Diamond wire cutting silicon wafer cleaning device

Abstract

The utility model relates to the technical field of silicon wafer processing, and particularly discloses a diamond wire cutting silicon wafer cleaning device which comprises two arc-shaped plates which are arranged up and down, a rotating shaft is arranged between the two arc-shaped plates, a plurality of spraying assemblies are arranged on the sides, away from the rotating shaft, of the arc-shaped plates, a driving box is arranged at the end, away from the arc-shaped plates, of the rotating shaft, and the rotating shaft is rotationally connected with the driving box. An intermittent transmission mechanism used for controlling the rotating shaft to rotate and enabling the arc-shaped plate to swing back and forth is arranged in the arc-shaped plate. In the liquid injection process, the intermittent transmission mechanism can drive the rotating shaft to alternately rotate anticlockwise and clockwise, the rotating shaft can drive the two arc-shaped plates to swing back and forth around the axis of the silicon column in the rotating process, the cleaning effect of the silicon wafer is enhanced through swinging water flow, and the smoothness of the surface of the silicon wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing, in particular to a diamond wire cut silicon wafer cleaning device. Background Art

[0002] There are two main ways to cut polycrystalline silicon solar wafers: one is mortar cutting, which uses steel wire to drive the silicon carbide particles in the mortar to interact with the silicon wafers, and then cut; the other is diamond wire cutting, which uses electroplating to fix diamond particles in the nickel-based alloy layer on the surface of stainless steel, and the wire saw and diamond particles move together to cut. Compared with mortar cutting, the fine steel wire saw cutting technology has the advantages of fast cutting speed, low environmental load and easy recycling of cutting sawdust, and is the mainstream technology for current silicon wafer cutting production.

[0003] When cutting silicon wafers, workers will set up nozzles around the cutting area. The nozzles can spray cutting fluid to clean the silicon wafers and improve the diamond wire cutting effect of the silicon wafers. However, since the nozzles are mostly directly fixed on the bracket of the cutting equipment, their positions cannot be adjusted. During the cutting process, the range of the liquid sprayed by the nozzles is limited, and the cutting area of ​​the silicon wafer cannot be fully covered, affecting the smoothness of the cut surface of the silicon wafer. Utility Model Content

[0004] In view of the above problems, the utility model proposes a diamond wire cut silicon wafer cleaning device to solve the shortcomings of the existing diamond wire cut silicon wafer cleaning device in that the range of the liquid sprayed by the nozzle is limited during the cutting process, and the cutting part of the silicon wafer cannot be fully covered, thus affecting the smoothness of the cut surface of the silicon wafer.

[0005] To achieve the purpose of the utility model, the utility model is implemented by the following technical solutions: a diamond wire cut silicon wafer cleaning device, comprising two arc-shaped plates arranged up and down, a rotating shaft is provided between the two arc-shaped plates, a plurality of connecting frames are provided on the side of the arc-shaped plates close to the rotating shaft, the rotating shaft is fixedly connected to the arc-shaped plates through the connecting frames, and a plurality of spray assemblies are provided on the side of the arc-shaped plates away from the rotating shaft;

[0006] A drive box is provided at one end of the rotating shaft away from the arc plate, and the rotating shaft is rotatably connected to the drive box. An intermittent transmission mechanism for controlling the rotation of the rotating shaft and making the arc plate swing back and forth is provided in the arc plate, and a supporting frame is provided at the lower end of the drive box.

[0007] Further improvements are: the intermittent transmission mechanism includes a motor, a gear, a tooth plate, a nut seat and a reciprocating screw, the gear is placed in a drive box, the gear is fixedly connected to the rotating shaft, the tooth plate is placed above the gear and meshes with the gear, the nut seat is fixedly connected to the upper end of the tooth plate, the reciprocating screw penetrates the nut seat and cooperates with the nut seat thread, the motor is installed on the outside of the drive box, and the motor output end is fixedly connected to one end of the reciprocating screw.

[0008] A further improvement is that the spray assembly comprises a nozzle having an output end and an input end, a liquid injection pipe is connected to the input end of the nozzle, and the nozzle is detachably connected to the arc plate.

[0009] A further improvement is that a bolt plate is provided on each side of the nozzle, the bolt plate is fixedly connected to the arc plate, a fixing bolt is installed on the side of the bolt plate away from the nozzle, the fixing bolt passes through the bolt plate and is threadedly connected to a threaded hole opened on the outside of the nozzle.

[0010] A further improvement is that a guide rail is provided above the reciprocating screw, the guide rail is fixedly connected to the inner side wall of the driving box, and the guide rail is slidably connected to the nut seat.

[0011] A further improvement is that the support frame includes a workbench, the upper end of the workbench is fixedly connected to the lower end of the drive box, a plurality of legs are arranged at the lower end of the workbench, a rib is arranged between two adjacent legs, and a rubber pad is arranged at the lower end of the legs.

[0012] The beneficial effects of the utility model are:

[0013] During the liquid injection process, the intermittent transmission mechanism will drive the shaft to rotate alternately counterclockwise and clockwise. When the shaft rotates, it will drive the two arc-shaped plates to swing back and forth around the axis of the silicon column. The swinging water flow will enhance the cleaning effect of the silicon wafer and improve the smoothness of the silicon wafer surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0015] Figure 1 It is a structural diagram of the arc plate in the utility model.

[0016] Figure 2 This utility model Figure 1 A magnified view of the structure at center.

[0017] Figure 3 It is a structural diagram of the interior of the drive box in the utility model.

[0018] Among them: 1. workbench; 101. support leg; 102. rubber pad; 2. drive box; 201. motor; 202. gear; 203. tooth plate; 204. nut seat; 205. reciprocating screw; 206. guide rail; 3. rotating shaft; 301. connecting frame; 4. arc plate; 401. bolt plate; 402. fixing bolt; 5. spray assembly; 501. injection pipe; 502. nozzle. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0020] according to Figure 1 , 2 As shown in Figure 3, a diamond wire cut silicon wafer cleaning device is proposed in this embodiment, including two arc plates 4 arranged up and down, a rotating shaft 3 is provided between the two arc plates 4, a plurality of connecting frames 301 are provided on the side of the arc plate 4 close to the rotating shaft 3, the rotating shaft 3 is fixedly connected to the arc plate 4 through the connecting frames 301, and a plurality of spray components 5 are provided on the side of the arc plate 4 away from the rotating shaft 3; when the silicon wafer is cut using the diamond wire, the cutting liquid will be sprayed to the contact position between the silicon column and the diamond wire through the spray component 5, so as to clean the debris generated at the cutting position and improve the smoothness of the cutting surface.

[0021] A drive box 2 is provided at one end of the rotating shaft 3 away from the arc plate 4, and the rotating shaft 3 is rotatably connected to the drive box 2. An intermittent transmission mechanism for controlling the rotation of the rotating shaft 3 and making the arc plate 4 swing back and forth is provided in the arc plate 4, and a support frame is provided at the lower end of the drive box 2. During the injection process, the intermittent transmission mechanism will drive the rotating shaft 3 to rotate alternately counterclockwise and clockwise. During the rotation of the rotating shaft 3, the two arc plates 4 will be driven to swing back and forth around the axis of the silicon column, and the washing effect of the silicon wafer will be enhanced by the swinging water flow, thereby improving the smoothness of the silicon wafer surface.

[0022] For the specific structure of the intermittent transmission mechanism, please refer to the following description.

[0023] The intermittent transmission mechanism includes a motor 201, a gear 202, a tooth plate 203, a nut seat 204 and a reciprocating screw 205. The gear 202 is placed in the drive box 2, the gear 202 is fixedly connected to the rotating shaft 3, the tooth plate 203 is placed above the gear 202 and meshes with the gear 202, the nut seat 204 is fixedly connected to the upper end of the tooth plate 203, the reciprocating screw 205 penetrates the nut seat 204 and is threadedly matched with the nut seat 204, the motor 201 is installed on the outside of the drive box 2, and the output end of the motor 201 is fixedly connected to one end of the reciprocating screw 205.

[0024] The specific working process of the intermittent transmission mechanism is as follows:

[0025] The motor 201 drives the reciprocating screw 205 to rotate. The reciprocating screw 205 cooperates with the nut seat 204 to drive the nut seat 204 to move along the shaft of the reciprocating screw 205. The reciprocating screw 205 usually adopts two thread grooves with the same pitch but opposite rotation directions, such as one left-handed and one right-handed. Such a design makes it possible that when the reciprocating screw 205 rotates, due to the interaction of the two sections of thread, the nut seat 204 placed outside the reciprocating screw 205 will be subjected to opposite forces, thereby generating reciprocating linear motion along the axis of the reciprocating screw 205. When the nut seat 204 performs reciprocating linear motion, the tooth plate 203 fixed to the nut seat 204 will also move. The tooth plate 203 drives the gear 202 to rotate alternately counterclockwise and clockwise by meshing with the gear 202. The rotating shaft 3 is fixed to the gear 202. When the gear 202 rotates, the rotating shaft 3 will also rotate.

[0026] About spray component 5:

[0027] The spray assembly 5 includes a nozzle 502, which has an output end and an input end. The input end of the nozzle 502 is connected to an injection tube 501, and the end of the injection tube 501 away from the nozzle 502 is connected to an external pump. The pump draws the cutting liquid into the injection tube 501 and then sprays it out through the output end of the nozzle 502. To facilitate the replacement of the spray assembly 5, the nozzle 502 is detachably connected to the arc plate 4.

[0028] In a preferred embodiment, a bolt plate 401 is provided on each side of the nozzle 502, the bolt plate 401 is fixedly connected to the arc plate 4, a fixing bolt 402 is provided on the side of the bolt plate 401 away from the nozzle 502, the fixing bolt 402 passes through the bolt plate 401 and is threadedly connected to a threaded hole provided on the outside of the nozzle 502. When removing the arc plate 4, the fixing bolt 402 on the outside of the bolt plate 401 can be screwed out of the threaded groove on the outside of the nozzle 502. Of course, in addition to fixing the nozzle 502 by bolt connection, the nozzle 502 can also be fixed by a method such as a snap connection.

[0029] It is worth noting that when the nut seat 204 cooperates with the reciprocating screw 205, the reciprocating screw 205 will generate a rotational force on the nut seat 204. The rotational force will cause the tooth plate 203 to deflect when the nut seat 204 moves, and it cannot be stably engaged with the gear 202.

[0030] Based on this, a guide rail 206 is provided above the reciprocating screw 205, the guide rail 206 is fixedly connected to the inner side wall of the driving box 2, and the guide rail 206 is slidably connected to the nut seat 204. The lower end of the nut seat 204 is fixedly connected to the tooth plate 203, and the upper end of the nut seat 204 is slidably connected to the guide rail 206. When the nut seat 204 moves along the shaft of the reciprocating screw 205, the guide rail 206 will guide the nut seat 204 from the upper end of the nut seat 204, so that the nut seat 204 will not deflect when sliding.

[0031] About the support frame:

[0032] The support frame includes a workbench 1, the upper end of the workbench 1 is fixedly connected to the lower end of the driving box 2, a plurality of legs 101 are provided at the lower end of the workbench 1, a rib plate is provided between two adjacent legs 101, and a rubber pad 102 is provided at the lower end of the leg 101. The legs 101 support the workbench 1, the rubber pad 102 plays an anti-slip role, and the rib plate is fixed between two adjacent legs 101 to play a reinforcing role.

[0033] How this application works:

[0034] When the silicon wafer is cut using the diamond wire, the cutting liquid is sprayed to the contact position between the silicon column and the diamond wire through the spray assembly 5 to clean the debris generated at the cutting position and improve the smoothness of the cut surface.

[0035] During the injection process, the motor 201 drives the reciprocating screw 205 to rotate, and the reciprocating screw 205 cooperates with the nut seat 204 to drive the nut seat 204 to move along the shaft of the reciprocating screw 205. The reciprocating screw 205 usually has two thread grooves with the same pitch but opposite rotation directions, such as one left-handed and one right-handed. Such a design makes it possible that when the reciprocating screw 205 rotates, due to the interaction of the two sections of the thread, the nut seat 204 placed outside the reciprocating screw 205 will be subjected to opposite forces, thereby generating reciprocating linear motion along the axis of the reciprocating screw 205.

[0036] When the nut seat 204 performs reciprocating linear motion, the toothed plate 203 fixed to the nut seat 204 will also move, and the toothed plate 203 drives the gear 202 to rotate alternately counterclockwise and clockwise by meshing with the gear 202. The rotating shaft 3 is fixed to the gear 202, and when the gear 202 rotates, the rotating shaft 3 will also rotate alternately counterclockwise and clockwise. During the rotation of the rotating shaft 3, the two arc plates 4 will swing back and forth around the axis of the silicon column, and the swinging water flow will enhance the cleaning effect of the silicon wafer and improve the smoothness of the silicon wafer surface.

[0037] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0038] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A diamond wire cut silicon wafer cleaning device, comprising two arc-shaped plates (4) arranged one above the other, a rotating shaft (3) being arranged between the two arc-shaped plates (4), characterized in that: A plurality of connecting frames (301) are provided on a side of the arc-shaped plate (4) close to the rotating shaft (3); the rotating shaft (3) is fixedly connected to the arc-shaped plate (4) via the connecting frames (301); and a plurality of spraying assemblies (5) are provided on a side of the arc-shaped plate (4) away from the rotating shaft (3); A drive box (2) is provided at one end of the rotating shaft (3) away from the arc-shaped plate (4), the rotating shaft (3) being rotatably connected to the drive box (2), an intermittent transmission mechanism for controlling the rotation of the rotating shaft (3) and causing the arc-shaped plate (4) to swing back and forth is provided inside the arc-shaped plate (4), and a support frame is provided at the lower end of the drive box (2).

2. The diamond wire cutting silicon wafer cleaning device according to claim 1, characterized in that: The intermittent transmission mechanism comprises a motor (201), a gear (202), a tooth plate (203), a nut seat (204) and a reciprocating screw (205); the gear (202) is placed in the drive box (2); the gear (202) is fixedly connected to the rotating shaft (3); the tooth plate (203) is placed above the gear (202) and meshes with the gear (202); the nut seat (204) is fixedly connected to the upper end of the tooth plate (203); the reciprocating screw (205) penetrates the nut seat (204) and is threadedly engaged with the nut seat (204); the motor (201) is mounted on the outside of the drive box (2); and the output end of the motor (201) is fixedly connected to one end of the reciprocating screw (205).

3. The diamond wire cut silicon wafer cleaning device according to claim 1, characterized in that: The spray assembly (5) comprises a nozzle (502), the nozzle (502) having an output end and an input end, the input end of the nozzle (502) being connected to a liquid injection tube (501), and the nozzle (502) is detachably connected to the arc plate (4).

4. The diamond wire cutting silicon wafer cleaning device according to claim 3, characterized in that: A bolt plate (401) is provided on each side of the nozzle (502), the bolt plate (401) being fixedly connected to the arc-shaped plate (4), and a fixing bolt (402) is provided on the side of the bolt plate (401) away from the nozzle (502), the fixing bolt (402) passing through the bolt plate (401) and being threadedly connected to a threaded hole provided on the outside of the nozzle (502).

5. The diamond wire cut silicon wafer cleaning device according to claim 2, characterized in that: A guide rail (206) is provided above the reciprocating screw (205), the guide rail (206) being fixedly connected to the inner wall of the drive box (2), and the guide rail (206) being slidably connected to the nut seat (204).

6. The diamond wire cutting silicon wafer cleaning device according to claim 1, characterized in that: The support frame comprises a workbench (1), the upper end of the workbench (1) being fixedly connected to the lower end of the drive box (2), the lower end of the workbench (1) being provided with a plurality of legs (101), a rib plate being provided between two adjacent legs (101), and a rubber pad (102) being provided at the lower end of the legs (101).

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