Storage assembly for packaging semiconductor parts

Abstract

The utility model relates to the field of semiconductor part storage, in particular to a storage assembly for semiconductor part packaging. Comprising a storage box, a moving groove is formed in the center of one side wall of the storage box, a drawing box is arranged in the moving groove, a drawing handle is installed in the center of one side wall of the drawing box, an empty groove is formed in the center of the top of the drawing box, a plurality of sets of installation boxes are arranged in the empty groove, and the multiple sets of installation boxes are different in specification and size; and the multiple sets of mounting boxes are arranged in a rectangular array, the bottom of each set of mounting box is slidably attached to the inner wall of the bottom of the drawing box, a set of storage cavities are formed in the center of the top of each set of mounting box, a set of second soft cushions are arranged in each set of storage cavities, and each set of second soft cushions are installed on the inner wall of the corresponding mounting box. According to the embodiment, the parts can be placed according to the sizes of the parts, limitation is reduced, and meanwhile the space utilization rate is increased.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor component storage, and particularly relates to a storage component for semiconductor component packaging. Background Art

[0002] Semiconductor components refer to components that meet the requirements of semiconductor equipment and technology in terms of materials, structure, process, quality and precision, reliability and stability, such as O-Ring sealing ring, EFEM (transmission module), RFGen radio frequency power supply, ESC electrostatic chuck, Si silicon ring and other structural parts, Pump vacuum pump, MFC gas flow meter, precision bearing, ShowerHead gas shower head, etc.

[0003] After searching, in the prior art, China Patent Announcement No.: CN213531267U, Authorization Announcement Date: 2021-06-25, announced a semiconductor laser parts storage box, including a box body, two sets of support plates are fixedly installed on both sides of the inner wall of the box body, and the two sets of support plates are slidably connected to the storage box through the first slider, and the support plate is provided with a first slide groove, and the first slider is slidably connected in the first slide groove. The structure matching the first slider and the first slide groove is set to make the storage box slide more smoothly on the support plate. The above embodiment has high safety and high practicality.

[0004] However, the device still has the following defects: the above embodiment has limitations. If semiconductor parts of different sizes cannot be placed, the range of parts that can be placed will be limited or the space will be insufficiently utilized, thereby increasing the limitations and reducing the space utilization rate. Utility Model Content

[0005] In view of the above problems, the utility model provides a storage assembly for semiconductor parts packaging, comprising a storage box, a movable groove is opened at the center of one side wall of the storage box, a pull-out box is arranged in the movable groove, a pull-out handle is installed at the center of one side wall of the pull-out box, and an empty groove is opened at the center of the top of the pull-out box;

[0006] Several groups of installation boxes are arranged in the empty slot, and the specifications and sizes of the several groups of installation boxes are different. The several groups of installation boxes are arranged in a rectangular array, and the bottom of each group of installation boxes slides and fits on the bottom inner wall of the pull-out box. A group of storage cavities are opened at the top center of each group of installation boxes, and a group of second soft pads are arranged in each group of storage cavities, and each group of second soft pads is installed on the inner wall of the installation box.

[0007] Furthermore, two groups of snap-in grooves are symmetrically provided at the top edge of the storage box, and the pull-out handle is located at one end of the storage box.

[0008] Furthermore, the bottom of the pull-out box is slidably fitted on the bottom inner wall of the storage box, and the top of the pull-out box is slidably fitted on the bottom of the first cushion.

[0009] Furthermore, two groups of mounting columns are symmetrically installed at the bottom edge of the storage box, and a group of mounting grooves are opened at the bottom center of each group of mounting columns.

[0010] Furthermore, a group of electric push rods are arranged in each group of the mounting grooves, and each group of the electric push rods are installed at the center of the top inner wall of the mounting column.

[0011] Furthermore, a group of moving components is installed on the output end of each group of electric push rods, and each group of moving components is located in the installation groove.

[0012] Furthermore, a control panel is installed at an edge of one side wall of the storage box, and the electric push rod is electrically connected to the control panel.

[0013] Furthermore, a first soft cushion is arranged in the movable groove, and the top of the first soft cushion is installed on the top inner wall of the storage box.

[0014] The beneficial effects of the utility model are:

[0015] 1. Several groups of installation boxes have different sizes. The semiconductor parts are placed in installation boxes of different sizes according to different sizes. The parts are attached to the second soft pad and can be placed according to different sizes of parts, which reduces limitations and improves space utilization.

[0016] 2. Several groups of installation boxes have different sizes. The semiconductor parts are placed in installation boxes of different sizes according to different sizes. The parts are attached to the second soft pad and can be placed according to different parts sizes, which reduces limitations and improves space utilization.

[0017] Other features and advantages of the utility model will be described in the following description, and partly become apparent from the description, or understood by implementing the utility model. The purpose and other advantages of the utility model can be realized and obtained by the structures indicated in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A schematic diagram of the structure of a storage component according to an embodiment of the utility model is shown;

[0020] Figure 2 A schematic cross-sectional view of a storage assembly according to an embodiment of the utility model is shown;

[0021] Figure 3 An enlarged view of part A according to an embodiment of the utility model is shown;

[0022] Figure 4 An enlarged view of part B according to an embodiment of the utility model is shown.

[0023] In the figure: 1. storage box; 2. mounting column; 3. mounting slot; 4. electric push rod; 5. moving component; 6. control panel; 7. snap-in slot; 8. moving slot; 9. first cushion; 10. pull-out box; 11. pull-out handle; 12. empty slot; 13. mounting box; 14. storage cavity; 15. second cushion. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] The utility model embodiment provides a storage assembly for semiconductor parts packaging, including a storage box 1, exemplarily, as Figure 2 and Figure 3 As shown, two groups of mounting columns 2 are symmetrically installed at the bottom edge of the storage box 1, and a group of mounting grooves 3 are opened at the bottom center of each group of mounting columns 2. A group of electric push rods 4 are arranged in each group of mounting grooves 3, and each group of electric push rods 4 is installed at the center of the top inner wall of the mounting column 2. A group of moving components 5 are installed on the output end of each group of electric push rods 4, and each group of moving components 5 is located in the mounting groove 3.

[0026] For example, Figure 1 , Figure 2 and Figure 4As shown, a control panel 6 is installed at the edge of one side wall of the storage box 1, the electric push rod 4 is electrically connected to the control panel 6, two groups of card slots 7 are symmetrically opened at the top edge of the storage box 1, a movable slot 8 is opened at the center of one side wall of the storage box 1, a first soft pad 9 is arranged in the movable slot 8, the top of the first soft pad 9 is installed on the top inner wall of the storage box 1, a pull-out box 10 is arranged in the movable slot 8, the bottom of the pull-out box 10 is slidably fitted on the bottom inner wall of the storage box 1, the top of the pull-out box 10 is slidably fitted on the bottom of the first soft pad 9, and the center of one side wall of the pull-out box 10 A pull-out handle 11 is installed at the pull-out box 10, and the pull-out handle 11 is located at one end of the storage box 1. An empty slot 12 is opened at the top center of the pull-out box 10, and a plurality of groups of installation boxes 13 are arranged in the empty slot 12. The sizes of the plurality of installation boxes 13 are different, and the plurality of groups of installation boxes 13 are arranged in a rectangular array. The bottom of each group of the installation boxes 13 is slidably fitted on the bottom inner wall of the pull-out box 10, and a group of storage cavities 14 are opened at the top center of each group of the installation boxes 13. A group of second soft pads 15 are arranged in each group of the storage cavities 14, and each group of the second soft pads 15 are installed on the inner wall of the installation box 13.

[0027] Working principle: by pulling the pull-out handle 11, the pull-out box 10 is driven to move, and the semiconductor parts are placed in installation boxes 13 of different sizes according to different sizes and specifications. The parts are fitted on the second soft pad 15. After the semiconductor parts are placed and stored, the pull-out handle 11 is pushed to drive the pull-out box 10 to move into the moving groove 8. The control panel 6 controls the electric push rod 4 to start. The electric push rod 4 drives the moving component 5 to descend and drives the storage box 1 to rise. The electric push rod 4 contacts the ground, pushes the storage box 1 to drive the electric push rod 4 to roll, and the equipment moves. When the equipment moves, the second soft pad 15 and the first soft pad 9 are set to prevent the parts from colliding. The electric push rod 4 drives the moving component 5 to rise into the installation groove 3. The bottom of the installation column 2 contacts the ground, and the installation column 2 of another group of storage components is slid and connected to the card slot 7. The two groups of storage components are stacked.

[0028] The sizes of the several groups of installation boxes 13 are different. The semiconductor parts are placed in the installation boxes 13 of different sizes according to the different sizes. The parts are attached to the second soft pad 15 and can be placed according to the different sizes of parts, which reduces the limitations and improves the space utilization.

[0029] Slide the mounting column 2 of another group of storage components into the card slot 7. The two groups of storage components can be stacked. Storage components can be increased as needed. A single storage component can be moved or multiple storage components can be moved at the same time, which reduces the complexity of management and reduces the workload.

[0030] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A storage assembly for semiconductor component packaging, comprising a storage box (1), characterized in that: A movable groove (8) is provided at the center of one side wall of the storage box (1), a pull-out box (10) is arranged in the movable groove (8), a pull-out handle (11) is installed at the center of one side wall of the pull-out box (10), and an empty groove (12) is provided at the center of the top of the pull-out box (10); A plurality of groups of installation boxes (13) are arranged in the empty slot (12), the sizes of the plurality of installation boxes (13) being different, and the plurality of groups of installation boxes (13) being arranged in a rectangular array, the bottom of each group of installation boxes (13) being slidably fitted on the bottom inner wall of the pull-out box (10), a group of storage cavities (14) being opened at the top center of each group of installation boxes (13), a group of second soft pads (15) being arranged in each group of storage cavities (14), and each group of the second soft pads (15) being installed on the inner wall of the installation box (13).

2. The storage assembly for semiconductor component packaging according to claim 1, characterized in that: Two groups of snap-in grooves (7) are symmetrically provided at the top edge of the storage box (1), and the pull-out handle (11) is located at one end of the storage box (1).

3. The storage assembly for semiconductor component packaging according to claim 1, characterized in that: The bottom of the pull-out box (10) is slidably fitted on the bottom inner wall of the storage box (1), and the top of the pull-out box (10) is slidably fitted on the bottom of the first soft pad (9).

4. The storage assembly for semiconductor component packaging according to claim 1, characterized in that: Two groups of mounting columns (2) are symmetrically mounted at the bottom edge of the storage box (1), and a group of mounting grooves (3) are opened at the bottom center of each group of mounting columns (2).

5. The semiconductor component packaging storage assembly according to claim 4, characterized in that: A group of electric push rods (4) is arranged in each group of the installation grooves (3), and each group of the electric push rods (4) is installed at the center of the top inner wall of the installation column (2).

6. The storage assembly for semiconductor component packaging according to claim 5, characterized in that: A group of moving components (5) is installed on the output end of each group of electric push rods (4), and each group of moving components (5) is located in the installation groove (3).

7. The storage assembly for semiconductor component packaging according to claim 6, characterized in that: A control panel (6) is installed at the edge of one side wall of the storage box (1), and the electric push rod (4) is electrically connected to the control panel (6).

8. The storage assembly for semiconductor component packaging according to claim 1, characterized in that: A first soft pad (9) is arranged in the movable groove (8), and the top of the first soft pad (9) is mounted on the top inner wall of the storage box (1).

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