled closed chassis suitable for 6U modules according to claim 4, characterized in that: The heat dissipation fins are provided with transverse spoiler holes penetrating along the length direction of the heat conduction mounting plate.

6. The air-cooled closed chassis suitable for 6U modules according to claim 5, characterized in that: Each of the heat dissipation fins is provided with a longitudinal spoiler groove along a direction perpendicular to the heat conduction mounting plate.

7. The air-cooled closed chassis suitable for 6U modules according to claim 1, characterized in that: A back plate mounting block for fixedly connecting a rear cover plate is fixedly provided on one end edge of the two heat-conducting bosses located at the edge of the heat dissipation plate structure. The rear cover plate is fixedly connected to the back plate mounting block by screws to form a welding sealing structure.

8. The air-cooled closed chassis suitable for 6U modules according to claim 1, characterized in that: The fan module includes a plurality of fans, and the plurality of fans are connected in parallel.

9. The air-cooled closed chassis suitable for 6U modules according to any one of claims 1 to 8, characterized in that: The locking device is a multi-section locking device.

10. The air-cooled closed chassis suitable for 6U modules according to any one of claims 1 to 8, characterized in that: The heat sink structure, module heat conducting plate and auxiliary heat conducting plate are made of 6063 aluminum alloy.

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