Welding tool for power module substrate
By setting a movable carrier on the heating surface of the welding tool, the problem of uneven heating caused by the curvature of the substrate is solved, a more uniform heating effect is achieved, and the welding quality is improved.
Patent Information
- Application Number
- CN202420338344.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-22
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-02-22
AI Technical Summary
During the welding process of the power module substrate, the heating is uneven due to the curvature of the substrate, which affects the welding quality.
A welding tool is designed, by providing a plurality of movable carriers on the heating surface, so that the bearing surface can be adjusted according to the curvature of the substrate, thereby achieving more uniform heating.
Through this welding tool, substrates with different curvatures can be better adapted to achieve uniform heating of the substrate during the heating process and improve welding quality.
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Figure CN222492695U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of welding, in particular to a welding tool for a power module substrate. Background Art
[0002] In the manufacturing process of power modules, the current mainstream packaging process adopts a two-step welding method, namely liner welding and substrate welding. However, since the substrate has a certain curvature and is not a horizontal flat plate, this leads to a problem when welding the substrate. Specifically, when the substrate is placed on the welding tray, since the surface of the tray is a horizontal plane, the two ends of the substrate will bend upward due to the curvature, resulting in no direct contact between the two ends of the substrate and the welding tray.
[0003] During the soldering process, the center of the substrate is in direct contact with the heating plate, so the temperature rises fastest and the solder melts first. The temperature rise at both ends of the substrate is delayed, and the solder melting is also delayed accordingly. This results in a more sufficient heating time for the solder under the center liner.
[0004] CN110919124A discloses a mold for welding an IGBT module, the mold comprising a heating plate, the upper surface of which is provided with a heat-conducting block, the thermal conductivity of which is smaller than the thermal conductivity of the heating plate. The above technical solution allows the lower surface of the copper bottom plate to be heated uniformly as a whole, but it is not universal for substrates with different curvatures.
[0005] Therefore, how to achieve uniform heating and welding for substrates with different curvatures remains a problem that needs to be solved. Utility Model Content
[0006] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the utility model is to provide a welding tool. According to the welding tool of the utility model, by arranging a plurality of bearing members on the heating surface, at least one bearing member can move on the heating surface, so that the bearing surface can be adjusted according to the curvature of the substrate, so as to better adapt to substrates with different curvatures and achieve a more uniform heating effect.
[0007] The welding tool according to the utility model is used for a power module substrate, and the welding tool comprises: a tray, a heating surface is formed on the tray, and the heating surface is suitable for heating the substrate; a carrier, the carrier is arranged on the heating surface, one end of the carrier is connected to the tray, the carrier is constructed in multiple parts and the other ends of the multiple carriers jointly form a carrying surface, and the carrying surface is suitable for carrying the substrate; wherein at least one of the carriers can be movably arranged on the tray so that the carrying surface is adapted to the substrate.
[0008] According to the welding fixture of the utility model, the tray has a heating surface that can generate heat. When the substrate is placed on the heating surface, the heating surface can heat the substrate, thereby implementing the welding process. By setting a carrier, the carrier is constructed in multiple structures and is arranged on the heating surface. One end of the carrier is connected to the tray, and the other ends of the multiple carriers jointly form a bearing surface. The substrate can be placed on the bearing surface. The multiple carriers jointly support the substrate, and the carriers can conduct the heat generated by the heating of the tray to the substrate, thereby achieving heating of the substrate. By movably setting at least one carrier on the tray, the bearing surface can be adjusted according to the curvature of the substrate, thereby better adapting to substrates with different curvatures. The substrate can fully contact with multiple carriers during the heating process, thereby achieving uniform heating of the substrate and improving product quality.
[0009] According to some embodiments of the present invention, at least one of the supporting members can move or telescopically deform in the extension direction.
[0010] According to some embodiments of the present invention, the carrier further includes: an elastic member, wherein the elastic member is disposed between at least one of the carriers and the tray.
[0011] According to some embodiments of the present invention, the lengths of the plurality of supporting members are equal and the elastic member is disposed between each of the supporting members and the tray.
[0012] According to some embodiments of the utility model, the heating surface is divided into a first heating zone and a second heating zone, and the second heating zone surrounds the first heating zone; the multiple carriers are divided into a first carrier and a second carrier, the first carrier is arranged in the first heating zone, and the second carrier is arranged in the second heating zone, and the thermal resistance of the first carrier is greater than the thermal resistance of the second carrier.
[0013] According to some embodiments of the present invention, at least one of the carriers is detachably connected to the tray.
[0014] According to some embodiments of the present invention, the tray is formed with a receiving groove on the heating surface, and the elastic member is received in the receiving groove.
[0015] According to some embodiments of the present invention, a plurality of the carriers are arranged in multiple rows and columns on the heating surface.
[0016] According to some embodiments of the present invention, the number of the carriers in a row is n1, the number of the carriers in a column is n2, and the following condition is satisfied: 2≤n1 / n2≤6.
[0017] According to some embodiments of the present invention, the other end surface of the carrier is configured as an arc-shaped surface protruding away from the tray.
[0018] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:
[0020] Figure 1 It is a front view schematic diagram of a welding tool according to an embodiment of the utility model;
[0021] Figure 2 It is a front view schematic diagram of a substrate placed on a welding tool according to an embodiment of the utility model;
[0022] Figure 3 It is a schematic top view of a welding tool according to an embodiment of the utility model.
[0023] Reference numerals:
[0024] Welding tool 1;
[0025] Tray 11, heating surface 11a, receiving groove 11b;
[0026] Carrying member 12;
[0027] Elastic member 13;
[0028] Substrate 2. DETAILED DESCRIPTION
[0029] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.
[0030] In the related art, how to achieve uniform heating and welding for substrates with different curvatures is still a problem that needs to be solved.
[0031] Reference below Figure 1-Figure 3 A welding tool 1 according to an embodiment of the present invention is described.
[0032] like Figure 1-Figure 3As shown, the welding tool 1 according to the utility model is used for the power module substrate, and the welding tool 1 includes a tray 11 and a carrier 12. A heating surface 11a is formed on the tray 11, and the heating surface 11a is suitable for heating the substrate 2; the carrier 12 is arranged on the heating surface 11a, one end of the carrier 12 is connected to the tray 11, and the carrier 12 is constructed in multiple and the other ends of the multiple carriers 12 jointly form a carrying surface, and the carrying surface is suitable for carrying the substrate 2; wherein at least one carrier 12 can be movably arranged on the tray 11 so that the carrying surface is adapted to the substrate 2.
[0033] In the welding tool 1 of the present application, the tray 11 has a heating surface 11a that can generate heat. When the substrate 2 is placed on the heating surface 11a, the heating surface 11a can heat the substrate 2, thereby implementing the welding process. By setting a carrier 12, the carrier 12 is constructed in multiples and is arranged on the heating surface 11a. One end of the carrier 12 is connected to the tray 11, and the other ends of the multiple carriers 12 jointly form a bearing surface. The substrate 2 can be placed on the bearing surface, and the multiple carriers 12 jointly support the substrate 2, and the carrier 12 can conduct the heat generated by the heating of the tray 11 to the substrate 2, thereby achieving heating of the substrate 2. By movably setting at least one carrier 12 on the tray 11, the bearing surface can be adjusted according to the curvature of the substrate 2, so as to better adapt to substrates 2 with different curvatures. The substrate 2 can fully contact with multiple carriers 12 during the heating process, achieving a more uniform heating effect and improving product quality.
[0034] Therefore, the welding tool 1 of the present application, by arranging a plurality of bearing members 12 on the heating surface 11a, at least one bearing member 12 can move on the heating surface 11a, so that the bearing surface can be adjusted according to the curvature of the substrate 2, thereby better adapting to substrates 2 with different curvatures and achieving a more uniform heating effect.
[0035] According to some embodiments of the utility model, at least one carrier 12 can move or telescopically deform in the extension direction. Movement refers to the change in the position of the carrier 12 in the extension direction, and telescopic deformation refers to the change in shape of the carrier 12 caused by elongation or shortening. When the carrier 12 moves or telescopically deforms in the extension direction, the bearing surface will be adjusted to adapt to the substrate 2. Specifically, when the substrate 2 is placed on the bearing surface, the movable carrier 12 will move or shorten toward the tray 11 under the pressure of the substrate 2, and adjust the shape of the bearing surface to adapt to the curvature of the substrate 2, so that multiple carriers 12 can maintain close contact with the substrate 2, and heat can be evenly transferred to various parts of the substrate 2; after the substrate 2 is removed from the bearing surface, the movable carrier 12 can move or shorten away from the tray 11 to restore the original position or shape.
[0036] According to some embodiments of the present invention, Figure 1As shown, the carrier also includes an elastic member 13, and the elastic member 13 is arranged between at least one carrier 12 and the tray 11. By arranging the elastic member 13 between at least one carrier 12 and the tray 11, the carrier 12 can move in the extension direction through the elastic deformation of the elastic member 13, and adjust the shape of the bearing surface to adapt to the substrate 2. Specifically, when the substrate 2 is placed on the bearing surface, due to the gravity of the substrate 2, the carrier 12 will be subjected to pressure and transfer the pressure to the elastic member 13, and the elastic member 13 will shrink under the pressure, so that the carrier 12 can move in the extension direction, thereby adjusting the shape of the bearing surface to adapt to the substrate 2. When the carrier 12 is under pressure, the carrier 12 moves under the action of the elastic member 13, and when the substrate 2 is removed, the carrier 12 can be restored to the original position by the resilience of the elastic member 13, and the operation is simple. In addition, the elastic member 13 can also play a buffering role, so that the substrate 2 can be placed more stably during the heating process.
[0037] According to some embodiments of the present invention, Figure 1 As shown, the lengths of the plurality of carriers 12 are equal and the elastic member 13 is disposed between each carrier 12 and the tray 11. By disposing the elastic member 13 between each carrier 12 and the tray 11, when the substrate 2 is placed on the carrying surface, the carriers 12 in contact with the substrate 2 can all move, and the shape of the carrying surface can be fully adjusted, and the carrying surface can better adapt to the curvature of the substrate 2. Moreover, since the lengths of the plurality of carriers 12 are equal, when the plurality of carriers 12 are in the initial position, the carrying surface is a plane. After the substrate 2 is placed on the carrying surface, the carrier 12 can move accordingly according to the curvature of the substrate 2, and the carrying surface changes from a plane to a curved surface adapted to the curvature of the substrate 2, so that the carrying surface can better adapt to the substrate 2, and the substrate 2 can be heated stably and evenly.
[0038] According to some embodiments of the utility model, the heating surface 11a is divided into a first heating zone and a second heating zone, and the second heating zone surrounds the first heating zone; the plurality of carriers 12 are divided into a first carrier 12 and a second carrier 12, and the first carrier 12 is arranged in the first heating zone, and the second carrier 12 is arranged in the second heating zone, and the thermal resistance of the first carrier 12 is greater than the thermal resistance of the second carrier 12. Since the second heating zone surrounds the first heating zone, when the substrate 2 is placed on the carrying surface, the first carrier 12 on the first heating zone supports the central area of the substrate 2, and the second carrier 12 on the second heating zone supports the edge area of the substrate 2, and the distance that the first carrier 12 moves toward the tray 11 is shorter than the distance that the second carrier 12 moves toward the tray 11. Since the carrier 12 conducts the heat generated by the heat of the tray 11 to the substrate 2, the heat transfer path on the first heating zone is shorter than the heat transfer path on the second heating zone. Since the thermal resistances of the first carrier 12 and the second carrier 12 are different, the heat conduction performance of the first carrier 12 and the second carrier 12 is also different. The thermal resistance of the first carrier 12 is greater than that of the second carrier 12, which means that the first carrier 12 has a lower thermal conductivity than the second carrier 12, and the heat transfer path on the first heating zone is shorter than the heat transfer path on the second heating zone, so that the substrate 2 can be heated uniformly. Specifically, the materials of the first carrier 12 and the second carrier 12 can be different. The first carrier 12 can use a low thermal conductivity material to reduce the heat conduction efficiency; and the second carrier 12 can use a high thermal conductivity material to improve the heat conduction efficiency.
[0039] According to some embodiments of the utility model, at least one carrier 12 is detachably connected to the tray 11. By detachably connecting the carrier 12 to the tray 11, the carrier 12 can be easily replaced, and carriers 12 of different materials or sizes can be selected according to actual needs to adapt to substrates 2 of different shapes or sizes, thereby improving the flexibility of the welding tool 1. In addition, the detachable connection between the carrier 12 and the tray 11 also helps to improve the maintainability of the welding tool 1.
[0040] According to some embodiments of the present invention, Figure 1 As shown, the tray 11 is formed with a receiving groove 11b on the heating surface 11a, and the elastic member 13 is received in the receiving groove 11b. By providing the receiving groove 11b on the tray 11, the receiving groove 11b can provide an installation space for the elastic member 13, thereby facilitating the installation of the elastic member 13. By receiving the elastic member 13 in the receiving groove 11b, when the carrier 12 supports the substrate 2, the elastic member 13 is not easily displaced or falls off, thereby improving the stability and reliability of the welding tool 1.
[0041] According to some embodiments of the present invention, Figure 3As shown, a plurality of carriers 12 are arranged in multiple rows and columns on the heating surface 11a. By arranging the plurality of carriers 12 in multiple rows and columns, the support surface can be more adapted to the shape and size of the substrate 2. During the heating process, each carrier 12 can apply appropriate pressure to the corresponding part of the substrate 2, thereby achieving uniform heat conduction, which helps to improve the uniformity and stability of heating the substrate 2.
[0042] According to some embodiments of the utility model, the number of carriers 12 in a row is n1, the number of carriers 12 in a column is n2 and satisfies: 2≤n1 / n2≤6. n1 / n2 represents the ratio of the layout length to the layout width of the carrier 12. By adjusting the layout of the rows and columns of the carriers 12 to satisfy 2≤n1 / n2≤6, the aspect ratio of the substrate 2 can be better adapted, the carriers 12 can be more fully utilized, and the uniformity and stability of heating can be improved. When the ratio of n1 / n2 is equal to 2, it means that the ratio of the layout length to the layout width of the carrier 12 is equal to 2:1, which is suitable for the case where the length-width ratio of the substrate 2 is relatively small. As the ratio of n1 / n2 increases, the layout length of the carrier 12 gradually increases relative to the layout width. When the ratio of n1 / n2 is equal to 6, the layout length of the carrier 12 is very small relative to the layout width, which is suitable for the case where the length-width ratio of the substrate 2 is relatively large.
[0043] According to some embodiments of the present invention, Figure 1 and Figure 3 As shown, the other end face of the carrier 12 is configured as an arc-shaped surface protruding away from the tray 11. By configuring the other end face of the carrier 12 as an arc-shaped surface, since the arc-shaped surface protrudes away from the tray 11, the arc-shaped surface can form a good fit with the surface of the substrate 2, which can increase the contact area between the carrier 12 and the substrate 2, improve the efficiency of heat transfer, and enhance the stability of the carrier 12 supporting the substrate 2. In addition, when the position heights of two adjacent carriers 12 are inconsistent, they will not interfere with each other and produce a contact dead angle. Both carriers 12 can have good contact with the substrate 2, improving the continuity and uniformity of heat transfer.
[0044] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0045] In the description of the present invention, "first feature" or "second feature" may include one or more of the features.
[0046] In the description of the present invention, "plurality" means two or more.
[0047] In the description of the present invention, a first feature being “above” or “below” a second feature may include that the first and second features are directly in contact with each other, or may include that the first and second features are not in direct contact but are in contact with each other via another feature therebetween.
[0048] In the description of the present invention, a first feature “above”, “over” and “above” a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.
[0049] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0050] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.
Claims
1. A welding tool for a power module substrate (2), characterized in that: include: A tray (11), wherein a heating surface (11a) is formed on the tray (11), and the heating surface (11a) is suitable for heating the substrate (2); A carrier (12), the carrier (12) being arranged on the heating surface (11a), one end of the carrier (12) being connected to the tray (11), the carrier (12) being structured as a plurality of carriers and the other ends of the plurality of carriers (12) jointly forming a carrying surface, the carrying surface being suitable for carrying the substrate (2); At least one of the carriers (12) is movably arranged on the tray (11) so that the carrier surface is adapted to the substrate (2).
2. The welding tool according to claim 1, characterized in that: At least one of the supporting members (12) can move or telescopically deform in the extension direction.
3. The welding tool according to claim 2, characterized in that: The carrier also includes: An elastic member (13), wherein the elastic member (13) is arranged between at least one of the supporting members (12) and the tray (11).
4. The welding tool according to claim 3, characterized in that: The lengths of the plurality of carriers (12) are equal, and the elastic member (13) is arranged between each of the carriers (12) and the tray (11).
5. The welding tool according to claim 4, characterized in that: The heating surface (11a) is divided into a first heating zone and a second heating zone, and the second heating zone surrounds the first heating zone; The plurality of carriers (12) are divided into a first carrier (12) and a second carrier (12), the first carrier (12) being arranged in the first heating zone, the second carrier (12) being arranged in the second heating zone, and the thermal resistance of the first carrier (12) being greater than the thermal resistance of the second carrier (12).
6. The welding tool according to claim 1, characterized in that: At least one of the carriers (12) is detachably connected to the tray (11).
7. The welding tool according to claim 3, characterized in that: The tray (11) is formed with a receiving groove (11b) on the heating surface (11a), and the elastic member (13) is received in the receiving groove (11b).
8. The welding tool according to claim 1, characterized in that: The plurality of carriers (12) are arranged in a plurality of rows and columns on the heating surface (11a).
9. The welding tool according to claim 8, characterized in that: The number of the carriers (12) in a row is n1, the number of the carriers (12) in a column is n2 and the following condition is satisfied: 2≤n1 / n2≤6.
10. The welding tool according to claim 2, characterized in that: The other end surface of the carrier (12) is configured as an arc-shaped surface protruding away from the tray (11).
Citation Information
Patent Citations
Mold for IGBT module welding
CN110919124A