Reflow soldering device with soldering paste filling function

Abstract

The utility model relates to the technical field of electric welding equipment, and discloses a reflow soldering device with a soldering paste filling function, which comprises a handle, a connecting frame is arranged at the top of the handle, a soldering device body is arranged at the top of the connecting frame, and a feeding box is arranged at the top of the soldering device body. A feeding mechanism is arranged in the feeding box, and a conveying mechanism is arranged at the top of the connecting frame. The feeding mechanism comprises two mounting sleeves, the two mounting sleeves are fixedly connected to the two sides of the inner wall of the feeding box correspondingly, and rotating rods are arranged in the mounting sleeves. According to the reflow soldering device with the soldering paste filling function, rotation of a rotating rod can be effectively controlled by arranging a rotating disc and a rotating handle, so that rotation operation can be conducted on the rotating rod from the outside, and the rotating rod drives a conveying roller to rotate to be matched with a limiting conveying plate so that soldering paste can be conveyed into the soldering device body; and filling operation is carried out.

Description

Technical Field

[0001] The utility model relates to the technical field of electric welding equipment, in particular to a reflow soldering device with a solder paste filling function. Background Art

[0002] When welding electronic components, a solder paste with a certain viscosity and good thixotropy, which is a mixture of alloy solder powder, paste flux and some additives, is applied to the welding points to temporarily stick the electronic components. At the same time, as the welding is heated, it gradually melts and connects the electronic components to the welding plane into an integral structure.

[0003] According to the Chinese patent "A reflow soldering device with solder paste filling function", and the publication number is: "CN217667007U", the reflow soldering device is intended to solve the technical problem that when the amount of solder paste is insufficient in the current welding operation, it cannot be quickly replenished, resulting in a decrease in the strength of the weld structure and easy disconnection of electronic components. The reflow soldering device includes a welding machine, a slide groove opened on the left and right sides of the welding machine, a movable seat installed on the inner side of the slide groove, and a solder paste chamber arranged on the outer side of the movable seat. The reflow soldering device adopts a solder paste filling device that can be installed on the welding machine, and an electrically controlled solder paste extrusion mode. When the operator holds the welding machine, the other hand can operate the solder paste with one hand, and there is no need to put down the welding machine, which is more convenient to use. The solder paste on the welding plane can be replenished at any time during the welding operation to avoid interruptions in the welding operation, resulting in a decrease in the strength of the weld structure and affecting the performance of electronic components.

[0004] However, in actual use, this patent requires real-time manual operation of solder paste filling according to actual needs to ensure that there is no accumulation and blockage caused by excessive solder paste inside the device. This situation can be effectively avoided by setting a conveying roller. Therefore, we need a reflow soldering device with solder paste filling function. Utility Model Content

[0005] 1. Technical issues to be solved

[0006] In view of the deficiencies of the prior art, the utility model provides a reflow soldering device with a solder paste filling function.

[0007] (II) Technical solution

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a reflow soldering device with a solder paste filling function, comprising a handle, a connecting frame is arranged on the top of the handle, a soldering device body is arranged on the top of the connecting frame, a feed box is arranged on the top of the soldering device body, a feed mechanism is arranged inside the feed box, and a conveying mechanism is arranged on the top of the connecting frame;

[0009] The feeding mechanism comprises: a mounting sleeve, wherein two mounting sleeves are provided and fixedly connected to two sides of the inner wall of the feeding box respectively, and a rotating rod is arranged inside the mounting sleeve.

[0010] Preferably, one end of the rotating rod is rotatably connected to the inside of the right installation sleeve, and the other end is movable through the left side of the left installation sleeve and the feed box in turn and extends outward to be fixedly connected to a rotating disk, and a rotating handle is fixedly connected to the left side of the rotating disk. By setting the rotating disk and the rotating handle, the rotating rod can be effectively controlled to rotate, so that the rotating rod can be rotated from the outside.

[0011] Preferably, the outer wall of the rotating rod is fixedly sleeved with a conveying roller, and the outer wall of the conveying roller is respectively fixedly connected with six limiting conveying plates. By arranging the conveying roller and the limiting conveying plate to cooperate with each other, the solder paste can be conveyed into the interior of the soldering device body for filling operation.

[0012] Preferably, a sealing cover is provided on the top of the feed box through a sealing ring sleeve. The sealing cover can effectively prevent the solder paste from splashing outside the device due to the rotation of the conveying roller during the filling work.

[0013] Preferably, the conveying mechanism comprises: a solder paste storage box, the solder paste storage box is fixedly connected to the top of the connecting frame, a connecting sleeve is fixedly penetrated through the top of the connecting frame, a sealing rubber plug is inserted inside the connecting sleeve, and a conveying pipe is fixedly penetrated through the top of the sealing rubber plug. By setting up the solder paste storage box, the solder paste can be effectively stored, and its sealing rubber plug can effectively prevent the sealing structure of the solder paste during storage, so that it is not easy to volatilize.

[0014] Preferably, the output end of the delivery pipe is connected to the inside of the feed box through a fixed sleeve, the input end of the delivery pipe extends downward through an air pump and is connected to the inside of the solder paste storage box, and the outer wall of the delivery pipe is sleeved with a plurality of protective rings. By arranging the delivery pipe and the air pump to cooperate with each other, the solder paste stored in the solder paste storage box can be effectively delivered to the feed box for filling.

[0015] (III) Beneficial effects

[0016] Compared with the prior art, the utility model provides a reflow soldering device with solder paste filling function, which has the following beneficial effects:

[0017] 1. This reflow soldering device with solder paste filling function can effectively control the rotation of the rotating rod by setting a turntable and a turn handle, so that the rotating rod can be rotated from the outside, and the rotating rod drives the conveying roller to rotate and cooperates with the limiting conveying plate to convey the solder paste into the interior of the soldering device body for filling operation.

[0018] 2. This reflow soldering device with solder paste filling function can effectively store solder paste by setting up a solder paste storage box, and its sealing rubber plug can effectively prevent the solder paste from being sealed during storage, making it less likely to volatilize. The cooperation between the delivery pipe and the air pump can effectively deliver the solder paste stored in the solder paste storage box to the feed box for filling. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0020] Figure 1 It is a front perspective view of the utility model;

[0021] Figure 2 It is a rear perspective view of the utility model;

[0022] Figure 3 It is a front sectional stereogram of the present utility model.

[0023] In the figure: 1. handle; 2. connecting frame; 3. welding device body; 4. feed box; 5. feed mechanism; 6. conveying mechanism; 501. installation sleeve; 502. rotating rod; 503. turntable; 504. turning handle; 505. conveying roller; 506. limiting conveying plate; 507. sealing cover; 601. solder paste storage box; 602. connecting sleeve; 603. sealing rubber plug; 604. conveying tube; 605. protective ring. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0025] Example 1

[0026] like Figure 1-3As shown, the utility model provides a reflow soldering device with solder paste filling function, including a handle 1, a connecting frame 2 is arranged on the top of the handle 1, a soldering device body 3 is arranged on the top of the soldering device body 3, a feed box 4 is arranged on the top of the soldering device body 3, a feed mechanism 5 is arranged inside the feed box 4, and a conveying mechanism 6 is arranged on the top of the connecting frame 2; the feed mechanism 5 includes: a mounting sleeve 501, two mounting sleeves 501, which are respectively fixedly connected to the two sides of the inner wall of the feed box 4, and a rotating rod 502 is arranged inside the mounting sleeve 501. One end of the rotating rod 502 is rotatably connected to the inside of the right mounting sleeve 501, and the other end is movable through the left side of the left mounting sleeve 501 and the feed box 4 in turn and extends outward and is fixedly connected to a rotating disk 503, and a rotating handle 504 is fixedly connected to the left side of the rotating disk 503. By setting the rotating disk 503 and the rotating handle 504, the rotating rod 502 can be effectively controlled to rotate, so that the rotating rod 502 can be rotated from the outside. The outer wall of the rotating rod 502 is fixedly sleeved with a conveying roller 505, and the outer wall of the conveying roller 505 is respectively fixedly connected with six limiting conveying plates 506. By setting the conveying roller 505 and the limiting conveying plate 506 to cooperate with each other, the solder paste can be conveyed into the interior of the welding device body 3 for filling operation. The top of the feed box 4 is provided with a sealing cover 507 through a sealing ring sleeve. The sealing cover 507 can effectively prevent the solder paste from splashing to the outside of the device due to the rotation of the conveying roller 505 during the filling operation.

[0027] In this embodiment, the rotation of the rotating rod 502 can be effectively controlled by setting the turntable 503 and the turn handle 504, so that the rotating rod 502 can be rotated from the outside. The rotating rod 502 drives the conveying roller 505 to rotate and cooperates with the limiting conveying plate 506 to convey the solder paste into the interior of the welding device body 3 for filling operation.

[0028] Example 2

[0029] like Figure 1-3As shown, on the basis of Example 1, the utility model provides a technical solution: preferably, the conveying mechanism 6 includes: a solder paste storage box 601, the solder paste storage box 601 is fixedly connected to the top of the connecting frame 2, the top of the connecting frame 2 is fixedly penetrated by a connecting sleeve 602, the interior of the connecting sleeve 602 is plugged with a sealing rubber plug 603, and the top of the sealing rubber plug 603 is fixedly penetrated by a conveying pipe 604. By setting the solder paste storage box 601, the solder paste can be effectively stored, and its sealing rubber plug 603 can effectively prevent the sealing structure of the solder paste during storage, so that it is not easy to volatilize. The output end of the conveying pipe 604 is connected to the inside of the feed box 4 through a fixed sleeve, and the input end of the conveying pipe 604 extends downward through the air pump and is connected to the inside of the solder paste storage box 601, and the outer wall of the conveying pipe 604 is provided with a plurality of protective rings 605. By setting the mutual cooperation between the conveying pipe 604 and the air pump, the solder paste stored in the solder paste storage box 601 can be effectively conveyed to the feed box 4 for filling.

[0030] In this embodiment, the solder paste can be effectively stored by setting up a solder paste storage box 601, and its sealing plug 603 can effectively prevent the solder paste from being sealed during storage, making it less likely to volatilize, and the cooperation between the delivery pipe 604 and the air pump can effectively deliver the solder paste stored in the solder paste storage box 601 to the feed box 4 for filling.

[0031] The working principle of the reflow soldering device with solder paste filling function is described in detail below.

[0032] like Figure 1-3 As shown, when in use, the air pump can be turned on through the control panel first to convey the solder paste to the feed box 4 through the conveying tube 604, and then the turntable 503 and the handle 504 can be rotated to effectively control the rotation of the rotating rod 502, so that the rotating rod 502 can be rotated from the outside, and the rotating rod 502 drives the conveying roller 505 to rotate and cooperate with the limiting conveying plate 506 to convey the solder paste into the interior of the welding device body 3 for filling operation.

Claims

1. A reflow soldering device with solder paste filling function, comprising a handle (1), characterized in that: A connecting frame (2) is arranged on the top of the handle (1), a welding device body (3) is arranged on the top of the connecting frame (2), a feeding box (4) is arranged on the top of the welding device body (3), a feeding mechanism (5) is arranged inside the feeding box (4), and a conveying mechanism (6) is arranged on the top of the connecting frame (2); The feeding mechanism (5) comprises: a mounting sleeve (501), wherein there are two mounting sleeves (501) which are respectively fixedly connected to the two sides of the inner wall of the feeding box (4); a rotating rod (502) is arranged inside the mounting sleeve (501); one end of the rotating rod (502) is rotatably connected to the inside of the mounting sleeve (501) on the right side, and the other end of the rotating rod (502) is movable through the left side of the mounting sleeve (501) on the left side and the feeding box (4) and extends outwardly and is fixedly connected to a rotating disk (503); the left side of the rotating disk (503) is fixedly connected to a rotating handle (504); the outer wall of the rotating rod (502) is fixedly sleeved with a conveying roller (505), and the outer wall of the conveying roller (505) is respectively fixedly connected to six limiting conveying plates (506).

2. A reflow soldering device with solder paste filling function according to claim 1, characterized in that: A sealing cover (507) is provided on the top of the feed box (4) via a sealing ring sleeve.

3. The reflow soldering device with solder paste filling function according to claim 1, characterized in that: The conveying mechanism (6) comprises: a solder paste storage box (601), the solder paste storage box (601) is fixedly connected to the top of the connecting frame (2), a connecting sleeve (602) is fixedly penetrated through the top of the connecting frame (2), a sealing plug (603) is inserted into the interior of the connecting sleeve (602), and a conveying tube (604) is fixedly penetrated through the top of the sealing plug (603).

4. The reflow soldering device with solder paste filling function according to claim 3, characterized in that: The output end of the delivery pipe (604) is connected to the interior of the feed box (4) through a fixed sleeve, and the input end of the delivery pipe (604) extends downward through an air pump and is connected to the interior of the solder paste storage box (601). The outer wall of the delivery pipe (604) is provided with a plurality of protective rings (605).

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