Pick-and-place device and carrying manipulator
By designing a pick-and-place device with a Bernoulli suction cup and a buffer pad, the problem of difficulty in adsorbing warped wafers in the prior art is solved, and safe and effective handling of warped wafers is achieved.
Patent Information
- Application Number
- CN202420246418.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-31
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-01-31
AI Technical Summary
The existing vacuum adsorption method is difficult to effectively adsorb warped wafers, resulting in the inability to transport or the wafer is damaged during the handling process.
A pick-up and placement device is designed, including a housing and a plurality of air outlets arranged along the circumference, and a Bernoulli suction cup and a cushion pad are provided at the air outlets. The negative pressure cyclone is formed through the positive pressure air flow, adsorbs the wafer, and the adsorption force is buffered through the buffer pad to reduce the impact force of the wafer.
Effective adsorption and handling of warped wafers are achieved, and scratches and damage of wafers are avoided.
Smart Images
Figure CN222494318U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a pick-and-place device and a handling robot. Background Art
[0002] Wafer refers to the chip used in the manufacture of semiconductor integrated circuits. Because of its round shape, it is called a wafer. Various circuit component structures can be processed on the wafer to become IC products with specific electrical functions. In the automated process of wafers, it is often necessary to move the sheet wafer from one fixed point to another to transfer the wafer between different processes or within a process. In the process of producing wafers, the yield rate is a very important condition, so the wafer protection should be paid attention to when it is taken and placed. Wafers on the production line are usually taken and placed by vacuum adsorption.
[0003] The existing vacuum adsorption method is not effective in taking and placing wafers because the vacuum adsorption port of the vacuum adsorber is usually a long single-point vacuum adsorption, but not all wafers have flat surfaces. Wafers of different models and production processes will have a certain degree of warping, and as the wafers become thinner, the rigidity of the wafers becomes very poor. Under local support or under different process conditions, the wafers will also have obvious warping, making it difficult for the long single-point vacuum adsorber to fully fit and contact the surface of the warped wafer, making it difficult to achieve the sealing requirements required for vacuum adsorption. The vacuum adsorber is prone to fail to hold the wafer, resulting in the inability to transport or damage to the wafer during transportation. Utility Model Content
[0004] The purpose of the present application is to provide a pick-and-place device and a handling robot that can absorb warped wafers.
[0005] On the one hand, an embodiment of the present application provides a pick-and-place device, including a shell and a plurality of air outlets opened on a first side surface of the shell, wherein the plurality of air outlets are arranged along a circumference; the air outlet is connected to an air source for ejecting a positive pressure airflow through the air outlet, a Bernoulli suction cup connected to the air outlet is provided at the air outlet, and a plurality of buffer pads are provided at intervals on the first side surface; wherein, when a plurality of Bernoulli suction cups adsorb wafers at the same time, the buffer pads are used to contact with the adsorbed wafers to buffer the force of the Bernoulli suction cup adsorbing the wafers.
[0006] As an practicable manner, the buffer pad includes a hollow cylindrical base connected to the first side and an adsorption portion connected to the base; the adsorption portion is arranged in a trumpet shape, and the small end of the adsorption portion is connected to the base.
[0007] As an implementable manner, the side wall of the base is provided with a plurality of air holes connecting the inside and the outside.
[0008] As an practicable manner, the buffer pad is a silicone pad, a rubber pad or a polyurethane pad.
[0009] As an practicable manner, the deformation amount of the buffer pad along a direction perpendicular to the first side surface is between 0.1-1 mm.
[0010] As an implementable manner, the pick-and-place device further includes a detector disposed on the first side surface, for detecting the distance between the first side surface and the wafer.
[0011] As an implementable manner, the buffer pad is an antistatic pad.
[0012] As an implementable manner, a plurality of buffer pads are evenly distributed on the first side surface of the shell along the circumferential direction.
[0013] As an implementable manner, a plurality of buffer pads are evenly distributed around the periphery of a plurality of Bernoulli suction cups.
[0014] On the other hand, an embodiment of the present application provides a handling robot, including a motion component and the above-mentioned pick-and-place device, wherein the motion component is connected to the pick-and-place device to drive the pick-and-place device to move.
[0015] The beneficial effects of the embodiments of the present application include:
[0016] The pick-and-place device provided in the present application includes a shell and a plurality of air outlets opened on a first side surface of the shell, wherein the plurality of air outlets are arranged along a circumference, and the air outlets are connected to an air source for ejecting a positive-pressure airflow through the air outlets. A Bernoulli suction cup connected to the air outlet is provided at the air outlet, and the positive-pressure airflow is ejected rapidly from the air outlet of the Bernoulli suction cup, and a negative-pressure cyclone is formed under the action of the internal structure of the Bernoulli suction cup. When a wafer is located on one side of the plurality of Bernoulli suction cups, a plurality of negative-pressure centers are formed on one side surface of the wafer, and an upward adsorption force is formed on the wafer under the action of the pressure difference between the upper and lower surfaces of the wafer. A plurality of buffer pads are also arranged at intervals on the first side surface, and when the plurality of Bernoulli suction cups adsorb wafers at the same time, the buffer pads are used to contact with the adsorbed wafers to buffer the force of the Bernoulli suction cups adsorbing the wafers. When the Bernoulli suction cup adsorbs the wafer, one side surface of the wafer contacts the buffer pad to buffer the adsorption force of the Bernoulli suction cup, thereby reducing the impact force when the wafer is adsorbed, and further avoiding scratches and damage to the wafer. Therefore, the placement device of the embodiment of the present application can adsorb warped wafers without scratching the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0018] Figure 1 One of the structural schematic diagrams of a pick-and-place device provided in an embodiment of the present application;
[0019] Figure 2 A second structural schematic diagram of a pick-and-place device provided in an embodiment of the present application;
[0020] Figure 3 One of the structural schematic diagrams of a buffer pad provided in an embodiment of the present application;
[0021] Figure 4 This is a second structural schematic diagram of a buffer pad provided in an embodiment of the present application.
[0022] Icon: 100 - pick-and-place device; 110 - shell; 120 - Bernoulli suction cup; 130 - cushion; 131 - base; 132 - adsorption part; 133 - air vent; 140 - detector. DETAILED DESCRIPTION
[0023] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0024] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.
[0025] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0026] In the description of this application, it should be noted that the terms "center", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0027] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0028] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0029] The present application embodiment provides a pick-and-place device 100, such as Figure 1 and Figure 2 As shown, it includes a shell 110 and a plurality of air outlets opened on the first side of the shell 110, the plurality of air outlets are arranged along the circumference, the air outlets are connected to the air source for ejecting positive pressure airflow through the air outlets, a Bernoulli suction cup 120 connected to the air outlet is arranged at the air outlet, and a plurality of buffer pads 130 are also arranged at intervals on the first side. When the plurality of Bernoulli suction cups 120 adsorb wafers at the same time, the buffer pads 130 are used to contact with the adsorbed wafers to buffer the force of the Bernoulli suction cup adsorbing the wafers.
[0030] The pick-and-place device 100 provided in the embodiment of the present application is applied to a mechanical handler and is connected to a motion component of the mechanical handler. Specifically, the motion component drives the pick-and-place device 100 to a wafer storage position. At this time, the pick-and-place device 100 absorbs the wafer. After confirming that the pick-and-place device 100 absorbs the wafer, the motion component drives the pick-and-place device 100 to move to a target position. At the target position, the pick-and-place device releases the adsorption of the wafer, so that the wafer is placed at the target position, completing the movement of the wafer position.
[0031] Specifically, the pick-and-place device 100 of the present application includes a shell 110, an airflow channel is formed in the shell 110, a first side surface of the shell 110 is provided with a plurality of air outlets, one end of the airflow channel is connected to an air source, and the other end is respectively connected to a plurality of air outlets, the air source blows out a positive pressure airflow, and the positive pressure airflow is transmitted to each air outlet through the airflow channel. A Bernoulli suction cup 120 is provided at each air outlet, and the Bernoulli suction cup 120 is connected to the air outlet, so that the positive pressure airflow is quickly ejected from the air outlet of the Bernoulli suction cup 120, and a negative pressure cyclone is formed under the action of the internal structure of the Bernoulli suction cup 120; when the motion component drives the pick-and-place device 100 to one side of the wafer, the plurality of Bernoulli suction cups 120 on the pick-and-place device 100 form a plurality of negative pressure centers on one side surface of the wafer, so that there is a pressure difference on both sides of the wafer. Under the action of the pressure difference on the two sides of the wafer surface, an upward adsorption force is formed on the wafer, that is, a force is formed to drive the wafer to move in the direction of the Bernoulli suction cup; since multiple negative pressure centers are formed on the wafer surface and the multiple negative pressure centers are arranged along the circumference, the placement device 100 of the present application can adsorb warped wafers.
[0032] A plurality of buffer pads 130 are also provided on the first side surface of the shell 110. When the plurality of Bernoulli suction cups 120 adsorb the wafer, the surface of the wafer contacts the buffer pads 130. The material of the buffer pads 130 is relatively soft, which can buffer the adsorption force of the Bernoulli suction cups 120, thereby reducing the impact force when the wafer is adsorbed, thereby avoiding scratches and damages to the wafer.
[0033] The number of the Bernoulli suction cup 120 and the buffer pad 130 is not limited in the present embodiment, and those skilled in the art can make specific settings according to the actual conditions of the wafer and the gas source. Figure 1 and Figure 2 The eight shown form eight negative pressure centers at the first side surface. The number of the buffer pads 130 is set to 10, so that the pick-and-place device 100 has 10 contact points with the wafer.
[0034] The pick-and-place device 100 provided in the embodiment of the present application includes a shell 110 and a plurality of air outlets opened on the first side surface of the shell 110, the plurality of air outlets are arranged along the circumference, the air outlets are connected to the air source for ejecting positive-pressure airflow through the air outlets, a Bernoulli suction cup 120 connected to the air outlet is provided at the air outlet, the positive-pressure gas is rapidly ejected from the air outlet of the Bernoulli suction cup 120, and a negative-pressure cyclone is formed under the action of the internal structure of the Bernoulli suction cup 120, when the wafer is located on one side of the plurality of Bernoulli suction cups 120, a plurality of negative-pressure centers are formed on one side surface of the wafer, and an upward adsorption force is formed on the wafer under the action of the pressure difference between the upper and lower surfaces of the wafer, and a plurality of buffer pads 130 are also spaced apart on the first side surface, when the plurality of Bernoulli suction cups 120 adsorb the wafer at the same time, the buffer pads 130 are used to contact with the adsorbed wafer to buffer the force of the Bernoulli suction cup adsorbing the wafer. When the Bernoulli suction cup 120 sucks the wafer, one side surface of the wafer contacts the buffer pad 130 to buffer the suction force of the Bernoulli suction cup 120, thereby reducing the impact force when the wafer is sucked, and further avoiding scratches and damage to the wafer. Therefore, the placement device 100 of the embodiment of the present application can absorb warped wafers without scratching the wafers.
[0035] Optional, such as Figure 3 and Figure 4 As shown, the buffer pad 130 includes a hollow cylindrical base 131 connected to the first side surface and an adsorption portion 132 connected to the base 131 ; the adsorption portion 132 is arranged in a trumpet shape, and the small end of the adsorption portion 132 is connected to the base 131 , and the large end thereof is away from the base 131 .
[0036] After the pick-and-place device 100 absorbs the wafer, the wafer contacts the surface of the buffer pad 130. Due to the absorption force of the Bernoulli suction cup 120, the wafer presses the buffer pad 130. When the wafer presses the buffer pad 130, the buffer pad 130 has a certain amount of deformation. When the buffer pad 130 includes a trumpet-shaped absorption portion 132, the absorption portion 132 is more likely to deform, so that the buffering effect is more obvious.
[0037] In one possible implementation of the embodiment of the present application, Figure 3 and Figure 4 As shown, the side wall of the base 131 is provided with a plurality of air holes 133 connecting the inside and the outside.
[0038] When the wafer presses the buffer pad 130 and the buffer pad 130 is deformed, the air in the adsorption part 132 is discharged from the vent hole 133. Similarly, when placing the wafer, the Bernoulli suction cup 120 stops adsorption, and the external air enters the base 131 through the vent hole 133, so that the pressure on both sides of the wafer is balanced and the wafer falls from the pick-and-place device 100.
[0039] Optionally, the buffer pad 130 is a silicone pad, a rubber pad or a polyurethane pad.
[0040] Silicone pads, rubber pads or polyurethane pads are made of softer materials, are more easily deformed, and are resistant to high temperatures and anti-static. They are relatively stable during the wafer handling process.
[0041] In one achievable manner of the embodiment of the present application, the deformation amount of the buffer pad 130 along a direction perpendicular to the first side surface is between 0.1-1 mm.
[0042] After the pick-and-place device 100 absorbs the wafer, the wafer contacts the surface of the buffer pad 130. Due to the absorption force of the Bernoulli suction cup 120, the wafer presses the buffer pad 130. The buffer pad 130 is made of a relatively soft material. When the wafer presses the buffer pad 130, the buffer pad 130 has a certain amount of deformation. The embodiment of the present application adjusts the ratio of each material in the buffer pad 130 to make the buffer pad 130 moderately soft and hard. During the wafer absorption process, the deformation of the buffer pad 130 in the direction perpendicular to the first side surface is between 0.1-1 mm, which protects the wafer while realizing the transfer of the wafer.
[0043] Optional, such as Figure 1 and Figure 2 As shown, the pick-and-place device 100 further includes a detector 140 disposed on the first side surface, for detecting the distance between the first side surface and the wafer.
[0044] In order to ensure that the wafer is adsorbed, the embodiment of the present application further provides a detector 140 on the first side surface, which is used to detect the distance between the first side surface and the wafer when the pick-and-place device 100 is located at a certain height, and the controller is connected to the detector 140 to determine whether the wafer is adsorbed according to the detection result of the detector 140. The detector 140 may be an optical fiber sensor.
[0045] In one achievable manner of the embodiment of the present application, the buffer pad 130 is an antistatic pad.
[0046] Those skilled in the art should know that multiple semiconductor electronic components can be prepared on a wafer to achieve a certain function. Semiconductor electronic components are sensitive to static electricity, which can affect the normal operation of the internal circuit of the wafer. In order to avoid the static electricity on the pick-and-place device 100 from being transmitted to the wafer during the wafer transfer process and affecting the wafer, the buffer pad 130 is set as an antistatic pad in the embodiment of the present application. The antistatic pad can prevent static electricity from being transmitted to the wafer through the pick-and-place device 100.
[0047] In addition, the buffer pad 130 of the embodiment of the present application has the advantages of high temperature resistance and no contamination of the wafer by adjusting the ratio of various materials.
[0048] Optional, such as Figure 1 and Figure 2 As shown, a plurality of buffer pads 130 are evenly distributed on the first side surface of the housing 110 along the circumferential direction.
[0049] The plurality of buffer pads 130 are evenly distributed on the first side surface of the housing 110 along the circumferential direction, so that the arrangement of the plurality of buffer pads 130 is relatively regular and the buffering of the adsorption force is uniform.
[0050] In one achievable manner of the embodiment of the present application, the plurality of buffer pads 130 are evenly distributed on the periphery of the plurality of Bernoulli suction cups 120 .
[0051] A negative pressure center is formed at the Bernoulli suction cup 120 , and the adsorption force on the wafer is strongest at the negative pressure center. When multiple buffer pads 130 are evenly distributed on the periphery of the Bernoulli suction cup 120 , the buffer pads 130 can effectively buffer the adsorption force formed by the Bernoulli suction cup 120 , thereby improving the buffering effect of the buffer pads 130 .
[0052] The embodiment of the present application also discloses a handling robot, including a motion component and the above-mentioned pick-and-place device 100, and the motion component is connected to the pick-and-place device 100 to drive the pick-and-place device 100 to move. Specifically, the motion component drives the pick-and-place device 100 to the wafer storage position. At this time, the pick-and-place device 100 absorbs the wafer. After confirming that the pick-and-place device 100 absorbs the wafer, the motion component drives the pick-and-place device 100 to move to the target position. At the target position, the pick-and-place releases the adsorption of the wafer, so that the wafer is placed in the target position, and the movement of the wafer position is completed. Among them, the specific structure of the motion component is not limited in the embodiment of the present application. For example, it can be a three-axis moving component, or it can be a seven-axis robot, etc. The mechanical handling arm includes the same structure and beneficial effects as the pick-and-place device 100 in the aforementioned embodiment. The structure and beneficial effects of the pick-and-place device 100 have been described in detail in the aforementioned embodiment, and will not be repeated here.
[0053] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A pick-and-place device, characterized in that: It includes a shell and a plurality of air outlets opened on a first side surface of the shell, wherein the plurality of air outlets are arranged along a circumference; the air outlet is connected to an air source and is used to eject a positive pressure airflow through the air outlet, a Bernoulli suction cup connected to the air outlet is arranged at the air outlet, and a plurality of buffer pads are arranged at intervals on the first side surface; wherein, when the plurality of Bernoulli suction cups adsorb wafers at the same time, the buffer pads are used to contact with the adsorbed wafers to buffer the force of the Bernoulli suction cup adsorbing the wafers.
2. The pick-and-place device according to claim 1, characterized in that: The buffer pad comprises a hollow cylindrical base connected to the first side surface and an adsorption portion connected to the base; the adsorption portion is arranged in a trumpet shape, and the small end of the adsorption portion is connected to the base.
3. The pick-and-place device according to claim 2, characterized in that: The side wall of the base is provided with a plurality of air holes communicating with the inside and the outside.
4. The pick-and-place device according to claim 1, characterized in that: The buffer pad is a silicone pad, a rubber pad or a polyurethane pad.
5. The pick-and-place device according to claim 3, characterized in that: The deformation amount of the buffer pad along a direction perpendicular to the first side surface is between 0.1-1 mm.
6. The pick-and-place device according to claim 1, characterized in that: The pick-and-place device further includes a detector disposed on the first side surface, for detecting a distance between the first side surface and the wafer.
7. The pick-and-place device according to claim 1, characterized in that: The buffer pad is an antistatic pad.
8. The pick-and-place device according to claim 1, characterized in that: The plurality of buffer pads are evenly distributed on the first side surface of the shell along a circumferential direction.
9. The pick-and-place device according to claim 1, characterized in that: The plurality of buffer pads are evenly distributed on the peripheries of the plurality of Bernoulli suction cups.
10. A handling robot, characterized in that: It comprises a motion component and a pick-and-place device as described in any one of claims 1 to 9, wherein the motion component is connected to the pick-and-place device to drive the pick-and-place device to move.