Glue injection structure of semiconductor packaging mold

Abstract

The utility model relates to the technical field of glue injection structures, and discloses a glue injection structure of a semiconductor packaging mould, which comprises a glue injection box body, the bottom of the glue injection box body is open, the two sides of the rear end surface of the glue injection box body are connected with mounting blocks, a feeding funnel is inserted into the left upper end of the glue injection box body, and the feeding funnel is connected with the mounting blocks. A glue injection liquid storage chamber is connected to the left side wall of the interior of the glue injection box body through a connecting piece, the lower end of the feeding hopper communicates with the upper left end of the glue injection liquid storage chamber, an output pipeline is arranged in the glue injection liquid storage chamber, and a glue injection pipeline is arranged at the position, close to the bottom, of the interior of the glue injection box body; the lower end of the glue injection pipeline is connected with a plurality of glue injection nozzles which are horizontally distributed at equal intervals, and one side of the bottom of the glue injection liquid storage chamber is connected with a first lifting air cylinder. According to the utility model, the glue injection pipeline and the plurality of glue injection nozzles are arranged and are matched with each other, so that a plurality of semiconductor workpieces can be simultaneously injected at one time, and the working efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of glue injection structures, in particular to a glue injection structure of a semiconductor packaging mold. Background Art

[0002] Semiconductor packaging molds are key tools for manufacturing semiconductor devices, and they play an important role in the semiconductor industry chain. In the semiconductor packaging process, one of the steps is to inject glue into the semiconductor, and the injection structure is used at this time.

[0003] The existing semiconductor packaging mold glue injection structure cannot inject glue into multiple semiconductor workpieces at the same time when in use, resulting in low work efficiency. In addition, the glue injection liquid cannot be filtered out impurities accidentally mixed in, resulting in low quality of the glue injection liquid, which in turn reduces the quality of subsequent semiconductor glue injection. Impurities accidentally mixed in during use are likely to clog the pipeline. Therefore, there is an urgent need for a semiconductor packaging mold glue injection structure to solve the above technical problems. Utility Model Content

[0004] The purpose of the utility model is to provide a glue injection structure for a semiconductor packaging mold to solve the problem that the existing glue injection structure of the semiconductor packaging mold proposed in the above background technology cannot inject glue into multiple semiconductor workpieces at one time during use, resulting in low work efficiency. In addition, the glue injection liquid cannot be filtered out impurities accidentally mixed therein, resulting in low quality of the glue injection liquid, thereby reducing the quality of subsequent semiconductor glue injection, and the impurities accidentally mixed in during use are prone to blockage of pipelines.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A glue injection structure for a semiconductor packaging mold comprises a glue injection box, the bottom of the glue injection box is open, both sides of the rear end surface of the glue injection box are connected to mounting blocks, a feed funnel is inserted into the upper left end of the glue injection box, a glue injection liquid storage chamber is connected to the inner left side wall of the glue injection box through a connector, the lower end of the feed funnel is connected to the upper left end of the glue injection liquid storage chamber, an output pipe is arranged in the glue injection liquid storage chamber, a glue injection pipe is arranged inside the glue injection box near the bottom, a plurality of glue injection nozzles distributed horizontally at equal intervals are connected to the lower end of the glue injection pipe, and a first A lifting cylinder, a support plate is connected to the lower right side of the glue injection liquid storage chamber, a second lifting cylinder is connected to the lower right end of the support plate, the lower ends of the first lifting cylinder and the second lifting cylinder are connected to a supporting beam, the lower end of the supporting beam is connected to the glue injection pipe through a connecting column, a support member is connected to the middle of the right side wall of the glue injection liquid storage chamber, the upper end of the output pipe passes through the top of the glue injection liquid storage chamber, the support member, the support plate and the supporting beam in sequence and is connected to the glue injection pipe, a delivery pump is installed on the output pipe, a filter screen is provided inside the upper end of the feed funnel, and mounting holes are provided on the two mounting blocks.

[0007] As a preferred technical solution of the utility model, the number of the connecting pieces is set to two, and the two connecting pieces are symmetrically arranged about the upper and lower axes of the injection liquid storage chamber.

[0008] As a preferred technical solution of the utility model, both left and right ends of the delivery pump are connected to the top of the injection liquid storage chamber through a support frame.

[0009] As a preferred technical solution of the utility model, the number of the connecting columns is set to two, and the two connecting columns are symmetrically arranged with respect to the left and right axis of the injection liquid storage chamber.

[0010] As a preferred technical solution of the utility model, the output pipe is located on the right side of the feeding funnel.

[0011] As a preferred technical solution of the present utility model, the shape of the output pipe is an inverted U-shaped structure.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] The utility model provides a glue injection pipeline and a plurality of glue injection nozzles and utilizes the mutual cooperation between them, so that glue injection of a plurality of semiconductor workpieces can be realized at one time, thereby improving the working efficiency.

[0014] The utility model provides a filter screen in the feeding funnel, through which the impurities accidentally mixed in the glue injection liquid can be filtered out to avoid clogging of subsequent pipelines, and the quality of the glue injection liquid can be improved, thereby improving the quality of semiconductor glue injection in the later stage. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a schematic cross-sectional view of the overall structure of the utility model;

[0018] Figure 3 It is a schematic diagram of the back cross-sectional structure of the glue injection box body of the utility model.

[0019] In the figure: 1. Glue injection box; 2. Mounting block; 3. Feed leak; 4. Filter screen; 5. Glue injection liquid storage chamber; 6. Connecting piece; 7. Output pipeline; 8. Delivery pump; 9. Support plate; 10. First lifting cylinder; 11. Second lifting cylinder; 12. Support beam; 13. Glue injection pipeline; 14. Glue injection nozzle; 15. Support frame; 16. Support piece; 17. Mounting hole; 18. Connecting column. DETAILED DESCRIPTION

[0020] The present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are only used to explain the relevant utility model, rather than to limit the utility model. It should also be noted that, for ease of description, only the parts related to the utility model are shown in the accompanying drawings. The different types of section lines in the drawings in the embodiments of the utility model are not marked according to the national standard, nor are there any requirements for the materials of the components, but are used to distinguish the cross-sectional views of the components in the drawings.

[0021] See also Figure 1-3, a glue injection structure for a semiconductor packaging mold, comprising a glue injection box 1, the bottom of the glue injection box 1 is open, both sides of the rear end surface of the glue injection box 1 are connected with mounting blocks 2, a feeding funnel 3 is inserted at the upper left end of the glue injection box 1, a glue injection liquid storage chamber 5 is connected to the left side wall of the interior of the glue injection box 1 through a connector 6, the lower end of the feeding funnel 3 is connected to the upper left end of the glue injection liquid storage chamber 5, an output pipe 7 is arranged in the glue injection liquid storage chamber 5, a glue injection pipe 13 is arranged at the bottom of the glue injection box 1, a plurality of glue injection nozzles 14 distributed horizontally at equal intervals are connected to the lower end of the glue injection pipe 13, a first lifting cylinder 10 is connected to one side of the bottom of the glue injection liquid storage chamber 5, and the glue injection nozzle 14 is connected to the lower end of the glue injection nozzle 14. A support plate 9 is connected to the lower right side of the glue storage chamber 5, and a second lifting cylinder 11 is connected to the lower right end of the support plate 9. A support beam 12 is connected to the lower ends of the first lifting cylinder 10 and the second lifting cylinder 11. The lower end of the support beam 12 is connected to the glue injection pipe 13 through a connecting column 18. A support member 16 is connected to the middle of the right side wall of the glue storage chamber 5. The upper end of the output pipe 7 passes through the top of the glue storage chamber 5, the support member 16, the support plate 9 and the support beam 12 in sequence and is connected to the glue injection pipe 13. A delivery pump 8 is installed on the output pipe 7. A filter screen 4 is provided inside the upper end of the feed funnel 3, and mounting holes 17 are provided on the two mounting blocks 2.

[0022] The number of the connecting members 6 is set to two, and the two connecting members 6 are symmetrically arranged about the upper and lower axes of the injection liquid storage chamber 5 .

[0023] The left and right ends of the delivery pump 8 are connected to the top of the injection liquid storage chamber 5 through the support frame 15 .

[0024] The number of the connecting columns 18 is set to two, and the two connecting columns 18 are symmetrically arranged with respect to the left-right axis of the injection liquid storage chamber 5 .

[0025] The output pipe 7 is located on the right side of the feeding funnel 3 .

[0026] The output pipe 7 is in the shape of an inverted U-shaped structure.

[0027] The working principle and use process of the utility model are as follows: first, the glue injection liquid is poured from the feeding funnel 3 into the glue injection liquid storage chamber 5. When the glue injection liquid passes through the feeding funnel 3, the filter screen 4 in the feeding funnel 3 filters out impurities accidentally mixed in the glue injection liquid to avoid clogging the subsequent pipelines, and can improve the quality of the glue injection liquid, thereby improving the quality of semiconductor glue injection in the later stage. Then, the first lifting cylinder 10 and the second lifting cylinder 11 are started to drive the entire support beam 12 to move downward, so that multiple glue injection nozzles 14 pass through the bottom opening of the glue injection box 1 and move downward to the designated glue injection position. The filtered glue injection liquid is transported to the glue injection pipe 13 through the output pipe 7 by starting the delivery pump 8, and finally multiple semiconductor workpieces are injected with glue simultaneously through the multiple glue injection nozzles 14 on the glue injection pipe 13, thereby improving work efficiency. The contents not described in detail in this description belong to the prior art known to professional and technical personnel in this field.

[0028] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the utility model involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the concept of the utility model. For example, the above features are replaced with the technical features with similar functions disclosed in the present application (but not limited to) by each other to form a technical solution.

Claims

1. A glue injection structure for a semiconductor packaging mold, comprising a glue injection box (1), characterized in that: The bottom of the glue injection box (1) is open, and mounting blocks (2) are connected to both sides of the rear end surface of the glue injection box (1). A feeding funnel (3) is inserted at the upper left end of the glue injection box (1). A glue injection liquid storage chamber (5) is connected to the left side wall of the glue injection box (1) via a connecting piece (6). The lower end of the feeding funnel (3) is connected to the upper left end of the glue injection liquid storage chamber (5). An output pipe (7) is arranged in the glue injection liquid storage chamber (5). A glue injection pipe (13) is arranged near the bottom of the glue injection box (1). The lower end of the glue injection pipe (13) is connected to a plurality of glue injection nozzles (14) distributed horizontally at equal intervals. A first lifting cylinder (10) is connected to one side of the bottom of the glue injection liquid storage chamber (5). A support (7) is connected to the lower right side of the glue injection liquid storage chamber (5). A support plate (9), the lower right end of the support plate (9) is connected to a second lifting cylinder (11), the lower ends of the first lifting cylinder (10) and the second lifting cylinder (11) are connected to a support beam (12), the lower end of the support beam (12) is connected to a glue injection pipeline (13) via a connecting column (18), a support member (16) is connected to the middle of the right side wall of the glue injection liquid storage chamber (5), the upper end of the output pipeline (7) passes through the top of the glue injection liquid storage chamber (5), the support member (16), the support plate (9) and the support beam (12) in sequence and is connected to the glue injection pipeline (13), a delivery pump (8) is installed on the output pipeline (7), a filter screen (4) is arranged inside the upper end of the feed funnel (3), and mounting holes (17) are provided on both mounting blocks (2).

2. The glue injection structure of a semiconductor packaging mold according to claim 1, characterized in that: The number of the connecting pieces (6) is set to two, and the two connecting pieces (6) are arranged symmetrically about the upper and lower axes of the injection liquid storage chamber (5).

3. The glue injection structure of a semiconductor packaging mold according to claim 1, characterized in that: The left and right ends of the delivery pump (8) are connected to the top of the injection liquid storage chamber (5) via a support frame (15).

4. The glue injection structure of a semiconductor packaging mold according to claim 1, characterized in that: The number of the connecting columns (18) is set to two, and the two connecting columns (18) are arranged symmetrically about the left and right axes of the injection liquid storage chamber (5).

5. The glue injection structure of a semiconductor packaging mold according to claim 1, characterized in that: The output pipe (7) is located on the right side of the feeding funnel (3).

6. The glue injection structure of a semiconductor packaging mold according to claim 1, characterized in that: The output pipe (7) is in the shape of an inverted U-shaped structure.

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