Ultrasonic treatment head assembly and ultrasonic treatment instrument

Abstract

The utility model relates to the technical field of medical beauty instruments, in particular to an ultrasonic treatment head assembly and an ultrasonic treatment instrument, which comprise a shell, an ultrasonic membrane is arranged at one end of the shell, an ultrasonic transducer is arranged in the shell, and the ultrasonic transducer and the ultrasonic membrane are correspondingly arranged; and a semiconductor refrigeration device for refrigerating the liquid sound conducting medium in the shell is also arranged in the shell. According to the utility model, the semiconductor refrigerating device is used for refrigerating the liquid sound conducting medium in the shell, so that the skin comfort during treatment can be improved when the ultrasonic treatment head is in contact with the skin for treatment.

Description

Technical Field

[0001] The utility model relates to the technical field of medical beauty instruments, in particular to an ultrasonic treatment head component and an ultrasonic treatment instrument. Background Art

[0002] In recent years, the technology of non-invasive beauty treatment with focused ultrasound has been widely used. Ultrasonic therapy device is an instrument commonly used in beauty salons to implement this non-invasive beauty technology. It includes an ultrasonic therapy head assembly and a handle assembly. When in use, the operator holds the handle assembly and performs ultrasonic therapy on human skin through the ultrasonic therapy head assembly. An ultrasonic transducer is arranged inside the ultrasonic therapy head assembly. The ultrasonic transducer can emit ultrasonic waves forward. After being transmitted through the liquid sound-conducting medium, the ultrasonic waves irradiate the subcutaneous tissue of the human body, reach multiple layers such as the lower dermis, the superficial fat layer, and the SMS fascia layer, and gather on the central axis of the ultrasonic transducer to form a "thermal condensation point" with a temperature of 50-70°C, which plays a role in shrinking the aged collagen, stimulating the proliferation and reorganization of collagen, restoring the elasticity of the skin, and achieving the effect of tightening and lifting.

[0003] The existing ultrasonic treatment head assembly usually includes a treatment head shell and an ultrasonic transducer arranged in the treatment head shell. For example, the Chinese utility model patent with patent publication number CN217745387U discloses an ultrasonic treatment head, including a shell, a cover body, and an ultrasonic transducer. The shell is provided with a sound-transmitting hole, and the sound-transmitting hole is covered with a sound-transmitting membrane. The cover body is fixed to the shell body and forms a receiving cavity together with the sound-transmitting membrane. The ultrasonic transducer is arranged in the receiving cavity, and the sound-emitting unit of the ultrasonic transducer is directly opposite to the sound-transmitting hole. One of the shell or the cover body is provided with a compensation mechanism to offset the pressure change in the receiving cavity when the sound-emitting unit is working. This prior art can avoid the pressure in the receiving cavity from being concentrated on the sound-transmitting membrane and causing the sound-transmitting membrane to be damaged, thereby extending the service life of the ultrasonic treatment head. However, the ultrasonic treatment head described in the prior art cannot improve the skin comfort during treatment in contact with the skin, and the customer experience is not good.

[0004] Therefore, there is still room for improvement and development in the existing technology. Utility Model Content

[0005] In view of the problems of the prior art, the utility model provides an ultrasonic therapy head assembly and an ultrasonic therapy device, which cools the liquid sound-conducting medium in the shell through a semiconductor refrigeration device, so that the ultrasonic therapy head can improve the skin comfort during treatment when in contact with the skin.

[0006] In order to achieve the above purpose, the technical solution applied by the utility model is as follows:

[0007] An ultrasonic therapy head assembly comprises a shell, one end of which is provided with an ultrasonic membrane, an ultrasonic transducer is arranged inside the shell, and the ultrasonic transducer is arranged corresponding to the ultrasonic membrane; the shell is also provided with a semiconductor refrigeration device for cooling a liquid sound-conducting medium in the shell.

[0008] According to the above solution, the semiconductor refrigeration device includes a lower heat sink, a semiconductor refrigeration fin and an upper heat sink, and the semiconductor refrigeration fin is fixed between the lower heat sink and the upper heat sink.

[0009] According to the above solution, the shell is provided with heat dissipation holes which are arranged in cooperation with the semiconductor refrigeration device.

[0010] According to the above scheme, the shell includes an outer shell, an inner shell, an inner cover and a back cover, the first end of the outer shell is provided with a sound-permeable hole, the ultrasonic membrane is fixed in the sound-permeable hole, the second end of the outer shell is fixedly connected to the back cover, and a first accommodating chamber is formed between the ultrasonic membrane, the outer shell and the back cover; the inner shell and the inner cover are located in the first accommodating chamber, the inner shell and the inner cover are fixedly connected, a second accommodating chamber is formed between the inner shell and the inner cover, the second accommodating chamber is not connected to the first accommodating chamber, the ultrasonic transducer is located in the second accommodating chamber, the semiconductor refrigeration device is installed on the inner shell, and the heat dissipation hole is provided on the outer shell.

[0011] According to the above solution, the outer shell is sleeved on the outside of the inner shell, the first end of the inner shell abuts against the ultrasonic membrane, the inner cover is fixedly connected to the back cover, and a seal is provided between the inner cover and the back cover.

[0012] According to the above solution, a sealing ring is provided between the lower heat sink and the inner shell of the semiconductor refrigeration device.

[0013] According to the above solution, a conductive sheet is fixed on the back cover, and the conductive sheet is electrically connected to the semiconductor refrigeration sheet of the semiconductor refrigeration device.

[0014] An ultrasonic therapeutic apparatus comprises an ultrasonic therapeutic handle assembly and the ultrasonic therapeutic head assembly. The ultrasonic therapeutic head assembly is detachably mounted on the ultrasonic therapeutic handle assembly via a quick-release assembly.

[0015] According to the above solution, the quick-release assembly includes a buckle provided on the ultrasonic treatment head assembly and a slot provided on the ultrasonic treatment handle assembly, and the buckle is connected to the slot in a locking position.

[0016] According to the above solution, a control button for controlling the extension and retraction of the buckle is provided on the ultrasonic treatment head assembly.

[0017] Beneficial effects of the utility model:

[0018] The utility model is arranged in this way, and the liquid sound-conducting medium in the shell is cooled by the semiconductor refrigeration device, so that the ultrasonic treatment head can improve the skin comfort during the treatment when in contact with the skin. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the ultrasonic treatment head assembly of the utility model;

[0020] Figure 2 This is an exploded view of the ultrasonic treatment head assembly of the utility model;

[0021] Figure 3 The utility model is a schematic diagram of an ultrasonic therapeutic apparatus.

[0022] In the figure:

[0023] 30. Ultrasonic membrane; 31. Outer shell; 32. Inner shell; 33. Ultrasonic transducer; 34. Inner cover; 35. Buckle; 36. Outer cover; 37. Conductive sheet; 38. Control button; 40. Sealing ring; 41. Lower heat sink; 42. Semiconductor cooling sheet; 43. Upper heat sink; 44. Heat dissipation hole; 50. Ultrasonic treatment handle assembly. DETAILED DESCRIPTION

[0024] The technical solution of the utility model is described below in conjunction with the accompanying drawings and embodiments.

[0025] like Figure 1 and Figure 2 As shown, the ultrasonic treatment head assembly described in the utility model includes a shell, an ultrasonic membrane 30 is provided at one end of the shell, an ultrasonic transducer 33 is provided in the shell, and the ultrasonic transducer 33 is arranged corresponding to the ultrasonic membrane 30; the shell is also provided with a semiconductor refrigeration device for cooling the liquid sound-conducting medium in the shell. In this way, the liquid sound-conducting medium in the shell is cooled by the semiconductor refrigeration device, so that the ultrasonic treatment head can improve the skin comfort during treatment when it is in contact with the skin. More specifically, when the ultrasonic treatment head is working, the ultrasonic membrane 30 is in contact with the skin, and the ultrasonic wave generated by the ultrasonic transducer 33 passes through the ultrasonic membrane 30 to act on the subcutaneous tissue of the skin, and the low-temperature liquid sound-conducting medium formed by the semiconductor refrigeration device is transmitted to the surface of the skin through the ultrasonic membrane 30, so that the skin comfort during treatment is better and the customer experience is better.

[0026] It should be noted that the ultrasonic transducer 33 and the semiconductor refrigeration device can work simultaneously or separately.

[0027] In this embodiment, the semiconductor refrigeration device includes a lower heat sink 41, a semiconductor refrigeration fin 42 and an upper heat sink 43, and the semiconductor refrigeration fin 42 is fixed between the lower heat sink 41 and the upper heat sink 43. In this arrangement, the liquid sound-conducting medium in the shell is cooled by the cooperation of the lower heat sink 41, the semiconductor refrigeration fin 42 and the upper heat sink 43, and the cooling effect is good.

[0028] In this embodiment, the housing is provided with heat dissipation holes 44 which are arranged in cooperation with the semiconductor refrigeration device. This arrangement has a better heat dissipation effect and further improves the refrigeration efficiency.

[0029] In this embodiment, the shell includes an outer shell 31, an inner shell 32, an inner cover 34 and a back cover 36. The first end of the outer shell 31 is provided with a sound-transmitting hole, and the ultrasonic membrane 30 is fixed in the sound-transmitting hole. The second end of the outer shell 31 is fixedly connected to the back cover 36, and a first accommodating chamber is formed between the ultrasonic membrane 30, the outer shell 31 and the back cover 36; the inner shell 32 and the inner cover 34 are located in the first accommodating chamber, and the inner shell 32 and the inner cover 34 are fixedly connected. A second accommodating chamber is formed between the inner shell 32 and the inner cover 34, and the second accommodating chamber is not connected to the first accommodating chamber; the ultrasonic transducer 33 is located in the second accommodating chamber, the semiconductor refrigeration device is installed on the inner shell 32, and the heat dissipation hole 44 is provided on the outer shell 31. Such a configuration is convenient for assembly. It should be noted that the ultrasonic wave generated by the ultrasonic transducer 33 acts on the ultrasonic membrane 30 through the second accommodating chamber, and the low-temperature liquid sound-conducting medium formed by the semiconductor refrigeration device acts on the ultrasonic membrane 30 through the first accommodating chamber, and they do not interfere with each other.

[0030] In this embodiment, the outer shell 31 is sleeved on the outer portion of the inner shell 32, the first end of the inner shell 32 abuts against the ultrasonic membrane 30, the inner cover 34 is fixedly connected to the rear cover 36, and a sealing member is provided between the inner cover 34 and the rear cover 36. This arrangement achieves the purpose of not communicating between the first accommodating chamber and the second accommodating chamber.

[0031] In this embodiment, a sealing ring 40 is provided between the lower heat sink 41 of the semiconductor refrigeration device and the inner shell 32. This arrangement further ensures that the first accommodating chamber and the second accommodating chamber are not connected.

[0032] In this embodiment, a conductive sheet 37 is fixed on the rear cover 36, and the conductive sheet 37 is electrically connected to the semiconductor refrigeration sheet 42 of the semiconductor refrigeration device. In this way, when the ultrasonic treatment head and the ultrasonic treatment handle are assembled, the circuit is conducted through the conductive sheet 37.

[0033] like Figure 3 As shown, an ultrasonic therapeutic apparatus comprises an ultrasonic therapeutic handle assembly 50 and the ultrasonic therapeutic head assembly described above, and the ultrasonic therapeutic head assembly is detachably mounted on the ultrasonic therapeutic handle assembly 50 through a quick-release assembly. It should be noted that the ultrasonic therapeutic handle assembly 50 is provided with a power terminal that cooperates with the conductive sheet 37 to conduct a circuit. When the ultrasonic therapeutic head assembly is assembled on the ultrasonic therapeutic handle assembly 50, the power terminal and the conductive sheet 37 conduct the circuit. When the ultrasonic therapeutic head assembly is separated from the ultrasonic therapeutic handle assembly 50, the circuit is disconnected.

[0034] In this embodiment, the quick-install assembly includes a buckle 35 provided on the ultrasonic treatment head assembly and a slot provided on the ultrasonic treatment handle assembly 50, and the buckle 35 is connected to the slot in a locking manner. This arrangement makes it easy to assemble and disassemble.

[0035] In this embodiment, the ultrasonic treatment head assembly is provided with a control button 38 for controlling the extension and retraction of the buckle 35. This arrangement is convenient for operation.

[0036] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which belong to the protection scope of the present invention.

Claims

1. An ultrasonic treatment head assembly, comprising a housing, characterized in that: An ultrasonic membrane is provided at one end of the shell, an ultrasonic transducer is provided inside the shell, and the ultrasonic transducer is arranged corresponding to the ultrasonic membrane; The shell is also provided with a semiconductor refrigeration device for cooling the liquid sound-conducting medium in the shell.

2. The ultrasonic treatment head assembly according to claim 1, characterized in that: The semiconductor refrigeration device comprises a lower heat sink, a semiconductor refrigeration fin and an upper heat sink, wherein the semiconductor refrigeration fin is fixed between the lower heat sink and the upper heat sink.

3. An ultrasonic treatment head assembly according to claim 2, characterized in that: The shell is provided with heat dissipation holes which are matched with the semiconductor refrigeration device.

4. The ultrasonic treatment head assembly according to claim 3, characterized in that: The shell includes an outer shell, an inner shell, an inner cover and a back cover. The first end of the outer shell is provided with a sound-permeable hole, the ultrasonic membrane is fixed in the sound-permeable hole, the second end of the outer shell is fixedly connected to the back cover, and a first accommodating chamber is formed between the ultrasonic membrane, the outer shell and the back cover; the inner shell and the inner cover are located in the first accommodating chamber, the inner shell and the inner cover are fixedly connected, and a second accommodating chamber is formed between the inner shell and the inner cover, and the second accommodating chamber is not connected to the first accommodating chamber; the ultrasonic transducer is located in the second accommodating chamber, the semiconductor refrigeration device is installed on the inner shell, and the heat dissipation hole is provided on the outer shell.

5. The ultrasonic treatment head assembly according to claim 4, characterized in that: The outer shell is sleeved on the outside of the inner shell, the first end of the inner shell is in contact with the ultrasonic membrane, the inner cover is fixedly connected to the back cover, and a sealing member is provided between the inner cover and the back cover.

6. The ultrasonic treatment head assembly according to claim 4, characterized in that: A sealing ring is arranged between the lower heat sink and the inner shell of the semiconductor refrigeration device.

7. The ultrasonic treatment head assembly according to claim 4, characterized in that: A conductive sheet is fixed on the rear cover, and the conductive sheet is electrically connected to the semiconductor refrigeration sheet of the semiconductor refrigeration device.

8. An ultrasonic therapeutic apparatus, characterized in that: It comprises an ultrasonic treatment handle assembly and an ultrasonic treatment head assembly as claimed in any one of claims 1 to 7, wherein the ultrasonic treatment head assembly is detachably mounted on the ultrasonic treatment handle assembly via a quick-release assembly.

9. An ultrasonic therapeutic apparatus according to claim 8, characterized in that: The quick-release assembly comprises a buckle arranged on the ultrasonic treatment head assembly and a slot arranged on the ultrasonic treatment handle assembly, and the buckle is connected to the slot in a locking position.

10. An ultrasonic therapeutic apparatus according to claim 9, characterized in that: The ultrasonic treatment head assembly is provided with a control button for controlling the extension and retraction of the buckle.

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